CN2328099Y - Direct welded flat plastic sealed diode - Google Patents
Direct welded flat plastic sealed diode Download PDFInfo
- Publication number
- CN2328099Y CN2328099Y CN97247851U CN97247851U CN2328099Y CN 2328099 Y CN2328099 Y CN 2328099Y CN 97247851 U CN97247851 U CN 97247851U CN 97247851 U CN97247851 U CN 97247851U CN 2328099 Y CN2328099 Y CN 2328099Y
- Authority
- CN
- China
- Prior art keywords
- terminal pin
- diode
- pancake
- weld tabs
- soldering lug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to a direct welded flat plastic sealed diode, which is suitable for rectifying, voltage stabilizing and voltage reducing and is widely used in the rectifying voltage stabilizing, clamping and other circuits in electronic and electric appliances. The utility model is composed of a terminal pin soldering lug, a unilateral conductive chip and a plastic sealing housing. The utility model is characterized in that the upper part of the unilateral conductive chip on a terminal pin rack point is provided with an upper soldering lug, and the lower part of the unilateral conductive chip is provided with a lower soldering lug, a terminal pin is arranged on the upper part of the upper soldering lug, and the other terminal pin is arranged at the lower part of the lower soldering lug. The configuration of the diode is flat, the terminal pin is flat, the top end is a sharp angle, and one end of the diode housing is provided with a mark.
Description
The utility model relates to and a kind ofly be applicable to rectification, voltage stabilizing, step-down with directly welded pancake plastic package diode, be widely used in the circuit such as rectifying and voltage-stabilizing, clamper of electronics, electric equipment products.
Traditional diode adopts the garden columnar leads, the order lead-in wire is longer, usually run into many troubles aborning, such as electroplate, in the cleaning process because of the long flexible distortion that goes between, alignment process together must increase goes between, and can make originally with regard to the thin easy oxidation of coating because of lead-in wire coating is worn in the lead-in wire alignment, cause the difficult rosin joint of welding, simultaneously long because of going between, plug-in unit inconvenience influences work efficiency, and secondary is cut pin influences Joint Strength, cause electronic circuit to produce unnecessary fault, influence the time between failures of electronic product.
The purpose of this utility model is to have weak point at conventional diode, and a kind of directly welded pancake plastic package diode is provided, and its profile is a pancake, and the terminal pin punch forming is platypelloid type, does not need secondary to cut pin, little, the easy installation of volume, easy to use.
Directly welded pancake plastic package diode takes following mode to realize: its structure is made of right terminal pin, last weld tabs, unilateal conduction chip (abbreviating chip as), following weld tabs, left terminal pin, plastic packaging shell, it is characterized in that unilateal conduction chip top, the terminal pin place of shelving is provided with weld tabs, unilateal conduction chip bottom is provided with down weld tabs, one terminal pin is arranged on weld tabs top, and another terminal pin is arranged on down the weld tabs bottom.Terminal pin is shelved place's weld tabs, unilateal conduction chip, the once sintered moulding of terminal pin, makes it constitute the unilateal conduction path, and the injection moulding encapsulation forms the plastic packaging shell.The diode profile is a pancake, and terminal pin adopts punch forming to be pancake, has spill or half garden shape, triangular marker in the matched moulds place up and down at diode case one end, represents diode polarity.
The utility model has the advantages that and adopt cold stamping shaped pancake terminal pin, the material of its terminal pin shortens to traditional diode about 1/4, does not need secondary to cut pin, and installs easily, and is easy to use.This diode volume is little, stable work in work in light weight, owing to adopt the pancake terminal pin, terminal pin and weld tabs, chip are shelved conveniently, the anti-damage intensity height of the disposable sinter molding that can superpose (stack welding procedure) diode, saved many technological processes, reduced production cost, be particularly suitable for automated production in enormous quantities, large-scale.
The utility model is described in further detail below with reference to accompanying drawing.
Fig. 1 is a directly welded pancake plastic package diode schematic diagram.
Fig. 2 is a directly welded pancake plastic package diode structural representation.
With reference to accompanying drawing, directly welded pancake plastic package diode structure is made of right terminal pin (1), last weld tabs (2), unilateal conduction chip (3), following weld tabs (4), left terminal pin (5), plastic packaging shell (6).The two terminal pin place of shelving unilateal conduction chip (3) tops are provided with that weld tabs (2), unilateal conduction chip (3) bottom are provided with down weld tabs (4), right terminal pin (1) is arranged on weld tabs top, and left terminal pin (5) is arranged on down weld tabs (4) bottom.Unilateal conduction chip and weld tabs, terminal pin are by disposable sinter molding, and the injection molding material encapsulation, constitute protectiveness plastic packaging shell (6).The diode profile is a pancake, and the matched moulds place has spill mark (7) or has half garden shape, triangular marker, representative diode cathode up and down in the diode case left side, and the other end then is a negative pole.Left and right sides terminal pin is the cold stamping shaped pancake that is, and the top of its terminal pin is pointed shape (8).
Claims (5)
1, a kind of directly welded pancake plastic package diode, constitute by terminal pin weld tabs, unilateal conduction chip, plastic packaging shell, it is characterized in that unilateal conduction chip top, the terminal pin place of shelving is provided with weld tabs, unilateal conduction chip bottom is provided with down weld tabs, a terminal pin is arranged on weld tabs top, and another terminal pin is arranged on down the weld tabs bottom.
2, directly welded pancake plastic package diode according to claim 1 is characterized in that the diode profile is a pancake.
3, directly welded pancake plastic package diode according to claim 1 is characterized in that terminal pin is pancake.
4, according to claim 1,3 described directly welded pancake plastic package diodes, the top that it is characterized in that terminal pin is a pointed shape.
5, directly welded pancake plastic package diode according to claim 1 is characterized in that diode case one end has mark.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97247851U CN2328099Y (en) | 1997-11-27 | 1997-11-27 | Direct welded flat plastic sealed diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97247851U CN2328099Y (en) | 1997-11-27 | 1997-11-27 | Direct welded flat plastic sealed diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2328099Y true CN2328099Y (en) | 1999-07-07 |
Family
ID=33955228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97247851U Expired - Fee Related CN2328099Y (en) | 1997-11-27 | 1997-11-27 | Direct welded flat plastic sealed diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2328099Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007056890A1 (en) * | 2005-11-16 | 2007-05-24 | Tak Cheong Electronics (Shanwei) Co., Ltd. | Surface mounting plastic packaging diode and manufacture method of the same |
| CN101459160B (en) * | 2007-12-13 | 2011-07-13 | 沈阳兴华航空电器有限责任公司 | Diode needle contact member for voltage stabilization |
| CN102263094A (en) * | 2011-08-14 | 2011-11-30 | 绍兴旭昌科技企业有限公司 | Non-interconnected multi-chip package diode |
-
1997
- 1997-11-27 CN CN97247851U patent/CN2328099Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007056890A1 (en) * | 2005-11-16 | 2007-05-24 | Tak Cheong Electronics (Shanwei) Co., Ltd. | Surface mounting plastic packaging diode and manufacture method of the same |
| CN101459160B (en) * | 2007-12-13 | 2011-07-13 | 沈阳兴华航空电器有限责任公司 | Diode needle contact member for voltage stabilization |
| CN102263094A (en) * | 2011-08-14 | 2011-11-30 | 绍兴旭昌科技企业有限公司 | Non-interconnected multi-chip package diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |