CN220856535U

CN220856535U - Wafer pre-alignment device

Info

Publication number: CN220856535U
Application number: CN202322196861.9U
Authority: CN
Inventors: 杨涧; 王通; 吕瑞卿
Original assignee: SiEn Qingdao Integrated Circuits Co Ltd
Current assignee: SiEn Qingdao Integrated Circuits Co Ltd
Priority date: 2023-08-15
Filing date: 2023-08-15
Publication date: 2024-04-26
Anticipated expiration: 2033-08-15

Abstract

The utility model provides a wafer prealignment device, which comprises a wafer rotating base, a bracket provided with a fixed frame and a wafer information acquisition structure comprising a wafer prealignment collector, a wafer ID code reader and a counter, wherein the wafer prealignment collector and the wafer ID code reader are arranged on the fixed frame, and the counter is communicated with the wafer ID code reader to count wafer IDs; checking mixed batch and sequential placement of wafers while realizing wafer prealignment; checking the process omission and repetition; monitoring whether unfilled corners and/or cracks exist at the edge of the wafer; the PM operation is convenient, the distance can be quickly adjusted, and the WPH is improved; the wafer processing device can be compatible with wafers of different sizes, reduces cost and greatly meets factory requirements; the affected range of the product can be greatly reduced, and the damage can be effectively stopped in time; the whole device has simple structure, convenient system manufacture and maintenance, high stability and reliability, long-term use and strong practicability, and improves the production benefit of factories.

Description

Wafer pre-alignment device

Technical Field

The utility model belongs to the technical field of semiconductor equipment, and relates to a wafer pre-alignment device.

Background

In the manufacturing and production process of semiconductor wafers, in order to ensure that the wafers can be processed in a fixed posture, the positioning and identification of the wafers are important links in the manufacturing process of the wafers, in the prior device, the positioning and identification of the wafers are performed through a wafer Pre-alignment device (Pre-Aligner), and the working principle is as follows: calculating the eccentricity of the wafer and finding a wafer notch (notch), further compensating the eccentricity of the wafer and turning the notch to a certain direction so as to prepare for the next step of wafer identification and processing.

The conventional wafer pre-alignment apparatus, as shown in fig. 1, comprises a carrier plate 10, a rotating base 20 disposed on the carrier plate 10, a vacuum adsorption platform 30 fixed on the rotating base 20 for adsorbing wafers, a stand 40 disposed on one side of the rotating base 20, and a wafer pre-alignment collector 50 disposed on the stand 40. After the system is started, vacuum is opened, a wafer placed on the vacuum adsorption platform 30 is adsorbed, after a vacuum value reaches a set value, the rotating base 20 drives the wafer (not shown) on the vacuum adsorption platform 30 to rotate together, the wafer prealignment collector 50 recognizes, the system operation process calculates the wafer center position and the wafer notch position, and the wafer notch is adjusted to a required angle, so that prealignment of the wafer is realized.

However, the conventional wafer pre-alignment device can only realize the pre-alignment of the wafer, and has single structural function, but the following problems are unavoidable in the wafer manufacturing factory:

1. Wafers (wafer IDs) of different stages are mixed in the same batch (lot) or wafer codes (wafer IDs) of the same lot are placed in error sequentially;

2. Defects (defects) such as cracks or unfilled corners appear at wafer edges (edge);

3. Some wafer do not have a process (process) under the same stage, while some wafer have a repeat process (double process) and the like, so that some wafer are not processed to cause omission, and some wafer are processed for multiple times to cause waste of time resources;

4. Different sizes of wafer require different sizes of pre-alignment devices, which are costly.

For the abnormal phenomenon faced by the wafer, the abnormal phenomenon can be found only at the final macroscopic shipment detection or detection station, so that the problem can be found untimely, the influence range of the product is enlarged, and the normal operation of the production line and the product yield are seriously influenced.

Therefore, it is necessary to provide a wafer pre-alignment device with multiple functions.

Disclosure of utility model

In view of the above-mentioned drawbacks of the prior art, an object of the present utility model is to provide a wafer pre-alignment device for solving the above-mentioned problems caused by the single function of the wafer pre-alignment device in the prior art.

