CN2370569Y - Diode - Google Patents
Diode Download PDFInfo
- Publication number
- CN2370569Y CN2370569Y CN99208170U CN99208170U CN2370569Y CN 2370569 Y CN2370569 Y CN 2370569Y CN 99208170 U CN99208170 U CN 99208170U CN 99208170 U CN99208170 U CN 99208170U CN 2370569 Y CN2370569 Y CN 2370569Y
- Authority
- CN
- China
- Prior art keywords
- diode
- welding body
- encapsulating material
- brilliant unit
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model relates to a diode, which is composed of conducting wire posts (1), a crystal element (2), a welding body (3), packaged material (4), etc., wherein, one end of each conducting wire post (1) is provided with a vertical and flat connecting plate (11); the other end part extends a flat part (12) towards intermediate section; the connecting plate (11) of the two conducting wire posts (1) is stuck at both poles of the crystal element of the diode, and is combined with the welding body (3); then the conducting wire posts (1), the crystal element, the sealing body (3), etc. are sealed by the packaged material (4); two flat parts (12) are made to extend outwards from both sides of the packaged material (4). When used, two flat parts (12) can be directly stuck and welded on a copper foil of a circuit board.
Description
The utility model relates to the electric elements class, particularly a kind of diode.
General common diode structure, as shown in Figure 1, wherein a vertical flat engagement plate (61) is made in an end of two wire columns (6), and by welding two utmost points that body (3) is welded in two engagement plates (61) the brilliant unit of diode (2), at last again with encapsulating material (4) with crystalline substance unit (2), welding body (3) and engagement plate positions such as (61) are sealed to a cylinder, two wire columns (6) are stretched out in encapsulating material (4) two ends, become a complete diode product, and with suitably bending of two wire columns (6), can insert and give the position, hole of establishing and in addition solid welding on the circuit board, yet along with the continuous progress of science and technology, the electrification product moves towards sophistication gradually, downsizing, because circuit board lamination number constantly increases, the planning of circuit board is complicated gradually, therefore again, reduce the setting of part jack on the present circuit board gradually, with the planning of effective simplification circuit board, so the shortcoming that exists of the diode shown in the accompanying drawing 1, be difficult to meet and modernly use than the precision circuit plate; Diode structure as shown in Figure 2 again, two lead frames (7) are made has several flat outstanding guide cards (71), be provided with bending convergence part (72) in guide card (71) end, two lead frames (71) are reverse relatively, make bending convergence part (72) be divided into two utmost points of the brilliant unit of diode (2), by welding body (3) solder bond in addition, again with encapsulating material (4) with crystalline substance unit (2), welding body (3) and bending positions such as (72), convergence part are sealed to a square body, two flat guide cards (71) are stretched out in encapsulating material (4) two ends, directly paste during use and be welded on the copper foil of circuit board from bi-conductive plate (71), though the diode of this kind structure can satisfy the use that modern more accurate multilayer circuit board is avoided unnecessary boring, but its lead frame (7) all gets punching press and makes, not only need the investment of the precise punching die and the pressing equipment of both expensive, and complex process, waste material is many, uneconomical.
The purpose of this utility model is exactly the shortcoming at the structure existence of above-mentioned two kinds of diodes, promptly do not meet and modern use and invest height, complex process, uneconomical etc. than the precision circuit plate, a kind of diode is provided, make it directly to paste to be welded on the circuit board Copper Foil to use, and have manufacturing process simple, save equipment investment, reduce waste material, advantage such as increase economic efficiency.
The technical solution of the utility model:
According to the purpose of this utility model, a kind of diode is provided, and wherein the end at wire column is provided with vertical flat engagement plate, to be connected in the brilliant unit of diode, the other end of wire column then is provided with a plat part, make this wire column and brilliant unit after encapsulation finishes, form two ends and outwards protrude out, can directly paste to be welded on the circuit board Copper Foil and use with plat part, it is simple to reach its manufacturing process, do not need expensive diel and equipment investment, and waste material is few in producing, thereby increases economic efficiency.
Accompanying drawings structure of the present utility model and embodiment:
Fig. 1, Fig. 2 are the structural representation of common diode.
Fig. 3 is a perspective exploded view of the present utility model.
Fig. 4 is a three-dimensional combination schematic diagram of the present utility model.
Fig. 5 is another embodiment perspective exploded view of the present utility model.
