DE10049274A1 - Kühleinrichtung und Verfahren zu deren Herstellung - Google Patents
Kühleinrichtung und Verfahren zu deren HerstellungInfo
- Publication number
- DE10049274A1 DE10049274A1 DE10049274A DE10049274A DE10049274A1 DE 10049274 A1 DE10049274 A1 DE 10049274A1 DE 10049274 A DE10049274 A DE 10049274A DE 10049274 A DE10049274 A DE 10049274A DE 10049274 A1 DE10049274 A1 DE 10049274A1
- Authority
- DE
- Germany
- Prior art keywords
- particles
- cooling device
- heat
- substrate
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 5
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 239000002245 particle Substances 0.000 claims description 23
- 230000017525 heat dissipation Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 7
- 238000007788 roughening Methods 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 2
- 150000002736 metal compounds Chemical class 0.000 claims 1
- 239000010419 fine particle Substances 0.000 abstract 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0077—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for tempering, e.g. with cooling or heating circuits for temperature control of elements
- F28D2021/0078—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for tempering, e.g. with cooling or heating circuits for temperature control of elements in the form of cooling walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (12)
Definiertes Strukturieren eines Substrates gemäß Patent 100 41 829.5, dadurch gekennzeichnet,
daß auf die Oberfläche des Substrates Partikel oder eine schwammartig, poröse Schicht aufgebracht werden, die die Oberfläche aufrauhen und damit vergrößern.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/362,865 US7044212B1 (en) | 2000-08-25 | 2000-08-25 | Refrigeration device and a method for producing the same |
DE10049274A DE10049274B4 (de) | 2000-08-25 | 2000-09-28 | Kühlvorrichtung und Verfahren zu deren Herstellung |
PCT/EP2001/009089 WO2002017390A2 (de) | 2000-08-25 | 2001-08-07 | Kühleinrichtung und verfahren zu deren herstellung |
KR10-2003-7002768A KR20030024916A (ko) | 2000-08-25 | 2001-08-07 | 냉각장치와 그 제조방법 |
JP2002521358A JP2004518269A (ja) | 2000-08-25 | 2001-08-07 | 冷却装置及びその製造プロセス |
EP01971879A EP1354352A2 (de) | 2000-08-25 | 2001-08-07 | Kühleinrichtung und verfahren zu deren herstellung |
TW090120228A TW507520B (en) | 2000-08-25 | 2001-08-17 | Cooling device and method for its manufacture |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2000141829 DE10041829B4 (de) | 2000-08-25 | 2000-08-25 | Kühlvorrichtung |
DE10049274A DE10049274B4 (de) | 2000-08-25 | 2000-09-28 | Kühlvorrichtung und Verfahren zu deren Herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE10049274A1 true DE10049274A1 (de) | 2002-05-29 |
DE10049274B4 DE10049274B4 (de) | 2008-07-24 |
Family
ID=26006813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10049274A Expired - Fee Related DE10049274B4 (de) | 2000-08-25 | 2000-09-28 | Kühlvorrichtung und Verfahren zu deren Herstellung |
Country Status (7)
Country | Link |
---|---|
US (1) | US7044212B1 (de) |
EP (1) | EP1354352A2 (de) |
JP (1) | JP2004518269A (de) |
KR (1) | KR20030024916A (de) |
DE (1) | DE10049274B4 (de) |
TW (1) | TW507520B (de) |
WO (1) | WO2002017390A2 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10332162A1 (de) * | 2003-07-15 | 2005-02-03 | Access Materials&Processes | Latentwärmespeichersystem |
DE102004002990A1 (de) * | 2004-01-21 | 2005-08-18 | Robert Dr. Simmoteit | Material und Verfahren zum Stoffaustausch und Stofftransfer |