To achieve the above and other related objects, the present utility model provides a wafer pre-alignment apparatus comprising:

A wafer rotating base for carrying and rotating the wafer;

The support is provided with a fixed frame, and the fixed frame is arranged corresponding to the wafer rotating base;

The wafer information acquisition structure comprises a wafer prealignment collector, a wafer ID code reader and a counter, wherein the wafer prealignment collector and the wafer ID code reader are arranged on the fixed frame, and the counter is communicated with the wafer ID code reader to count the wafer ID.

Optionally, the support comprises a lifting support, and the lifting support comprises an automatic lifting support or a manual lifting support.

Optionally, the wafer information acquisition structure further includes an image collector disposed on the fixed frame, and the image collector is used to obtain an edge image of the wafer.

Optionally, the fixing frame is provided with N image collectors, where N is greater than or equal to 2, and the N image collectors are arranged at equal intervals.

Optionally, the ring type fixed frame comprises a single ring type fixed frame or an M ring type fixed frame with the circle centers coincident, wherein M is more than or equal to 2.

Optionally, when the fixed frame is an M-ring fixed frame, the wafer information collecting structure is set in one-to-one correspondence with the ring fixed frame.

Optionally, when the fixed frame is an M-ring fixed frame, a connection beam is further disposed between adjacent ring fixed frames, and the wafer information acquisition structure is operated along a radial direction through the connection beam so as to realize sharing of the wafer information acquisition structure.

Optionally, the communication mode between the counter and the wafer ID code reader includes wired communication and/or wireless communication.

Optionally, an alarm is further included, the alarm being in communication with the wafer information collection structure.

Optionally, the alarm comprises an audible alarm, a light alarm or an audible and light alarm.

As described above, the wafer pre-alignment device can realize wafer pre-alignment and simultaneously verify wafer mixed batch and wafer sequential placement; checking the process omission and repeated process of the wafer; whether unfilled corners and/or cracks exist at the edge of the wafer or not can be monitored; the lifting function of the wafer information acquisition structure is realized, PM operation is convenient, the distance can be quickly adjusted, and WPH (Wafer Per Hour) is lifted; can be compatible with wafers with different sizes, reduce the cost and greatly meet the factory requirements.

The wafer pre-alignment device can greatly reduce the affected range of products and effectively stop damage in time; the whole device has simple structure, convenient system manufacture, convenient maintenance, high stability and reliability, long-term use and strong practicability, and improves the production benefit of factories.

Drawings

Fig. 1 is a schematic structural view of a wafer pre-alignment device in the prior art.

Fig. 2 is a schematic structural view of a wafer pre-alignment device according to the present utility model.

Description of element reference numerals

10. Bearing plate

20. Rotary base

30. Vacuum adsorption platform

40. Stand

50. Wafer prealignment collector

100. Base seat

200. Wafer rotating base

300. Lifting support

401. First ring type fixing frame

402. Second ring type fixing frame

403. Connecting beam

501. Wafer prealignment collector

502. Wafer ID code reader

503. Counter

504. Image collector

Detailed Description

Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model.

It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present utility model by way of illustration, and only the components related to the present utility model are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.

Referring to fig. 2, the present embodiment provides a wafer pre-alignment device, which includes a wafer rotating base 200, a bracket, and a wafer information collecting structure.

Wherein the wafer spin pedestal 200 is used to carry and spin a wafer (not shown); a fixed frame is arranged on the bracket, and the fixed frame is arranged corresponding to the wafer rotating base 200; the wafer information collection structure comprises a wafer pre-alignment collector 501, a wafer ID code reader 502 and a counter 503, wherein the wafer pre-alignment collector 501 and the wafer ID code reader 502 are arranged on the fixed frame, and the counter 503 is communicated with the wafer ID code reader 502 to count the wafer ID.

Referring to fig. 2, it can be appreciated that the wafer pre-alignment apparatus further includes a base 100 for mounting the wafer rotation base 200 and/or the support.

Specifically, the wafer prealignment collector 501 and the wafer ID code reader 502 are preferably disposed at the edge of the fixed frame, so as to be disposed corresponding to the wafer to be detected, and the wafer prealignment collector 501 can be used for prealignment operation of the wafer, so as to prepare for the next wafer identification and processing, and ensure the accuracy of the angle of the wafer before the wafer is transferred to the workbench; the wafer ID reader 502 can obtain the wafer ID of the wafer to identify the wafer, so as to avoid the error of placing the mixed lot of wafers in different stages in the same lot or the wafer position of the same lot, thereby ensuring the accuracy of the wafer for processing.

