CN217765303U - Pressure sensor with waterproof function - Google Patents
Pressure sensor with waterproof function Download PDFInfo
- Publication number
- CN217765303U CN217765303U CN202221722160.3U CN202221722160U CN217765303U CN 217765303 U CN217765303 U CN 217765303U CN 202221722160 U CN202221722160 U CN 202221722160U CN 217765303 U CN217765303 U CN 217765303U
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- CN
- China
- Prior art keywords
- circuit board
- pressure sensor
- bonding pads
- sensitive chip
- pressure sensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002184 metal Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000010931 gold Substances 0.000 claims abstract description 4
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 241000218202 Coptis Species 0.000 claims abstract description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 3
- 229920006335 epoxy glue Polymers 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000003750 conditioning effect Effects 0.000 abstract description 5
- 239000012528 membrane Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The invention provides a pressure sensor with waterproof function, which has simple structure, easy assembly and higher waterproof capability, and a user can adopt a self-selected signal conditioning circuit or chip, thereby enlarging the application range of the pressure sensor, the pressure sensor comprises a circuit board, the upper surface of the circuit board is fixedly provided with a metal ring, and the pressure sensor is characterized in that: a pressure sensitive chip is fixedly mounted on the circuit board in the inner cavity of the metal ring, bonding pads of the pressure sensitive chip are respectively connected with first bonding pads on the upper surface of the circuit board through gold wires, the first bonding pads are respectively connected with second bonding pads on the lower surface of the circuit board through via holes, and a through hole is formed in the circuit board right below the pressure sensitive chip; and glue is arranged in the inner chamber and seals the circuit board, the pressure sensitive chip and the gold thread.
Description
Technical Field
The utility model relates to a pressure sensor correlation technique field, concretely relates to take pressure sensor of waterproof function.
Background
The piezoresistive pressure sensor is suitable for the fields of biomedicine, automotive electronics and the like, and the core part of the piezoresistive pressure sensor is a silicon piezoresistive pressure sensitive chip processed by utilizing an MEMS technology. The pressure sensitive chip consists of an elastic membrane and four piezoresistors integrated on the membrane, wherein the four piezoresistors form a Wheatstone bridge structure, and when pressure acts on the elastic membrane, the Wheatstone bridge can generate a voltage output signal which is in linear proportional relation with the applied pressure.
More and more applications place higher demands on the applicability and water resistance of piezoresistive pressure sensors. There is therefore a need to design a new type of pressure sensor to meet the above needs.
Disclosure of Invention
In order to solve the above mentioned problems, the present invention provides a pressure sensor with waterproof function, which has simple structure, easy assembly, high waterproof capability and user-selected signal conditioning circuit or chip, thus increasing the application range of the pressure sensor.
The technical scheme is as follows:
the utility model provides a take pressure sensor of waterproof function, its includes the circuit board, fixed surface installs becket on the circuit board, its characterized in that: a pressure sensitive chip is fixedly mounted on the circuit board in the inner cavity of the metal ring, bonding pads of the pressure sensitive chip are respectively connected with first bonding pads on the upper surface of the circuit board through gold wires, the first bonding pads are respectively connected with second bonding pads on the lower surface of the circuit board through via holes, and a through hole is formed in the circuit board right below the pressure sensitive chip; and glue is arranged in the inner chamber and seals the circuit board, the pressure sensitive chip and the gold thread.
Further, the glue is specifically silicone gel.
Further, the outer side of the metal ring is provided with an annular groove.
Furthermore, the metal ring is fixed on the circuit board through epoxy glue or welding.
Furthermore, the pressure sensitive chip is fixed on the circuit board through epoxy glue.
Furthermore, the number of the bonding pads, the first bonding pads and the second bonding pads of the pressure sensitive chip is 4.
Furthermore, the circuit board is also provided with identification points.
The invention has the beneficial effects that:
the circuit board, the pressure sensitive chip and the gold wire are sealed by glue, so that the pressure sensor has higher waterproof capability; and then, the signal of the pressure sensitive chip is connected to the circuit board through the gold wire, and the circuit board is connected to a signal conditioning circuit or chip selected by an external user through the second bonding pad.
Drawings
FIG. 1 is a schematic exterior view of the overall structure of the present invention;
FIG. 2 is a schematic cross-sectional view of the overall structure of the present invention;
FIG. 3 is a schematic top view of the present invention;
FIG. 4 is a schematic bottom view of the present invention;
FIG. 5 is a schematic view of a metal ring according to the present invention.
Detailed Description
The present invention will be further described with reference to the following examples.
The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention. The conditions in the embodiments can be further adjusted according to specific conditions, and simple modifications of the method of the present invention based on the concept of the present invention are within the scope of the claimed invention.
As shown in fig. 1 to 5, a pressure sensor with a waterproof function includes a circuit board 2, a metal ring 1 is fixedly mounted on an upper surface of the circuit board 2, and the metal ring 1 is fixed on the circuit board 2 by epoxy glue or welding. The outer side of the metal ring 1 is provided with an annular groove 1-2, and the annular groove 1-2 is convenient to mount quickly and can prevent the pressure sensor from falling off in the using process.
A pressure sensitive chip 3 is fixedly mounted on a circuit board 2 in an inner chamber 1-1 of the metal ring 1, and the pressure sensitive chip 3 is fixed on the circuit board 2 through epoxy glue. The number of the bonding pads 3-1, the first bonding pads 2-1 and the second bonding pads 2-2 of the pressure sensitive chip 3 is 4. The bonding pads 3-1 of the pressure sensitive chip 3 are respectively connected with the first bonding pads 2-1 on the upper surface of the circuit board 2 through gold wires 4, the first bonding pads 2-1 are respectively connected with the second bonding pads 2-2 on the lower surface of the circuit board 2 through via holes, and the second bonding pads 2-2 are used for being connected to a signal conditioning circuit or chip selected by an external user. Compared with the prior art that the signal conditioning chip is arranged inside the sensor, the application range and the use flexibility of the pressure sensor are enlarged.
And a circuit board 2 right below the pressure sensitive chip 3 is provided with through holes 2-3. Through the through holes 2-3, the back surface of the pressure sensitive chip 3 can be directly communicated with the atmosphere, and the stability of the sensor is effectively ensured.
The circuit board 2 is also provided with identification points 2-4. The identification point 2-4 is used for positioning the pin 1# on the second bonding pad 2-2, and the second bonding pad 2-2 comprises four bonding pads 1#, 2#, 3#, and 4 #.
The utility model discloses a theory of operation: when the environmental pressure changes, the pressure acts on the pressure sensitive chip 3 through the glue 5, the pressure sensitive chip 3 converts the received pressure signal into a voltage signal and transmits the voltage signal to the circuit board 2, and then the voltage signal is output to an external circuit, a terminal or equipment through the second bonding pad 2-2 on the circuit board 2.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a take pressure sensor of waterproof function, its includes the circuit board, fixed surface installs becket on the circuit board, its characterized in that: a pressure sensitive chip is fixedly mounted on the circuit board in the inner cavity of the metal ring, bonding pads of the pressure sensitive chip are respectively connected with first bonding pads on the upper surface of the circuit board through gold wires, the first bonding pads are respectively connected with second bonding pads on the lower surface of the circuit board through via holes, and a through hole is formed in the circuit board right below the pressure sensitive chip; and glue is arranged in the inner chamber and seals the circuit board, the pressure sensitive chip and the gold thread.
2. The pressure sensor with waterproof function according to claim 1, characterized in that: the glue is specifically silicone gel.
3. The pressure sensor with waterproof function according to claim 1, characterized in that: the outer side of the metal ring is provided with an annular groove.
4. The pressure sensor with waterproof function according to claim 1, characterized in that: the metal ring is fixed on the circuit board through epoxy glue or welding.
5. The pressure sensor with waterproof function according to claim 1, characterized in that: the pressure sensitive chip is fixed on the circuit board through epoxy glue.
6. The pressure sensor with waterproof function according to claim 1, characterized in that: the number of the bonding pads, the first bonding pads and the second bonding pads of the pressure sensitive chip is 4.
7. The pressure sensor with waterproof function according to claim 1, characterized in that: the circuit board is also provided with identification points.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221722160.3U CN217765303U (en) | 2022-07-06 | 2022-07-06 | Pressure sensor with waterproof function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221722160.3U CN217765303U (en) | 2022-07-06 | 2022-07-06 | Pressure sensor with waterproof function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217765303U true CN217765303U (en) | 2022-11-08 |
Family
ID=83872073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221722160.3U Active CN217765303U (en) | 2022-07-06 | 2022-07-06 | Pressure sensor with waterproof function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217765303U (en) |
-
2022
- 2022-07-06 CN CN202221722160.3U patent/CN217765303U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: No. 100-17 Dicui Road, Liyuan Development Zone, Wuxi City, Jiangsu Province, 214000 Patentee after: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd. Address before: 214000 north side of 3 / F podium, building A10, No. 777, Jianshe West Road, Binhu District, Wuxi City, Jiangsu Province Patentee before: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd. |
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| CP02 | Change in the address of a patent holder |