CN220776134U - 电路基板 - Google Patents

电路基板 Download PDF

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Publication number
CN220776134U
CN220776134U CN202190001000.7U CN202190001000U CN220776134U CN 220776134 U CN220776134 U CN 220776134U CN 202190001000 U CN202190001000 U CN 202190001000U CN 220776134 U CN220776134 U CN 220776134U
Authority
CN
China
Prior art keywords
conductor layer
signal conductor
linear reference
signal
circuit substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202190001000.7U
Other languages
English (en)
Chinese (zh)
Inventor
西尾恒亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of CN220776134U publication Critical patent/CN220776134U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202190001000.7U 2021-02-12 2021-12-13 电路基板 Active CN220776134U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021020481 2021-02-12
JP2021-020481 2021-02-12
PCT/JP2021/045751 WO2022172575A1 (ja) 2021-02-12 2021-12-13 回路基板

Publications (1)

Publication Number Publication Date
CN220776134U true CN220776134U (zh) 2024-04-12

Family

ID=82838645

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202190001000.7U Active CN220776134U (zh) 2021-02-12 2021-12-13 电路基板

Country Status (4)

Country Link
US (1) US12439508B2 (https=)
JP (1) JP7574868B2 (https=)
CN (1) CN220776134U (https=)
WO (1) WO2022172575A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629654A (en) * 1996-05-06 1997-05-13 Watkins-Johnson Company Coplanar waveguide coupler
US7291907B2 (en) * 2005-02-28 2007-11-06 Infineon Technologies, Ag Chip stack employing a flex circuit
JP4863900B2 (ja) 2007-02-08 2012-01-25 セイコーインスツル株式会社 シールドフレキシブルプリント基板及び電子機器
EP2392196B1 (en) * 2009-01-30 2018-08-22 IMEC vzw Stretchable electronic device
WO2010086033A1 (en) * 2009-01-30 2010-08-05 Interuniversitair Microelektronica Centrum Vzw Stretchable electronic device
WO2010131523A1 (ja) 2009-05-11 2010-11-18 株式会社村田製作所 信号線路及び回路基板
WO2010150588A1 (ja) * 2009-06-24 2010-12-29 株式会社村田製作所 信号線路
TWI419094B (zh) * 2010-09-10 2013-12-11 Au Optronics Corp 可撓性顯示面板
JP5041108B2 (ja) 2010-12-03 2012-10-03 株式会社村田製作所 高周波信号線路
JP2012195456A (ja) * 2011-03-16 2012-10-11 Toshiba Corp フレキシブル配線モジュール及びフレキシブル配線装置
JP2014160690A (ja) * 2011-06-23 2014-09-04 Sanyo Electric Co Ltd 配線基板
CN205646089U (zh) 2014-01-20 2016-10-12 株式会社村田制作所 信号线路

Also Published As

Publication number Publication date
JP7574868B2 (ja) 2024-10-29
US20240008168A1 (en) 2024-01-04
US12439508B2 (en) 2025-10-07
JPWO2022172575A1 (https=) 2022-08-18
WO2022172575A1 (ja) 2022-08-18

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