CN201117652Y - Diode - Google Patents
Diode Download PDFInfo
- Publication number
- CN201117652Y CN201117652Y CNU2007200723773U CN200720072377U CN201117652Y CN 201117652 Y CN201117652 Y CN 201117652Y CN U2007200723773 U CNU2007200723773 U CN U2007200723773U CN 200720072377 U CN200720072377 U CN 200720072377U CN 201117652 Y CN201117652 Y CN 201117652Y
- Authority
- CN
- China
- Prior art keywords
- diode
- engagement plate
- wire
- plat part
- encapsulating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Abstract
A diode consists of two wire columns, a diode wafer, a welded body and package material. Each wire column includes a flat adaptor board at one end and a flat part connected with one side of the adaptor board. The other sides of the adaptor board of the two wire columns are respectively attached to the two poles of the diode wafer by the welded body. The package material seals one part of the flat part of the two wire columns, the diode wafer and the welded body. The wire column of the utility model is directly made of the wire of column shape. The flat part extending outwards can be welded on a circuit copper foil directly. The utility model has the advantages of simple manufacture technology, no need of expensive die and equipment investment, less waste material in the production and improved economical effect.
Description
Technical field
The utility model relates to the electric elements technical field, particularly a kind of diode.
Background technology
General common diode structure, as shown in Figure 1, wherein a vertical flat engagement plate (61) is made in an end of two wire columns (6), and nationality is welded in two engagement plates (61) by welding body (3) two utmost points of the brilliant unit of diode (2), at last again with encapsulating material (4) with crystalline substance unit (2), welding body (3) and engagement plate positions such as (61) are sealed to a cylinder, two wire columns (6) are stretched out in encapsulating material (4) two ends, become a complete diode product, and with suitably bending of two wire columns (6), can insert and give the position, hole of establishing and in addition solid welding on the circuit board, yet along with the continuous progress of science and technology, the electrification product moves towards sophistication gradually, downsizing, because circuit board lamination number constantly increases, the planning of circuit board is complicated gradually, therefore again, reduce the setting of part jack on the present circuit board gradually, with the planning of effective simplification circuit board, so the shortcoming that exists of the diode of accompanying drawing 1, be difficult to meet and modernly use than the precision circuit plate.Diode structure as shown in Figures 2 and 3 again, two lead frames (7) are made has several flat outstanding guide cards (71), reverse relatively in guide card (71), make bending convergence part (72) be divided into two utmost points of the brilliant unit of diode (2), nationality is by welding body (3) solder bond in addition, with encapsulating material (4) crystalline substance unit (2), welding body (3) and bending positions such as (72), convergence part are sealed to a square body again, two flat guide cards (71) are stretched out in encapsulating material (4) two ends.Directly paste during use and be welded on the copper foil of circuit board from bi-conductive plate (71), though the diode of this kind structure can satisfy the use that modern more accurate multilayer circuit board is avoided unnecessary boring, but its lead frame (7) all must be stamped to form, not only need the investment of the precise punching die and the pressing equipment of both expensive, and complex process, waste material are many, uneconomical.Again as shown in Figure 4 and Figure 5, wherein a vertical flat engagement plate (61) is made in an end of two wire columns (6), and nationality is welded in two engagement plates (61) by welding body (3) two utmost points of the brilliant unit of diode (2), with encapsulating material (4) crystalline substance unit (2), welding body (3) and engagement plate positions such as (61) are sealed to a square body more at last, two wire columns (6) are stretched out in encapsulating material (4) two ends, become a complete diode product, and two wire columns (6) are extended the position outward make two flat guide cards (71), suitably bending then.Directly paste during use and be welded on the copper foil of circuit board from bi-conductive plate (71).Though the diode of this kind structure can satisfy the use that modern more accurate multilayer circuit board is avoided unnecessary boring, but its two flat guide card (71) is made after encapsulation, therefore in its preparation process, damage encapsulating material (4) easily, make the quality of diode descend.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of diode, makes it directly to paste to be welded on the circuit board Copper Foil to use.This diode can solve the shortcoming of the structure existence of above-mentioned three kinds of diodes, promptly do not meet modern than the precision circuit plate use and invest height, complex process, uneconomical, have a hidden danger of quality etc., and it is simple to have manufacturing process, save equipment investment, reduce waste material, advantage such as increase economic efficiency.
Technical problem to be solved in the utility model can be achieved through the following technical solutions:
A kind of diode, form by two wire columns, the brilliant unit of diode, welding body and encapsulating material, described each wire column comprises a flat engagement plate and the plat part that is connected with described engagement plate one side that is positioned at an end, and the opposite side of the engagement plate of two wire columns fits in two utmost points of the brilliant unit of diode separately by the welding body; Described encapsulating material is sealed the brilliant unit of a plat part part, diode and the welding body region of two wire columns.
In the utility model, described plat part becomes kink to the bending of encapsulating material direction from the encapsulating material position that stretches out.
In the utility model, described engagement plate is vertical mutually with described plat part.
Described engagement plate is the disk shape, and the width dimensions of described plat part is greater than the external diameter of engagement plate, and the gauge of plat part is less than the external diameter of engagement plate.
Described plat part and described engagement plate pass through arc transition.
Wire column of the present utility model is directly made with the cylinder wire body, and outward extending plat part can directly paste
Be welded on the circuit Copper Foil and use, it is simple to reach its manufacturing process, does not need expensive diel and equipment investment,
And waste material is few in producing, thereby increase economic efficiency.
Description of drawings
Fig. 1 is a kind of structural representation of common diode.
Fig. 2 is the structural representation of another kind of common diode.
Fig. 3 is the enlarged diagram at Fig. 2 I place.
Fig. 4 is the structural representation of another common diode.
Fig. 5 is the half-finished structural representation of preceding working procedure of common diode shown in Figure 4.
Fig. 6 is the connection schematic perspective view of embodiment wire column of the present utility model, welding body, the brilliant unit of diode.
Fig. 7 is the combination schematic diagram of embodiment diode of the present utility model.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
As shown in Figure 6 and Figure 7, diode of the present utility model, form by two wire columns 1, the brilliant unit 2 of diode, welding body 3 and encapsulating material 4 etc., wherein each wire column 1 comprises that an opposite side that is positioned at the flat engagement plate 11 of an end and the engagement plate 11 of plat part 12, two wire columns 1 that are connected with engagement plate 11 1 sides fits in two utmost points of the brilliant unit 2 of diode separately by welding body 3; Encapsulating material 4 is sealed the brilliant unit 2 of a plat part part, diode and welding body 3 positions of two wire columns 1.Two plat parts 12 become kink 121 to the bending of encapsulating material direction from encapsulating material 4 position that stretches out.This kink 121 pastes and is welded on the circuit board Copper Foil.
As can be seen from Figure 6, engagement plate 11 is the disk shape, and is vertical mutually with plat part 12.The width dimensions of plat part 12 is greater than the external diameter of engagement plate 11, and the gauge of plat part 12 is less than the external diameter of engagement plate 11.Plat part 12 passes through arc transition with engagement plate 11.
Wire column 1 of the present utility model adopts and flattens, bending, and not only production process is simple, the product percent of pass height.Concrete method is: 1, an end of column type lead is flattened respectively; 2, the part round end that will flatten bends to the face vertical with lead, forms engagement plate 11, and this engagement plate 11 constitutes the polar body of diode; 3, on the face of above-mentioned engagement plate 11, stick scolder; 4, utilize special carbon graphite weld mold to weld; 5, adopting encapsulating material to encapsulate gets final product.
More than show and described basic principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that describes in the foregoing description and the specification just illustrates principle of the present utility model; the utility model also has various changes and modifications under the prerequisite that does not break away from the utility model spirit and scope, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (6)
1. diode, form by two wire columns, the brilliant unit of diode, welding body and encapsulating material, it is characterized in that, described each wire column comprises a flat engagement plate and the plat part that is connected with described engagement plate one side that is positioned at an end, and the opposite side of the engagement plate of two wire columns fits in two utmost points of the brilliant unit of diode separately by the welding body; Described encapsulating material is sealed the brilliant unit of a plat part part, diode and the welding body region of two wire columns.
2. diode according to claim 1 is characterized in that, described plat part becomes kink to the bending of encapsulating material direction from the encapsulating material position that stretches out.
3. diode according to claim 1 is characterized in that, described engagement plate is vertical mutually with described plat part.
4. diode according to claim 1 is characterized in that, described engagement plate is the disk shape.
5. diode according to claim 4 is characterized in that, the width dimensions of described plat part is greater than the external diameter of engagement plate, and the gauge of plat part is less than the external diameter of engagement plate.
6. diode according to claim 4 is characterized in that, described plat part and described engagement plate pass through arc transition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200723773U CN201117652Y (en) | 2007-07-11 | 2007-07-11 | Diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200723773U CN201117652Y (en) | 2007-07-11 | 2007-07-11 | Diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201117652Y true CN201117652Y (en) | 2008-09-17 |
Family
ID=39992234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200723773U Expired - Lifetime CN201117652Y (en) | 2007-07-11 | 2007-07-11 | Diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201117652Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820233A (en) * | 2012-08-28 | 2012-12-12 | 绍兴文理学院 | Surface-mounted power diode packaging technology |
-
2007
- 2007-07-11 CN CNU2007200723773U patent/CN201117652Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820233A (en) * | 2012-08-28 | 2012-12-12 | 绍兴文理学院 | Surface-mounted power diode packaging technology |
| CN102820233B (en) * | 2012-08-28 | 2015-07-29 | 绍兴文理学院 | A kind of slice power diode package technique |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI JINKE SEMICONDUCTOR + EQUIPMENT CO., LTD. Free format text: FORMER OWNER: LIN MAOCHANG Effective date: 20110705 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 200052 NO. 280, YANGGUANG GARDEN, CHANGXI ROAD, XINQIAO TOWN, SONGJIANG DISTRICT, SHANGHAI TO: 201108 NO. 135 (AREA B, BUILDING 1), LANE 1421, ZHUANXING ROAD, MINHANG DISTRICT, SHANGHAI |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110705 Address after: 201108 Shanghai city Minhang District Zhuan Hing Road 1421 Lane 135 (1 B) Patentee after: Shanghai Jinke Semiconductor & Equipment Co.,Ltd. Address before: 200052, sunshine garden, 280 West Road, Xinqiao Town, Shanghai, Songjiang District Patentee before: Lin Maochang |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080917 |