The counter 503 may be disposed on the fixing frame, but may also be disposed at other parts of the wafer pre-alignment device, as in fig. 2, the counter 503 may be disposed on the support, but is not limited to this, and may be selected according to needs, and only needs to ensure that the counter 503 is in communication with the wafer ID code reader 502, and the counter 503 counts and counts the wafer IDs obtained by the wafer ID code reader 502, so as to monitor and record whether the wafer is processed or not or whether the wafer is processed repeatedly, thereby avoiding omission of the wafer process and waste of time resources caused by the repeated process.

The specific types, numbers and specific mounting positions of the wafer prealignment collector 501, the wafer ID reader 502 and the counter 503 are not limited herein.

As an example, the fixed frame comprises a single-ring fixed frame or an M-ring fixed frame with the circle centers coincident, wherein M is more than or equal to 2.

Specifically, as shown in fig. 2, in this embodiment, the fixing frame adopts an M-ring type fixing frame with center overlapping, where M is 2, that is, the fixing frame includes 2 concentric ring type fixing frames, a first ring type fixing frame 401 located at an inner ring and a second ring type fixing frame 402 located at an outer ring, where the first ring type fixing frame 401 may be set corresponding to an 8-inch wafer, and the second ring type fixing frame 402 may be set corresponding to a 12-inch wafer, so that the detection of the 8-inch and 12-inch wafers can be simultaneously satisfied by the fixing frame, so as to reduce cost and satisfy factory requirements, but the value of M is not limited to this, for example, M may also be 1, 3, 4, and so on, and may be specifically selected according to needs.

As an example, the wafer information collection structure may further include an image collector 504 disposed on the fixing frame, so that a wafer edge image is obtained by the image collector 504 to monitor whether a corner defect and/or a crack exists at the wafer edge.

As an example, when the fixed frame is an M-ring type fixed frame, the wafer information collecting structure is disposed in one-to-one correspondence with the ring type fixed frame.

Specifically, as shown in fig. 2, in this embodiment, the first ring-type fixing frame 401 and the second ring-type fixing frame 402 are respectively provided with the wafer prealignment collector 501, the wafer ID code reader 502 and the image collector 504, so as to detect wafers with different sizes, where the counter 503 may be disposed in one-to-one correspondence with the first ring-type fixing frame 401 and the second ring-type fixing frame 402, and of course, the counter 503 may also be in communication with a plurality of wafer ID code readers 502 located on different ring-type fixing frames at the same time, thereby reducing the number of the counter 503 and reducing the cost.

Furthermore, N image collectors 504 may be disposed on the fixing frame, where N is greater than or equal to 2, and preferably N image collectors are disposed at equal intervals.

Specifically, in this embodiment, the first ring-type fixing frame 401 and the second ring-type fixing frame 402 are respectively provided with 4 image collectors 504 correspondingly, and the 4 image collectors 504 are disposed at equal intervals, so that pictures of the edges of the wafer are respectively obtained in different viewing angle ranges by the 4 image collectors 504, so as to realize detection of the edges of a whole wafer, and monitor whether the edges of the wafer have unfilled corners and/or cracks. Of course, the value of N is not limited to this, but may be 2, 3, 5, etc., and is not limited thereto.

As an example, when the fixing frame is an M-ring type fixing frame, a connection beam 403 may be further disposed between adjacent ring type fixing frames, and the wafer information collecting structure may be operated in a radial direction through the connection beam 403 to achieve sharing of the wafer information collecting structure.

Specifically, as shown in fig. 2, when the connection beam 403 is disposed between the first ring-type fixing frame 401 and the second ring-type fixing frame 402, the wafer information collection structure, such as the wafer prealignment collector 501, the wafer ID code reader 502, or the image collector 504, may be moved along the connection beam 403, so as to implement that the wafer information collection structure runs on different ring-type fixing frames in a radial direction, thereby implementing sharing of the wafer information collection structure, so as to further reduce the cost of disposing the wafer information collection structure while implementing compatibility of detecting wafers with different sizes.

As an example, the stand may include a lifting stand 300, wherein the lifting stand 300 may include an automatic lifting stand or a manual lifting stand.

Specifically, when the support is set to the lifting support 300, the fixing frame is conveniently driven to move up and down by the lifting support 300, so that the distance between the wafer information acquisition structure and the wafer is quickly adjusted, PM operation is facilitated, and WPH of the lifting platform is facilitated, wherein the lifting support 300 can comprise an automatic lifting support or a manual lifting support, and in the embodiment, the automatic lifting support with relatively convenient control is preferred.

As an example, the communication manner between the counter 503 and the wafer ID reader 502 may include wired communication and/or wireless communication.

Specifically, the communication manner between the counter 503 and the wafer ID code reader 502 may be wired communication and/or wireless communication, if necessary, and of course, a controller (not shown) may be disposed in the wafer pre-alignment device, and the wafer rotating base 200, the wafer pre-alignment collector 501, the wafer ID code reader 502, and the counter 503 may all perform wired communication and/or wireless communication with the controller, so as to implement automatic control over the wafer rotating base 200, the wafer pre-alignment collector 501, the wafer ID code reader 502, and the counter 503 by using the controller, and of course, the lifting bracket 300 may also perform wired communication and/or wireless communication with the controller, so as to implement automatic lifting.

As an example, an alarm (not shown) may be further disposed in the wafer pre-alignment device, and the alarm may be in communication with the wafer information collection structure, so that when the wafer information obtained by the wafer information collection structure does not meet the requirement, the alarm may be used to timely remind the staff of the existence of an abnormal phenomenon, so that effective measures can be taken in time to improve the wafer pre-alignment device, and loss is reduced.

As examples, the alarm may include an audible alarm, a light alarm, or an audible and visual alarm, and the specific type may be selected as desired.

In summary, the wafer pre-alignment device of the utility model can verify the mixed batch of wafers and the sequential placement of wafers while realizing the wafer pre-alignment; checking the process omission and repeated process of the wafer; whether unfilled corners and/or cracks exist at the edge of the wafer or not can be monitored; the lifting function of the wafer information acquisition structure is realized, PM operation is convenient, the distance can be quickly adjusted, and WPH is improved; can be compatible with wafers with different sizes, reduce the cost and greatly meet the factory requirements.

The wafer pre-alignment device can greatly reduce the affected range of products and effectively stop damage in time; the whole device has simple structure, convenient system manufacture, convenient maintenance, high stability and reliability, long-term use and strong practicability, and improves the production benefit of factories. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims

1. A wafer pre-alignment apparatus, comprising:

A wafer rotating base for carrying and rotating the wafer;

2. The wafer prealignment device according to claim 1, wherein: the support comprises a lifting support, and the lifting support comprises an automatic lifting support or a manual lifting support.

3. The wafer prealignment device according to claim 1, wherein: the wafer information acquisition structure further comprises an image acquisition device arranged on the fixed frame, and the image acquisition device is used for acquiring an image of the wafer edge.

4. The wafer prealignment device according to claim 1, wherein: the fixed frame is provided with N image collectors, N is more than or equal to 2, and N image collectors are arranged at equal intervals.

5. The wafer prealignment device according to claim 1, wherein: the fixed frame comprises a single-ring fixed frame or an M-ring fixed frame with the circle centers coincident, wherein M is more than or equal to 2.

6. The wafer prealignment device according to claim 5, wherein: when the fixed frame is an M-ring type fixed frame, the wafer information acquisition structure and the ring type fixed frame are arranged in one-to-one correspondence.

7. The wafer prealignment device according to claim 5, wherein: when the fixed frame is an M-ring type fixed frame, a connecting beam is further arranged between adjacent ring type fixed frames, and the wafer information acquisition structure runs along the radial direction through the connecting beam so as to realize the sharing of the wafer information acquisition structure.

8. The wafer prealignment device according to claim 1, wherein: the communication mode between the counter and the wafer ID reader comprises wired communication and/or wireless communication.

9. The wafer prealignment device according to claim 1, wherein: the wafer information acquisition system further comprises an alarm which is communicated with the wafer information acquisition structure.

10. The wafer prealignment device according to claim 9, wherein: the alarm comprises an audible alarm, a light alarm or an audible and light alarm.