CN215732667U

CN215732667U - Module device capable of realizing batch aging of laser chips

Info

Publication number: CN215732667U
Application number: CN202122170209.0U
Authority: CN
Inventors: 董勤锋; 潘文娟; 董芹焕
Original assignee: Shenzhen Leiyoute Electromechanical Co ltd
Current assignee: Shenzhen Leiyoute Electromechanical Co ltd
Priority date: 2021-09-09
Filing date: 2021-09-09
Publication date: 2022-02-01
Anticipated expiration: 2031-09-09

Abstract

The utility model discloses a module device capable of realizing batch aging of laser chips, which relates to the technical field of chip processing and comprises a red copper water cooling plate and a placing structure arranged at the upper end of the red copper water cooling plate, wherein the surface of a bottom plate is provided with a chip placing groove; the inner side of the chip placing groove is provided with a chip body; the chip standing groove is unanimous with the quantity that adds the electric briquetting setting, and the chip standing groove with add the electric briquetting one-to-one, when using, put the chip body in the chip standing groove, it places on the bottom plate through the bearing uide pin to place the back diaphragm, can be fixed with chip body locking through the electric briquetting that adds that sets up, after the installation, and add and carry out ageing treatment to the chip body, this device is provided with 20 chip standing grooves, can realize once ageing 20 chip bodies simultaneously, ageing efficiency is high, inlet tube and outlet pipe screw thread are installed in the both sides of red copper water-cooling board, the cooling water is intake from the inlet tube, the outlet pipe goes out water, can take away the heat that sends when the chip body is ageing.

Description

Module device capable of realizing batch aging of laser chips

Technical Field

The utility model relates to the technical field of chip processing, in particular to a module device capable of realizing batch aging of laser chips.

Background

Chips or microcircuits, microchips. In electronics, which is a way to miniaturize circuits (mainly including semiconductor devices, also including passive components, etc.) and is often manufactured on the surface of a semiconductor wafer, modular devices are mainly used for functional burn-in of laser chips.

When the existing laser chip is subjected to aging treatment, the aging efficiency is low because a single laser chip is generally aged, and when the laser chip is subjected to aging treatment, the laser chip cannot be radiated, so that the treatment on the chip is easily influenced, and the using effect is poor.

In order to solve the problems, the utility model provides a module device capable of realizing batch aging of laser chips.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a module device capable of realizing batch aging of laser chips, when in use, an operator places a chip body in a chip placing groove, a transverse plate is placed on a bottom plate through a bearing guide pin after the chip body is placed, the chip body can be locked and fixed through a set power-on pressing block, after the chip body is installed, the chip body is powered on to perform aging treatment, the device is provided with 20 chip placing grooves, 20 chip bodies can be aged at one time, the aging efficiency is high, the labor cost is reduced, and therefore the problems in the background technology are solved.

In order to achieve the purpose, the utility model provides the following technical scheme: a module device capable of realizing batch aging of laser chips comprises a red copper water cooling plate and a placing structure arranged at the upper end of the red copper water cooling plate, wherein a heat dissipation structure is arranged on one side of the red copper water cooling plate, and a processing structure is arranged at the upper end of the red copper water cooling plate;

the processing structure comprises a transverse plate arranged at the upper end of the red copper water cooling plate and lifting handles arranged on two sides of the transverse plate, and an electric pressing block is arranged on the lower surface of the transverse plate.

Preferably, the two sides of the red copper water cooling plate are respectively provided with a joint, the joints are connected with the heat dissipation structure, and the red copper water cooling plate is provided with two bearing guide pins.

Preferably, the heat radiation structure comprises a water inlet pipe and a water outlet pipe which are arranged on one side of the red copper water cooling plate, and interface pipes are arranged on one sides of the water inlet pipe and the water outlet pipe.

Preferably, the surface of the mouth-piece is provided with threads, and the mouth-piece is connected with the joint through the threads.

Preferably, the placing structure comprises a bottom plate arranged at the upper end of the red copper water cooling plate and a chip placing groove formed in the surface of the bottom plate.

Preferably, a chip body is disposed inside the chip placement groove.

Preferably, the chip placing grooves are consistent with the number of the power-on pressing blocks, and the chip placing grooves correspond to the power-on pressing blocks one to one.

Compared with the prior art, the utility model has the following beneficial effects:

1. the utility model provides a module device capable of realizing batch aging of laser chips, wherein a chip placing groove is formed in the surface of a bottom plate; the inner side of the chip placing groove is provided with a chip body; the chip standing groove is unanimous with the quantity that adds the briquetting setting, and the chip standing groove with add the briquetting one-to-one, when using, operating personnel puts the chip body in the chip standing groove, it places on the bottom plate through the bearing uide pin to place the back diaphragm, can be fixed with chip body locking through adding the briquetting that adds of setting, after the installation, and add and carry out ageing treatment to the chip body, this device is provided with 20 chip standing grooves, can realize once ageing 20 chip bodies simultaneously, ageing efficiency is high, reduce the cost of labor.

2. The utility model provides a module device capable of realizing batch aging of laser chips, wherein joints are respectively arranged on two sides of a red copper water cooling plate, and interface tubes are respectively arranged on one sides of a water inlet pipe and a water outlet pipe; the surface of mouth-piece is provided with the screw thread, by threaded connection between mouth-piece and the joint, operating personnel aims at the mouth-piece with the mouth-piece and connects, connects through the cooperation of screw thread, can install inlet tube and outlet pipe in the both sides of red copper water-cooling board, and when using, the cooling water is intake from the inlet tube, and the outlet pipe goes out water, can take away the heat that sends when the chip body is ageing, and the radiating effect is good.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic diagram of the water outlet pipe of the present invention after being disassembled;

fig. 3 is an enlarged view of the utility model at a in fig. 2.

In the figure: 1. a red copper water-cooled plate; 11. a joint; 12. a bearing guide pin; 2. a heat dissipation structure; 21. a water inlet pipe; 22. a water outlet pipe; 23. a mouthpiece; 231. a thread; 3. processing the structure; 31. a transverse plate; 32. lifting the handle; 33. adding a voltage block; 4. a placement structure; 41. a base plate; 42. a chip placing groove; 43. the chip body.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, a module device capable of realizing batch aging of laser chips includes a red copper water-cooling plate 1 and a placement structure 4 disposed at an upper end of the red copper water-cooling plate 1, wherein a heat dissipation structure 2 is disposed at one side of the red copper water-cooling plate 1, and a processing structure 3 is disposed at an upper end of the red copper water-cooling plate 1; the power-on aging processing device is used for carrying out power-on aging processing on the laser chip.

Referring to fig. 2 and 3, the processing structure 3 includes a horizontal plate 31 disposed at the upper end of the red copper water-cooling plate 1 and lifting handles 32 disposed at both sides of the horizontal plate 31, and an energizing block 33 is disposed on the lower surface of the horizontal plate 31; the placing structure 4 comprises a bottom plate 41 arranged at the upper end of the red copper water cooling plate 1 and a chip placing groove 42 arranged on the surface of the bottom plate 41; a chip body 43 is provided inside the chip placement groove 42; chip standing groove 42 is unanimous with the quantity that adds electric briquetting 33 and set up, and chip standing groove 42 with add electric briquetting 33 one-to-one, when using, operating personnel puts chip body 43 in chip standing groove 42, it places on bottom plate 41 through bearing uide pin 12 to place back diaphragm 31, can lock chip body 43 fixedly through the electric briquetting 33 that adds that sets up, after the installation, and add and carry out ageing treatment to chip body 43, this device is provided with 20 chip standing grooves 42, 20 chip bodies 43 that once age simultaneously can be realized, it is ageing efficient, and labor cost is reduced.

Referring to fig. 2, two sides of the red copper water-cooling plate 1 are respectively provided with a joint 11, the joints 11 are connected with the heat dissipation structure 2, and two bearing guide pins 12 are installed on the red copper water-cooling plate 1; the heat dissipation structure 2 comprises a water inlet pipe 21 and a water outlet pipe 22 which are arranged on one side of the red copper water cooling plate 1, and interface pipes 23 are arranged on one sides of the water inlet pipe 21 and the water outlet pipe 22; the surface of interface tube 23 is provided with screw thread 231, is connected by screw thread 231 between interface tube 23 and the joint 11, and operating personnel aims at interface tube 23 and connects 11, connects through the cooperation of screw thread 231, can install inlet tube 21 and outlet pipe 22 in the both sides of red copper water-cooling board 1, and when using, the cooling water is intake from inlet tube 21, and outlet pipe 22 goes out water, can take away the heat that sends when chip body 43 ages, and the radiating effect is good.

The working principle is as follows: when using, operating personnel puts chip body 43 in chip standing groove 42, place back diaphragm 31 and place on bottom plate 41 through bearing uide pin 12, can be fixed chip body 43 locking through the power-up briquetting 33 that sets up, after the installation, and power up and carry out ageing treatment to chip body 43, this device is provided with 20 chip standing groove 42, can realize once ageing 20 chip bodies 43 simultaneously, operating personnel aligns joint 11 with interface tube 23, cooperation through screw thread 231 is connected, can install inlet tube 21 and outlet pipe 22 in the both sides of red copper water-cooling board 1, when using, the cooling water is intake from inlet tube 21, outlet pipe 22 goes out water, can take away the heat that chip body 43 sent when ageing.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a can realize ageing module device in batches of laser chip, includes red copper water-cooling board (1) and sets up placing structure (4) in red copper water-cooling board (1) upper end, its characterized in that: a heat dissipation structure (2) is arranged on one side of the red copper water cooling plate (1), and a processing structure (3) is arranged at the upper end of the red copper water cooling plate (1);

the processing structure (3) comprises a transverse plate (31) arranged at the upper end of the red copper water cooling plate (1) and lifting handles (32) arranged on two sides of the transverse plate (31), and an energizing pressing block (33) is arranged on the lower surface of the transverse plate (31).

2. The module device capable of batch burn-in of laser chips according to claim 1, wherein: the two sides of the red copper water cooling plate (1) are respectively provided with a joint (11), the joints (11) are connected with the heat dissipation structure (2), and the red copper water cooling plate (1) is provided with two bearing guide pins (12).

3. The module device capable of batch burn-in of laser chips as claimed in claim 2, wherein: the heat dissipation structure (2) comprises a water inlet pipe (21) and a water outlet pipe (22) which are arranged on one side of the red copper water cooling plate (1), and interface tubes (23) are arranged on one sides of the water inlet pipe (21) and the water outlet pipe (22).

4. The module device capable of realizing batch aging of laser chips according to claim 3, wherein: the surface of the interface tube (23) is provided with threads (231), and the interface tube (23) is connected with the joint (11) through the threads (231).

5. The module device capable of batch burn-in of laser chips according to claim 1, wherein: the placing structure (4) comprises a bottom plate (41) arranged at the upper end of the red copper water cooling plate (1) and a chip placing groove (42) formed in the surface of the bottom plate (41).

6. The module device capable of batch burn-in of laser chips as claimed in claim 5, wherein: the inner side of the chip placing groove (42) is provided with a chip body (43).

7. The module device capable of batch burn-in of laser chips as claimed in claim 6, wherein: the chip placing grooves (42) are consistent with the number of the voltage applying pressing blocks (33), and the chip placing grooves (42) are in one-to-one correspondence with the voltage applying pressing blocks (33).