CN217765303U - Pressure sensor with waterproof function - Google Patents

Pressure sensor with waterproof function Download PDF

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Publication number
CN217765303U
CN217765303U CN202221722160.3U CN202221722160U CN217765303U CN 217765303 U CN217765303 U CN 217765303U CN 202221722160 U CN202221722160 U CN 202221722160U CN 217765303 U CN217765303 U CN 217765303U
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China
Prior art keywords
circuit board
pressure sensor
bonding pads
sensitive chip
pressure sensitive
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Active
Application number
CN202221722160.3U
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Chinese (zh)
Inventor
李超
刘同庆
林智敏
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WUXI SENCOCH SEMICONDUCTOR CO Ltd
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WUXI SENCOCH SEMICONDUCTOR CO Ltd
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Priority to CN202221722160.3U priority Critical patent/CN217765303U/en
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Publication of CN217765303U publication Critical patent/CN217765303U/en
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Abstract

The invention provides a pressure sensor with waterproof function, which has simple structure, easy assembly and higher waterproof capability, and a user can adopt a self-selected signal conditioning circuit or chip, thereby enlarging the application range of the pressure sensor, the pressure sensor comprises a circuit board, the upper surface of the circuit board is fixedly provided with a metal ring, and the pressure sensor is characterized in that: a pressure sensitive chip is fixedly mounted on the circuit board in the inner cavity of the metal ring, bonding pads of the pressure sensitive chip are respectively connected with first bonding pads on the upper surface of the circuit board through gold wires, the first bonding pads are respectively connected with second bonding pads on the lower surface of the circuit board through via holes, and a through hole is formed in the circuit board right below the pressure sensitive chip; and glue is arranged in the inner chamber and seals the circuit board, the pressure sensitive chip and the gold thread.

