CN217562539U - AOI automatic check out test set - Google Patents
AOI automatic check out test set Download PDFInfo
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- CN217562539U CN217562539U CN202221802965.9U CN202221802965U CN217562539U CN 217562539 U CN217562539 U CN 217562539U CN 202221802965 U CN202221802965 U CN 202221802965U CN 217562539 U CN217562539 U CN 217562539U
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Abstract
The utility model relates to an AOI automatic check out test set, its characterized in that: comprises a material taking and placing unit for taking out the wafer in the wafer box and moving the wafer to a wafer bearing unit; taking out the detected wafer from the wafer bearing unit; the wafer bearing unit is used for bearing the wafer and moving the position of the wafer; the detection unit is provided with a plurality of detection stations, and the bearing unit moves the wafer through the detection stations in sequence for detection; and the analysis control unit analyzes the data fed back by the detection unit. Through the design of the limiting plates with different sizes, when the limiting plates are taken out, the wafer with a larger diameter can be borne, and when the limiting plates with different sizes are installed, the wafers with different sizes can be borne; through the design of adsorption equipment, can adsorb the wafer on the plummer, effectively avoid wafer skew in transmission course, avoid the damage of wafer, and improved and detected the precision.
Description
Technical Field
The utility model relates to a wafer detects technical field, in particular to AOI automatic check out test set.
Background
In the production process of the wafer, the wafer needs to be detected, the general detection needs to be carried out for multiple times, and at the moment, the wafer needs to be placed on a wafer bearing platform and is sequentially transmitted to different detection stations for detection. The existing detection wafer bearing table is single in size, cannot meet the requirements of wafer detection of different specifications, and is easy to deviate due to vibration in the transmission process; when different stations are detected, accurate positioning cannot be carried out, and detection errors are large. Therefore, the utility model discloses automatic check out test set's research and development is carried out to solve the problem that exists among the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the purpose is: the AOI automatic detection equipment is provided to solve the problems that the traditional detection equipment in the prior art is single in size and low in applicability; the wafer is easy to shift in the transmission process; and the problem of inaccurate positioning of the detection station.
The technical scheme of the utility model is that: an AOI automatic check out test set which characterized in that: comprises a material taking and placing unit for taking out the wafer in the wafer box and moving the wafer to a wafer bearing unit; taking out the detected wafer from the wafer bearing unit; the wafer bearing unit is used for bearing the wafer and moving the position of the wafer; the detection unit is provided with a plurality of detection stations, and the bearing unit moves the wafer through the detection stations in sequence for detection; and the analysis control unit analyzes the data fed back by the detection unit.
Preferably, the wafer bearing unit comprises a first moving module, a second moving module and a wafer bearing table, wherein the second moving module and the wafer bearing table are arranged perpendicular to the first moving module, and the second moving module can reciprocate along the first moving module under the driving of the first moving module; the wafer bearing table can reciprocate along the second moving module under the driving of the second moving module.
Preferably, a plurality of first sensors are arranged on the first mobile module, and a first induction block matched with the first sensors is arranged at the end part of the second mobile module; the second moving module is provided with a plurality of second sensors, and a second induction block matched with the second sensors is arranged on the lateral side of the wafer bearing table.
Preferably, the wafer bearing table comprises a first base arranged on the second moving module, a U-shaped opening is formed in the first base, the opening end of the U-shaped opening is connected with the material taking and placing unit in a matched mode, and a third sensor is arranged below the U-shaped opening and can sense the material taking and placing unit; the U-shaped opening bottom is provided with the circular shape spacing groove, be provided with annular limiting plate in the spacing groove, annular limiting plate is provided with the opening, and its opening coincides in U-shaped opening.
Preferably, the bottom of the limiting groove is provided with an adsorption device; and a fourth sensor is arranged at the lower end part of the limiting groove.
Preferably, the detection unit comprises a first support, and a first detection module, a second detection module and a third detection module which are arranged on the first support, wherein the first detection module is arranged below the sheet bearing unit, and the second detection module and the third detection module are arranged above the sheet bearing unit.
Preferably, the device further comprises a device housing, and a PC and a display are arranged on the outer wall of the device housing.
Preferably, the material taking and placing unit, the sheet bearing unit and the detection unit are all subjected to blackening treatment, and the surfaces of the material taking and placing unit, the sheet bearing unit and the detection unit are all black.
Compared with the prior art, the utility model has the advantages that:
(1) Through the design of the limiting plates with different sizes, when the limiting plates are taken out, the wafer with a larger diameter can be borne, and when the limiting plates with different sizes are installed, the wafers with different sizes can be borne;
(2) Through the design of the adsorption device, the wafer on the bearing table can be adsorbed, the wafer is effectively prevented from shifting in the transmission process, the damage of the wafer is avoided, and the detection precision is improved;
(3) Through the design of a plurality of sensors on the mobile module, the different detection stations can be accurately positioned, and the detection precision is improved.
Drawings
The invention will be further described with reference to the following drawings and examples:
FIG. 1 is a schematic structural view of an AOI automatic inspection apparatus according to the present invention;
FIG. 2 is a schematic view of the AOI automatic inspection equipment of the present invention with the outer cover removed
Fig. 3 is a schematic structural diagram 1 of the bearing unit of the present invention;
fig. 4 is a schematic structural diagram of the carrying unit of the present invention 2;
FIG. 5 is an enlarged schematic view of the structure at A in FIG. 4;
FIG. 6 is an enlarged view of the structure at B in FIG. 4;
fig. 7 is a schematic structural diagram of the first bottom plate according to the present invention.
Wherein: the equipment comprises an equipment outer cover 1, a PC host 11 and a display 12;
a material taking and placing unit 2;
the sheet bearing unit 3, the first moving module 31, the first slide rail 311, the first sensor 312a at the upstream end, the first sensor 312b at the middle row end, the first sensor 312c at the downstream end, the second moving module 32, the second slide rail 321, the second sensor 322a at the upstream end, the second sensor 322b at the middle row end, the second sensor 322c at the downstream end, the first sensing block 323, the sheet bearing table 33, the U-shaped opening 331, the limiting groove 332, the third sensor 333, the second sensing block 334, the first base 335, the limiting plate 336, the adsorption device 337, and the fourth sensor 338;
the detection unit 4, the first bracket 41, the first detection module 42, the second detection module 43, and the third detection module 44;
an analysis control unit 5.
Detailed Description
The following detailed description is made for the contents of the present invention with reference to the specific embodiments:
as shown in fig. 1, an AOI automatic detection apparatus includes: the equipment outer cover 1 is provided with the material taking and placing unit 2, the sheet bearing unit 3, the detection unit 4 and the analysis control unit 5 inside; the equipment outer cover 1 is provided with an opening at one side, and the opening side is connected with FOUP wafer box equipment to ensure that the interior of the equipment outer cover 1 is in a dark state; the surfaces of all parts in the equipment outer cover 1 are subjected to blackening treatment, so that the situation that the surfaces of the parts are reflected to influence the detection precision in the detection is avoided; the PC host 11 and the display 12 are disposed outside the housing of the device, and can control and transmit commands to the device and display detection results in real time.
As shown in fig. 2 to 6, the pick-and-place unit 2 may employ a retractable and rotatable robot arm, so as to take out the wafer in the FOUP wafer cassette, move the wafer into the limit groove 332 of the wafer support unit 3 through the U-shaped opening 331, and take out the wafer in the limit groove 332 after the detection is completed. The fourth sensor 338 is arranged below the limiting groove 332 and can sense the wafer on the limiting groove 332, the third sensor 333 is arranged below the U-shaped opening 331, the third sensor 333 can sense the material taking and placing unit 2, only when the material taking and placing unit 2 leaves the U-shaped opening 331, the fifth sensor 333 does not sense the material taking and placing unit 2, and the fourth sensor 338 senses the wafer, the wafer bearing unit 3 starts to work, so that the interference between the material taking and placing unit 2 and the wafer bearing unit 3 is avoided, and the no-load operation of the wafer bearing unit is also avoided.
And the wafer bearing unit 3 is used for bearing the wafer and moving the position of the wafer. The device comprises a first moving module 31, a second moving module 32 and a wafer bearing table 33, wherein the second moving module 32 and the wafer bearing table are vertically arranged on the first moving module 31, one end part of the second moving module 32 is connected with the first moving module 31, a first sliding rail 311 parallel to the first moving module 31 is arranged below the other end of the second moving module 32, and the first sliding rail 311 plays a role in auxiliary support. The second moving module 32 can reciprocate along the first moving module 31 and the first slide rail 311 under the driving of the first moving module 31; the first moving module 31 is provided with a plurality of first sensors 312, which are divided into an uplink first sensor 312a, a middle-line first sensor 312b, and a downlink first sensor 312c according to different positions; the end of the second moving module 32 is provided with a first sensing block 323 matched with the first sensor 312.
The wafer supporting platform 33 includes a first base 335 disposed on the second moving module, one side of the first base 335 is connected to the second moving module 32, a second sliding rail 321 parallel to the second moving module 32 is disposed below the other side of the first base 335, the second sliding rail 321 supports the wafer supporting platform 33, and the second sliding rail 321 can move synchronously on the first moving module 31 along with the second moving module 32. The wafer support 33 can reciprocate along the second moving module 32 and the second sliding rail 321 under the driving of the second moving module 32. The second slide rail 321 is provided with a plurality of second sensors 322, which are divided into an upstream end second sensor 322a, a middle end second sensor 322b and a downstream end second sensor 322c according to different positions, and a second sensing block 334 matched with the second sensors 322 is arranged on the side of the wafer bearing table 33.
The detecting unit 4 comprises a first bracket 41, and a first detecting module 42, a second detecting module 43 and a third detecting module 44 which are arranged on the first bracket 41, wherein the first detecting module 42 is arranged below the sheet bearing unit 3, and the second detecting module 43 and the third detecting module 44 are arranged above the sheet bearing unit 3.
In this embodiment, the carrying unit 3 is initially located at the origin position, that is, the second sensor 322a at the upstream end senses the second sensing block 334, and the first sensor 312b at the intermediate end senses the first sensing block 323. When the third sensor 333 does not sense the wafer gripping device 2 and the fourth sensor 338 senses the wafer, the wafer gripping device 2 places the wafer on the position-limiting groove 332, and the wafer gripping device 2 is separated from the movement range of the carrying unit 3. The first moving module 31 is started to drive the second moving module 32 and the wafer supporting table 33 to move along the upward end direction of the first moving module 31, and stop when the first sensor 312a at the upward end senses the first sensing block 323, at this time, the wafer on the wafer supporting table 33 is just above the first detecting module 42, and the first detecting module 42 starts to perform code scanning detection on the wafer, and collects information for determining the wafer.
The first moving module 31 is started again to drive the second moving module 32 and the wafer supporting table 33 to move to the descending end of the first moving module 31, and the first sensor 312b at the descending end stops when sensing the first sensing block 323; when the first moving module 31 is started, the second moving module 32 is started to drive the wafer-holding table 33 to move to the downstream end of the second moving module 32, and stops when the second sensor 322b at the intermediate end senses the second sensing block 334, at this time, the wafer on the wafer-holding table 33 is located right below the second detecting module 43, the second detecting module 43 is started to detect the wafer, and the detection data is transmitted to the analysis control unit.
After the second detection module 43 completes the detection, the first moving module 31 is started again to drive the second moving module 32 and the wafer stage 33 to move to the downstream end of the first moving module 31, and stops when the first sensor 312c at the downstream end senses the first sensing block 323, at this time, the wafer is located right below the third detection module 44, the third detection module 44 is started to detect the wafer, and the detection data is transmitted to the analysis control unit.
After the detection is completed, the carrying unit 3 is reset to return to the original position, that is, the first moving module 31 drives the second moving module 32 and the wafer stage 33 to move in the direction of the ascending end of the first moving module 31, and stops when the first sensor 312b at the middle end senses the first sensing block 323; meanwhile, the second moving module 32 drives the wafer supporting table 33 to move toward the upward end of the second moving module 32, and stops when the second sensor 322a at the upward end senses the second sensing block 334.
Finally, the grasping unit 2 takes out and transfers the wafer on the wafer stage 33.
It should be noted that the positions of the first detecting module 42, the second detecting module 43 and the third detecting module 44 can be adjusted according to the actual situation, and the number of the detecting modules can be increased or decreased according to the actual situation; the positions of the first sensor 312 and the second sensor 322 are determined according to the position of the detection module, the first sensor 312 and the second sensor 322 form a plane coordinate system, and the intersection point when the sensing block is sensed can be set as a detection station of the detection module.
The first moving module 31 and the second moving module 32 can be driven by servo motors, and other driving devices can also be used.
As shown in fig. 7, a circular limiting groove 332 is disposed on the first base 335, and the center of the circular limiting groove is concentric with the center of the arc-shaped end of the U-shaped opening 331; the concentric annular limiting plate 336 is arranged in the limiting groove 332, the annular limiting plate 336 is provided with an opening, the opening section of the opening of the annular limiting plate 336 is overlapped with that of the U-shaped opening 331, and the inner diameter of the annular limiting plate 336 is smaller than the diameter of the arc-shaped end of the U-shaped opening 331. The inner diameter of the ring-shaped limiting plate 336 can be designed according to the size of the detected wafer, and the ring-shaped limiting plate can be just clamped on the outer diameter of the wafer; the number of the ring-shaped limiting plates 336 can be selected according to the specification of the wafer. Limiting groove 332 bottom is provided with adsorption equipment 337, and adsorption equipment can be pneumatic suction head, and adsorption equipment 337 can not be covered to limiting plate 336, and adsorption equipment 337's effect is firmly adsorbing the wafer, avoids in the testing process, and the condition such as production vibration causes the aversion.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. It is obvious to a person skilled in the art that the invention is not limited to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention, and that the embodiments are therefore to be considered in all respects as exemplary and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (8)
1. An AOI automatic detection equipment which characterized in that: the method comprises the following steps:
the material taking and placing unit is used for taking out the wafer in the wafer box and moving the wafer to the wafer bearing unit; taking out the detected wafer from the wafer bearing unit;
the wafer bearing unit is used for bearing the wafer and moving the position of the wafer;
the detection unit is provided with a plurality of detection stations, and the bearing unit moves the wafer through the detection stations in sequence for detection;
and the analysis control unit analyzes the data fed back by the detection unit.
2. The AOI automatic detection apparatus of claim 1, wherein: the wafer bearing unit comprises a first moving module, a second moving module and a wafer bearing platform, wherein the second moving module and the wafer bearing platform are vertically arranged with the first moving module, and the second moving module can reciprocate along the first moving module under the driving of the first moving module; the wafer bearing table can reciprocate along the second moving module under the driving of the second moving module.
3. The AOI automatic detection apparatus of claim 2, wherein: the first moving module is provided with a plurality of first sensors, and the end part of the second moving module is provided with a first sensing block matched with the first sensors; the second moving module is provided with a plurality of second sensors, and a second induction block matched with the second sensors is arranged on the lateral side of the wafer bearing table.
4. The AOI automatic detection equipment according to claim 3, wherein the wafer bearing table comprises a first base arranged on the second moving module, the first base is provided with a U-shaped opening, the open end of the U-shaped opening is matched and connected with the material taking and placing unit, a third sensor is arranged below the U-shaped opening, and the third sensor can sense the material taking and placing unit; the U-shaped opening bottom is provided with the circular shape spacing groove, be provided with annular limiting plate in the spacing groove, annular limiting plate is provided with the opening, and its opening coincides in U-shaped opening.
5. The AOI automatic detection equipment according to claim 4, wherein an adsorption device is arranged at the bottom of the limiting groove; and a fourth sensor is arranged at the lower end part of the limiting groove.
6. The AOI automatic detection equipment according to claim 1, wherein the detection unit comprises a first bracket, and a first detection module, a second detection module and a third detection module are arranged on the first bracket, the first detection module is arranged below the wafer bearing unit, and the second detection module and the third detection module are arranged above the wafer bearing unit.
7. The AOI automatic detection equipment according to claim 1, further comprising an equipment housing, wherein a PC host and a display are arranged on the outer wall of the equipment housing.
8. The AOI automatic detection equipment according to claim 1, wherein the material taking and placing unit, the sheet bearing unit and the detection unit are all blackened, and the surfaces of the material taking and placing unit, the sheet bearing unit and the detection unit are all black.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221802965.9U CN217562539U (en) | 2022-07-13 | 2022-07-13 | AOI automatic check out test set |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221802965.9U CN217562539U (en) | 2022-07-13 | 2022-07-13 | AOI automatic check out test set |
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| CN217562539U true CN217562539U (en) | 2022-10-11 |
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| CN202221802965.9U Active CN217562539U (en) | 2022-07-13 | 2022-07-13 | AOI automatic check out test set |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116125239A (en) * | 2022-12-21 | 2023-05-16 | 北京智慧能源研究院 | Thyristor failure test device and test system thereof |
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2022
- 2022-07-13 CN CN202221802965.9U patent/CN217562539U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116125239A (en) * | 2022-12-21 | 2023-05-16 | 北京智慧能源研究院 | Thyristor failure test device and test system thereof |
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