DE102006055755A1 (de) * | 2006-09-18 | 2008-04-10 | Fpe Fischer Gmbh | Staubgeschützte Computer, Elektronikgeräte und Elektroikkühler |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7044212B1 (en) | 2000-08-25 | 2006-05-16 | Net Nanofiltertechnik Gmbh | Refrigeration device and a method for producing the same |
GB2384618A (en) * | 2002-01-25 | 2003-07-30 | Denselight Semiconductors Pte | A structure for thermal management in an optoelectronic device. |
US20060105182A1 (en) * | 2004-11-16 | 2006-05-18 | Applied Materials, Inc. | Erosion resistant textured chamber surface |
US7135357B2 (en) | 2003-10-06 | 2006-11-14 | E. I. Du Pont De Nemours And Company | Process for making an organic electronic device having a roughened surface heat sink |
KR100712837B1 (ko) * | 2004-04-29 | 2007-05-02 | 엘지전자 주식회사 | 히트 싱크 및 그 표면처리방법 |
DE102004046790B3 (de) * | 2004-09-27 | 2006-06-14 | Kermi Gmbh | Fluid-Kühleinrichtung zur Kühlung wenigstens einer Verlustwärme erzeugender Komponente |
KR100619775B1 (ko) * | 2005-02-15 | 2006-09-11 | 엘지전자 주식회사 | 냉난방 동시형 멀티 에어컨 |
US7593230B2 (en) * | 2005-05-05 | 2009-09-22 | Sensys Medical, Inc. | Apparatus for absorbing and dissipating excess heat generated by a system |
DE102008005547B4 (de) * | 2008-01-23 | 2013-08-29 | Infineon Technologies Ag | Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul |
US8537548B2 (en) * | 2008-01-29 | 2013-09-17 | Intel Corporation | Method, apparatus and computer system for vortex generator enhanced cooling |
CN102067304B (zh) * | 2008-06-18 | 2013-01-09 | 布鲁萨电子公司 | 用于电子结构单元的冷却系统 |
US8860210B2 (en) | 2009-06-10 | 2014-10-14 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
TWI411389B (zh) * | 2010-05-18 | 2013-10-01 | Ckm Building Material Corp | 利用微孔板體散熱之方法 |
KR20120000282A (ko) * | 2010-06-25 | 2012-01-02 | 삼성전자주식회사 | 히트 스프레더 및 그를 포함하는 반도체 패키지 |
CN103162268A (zh) * | 2011-12-14 | 2013-06-19 | 欧司朗股份有限公司 | 散热装置和具有该散热装置的照明装置 |
TWI556375B (zh) * | 2013-05-21 | 2016-11-01 | 蔡承恩 | 複合式散熱片及其熱電裝置 |
CN104538836B (zh) * | 2014-12-31 | 2018-02-02 | 西安炬光科技股份有限公司 | 一种用于高功率半导体激光器的液体制冷片 |
US9612633B2 (en) | 2015-02-19 | 2017-04-04 | Compulab Ltd. | Passively cooled serviceable device |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE223570C (de) | ||||
DE7913126U1 (de) | 1979-05-07 | 1979-08-23 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Kuehlkoerper aus stranggepresstem aluminium fuer leistungshalbleiter |
DE8228451U1 (de) | 1982-10-09 | 1983-02-17 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Kühlblech |
DE8533265U1 (de) | 1985-11-26 | 1986-03-06 | Bicc-Vero Elektronics GmbH, 2800 Bremen | Frontplatte für Elektronik-Steckbaugruppen |
US4859805A (en) | 1987-09-19 | 1989-08-22 | Nippon Cmk Corp. | Printed wiring board |
US4962416A (en) * | 1988-04-18 | 1990-10-09 | International Business Machines Corporation | Electronic package with a device positioned above a substrate by suction force between the device and heat sink |
US5002123A (en) * | 1989-04-20 | 1991-03-26 | Microelectronics And Computer Technology Corporation | Low pressure high heat transfer fluid heat exchanger |
DE8908678U1 (de) | 1989-07-17 | 1990-11-15 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De | |
US5345107A (en) * | 1989-09-25 | 1994-09-06 | Hitachi, Ltd. | Cooling apparatus for electronic device |
US5018573A (en) * | 1989-12-18 | 1991-05-28 | Carrier Corporation | Method for manufacturing a high efficiency heat transfer surface and the surface so manufactured |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
US5455382A (en) * | 1991-10-31 | 1995-10-03 | Sumitomo Metal Industries, Ltd. | IC package heat sink fin |
US5285350A (en) * | 1992-08-28 | 1994-02-08 | Aavid Engineering, Inc. | Heat sink plate for multiple semi-conductors |
DE9214061U1 (de) | 1992-10-17 | 1992-12-24 | Ets Claude Kremer S.A.R.L., Vianden, Li | |
