CN2749079Y - 电连接器 - Google Patents

电连接器 Download PDF

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Publication number
CN2749079Y
CN2749079Y CNU2004201150474U CN200420115047U CN2749079Y CN 2749079 Y CN2749079 Y CN 2749079Y CN U2004201150474 U CNU2004201150474 U CN U2004201150474U CN 200420115047 U CN200420115047 U CN 200420115047U CN 2749079 Y CN2749079 Y CN 2749079Y
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circuit board
electric connector
insulating body
type terminal
insulation barrier
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约瑟夫·R·考桑斯盖
崇·H·易
托德·M·哈兰
艾瑞克·D·钟瑞特
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Hon Hai Precision Industry Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/735—Printed circuits including an angle between each other
    • H01R12/737—Printed circuits being substantially perpendicular to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
    • H01R13/518—Means for holding or embracing insulating body, e.g. casing, hoods for holding or embracing several coupling parts, e.g. frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

本实用新型公开一种电连接器，其包括具有若干平行槽道的绝缘本体、若干平行设置的电路板模组及与绝缘本体相扣持的遮蔽壳体。其中电路板模组固持于绝缘本体及遮蔽壳体之间，每一电路板模组包括绝缘挡板、收容于绝缘本体对应槽道中且设有安装部的电路板及设于对应槽道中且与印刷电路板机械及电性连接的压入式配合型端子，其中安装部设有若干圆形通孔，每一压入式配合型端子设有表面安装于安装部的接触部，压入式配合型端子接触部设有收容于圆形通孔中的凸起，该凸起与圆形通孔可靠固持，从而有利于压入式配合型端子的定位及电性连接。

Description

电连接器
【技术领域】
本实用新型涉及一种电连接器，尤指一种具有若干用于传输高速信号的电路板模组的电连接器。
【背景技术】
随着通讯与计算机技术的发展，需要用高密度电连接器于两个电子设备间构建若干信号传输路径。这种电连接器广泛应用于服务器、路由器等类似需高速数据处理及通信的电子设备的内部连接系统中。由于电子设备越来越趋向小型化，连接器本身尺寸的变小，通过该连接器的信号线路数量却增加了，导致了在连接器有限空间内信号数目的增加。随着信号线路的密度及信号传输速度的增加，电磁干扰及串音干扰问题越来越严重。
美国专利第6,171,115号及第6,267,604号揭示了一种设有若干电路板用以减小串音干扰的高速电连接器。该电连接器包括前绝缘部，前绝缘部设有一前壁及延伸贯穿前壁的若干平行缝隙；对接部，配接于前绝缘部并用以固持若干电路板，该对接部设有若干与缝隙相对应的狭槽及设于底壁且与缝隙相连通的开槽。每一电路板包括配接部及安装边，配接部超出前绝缘部的缝隙以与对接连接器相配接，安装边收容于对接部对应的开槽中。安装边设有通过焊接而固持于电路板上的导电端子，该导电端子延伸贯穿对接部的开槽以与电路基板电性连接。然而，该电连接器依然未有效解决电磁干扰这一不足，且导电端子与电路板非可靠固持，易产生导电端子自电路板脱离的情形。
美国专利第6,083,047号揭示了一种高速电连接器，该电连接器设有固持于绝缘本体内的若干端子组。每一端子组包括绝缘壳体及与绝缘壳体相配接的印刷电路板组合。该印刷电路板组合包括绝缘基板，该绝缘基板设有彼此垂直的配接边及安装边；若干线路路径，其分别自配接边延伸至安装边；若干插槽型端子，其焊接于配接边以与对接连接器配接；及若干压入式配合型端子，其焊接于安装边用以与电连接器所安装的电路板电性连接。每一压入式配合型端子设有一弹性端，该弹性端可通过弹性变形使压入式配合型端子插入印刷电路板对应的穿孔并通过弹性恢复使压入式配合型端子抵接于穿孔中，从而使电连接器可靠固持于印刷电路板。为了使压入式配合型端子可靠固持于穿孔中，通常需要高的插入力，这导致压入式配合型端子在插入过程中容易偏移或垮针，从而影响电连接器与印刷电路板的可靠定位及电性连接。
美国专利第5,980,321号揭示了一种采用遮蔽壳体来减小电磁干扰的高速电连接器，该电连接器包括若干彼此排列的芯片及固持芯片于适当位置的金属壳体。每一芯片包括遮蔽片及信号片两部分。为了固持芯片使其不旋转，在金属壳体及芯片之间设有三个卡扣点。此卡扣通过设在芯片上的凸起及设在金属壳体上的对应的狭槽来达成。然而，由于凸起必须与狭槽分别精确对应，因此将增加电连接器的制造及组装难度。此外，遮蔽片与信号片彼此间隔排列将减小有效的信号密度。
因此，有必要提供一种改进的电连接器，以克服现有技术的缺陷。
【实用新型内容】
本实用新型的目的在于提供一种电性能强、结构简单的高密度电连接器。
本实用新型的另一目的在于提供一种制造及组装简单的高密度电连接器。
为达成上述目的，本实用新型采用如下技术方案：电连接器包括具有若干平行槽道的绝缘本体、若干电路板模组及遮蔽壳体，电路板模组固持于绝缘本体及遮蔽壳体之间，每一电路板模组包括绝缘挡板、收容于绝缘本体对应槽道中且设有安装部的电路板及设置于对应槽道中且与电路板机械及电性连接的压入式配合型端子。
作为本实用新型的进一步改进，电路板的安装部收容于槽道中且表面设有可熔材料，该安装部设有若干圆形通孔。每一压入式配合型端子包括固持部、自固持部向上延伸并表面安装于安装部的接触部及自固持部向下延伸用以与印刷电路板电性连接的尾部。其中接触部设有收容于圆形通孔中的凸起。通过熔解可熔材料使凸起及通孔固持并电性连接。
与现有技术相比，本实用新型电连接器具有如下有益效果：遮蔽壳体遮盖于电路板且与绝缘本体可靠固持，从而达到良好的防电磁干扰效果。同时绝缘挡板可靠固持压入式配合型端子，压入式配合型端子的接触部上的凸起与电路板上圆形通孔可靠焊接，有利于压入式配合型端子的定位及电性连接。该电连接器结构简单、组装方便，降低了制造成本。
【附图说明】
图1为本实用新型电连接器的立体组合图。
图2为图1所示电连接器的侧视图。
图3为图1所示电连接器的立体分解图。
图4为沿图3所示圆圈A所取的局部放大图。
图5为本实用新型电连接器的电路板模组省略压入式配合型端子后的立体分解图。
图6为沿图2A-A方向的剖视图。
图7为沿图2B-B方向的剖视图。
图8为本实用新型电连接器所使用电路板的第一侧面的平面图。
图9为本实用新型电连接器所使用电路板的第二侧面的平面图。
图10为本实用新型电连接器所使用压入式配合型端子的立体图。
【具体实施方式】
请参阅图1、图2及图3所示，本实用新型电连接器100包括绝缘本体1、遮蔽壳体2、收容于绝缘本体1内的若干电路板模组3及插设于电路板模组3中的插销4。其中遮蔽壳体2充分包覆绝缘本体1及电路板模组3用以防止电磁干扰。
绝缘本体1包括矩形基体10、自基体10一端的底部向前延伸的舌板11、横向贯穿绝缘本体1的穿槽17及设于绝缘本体后端的若干穿孔16。基体10包括若干沿绝缘本体1纵向延伸的平行槽道13及若干与这些槽道13相连通并向下延伸贯穿基体10的通道14。舌板11设有若干与相应的槽道13对齐的开槽15。
