CN219938621U - Pressfitting cooling device is used in circuit board production - Google Patents
Pressfitting cooling device is used in circuit board production Download PDFInfo
- Publication number
- CN219938621U CN219938621U CN202321152257.XU CN202321152257U CN219938621U CN 219938621 U CN219938621 U CN 219938621U CN 202321152257 U CN202321152257 U CN 202321152257U CN 219938621 U CN219938621 U CN 219938621U
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- CN
- China
- Prior art keywords
- cooling
- circuit board
- seat
- board production
- pressfitting
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- 238000001816 cooling Methods 0.000 title claims abstract description 102
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000003825 pressing Methods 0.000 claims abstract description 14
- 239000000110 cooling liquid Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 abstract description 12
- 230000005855 radiation Effects 0.000 abstract description 8
- 239000007788 liquid Substances 0.000 abstract description 5
- 230000002950 deficient Effects 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 239000002826 coolant Substances 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
The utility model discloses a pressing cooling device for circuit board production, which comprises a first cooling seat, wherein a pressing table is arranged at the top of the first cooling seat, a fixing frame is fixedly connected to the position, close to the outer side of the pressing table, of the top of the first cooling seat through a bolt, an air cylinder is fixedly connected to the central position of the top of the fixing frame through a bolt, a lifting plate is fixedly connected to the air cylinder through an output end on one side of the air cylinder, and a second cooling seat is arranged at the bottom of the lifting plate. This pressfitting cooling device is used in circuit board production carries out top and bottom heat absorption to the circuit board of pressfitting in-process through first cooling seat and second cooling tube to through coolant liquid, first heat radiation fin and second heat radiation fin to the conduction of heat, the heat in the circuit board pressfitting in-process can be conducted to the air, and then realizes the efficient cooling of circuit board, guarantees the quality of circuit board pressfitting processing, reduces the generating rate of circuit defective products.
Description
Technical Field
The utility model relates to the technical field of circuit board lamination cooling, in particular to a lamination cooling device for circuit board production.
Background
The names of the circuit boards are: the ceramic circuit board, the alumina ceramic circuit board, the aluminum nitride ceramic circuit board, the PCB board, the aluminum substrate, the high-frequency board, the thick copper plate, the impedance board, the PCB, the ultrathin circuit board, the printed circuit board and other circuit boards enable circuits to be miniaturized and visualized, and play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances.
When the circuit board is pressed, the circuit board needs to be cooled, but the cooling effect of the traditional device is poor, so that the quality of the circuit board is reduced, and the generation rate of defective products is improved.
Disclosure of Invention
The utility model aims to provide a pressing and cooling device for circuit board production, which is used for solving the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a pressfitting cooling device is used in circuit board production, includes first cooling seat, the top of first cooling seat is provided with the pressfitting platform, and the outside position department that the top of first cooling seat is close to the pressfitting platform passes through bolt fixedly connected with mount, the top central point department of mount passes through bolt fixedly connected with cylinder, the cylinder is through its one side's output fixedly connected with lifter plate, the bottom of lifter plate is provided with the second cooling seat, through bolt fixedly connected with first circulating pump on one side outer wall of second cooling seat, the top of lifter plate is provided with first radiator fin, the inside of second cooling seat is provided with first cooling tube, all be connected fixedly through first connecting tube between first cooling tube and the first circulating pump, through bolt fixedly connected with second circulating pump on one side outer wall of first cooling seat, and be provided with the second radiator fin on one side outer wall of first cooling seat adjacent to the second circulating pump, all be connected fixedly through the second radiator fin between second radiator fin and the second circulating pump, the central point department of pressfitting platform has seted up the pressfitting cavity.
Compared with the prior art, the utility model has the beneficial effects that: this pressfitting cooling device is used in circuit board production carries out top and bottom heat absorption to the circuit board of pressfitting in-process through first cooling seat and second cooling tube to through coolant liquid, first heat radiation fin and second heat radiation fin to the conduction of heat, the heat in the circuit board pressfitting in-process can be conducted to the air, and then realizes the efficient cooling of circuit board, guarantees the quality of circuit board pressfitting processing, reduces the generating rate of circuit defective products.
