CS237343B2 - Alloyed solder for direct soldering of contacting materials - Google Patents

Alloyed solder for direct soldering of contacting materials Download PDF

Info

Publication number
CS237343B2
CS237343B2 CS836940A CS694083A CS237343B2 CS 237343 B2 CS237343 B2 CS 237343B2 CS 836940 A CS836940 A CS 836940A CS 694083 A CS694083 A CS 694083A CS 237343 B2 CS237343 B2 CS 237343B2
Authority
CS
Czechoslovakia
Prior art keywords
silver
solder
alloy
materials
contact
Prior art date
Application number
CS836940A
Other languages
Czech (cs)
English (en)
Other versions
CS694083A2 (en
Inventor
Willi Malikowski
Roger Wolmer
Wolfgang Boehm
Original Assignee
Degussa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa filed Critical Degussa
Publication of CS694083A2 publication Critical patent/CS694083A2/cs
Publication of CS237343B2 publication Critical patent/CS237343B2/cs

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Contacts (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacture Of Switches (AREA)
  • Coating With Molten Metal (AREA)
CS836940A 1982-09-25 1983-09-23 Alloyed solder for direct soldering of contacting materials CS237343B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823235574 DE3235574A1 (de) 1982-09-25 1982-09-25 Lotlegierungen zum aufloeten von kontaktwerkstoffen

Publications (2)

Publication Number Publication Date
CS694083A2 CS694083A2 (en) 1984-06-18
CS237343B2 true CS237343B2 (en) 1985-07-16

Family

ID=6174166

Family Applications (1)

Application Number Title Priority Date Filing Date
CS836940A CS237343B2 (en) 1982-09-25 1983-09-23 Alloyed solder for direct soldering of contacting materials

Country Status (20)

Country Link
EP (1) EP0104500B1 (xx)
JP (1) JPS5961593A (xx)
AR (1) AR230653A1 (xx)
AT (1) ATE21058T1 (xx)
AU (1) AU553712B2 (xx)
BR (1) BR8305233A (xx)
CA (1) CA1218882A (xx)
CS (1) CS237343B2 (xx)
DE (2) DE3235574A1 (xx)
DK (1) DK157839C (xx)
ES (1) ES525601A0 (xx)
FI (1) FI74228C (xx)
HU (1) HU191638B (xx)
IN (1) IN161201B (xx)
MX (1) MX161617A (xx)
NO (1) NO157288C (xx)
PL (1) PL243877A1 (xx)
PT (1) PT77366B (xx)
YU (1) YU43322B (xx)
ZA (1) ZA836877B (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2050562B1 (es) * 1991-06-28 1994-12-16 Univ Madrid Complutense Procedimiento de union de aleaciones base cobre con efecto de memoria de forma mediante soldadura por difusion con intermediarios ductiles.
JP3034845B2 (ja) * 1997-07-18 2000-04-17 エンドレス ウント ハウザー フローテック アクチエンゲゼルシャフト 銀／銅／パラジウム硬ろうの使用及び複合装置の製造方法
US6168069B1 (en) 1997-07-18 2001-01-02 Endress +Hauser Flowtec Ag Method of brazing titanium to stainless steel
DE102004040779B4 (de) * 2004-08-23 2009-06-18 Abb Technology Ag Verwendung von Silberlegierungen als Hartlote
DE102004040778B4 (de) * 2004-08-23 2011-11-24 Umicore Ag & Co. Kg Silberhartlotlegierungen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1180224B (de) * 1959-09-21 1964-10-22 Ass Elect Ind Verfahren zum Loeten von Beryllium mit Hilfe einer Palladium-Silber-Kupfer-Legierungals Loetmittel
US3163500A (en) * 1962-08-03 1964-12-29 Engelhard Ind Inc Sandwich composite brazing alloy
DE2365450B2 (de) * 1973-09-06 1975-09-04 Fa. Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim Verfahren zur Herstellung eines Silber-Metalloxid-Werkstoffs für Kontakte
NZ188341A (en) * 1977-09-16 1980-05-08 Johnson Matthey Co Ltd Brazing composition:brazing alloy and thermoplastic materi
JPS57115997A (en) * 1981-01-09 1982-07-19 Mitsubishi Metal Corp Low melting point cu-ag alloy brazing filler metal of good wettability