遮蔽壳体2由一金属片冲压成型，其包括顶壁20及自顶壁20后边缘向下延伸的后壁22。顶壁20在靠近其前边缘处设有若干开口202。后壁22设有若干扣持片220及自扣持片220向下延伸的若干定位脚222。这些扣持片220固持于绝缘本体1内对应的缺口中(未图示)，定位脚222插设于电连接器100所安装的印刷电路板对应的穿孔中(未图示)用以将电连接器100准确安装于印刷电路板上。
电路板模组3以并排方式排列。在本实施例中，除了图3所示最左侧的电路板模组，其它的电路板模组结构相同。请参阅图5所示，最左侧电路板模组3包括绝缘挡板30、绝缘隔板32及收容于两者之间的电路板组合34。绝缘挡板30为一扁平片体，其包括设于第一侧面(未标号)用以收容电路板组合34的凹槽300、设于凹槽300内且水平延伸的定位柱303、设于绝缘挡板30顶缘的T形凸起304、自绝缘挡板30前端底缘向下延伸且设有一通孔307的片体306及自绝缘挡板30后端底缘向下延伸的定位脚308。
请参阅图3及图8，电路板组合34包括电路板36及与电路板36机械及电性连接的若干压入式配合型端子38。电路板36设有若干固持孔360，这些固持孔360用以收容绝缘挡板30上对应定位柱303，从而将电路板组合34与绝缘挡板30相固持。绝缘隔板32设有若干穿孔320，这些穿孔320同样用以收容绝缘挡板30上对应定位柱303，从而将电路板组合34夹持于绝缘挡板30及绝缘隔板32之间。
请参阅图3、图5及图8，其它每一电路板模组3与最左侧的电路板模组相似，差别在于：其它电路板模组3未设有绝缘隔板32且凹槽300设于绝缘挡板30的第二侧面(未标号)。每两个相邻的电路板模组3以并排的方式排列并通过一绝缘挡板30上的延伸柱309与邻近绝缘挡板30上的凹槽310的配合来固持相邻的电路板模组3。其中，每两个绝缘挡板30上设有一个T形凸起304。
电路板36设有延伸超出绝缘挡板30前边缘的配接部362及延伸超出绝缘挡板30下边缘的安装部364。电路板36包括绝缘基板(未标号)及设于绝缘基板上的信号线路370、接地线路372。该信号线路370及接地线路372用以提供从配接部362至安装部364的电性路径。每一电路板36设有一穿孔366及一前下缘365。其中穿孔366与绝缘本体1的穿槽17及绝缘挡板30的通孔307相对齐，前下缘365收容于绝缘本体1的开槽15内。
请参阅图5、6、7并结合参阅图3，电路板模组3组设于绝缘本体1中。其中，凸起304收容于对应的开口202中，定位脚308定位于穿孔16中，安装部364插设于槽道13中。压入式配合型端子38收容于绝缘本体1的通道14中并延伸超出绝缘本体1的底面用以插设于印刷电路板对应的穿孔中(未图示)。当电路板模组3组接于绝缘本体1后，插销4插入并贯穿绝缘本体1的穿槽17、绝缘挡板30的通孔307及电路板36的穿孔366中用以准确定位电路板36的配接部362。
图8及图9揭示了电路板36的两侧面。电路板36的第一侧面301上交替设置有信号线路370及接地线路372，第二侧面302上则只设有接地线路372。
每一电路板36的配接部362设有信号垫374及接地垫376。信号垫374与信号线路370电性连接，且只设在电路板36的第一侧面301上。接地垫376与接地线路372电性连接，且设置于电路板36的第一及第二侧面301、302上。接地线路372穿过导电孔379以建立设置于电路板36两侧面的接地垫376之间的电性连接。
信号线路370成对设置于电路板36的第一侧面301形成若干差分对。接地线路372设置于相邻两对差分对信号线路370之间。差分对信号线路370自相应的信号垫374延伸，其中信号垫374与内侧缘375临近。差分对信号线路370布置紧密以在相邻两对差分对之间留有足够大的空间，从而减弱相邻差分对之间的串音干扰。最下面的差分对在第二侧面302设有线路39以减少长度并简化线路路径。
请参阅图3及图4所示，在本实用新型电连接器100中，压入式配合型端子38通过表面安装技术固持于电路板36上的安装部364。下文将对此作详细说明。
请参阅图10并结合图7所示，每一压入式配合型端子38包括一干涉固持于绝缘本体1的通道14中的固持部380、自固持部380向上延伸并与电路板36的安装部364表面焊接的接触部382及自固持部380向下延伸以与印刷电路板(未图示)电性连接的压入型尾部384。接触部382定位于固持部380的一侧且设有向固持部380相对另一侧延伸的凸起383。
请参阅图8、图9及图10所示，电路板36的安装部364设有收容压入式配合型端子38的凸起383的上排圆形通孔377及设于安装部364底缘用以收容压入式配合型端子38固持部380顶端的半圆孔378。
图4揭示了压入式配合型端子38焊接于电路板36的安装部364上的情形。安装部364的第一侧面301设有与对应信号线路370及接地线路372电性连接的焊接材料35。压入式配合型端子38设置于焊接材料35上，凸起383收容于圆形通孔377中，固持部380顶端收容于半圆孔378中。焊接材料35熔化后，其填充于凸起383与对应的圆形通孔377之间及固持部380与对应的半圆孔378之间。当焊接材料35冷却凝固后，压入式配合型端子38与电路板36的安装部364可靠固持。由于借助圆形通孔377及半圆孔378这种方式使电路板36及压入式配合型端子38之间达到可靠焊接，从而使电路板36可抵挡压入式配合型端子38的高插入力。

Claims (10)

1.一种电连接器，其包括具有若干平行槽道的绝缘本体、若干电路板模组及遮蔽壳体，电路板模组固持于绝缘本体及遮蔽壳体之间，每一电路板模组包括绝缘挡板、收容于绝缘本体对应槽道中且设有安装部的电路板及设置于对应槽道中且与电路板机械及电性连接的压入式配合型端子，每一压入式配合型端子包括固持部、自固持部向上延伸并表面安装于电路板安装部的接触部，其特征在于：该电路板安装部设有若干圆形通孔，压入式配合型端子接触部设有收容于圆形通孔中的凸起。
2.如权利要求1所述的电连接器，其特征在于：所述遮蔽壳体包括一设有若干开口的顶壁，绝缘挡板包括收容于开口中用以固持上述电路板模组的若干凸起。
3.如权利要求2所述的电连接器，其特征在于：所述遮蔽壳体设有一后壁，该后壁设有若干扣持片及自扣持片向下延伸的若干定位脚。
4.如权利要求3所述的电连接器，其特征在于：所述绝缘本体设有与前述槽道对应且贯穿绝缘本体的通道，压入式配合型端子焊接于对应电路板上，其尾部贯穿通道并延伸至通道下方。
5.如权利要求1所述的电连接器，其特征在于：所述电连接器进一步包括一插销，所述电路板设有一穿孔，所述绝缘挡板设有与电路板穿孔对齐的通孔，插销贯穿绝缘本体、电路板的穿孔及绝缘挡板的通孔中。
6.如权利要求1所述的电连接器，其特征在于：所述每两相邻的电路板模组通过设于绝缘挡板上的延伸柱与设于相邻绝缘挡板上凹槽的配合实现并排排列。
7.如权利要求1所述的电连接器，其特征在于：所述电路板模组的绝缘挡板设有一凹槽及若干组设于凹槽中并水平延伸的定位柱。
8.如权利要求1所述的电连接器，其特征在于：所述绝缘本体于其一端的底部设有向前延伸的舌板，舌板设有与对应槽道相对的开槽，电路板设有配接部，该配接部前下缘收容于对应的开槽中。
9.如权利要求1所述的电连接器，其特征在于：所述电路板的安装部表面涂有可熔材料。
10.如权利要求1所述的电连接器，其特征在于：所述电路板的安装部于其底缘设有半圆孔，压入式配合型端子固持部的顶端收容于该半圆孔中。
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