Fig. 6 is the three-dimensional combination of another an embodiment of the present utility model schematic diagram.
(1), (5), (6) are that wire column, (4) are welding body for brilliant unit, (71) for guide card, (3) for lead frame, (2) for plat part, (7) for bending convergence part, (12), (52) for engagement plate, (51), (72) for encapsulating material, (11), (61).
Shown in accompanying drawing 3 and accompanying drawing 4, the utility model is by wire column (1), brilliant unit (2), welding body (3) and encapsulating material compositions such as (4), wherein an end of wire column (1) is provided with a vertical flat engagement plate (11), the other end then extends a plat part (12) to the stage casing, the engagement plate (11) of two wire columns (1) is fitted in two utmost points of the brilliant unit of diode (2), and with in addition combination of welding body (3), at last again with encapsulating material (4) with two wire columns (1), brilliant unit (2) and welding body positions such as (3) are sealed, two plat parts (12) are stretched in encapsulating material (4) two epitaxial lateral overgrowths, during use, can directly be welded on the circuit board Copper Foil with two plat parts (12) subsides.
Shown in accompanying drawing 5 and accompanying drawing 6, be another embodiment of the present utility model, wire column (5) is made by the stage casing and is extended straight plat part (52) to a side, this plat part (52) end is provided with stepped bending convergence part (51), be connected in two utmost points of the brilliant unit of diode (2) via welding body (3) with this two bending convergence part (51), and sealed with encapsulating material (4), make two plat parts (52) stretch in encapsulating material (4) two epitaxial lateral overgrowths, at last unnecessary wire column (5) is cut off removal, also can directly paste to be welded on the circuit board Copper Foil and use with two plat parts (52).
The utility model is simple in structure, and is easy to make, can reduce production costs, and production waste reduces, thereby increases economic efficiency.
Claims (2)
1, a kind of diode, it is made up of wire column (1), brilliant unit (2), welding body (3) and encapsulating material (4) etc., an end that it is characterized in that wire column (1) is provided with a vertical flat engagement plate (11), the other end then extends a plat part (12) to the stage casing, the engagement plate (11) of two wire columns (1) is fitted in two utmost points of the brilliant unit of diode (2), and, with encapsulating material (4) two wire columns (1), brilliant unit (2) and welding body positions such as (3) are sealed again with in addition combination of welding body (3).
2, according to the described a kind of diode of claim 1, it is characterized in that a side of said wire column (5) can be made into the plat part (52) of extension, the end of this plat part (52) is provided with stepped bending convergence part (51), be connected in two utmost points of the brilliant unit of diode (2) via welding body (3) with this two bending convergence part (51), and sealed with encapsulating material (4), make two plat parts (52) stretch, more unnecessary wire column (5) is cut off removal in encapsulating material (4) two epitaxial lateral overgrowths.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99208170U CN2370569Y (en) | 1999-04-06 | 1999-04-06 | Diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99208170U CN2370569Y (en) | 1999-04-06 | 1999-04-06 | Diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2370569Y true CN2370569Y (en) | 2000-03-22 |
Family
ID=34002004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99208170U Expired - Lifetime CN2370569Y (en) | 1999-04-06 | 1999-04-06 | Diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2370569Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100424847C (en) * | 2006-05-11 | 2008-10-08 | 林茂昌 | Method for preparing transistor and combined improved structure obtained thereby |
| CN101944544A (en) * | 2009-07-03 | 2011-01-12 | 泰科电子Amp有限责任公司 | Be used to connect terminal box, electric diode, guide element and the permanent plant of solar cell |
| WO2023010645A1 (en) * | 2021-08-02 | 2023-02-09 | 江苏泽润新材料有限公司 | Axial diode junction box and manufacturing method therefor |
-
1999
- 1999-04-06 CN CN99208170U patent/CN2370569Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100424847C (en) * | 2006-05-11 | 2008-10-08 | 林茂昌 | Method for preparing transistor and combined improved structure obtained thereby |
| CN101944544A (en) * | 2009-07-03 | 2011-01-12 | 泰科电子Amp有限责任公司 | Be used to connect terminal box, electric diode, guide element and the permanent plant of solar cell |
| WO2023010645A1 (en) * | 2021-08-02 | 2023-02-09 | 江苏泽润新材料有限公司 | Axial diode junction box and manufacturing method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |