JPWO2022172575A1 - - Google Patents

Info

Publication number
JPWO2022172575A1
JPWO2022172575A1 JP2022581208A JP2022581208A JPWO2022172575A1 JP WO2022172575 A1 JPWO2022172575 A1 JP WO2022172575A1 JP 2022581208 A JP2022581208 A JP 2022581208A JP 2022581208 A JP2022581208 A JP 2022581208A JP WO2022172575 A1 JPWO2022172575 A1 JP WO2022172575A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022581208A
Other languages
Japanese (ja)
Other versions
JPWO2022172575A5 (https=
JP7574868B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022172575A1 publication Critical patent/JPWO2022172575A1/ja
Publication of JPWO2022172575A5 publication Critical patent/JPWO2022172575A5/ja
Application granted granted Critical
Publication of JP7574868B2 publication Critical patent/JP7574868B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022581208A 2021-02-12 2021-12-13 回路基板 Active JP7574868B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021020481 2021-02-12
JP2021020481 2021-02-12
PCT/JP2021/045751 WO2022172575A1 (ja) 2021-02-12 2021-12-13 回路基板

Publications (3)

Publication Number Publication Date
JPWO2022172575A1 true JPWO2022172575A1 (https=) 2022-08-18
JPWO2022172575A5 JPWO2022172575A5 (https=) 2023-10-23
JP7574868B2 JP7574868B2 (ja) 2024-10-29

Family

ID=82838645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022581208A Active JP7574868B2 (ja) 2021-02-12 2021-12-13 回路基板

Country Status (4)

Country Link
US (1) US12439508B2 (https=)
JP (1) JP7574868B2 (https=)
CN (1) CN220776134U (https=)
WO (1) WO2022172575A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008198651A (ja) * 2007-02-08 2008-08-28 Seiko Instruments Inc シールドフレキシブルプリント基板及び電子機器
WO2010150588A1 (ja) * 2009-06-24 2010-12-29 株式会社村田製作所 信号線路
JP2013153229A (ja) * 2009-05-11 2013-08-08 Murata Mfg Co Ltd 信号線路及び回路基板
JP2014212355A (ja) * 2010-12-03 2014-11-13 株式会社村田製作所 高周波信号線路
WO2015108094A1 (ja) * 2014-01-20 2015-07-23 株式会社村田製作所 信号線路

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629654A (en) * 1996-05-06 1997-05-13 Watkins-Johnson Company Coplanar waveguide coupler
US7291907B2 (en) * 2005-02-28 2007-11-06 Infineon Technologies, Ag Chip stack employing a flex circuit
EP2392196B1 (en) * 2009-01-30 2018-08-22 IMEC vzw Stretchable electronic device
WO2010086033A1 (en) * 2009-01-30 2010-08-05 Interuniversitair Microelektronica Centrum Vzw Stretchable electronic device
TWI419094B (zh) * 2010-09-10 2013-12-11 Au Optronics Corp 可撓性顯示面板
JP2012195456A (ja) * 2011-03-16 2012-10-11 Toshiba Corp フレキシブル配線モジュール及びフレキシブル配線装置
JP2014160690A (ja) * 2011-06-23 2014-09-04 Sanyo Electric Co Ltd 配線基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008198651A (ja) * 2007-02-08 2008-08-28 Seiko Instruments Inc シールドフレキシブルプリント基板及び電子機器
JP2013153229A (ja) * 2009-05-11 2013-08-08 Murata Mfg Co Ltd 信号線路及び回路基板
WO2010150588A1 (ja) * 2009-06-24 2010-12-29 株式会社村田製作所 信号線路
JP2014212355A (ja) * 2010-12-03 2014-11-13 株式会社村田製作所 高周波信号線路
WO2015108094A1 (ja) * 2014-01-20 2015-07-23 株式会社村田製作所 信号線路

Also Published As

Publication number Publication date
JP7574868B2 (ja) 2024-10-29
US20240008168A1 (en) 2024-01-04
US12439508B2 (en) 2025-10-07
WO2022172575A1 (ja) 2022-08-18
CN220776134U (zh) 2024-04-12

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