Drawings
FIG. 1 is a front view of the present utility model;
FIG. 2 is a front view of a first cooling seat according to the present utility model;
FIG. 3 is a front view of the press platen of the present utility model;
FIG. 4 is a top cross-sectional view of a first cooling seat according to the present utility model;
fig. 5 is a side cross-sectional view of a second cooling seat of the present utility model.
In the figure: 1. a first cooling seat; 2. a pressing table; 3. a fixing frame; 4. a cylinder; 5. a lifting plate; 6. a second cooling seat; 7. a first circulation pump; 8. a first heat sink fin; 9. a first cooling tube; 10. a first connection pipe; 11. a second circulation pump; 12. a second heat sink fin; 13. a second cooling tube; 14. a second connection pipe; 15. and a pressing cavity.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the present utility model provides a technical solution: a press-fit cooling device for circuit board production is disclosed, wherein a press-fit cavity 15 is matched with a second cooling seat 6, the circuit board in the press-fit cavity 15 can be pressed through the second cooling seat 6 by matching the second cooling seat 6 with the press-fit cavity 15.
The lifting plate 5 is in sliding connection with the fixing frame 3 through the sliding blocks and the sliding grooves, so that the lifting stability of the lifting plate 5 on the fixing frame 3 is guaranteed.
The first connecting pipe 10 penetrates through the first radiating fins 8, and the first connecting pipe 10 is communicated with the first radiating fins 8, so that the flow of cold cooling liquid can be realized, heat is radiated through the first radiating fins 8, heat can be effectively transferred to the air, and the temperature of the cooling liquid is reduced.
The first radiating fins 8 and the second radiating fins 12 are hollow structures, so that the cooling liquid can be filled in the first radiating fins 8 and the second radiating fins 12.
The second connecting pipe 14 penetrates through the second radiating fins 12, and the second connecting pipe 14 is communicated with the second radiating fins 12, so that the flow of cold cooling liquid can be realized, heat is radiated through the second radiating fins 12, heat can be effectively transferred to the air, and the temperature of the cooling liquid is reduced.
The cross sections of the first cooling pipe 9 and the second cooling pipe 13 are of S-shaped structures, so that the contact areas of the first cooling pipe 9 and the second cooling pipe 13 with the second cooling seat 6 and the first cooling seat 1 are increased, and the cooling effect is improved.
The first heat radiation fins 8, the first cooling pipes 9, the first connecting pipes 10, the second heat radiation fins 12, the second cooling pipes 13 and the second connecting pipes 14 are filled with cooling liquid, and effective heat transmission can be realized through the cooling liquid.
Working principle: when the circuit board pressing device is used, a circuit board to be pressed is placed in a pressing cavity 15 at the top of the pressing table 2, when the circuit board is pressed, the air cylinder 4 drives the lifting plate 5 to move downwards through the output end at one side of the circuit board, the lifting plate 5 drives the second cooling seat 6 to move downwards in the descending process, the second cooling seat 6 moves downwards to enter the pressing cavity 15, after the second cooling seat 6 contacts with the circuit board, the circuit board is pressed through the second cooling seat 6 and the first cooling seat 1, in the pressing process, the first circulating pump 7 carries out circulation flow on cooling liquid in the first cooling fins 8, the first cooling pipes 9 and the first connecting pipes 10, the second cooling seat 6 conducts heat on the circuit board, the heat is in cooling exchange with cooling zone liquid in the first cooling pipes 9, the cooling zone liquid containing the heat flows into the first cooling fins 8, the heat can be effectively transferred into the air through the first cooling fins 8, the problem of reducing the cooling liquid is solved, the second circulating pump 11 carries out circulation flow on cooling liquid in the second cooling fins 12, the second cooling pipes 13 and the cooling liquid in the second cooling pipes 13 and the cooling zone containing the heat can be effectively transferred into the cooling zone 12 through the cooling pipes, and the cooling liquid in the cooling zone 12 can be cooled by the cooling zone in the cooling pipes.
To sum up: this pressfitting cooling device is used in circuit board production carries out top and bottom heat absorption to the circuit board of pressfitting in-process through first cooling seat 1 and second cooling tube 13 to through coolant liquid, first heat radiation fin 8 and the conduction of second heat radiation fin 12 to heat, the heat of circuit board pressfitting in-process can be conducted to the air, and then realizes the efficient cooling of circuit board, guarantees the quality of circuit board pressfitting processing, reduces the generating rate of circuit defective products.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The electrical components are all connected with an external main controller and 220V mains supply, and the main controller can be conventional known equipment for controlling a computer and the like.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. Pressfitting cooling device is used in circuit board production, including first cooling seat (1), its characterized in that: the top of first cooling seat (1) is provided with pressfitting platform (2), and the outside position department that the top of first cooling seat (1) is close to pressfitting platform (2) is through bolt fixedly connected with mount (3), the top central point department of mount (3) is through bolt fixedly connected with cylinder (4), cylinder (4) are through its one side's output fixedly connected with lifter plate (5), the bottom of lifter plate (5) is provided with second cooling seat (6), be connected with first circulating pump (7) through bolt fixedly on one side outer wall of second cooling seat (6), the top of lifter plate (5) is provided with first radiator fin (8), the inside of second cooling seat (6) is provided with first cooling tube (9), all be connected fixedly through first connecting tube (10) between first cooling tube (9) and the first circulating pump (7), be connected with second circulating pump (11) through the bolt fixedly on one side outer wall of first cooling seat (1) through one side of bolt fixedly connected with second circulating pump (11), and first cooling seat (1) is adjacent to second circulating pump (12) and is provided with first radiator fin (12) and is connected with between second radiator fin (12) and the second radiator fin (12), a pressing cavity (15) is formed in the center of the top of the pressing table (2).
2. The press-fit cooling device for circuit board production according to claim 1, wherein: the pressing cavity (15) is matched and matched with the second cooling seat (6).
3. The press-fit cooling device for circuit board production according to claim 1, wherein: the lifting plate (5) is connected with the fixing frame (3) in a sliding manner through a sliding block and a sliding groove.
4. The press-fit cooling device for circuit board production according to claim 1, wherein: the first connecting pipe (10) penetrates through the first radiating fins (8), and the first connecting pipe (10) is communicated and connected with the first radiating fins (8).
5. The press-fit cooling device for circuit board production according to claim 1, wherein: the first radiating fins (8) and the second radiating fins (12) are hollow structures.
6. The press-fit cooling device for circuit board production according to claim 1, wherein: the second connecting pipe (14) penetrates through the second radiating fins (12), and the second connecting pipe (14) is communicated with the second radiating fins (12).
7. The press-fit cooling device for circuit board production according to claim 1, wherein: the cross sections of the first cooling pipe (9) and the second cooling pipe (13) are of S-shaped structures.
8. The press-fit cooling device for circuit board production according to claim 1, wherein: the first cooling fins (8), the first cooling pipes (9), the first connecting pipes (10), the second cooling fins (12), the second cooling pipes (13) and the second connecting pipes (14) are filled with cooling liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321152257.XU CN219938621U (en) | 2023-05-15 | 2023-05-15 | Pressfitting cooling device is used in circuit board production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321152257.XU CN219938621U (en) | 2023-05-15 | 2023-05-15 | Pressfitting cooling device is used in circuit board production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219938621U true CN219938621U (en) | 2023-10-31 |
Family
ID=88504282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321152257.XU Active CN219938621U (en) | 2023-05-15 | 2023-05-15 | Pressfitting cooling device is used in circuit board production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219938621U (en) |
-
2023
- 2023-05-15 CN CN202321152257.XU patent/CN219938621U/en active Active
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