YU159483A - Method of directly soldering semiproducts made of oxide-type contact materials onto contact carriers - Google Patents

Method of directly soldering semiproducts made of oxide-type contact materials onto contact carriers

Info

Publication number
YU159483A
YU159483A YU01594/83A YU159483A YU159483A YU 159483 A YU159483 A YU 159483A YU 01594/83 A YU01594/83 A YU 01594/83A YU 159483 A YU159483 A YU 159483A YU 159483 A YU159483 A YU 159483A
Authority
YU
Yugoslavia
Prior art keywords
semiproducts
oxide
materials onto
directly soldering
carriers
Prior art date
Application number
YU01594/83A
Other versions
YU43322B (en
Inventor
W Malikowski
R Wolmer
W Boehm
Original Assignee
Degussa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa filed Critical Degussa
Publication of YU159483A publication Critical patent/YU159483A/en
Publication of YU43322B publication Critical patent/YU43322B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Contacts (AREA)
  • Manufacture Of Switches (AREA)
  • Coating With Molten Metal (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
YU1594/83A 1982-09-25 1983-07-29 Method of directly soldering of semiproducts made of oxide-type silver contact materials onto contact carriers YU43322B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823235574 DE3235574A1 (en) 1982-09-25 1982-09-25 SOLDER ALLOYS FOR SOLDERING CONTACT MATERIALS

Publications (2)

Publication Number Publication Date
YU159483A true YU159483A (en) 1986-02-28
YU43322B YU43322B (en) 1989-06-30

Family

ID=6174166

Family Applications (1)

Application Number Title Priority Date Filing Date
YU1594/83A YU43322B (en) 1982-09-25 1983-07-29 Method of directly soldering of semiproducts made of oxide-type silver contact materials onto contact carriers

Country Status (20)

Country Link
EP (1) EP0104500B1 (en)
JP (1) JPS5961593A (en)
AR (1) AR230653A1 (en)
AT (1) ATE21058T1 (en)
AU (1) AU553712B2 (en)
BR (1) BR8305233A (en)
CA (1) CA1218882A (en)
CS (1) CS237343B2 (en)
DE (2) DE3235574A1 (en)
DK (1) DK157839C (en)
ES (1) ES8501276A1 (en)
FI (1) FI74228C (en)
HU (1) HU191638B (en)
IN (1) IN161201B (en)
MX (1) MX161617A (en)
NO (1) NO157288C (en)
PL (1) PL243877A1 (en)
PT (1) PT77366B (en)
YU (1) YU43322B (en)
ZA (1) ZA836877B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2050562B1 (en) * 1991-06-28 1994-12-16 Univ Madrid Complutense COPPER BASE ALLOY JOINING PROCEDURE WITH MEMORY EFFECT BY WELDING BY DIFFUSION WITH DUCTILE INTERMEDIARIES.
JP3034845B2 (en) * 1997-07-18 2000-04-17 エンドレス ウント ハウザー フローテック アクチエンゲゼルシャフト Use of silver / copper / palladium hard solder and method of manufacturing composite device
US6168069B1 (en) 1997-07-18 2001-01-02 Endress +Hauser Flowtec Ag Method of brazing titanium to stainless steel
DE102004040779B4 (en) * 2004-08-23 2009-06-18 Abb Technology Ag Use of silver alloys as brazing alloys
DE102004040778B4 (en) * 2004-08-23 2011-11-24 Umicore Ag & Co. Kg Silberhartlotlegierungen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1180224B (en) * 1959-09-21 1964-10-22 Ass Elect Ind Method of soldering beryllium with the aid of a palladium-silver-copper alloy as a soldering agent
US3163500A (en) * 1962-08-03 1964-12-29 Engelhard Ind Inc Sandwich composite brazing alloy
DE2365450B2 (en) * 1973-09-06 1975-09-04 Fa. Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim Solderable silver-metal oxide electrical contact composite - has backing layer of silver-copper alloy
NZ188341A (en) * 1977-09-16 1980-05-08 Johnson Matthey Co Ltd Brazing composition:brazing alloy and thermoplastic materi
JPS57115997A (en) * 1981-01-09 1982-07-19 Mitsubishi Metal Corp Low melting point cu-ag alloy brazing filler metal of good wettability

Also Published As

Publication number Publication date
FI74228C (en) 1988-01-11
NO832765L (en) 1984-03-26
DK375483D0 (en) 1983-08-17
MX161617A (en) 1990-11-21
NO157288B (en) 1987-11-16
JPS5961593A (en) 1984-04-07
FI833298A0 (en) 1983-09-15
DK157839C (en) 1990-07-23
CS694083A2 (en) 1984-06-18
AR230653A1 (en) 1984-05-31
EP0104500B1 (en) 1986-07-30
AU553712B2 (en) 1986-07-24
FI833298A (en) 1984-03-26
ES525601A0 (en) 1984-11-16
YU43322B (en) 1989-06-30
HU191638B (en) 1987-03-30
CA1218882A (en) 1987-03-10
FI74228B (en) 1987-09-30
DE3235574A1 (en) 1984-03-29
PL243877A1 (en) 1984-05-21
EP0104500A1 (en) 1984-04-04
AU1952283A (en) 1984-03-29
BR8305233A (en) 1984-05-02
IN161201B (en) 1987-10-17
ZA836877B (en) 1984-05-30
PT77366B (en) 1986-04-30
CS237343B2 (en) 1985-07-16
DE3364956D1 (en) 1986-09-04
NO157288C (en) 1988-02-24
ATE21058T1 (en) 1986-08-15
ES8501276A1 (en) 1984-11-16
DK375483A (en) 1984-03-26
PT77366A (en) 1983-10-01
DK157839B (en) 1990-02-26

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