Also Published As

Publication number Publication date
AU1952283A (en) 1984-03-29
BR8305233A (pt) 1984-05-02
AR230653A1 (es) 1984-05-31
DK157839C (da) 1990-07-23
FI74228C (fi) 1988-01-11
PT77366B (de) 1986-04-30
FI833298A0 (fi) 1983-09-15
NO157288B (no) 1987-11-16
ES8501276A1 (es) 1984-11-16
PT77366A (de) 1983-10-01
NO157288C (no) 1988-02-24
DK375483D0 (da) 1983-08-17
FI74228B (fi) 1987-09-30
DK157839B (da) 1990-02-26
ZA836877B (en) 1984-05-30
MX161617A (es) 1990-11-21
HU191638B (en) 1987-03-30
EP0104500A1 (de) 1984-04-04
EP0104500B1 (de) 1986-07-30
CA1218882A (en) 1987-03-10
CS694083A2 (en) 1984-06-18
NO832765L (no) 1984-03-26
DE3235574A1 (de) 1984-03-29
DE3364956D1 (en) 1986-09-04
YU159483A (en) 1986-02-28
IN161201B (xx) 1987-10-17
JPS5961593A (ja) 1984-04-07
YU43322B (en) 1989-06-30
ATE21058T1 (de) 1986-08-15
AU553712B2 (en) 1986-07-24
PL243877A1 (en) 1984-05-21
ES525601A0 (es) 1984-11-16
FI833298A (fi) 1984-03-26
DK375483A (da) 1984-03-26

Similar Documents

Publication Publication Date Title
KR102207301B1 (ko) 고신뢰성의 무연 납땜 합금
CN101687284B (zh) 接合体及其制造方法、以及功率半导体模块及其制造方法
JPH0145220B2 (xx)
US4456662A (en) Electrical contact piece
CN101198436A (zh) 氧化物接合用焊锡合金
KR20020080433A (ko) 구리와 스테인레스 강 사이에 접합부를 형성하는 방법
KR100328157B1 (ko) 카드뮴부재땜납용은합금
CS237343B2 (en) Alloyed solder for direct soldering of contacting materials
KR20020079898A (ko) 냉각부재 및 냉각부재의 제조방법
US3078562A (en) Method for attaching silver-cadmium oxide bodies to a supporting member
US4344794A (en) Solder alloy for the direct soldering of oxide containing silver catalyst on catalyst carrier
US5341981A (en) Use of a cadmium-free silver alloy as brazing solder (III)
EP3481576B1 (en) Use of an alloy as a brazing alloy for an electric switch braze joint, an electric switch braze joint, an electric switch and a method of producing an electric switch braze joint
JPH09234826A (ja) 金属−セラミックス複合基板及びその製造法
US3700420A (en) Ceramic-to-metal seal
US20220375819A1 (en) Copper/ceramic assembly and insulated circuit board
US4678636A (en) Ductile brazing alloy containing reactive metals and precious metals
KR850001485B1 (ko) 은계접점의 접합방법
JPS6022459B2 (ja) 接点材料を台材に固着する裏張り材
CA2124423A1 (en) Coated metal band as semi-finished goods for electrical contact pieces and method for the application of such contact pieces on a carrier
KR100366131B1 (ko) 드로스 발생이 적은 저융점 무연땜납
JPS6367722B2 (xx)
JPH01249669A (ja) セラミックス回路基板
CA2243762C (en) Alloy, in particular a solder alloy, method for joining workpieces by soldering using the solder alloy and use of the alloy for soldering
JP5722915B2 (ja) 電気接点材料およびその製造方法