US5504378A (en) | 1994-06-10 | 1996-04-02 | Westinghouse Electric Corp. | Direct cooled switching module for electric vehicle propulsion system |
US5476818A (en) * | 1994-08-19 | 1995-12-19 | Motorola, Inc. | Semiconductor structure and method of manufacture |
US5506753A (en) | 1994-09-26 | 1996-04-09 | International Business Machines Corporation | Method and apparatus for a stress relieved electronic module |
DE4442023C2 (de) | 1994-11-25 | 1997-02-06 | Bosch Gmbh Robert | Siliziumkörper mit einem Durchbruch mit frei definierbarer Austrittsöffnung und Verfahren zu seiner Herstellung |
JP3269397B2 (ja) | 1995-09-19 | 2002-03-25 | 株式会社デンソー | プリント配線基板 |
DE19619060A1 (de) | 1996-05-13 | 1997-11-20 | Austerlitz Electronic Gmbh | Kühlkörper aus Metall für Elektronikmodule |
DE19626227C2 (de) | 1996-06-29 | 1998-07-02 | Bosch Gmbh Robert | Anordnung zur Wärmeableitung bei Chipmodulen auf Mehrschicht-Keramikträgern, insbesondere für Multichipmodule, und Verfahren zu ihrer Herstellung |
DE19641731C2 (de) | 1996-07-05 | 2001-09-27 | Ernst Messerschmid Inst Fuer R | Vorrichtung zur Kühlung von mindestens zwei Elektroden aufweisenden Lichtbogengeneratoren |
US5781411A (en) * | 1996-09-19 | 1998-07-14 | Gateway 2000, Inc. | Heat sink utilizing the chimney effect |
US5825087A (en) * | 1996-12-03 | 1998-10-20 | International Business Machines Corporation | Integral mesh flat plate cooling module |
US5896271A (en) * | 1997-07-21 | 1999-04-20 | Packard Hughes Interconnect Company | Integrated circuit with a chip on dot and a heat sink |
DE19744281A1 (de) | 1997-10-07 | 1999-06-02 | Fraunhofer Ges Forschung | Vorrichtung zum Kühlen von Halbleiterbauelementen und ihre Verwendung |
CA2238128A1 (en) | 1998-05-20 | 1999-11-20 | Hualon Microelectronics Corporation | 3-step etching for contact window |
US6478082B1 (en) * | 2000-05-22 | 2002-11-12 | Jia Hao Li | Heat dissipating apparatus with nest wind duct |
US7044212B1 (en) | 2000-08-25 | 2006-05-16 | Net Nanofiltertechnik Gmbh | Refrigeration device and a method for producing the same |
JP3841633B2 (ja) * | 2000-10-16 | 2006-11-01 | ヤマハ株式会社 | 半導体レーザモジュール |
-
2000
- 2000-08-25 US US10/362,865 patent/US7044212B1/en not_active Expired - Fee Related
- 2000-09-28 DE DE10049274A patent/DE10049274B4/de not_active Expired - Fee Related
-
2001
- 2001-08-07 WO PCT/EP2001/009089 patent/WO2002017390A2/de not_active Application Discontinuation
- 2001-08-07 KR KR10-2003-7002768A patent/KR20030024916A/ko not_active Application Discontinuation
- 2001-08-07 JP JP2002521358A patent/JP2004518269A/ja active Pending
- 2001-08-07 EP EP01971879A patent/EP1354352A2/de not_active Withdrawn
- 2001-08-17 TW TW090120228A patent/TW507520B/zh not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10332162A1 (de) * | 2003-07-15 | 2005-02-03 | Access Materials&Processes | Latentwärmespeichersystem |
DE102004002990A1 (de) * | 2004-01-21 | 2005-08-18 | Robert Dr. Simmoteit | Material und Verfahren zum Stoffaustausch und Stofftransfer |
DE102006055755A1 (de) * | 2006-09-18 | 2008-04-10 | Fpe Fischer Gmbh | Staubgeschützte Computer, Elektronikgeräte und Elektroikkühler |
DE102006055755B4 (de) * | 2006-09-18 | 2008-12-24 | Fpe Fischer Gmbh | Gehäuse für ein elektrisches Gerät und elektrisches Gerät damit |
Also Published As
Publication number | Publication date |
---|---|
TW507520B (en) | 2002-10-21 |
KR20030024916A (ko) | 2003-03-26 |
US7044212B1 (en) | 2006-05-16 |
JP2004518269A (ja) | 2004-06-17 |
DE10049274B4 (de) | 2008-07-24 |
WO2002017390A3 (de) | 2003-08-21 |
WO2002017390A2 (de) | 2002-02-28 |
EP1354352A2 (de) | 2003-10-22 |
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