Description

Pressure sensor with waterproof function
Technical Field
The utility model relates to a pressure sensor correlation technique field, concretely relates to take pressure sensor of waterproof function.
Background
The piezoresistive pressure sensor is suitable for the fields of biomedicine, automotive electronics and the like, and the core part of the piezoresistive pressure sensor is a silicon piezoresistive pressure sensitive chip processed by utilizing an MEMS technology. The pressure sensitive chip consists of an elastic membrane and four piezoresistors integrated on the membrane, wherein the four piezoresistors form a Wheatstone bridge structure, and when pressure acts on the elastic membrane, the Wheatstone bridge can generate a voltage output signal which is in linear proportional relation with the applied pressure.
More and more applications place higher demands on the applicability and water resistance of piezoresistive pressure sensors. There is therefore a need to design a new type of pressure sensor to meet the above needs.
Disclosure of Invention
In order to solve the above mentioned problems, the present invention provides a pressure sensor with waterproof function, which has simple structure, easy assembly, high waterproof capability and user-selected signal conditioning circuit or chip, thus increasing the application range of the pressure sensor.
The technical scheme is as follows:
the utility model provides a take pressure sensor of waterproof function, its includes the circuit board, fixed surface installs becket on the circuit board, its characterized in that: a pressure sensitive chip is fixedly mounted on the circuit board in the inner cavity of the metal ring, bonding pads of the pressure sensitive chip are respectively connected with first bonding pads on the upper surface of the circuit board through gold wires, the first bonding pads are respectively connected with second bonding pads on the lower surface of the circuit board through via holes, and a through hole is formed in the circuit board right below the pressure sensitive chip; and glue is arranged in the inner chamber and seals the circuit board, the pressure sensitive chip and the gold thread.
Further, the glue is specifically silicone gel.
Further, the outer side of the metal ring is provided with an annular groove.
Furthermore, the metal ring is fixed on the circuit board through epoxy glue or welding.
Furthermore, the pressure sensitive chip is fixed on the circuit board through epoxy glue.
Furthermore, the number of the bonding pads, the first bonding pads and the second bonding pads of the pressure sensitive chip is 4.
Furthermore, the circuit board is also provided with identification points.
The invention has the beneficial effects that:
the circuit board, the pressure sensitive chip and the gold wire are sealed by glue, so that the pressure sensor has higher waterproof capability; and then, the signal of the pressure sensitive chip is connected to the circuit board through the gold wire, and the circuit board is connected to a signal conditioning circuit or chip selected by an external user through the second bonding pad.
Drawings
FIG. 1 is a schematic exterior view of the overall structure of the present invention;
FIG. 2 is a schematic cross-sectional view of the overall structure of the present invention;
FIG. 3 is a schematic top view of the present invention;
FIG. 4 is a schematic bottom view of the present invention;
FIG. 5 is a schematic view of a metal ring according to the present invention.
Detailed Description
The present invention will be further described with reference to the following examples.
The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention. The conditions in the embodiments can be further adjusted according to specific conditions, and simple modifications of the method of the present invention based on the concept of the present invention are within the scope of the claimed invention.
As shown in fig. 1 to 5, a pressure sensor with a waterproof function includes a circuit board 2, a metal ring 1 is fixedly mounted on an upper surface of the circuit board 2, and the metal ring 1 is fixed on the circuit board 2 by epoxy glue or welding. The outer side of the metal ring 1 is provided with an annular groove 1-2, and the annular groove 1-2 is convenient to mount quickly and can prevent the pressure sensor from falling off in the using process.
A pressure sensitive chip 3 is fixedly mounted on a circuit board 2 in an inner chamber 1-1 of the metal ring 1, and the pressure sensitive chip 3 is fixed on the circuit board 2 through epoxy glue. The number of the bonding pads 3-1, the first bonding pads 2-1 and the second bonding pads 2-2 of the pressure sensitive chip 3 is 4. The bonding pads 3-1 of the pressure sensitive chip 3 are respectively connected with the first bonding pads 2-1 on the upper surface of the circuit board 2 through gold wires 4, the first bonding pads 2-1 are respectively connected with the second bonding pads 2-2 on the lower surface of the circuit board 2 through via holes, and the second bonding pads 2-2 are used for being connected to a signal conditioning circuit or chip selected by an external user. Compared with the prior art that the signal conditioning chip is arranged inside the sensor, the application range and the use flexibility of the pressure sensor are enlarged.
And a circuit board 2 right below the pressure sensitive chip 3 is provided with through holes 2-3. Through the through holes 2-3, the back surface of the pressure sensitive chip 3 can be directly communicated with the atmosphere, and the stability of the sensor is effectively ensured.
Glue 5 is arranged in the inner chamber 1-1, the circuit board 2, the pressure sensitive chip 3 and the gold wire 4 are sealed by the glue 5, and no air bubble can exist in the glue 5. The glue 5 is specifically silicone gel. The glue 5 enables the pressure sensor to have high waterproof capacity.
The circuit board 2 is also provided with identification points 2-4. The identification point 2-4 is used for positioning the pin 1# on the second bonding pad 2-2, and the second bonding pad 2-2 comprises four bonding pads 1#, 2#, 3#, and 4 #.
The utility model discloses a theory of operation: when the environmental pressure changes, the pressure acts on the pressure sensitive chip 3 through the glue 5, the pressure sensitive chip 3 converts the received pressure signal into a voltage signal and transmits the voltage signal to the circuit board 2, and then the voltage signal is output to an external circuit, a terminal or equipment through the second bonding pad 2-2 on the circuit board 2.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a take pressure sensor of waterproof function, its includes the circuit board, fixed surface installs becket on the circuit board, its characterized in that: a pressure sensitive chip is fixedly mounted on the circuit board in the inner cavity of the metal ring, bonding pads of the pressure sensitive chip are respectively connected with first bonding pads on the upper surface of the circuit board through gold wires, the first bonding pads are respectively connected with second bonding pads on the lower surface of the circuit board through via holes, and a through hole is formed in the circuit board right below the pressure sensitive chip; and glue is arranged in the inner chamber and seals the circuit board, the pressure sensitive chip and the gold thread.
2. The pressure sensor with waterproof function according to claim 1, characterized in that: the glue is specifically silicone gel.
3. The pressure sensor with waterproof function according to claim 1, characterized in that: the outer side of the metal ring is provided with an annular groove.
4. The pressure sensor with waterproof function according to claim 1, characterized in that: the metal ring is fixed on the circuit board through epoxy glue or welding.
5. The pressure sensor with waterproof function according to claim 1, characterized in that: the pressure sensitive chip is fixed on the circuit board through epoxy glue.
6. The pressure sensor with waterproof function according to claim 1, characterized in that: the number of the bonding pads, the first bonding pads and the second bonding pads of the pressure sensitive chip is 4.
7. The pressure sensor with waterproof function according to claim 1, characterized in that: the circuit board is also provided with identification points.
CN202221722160.3U 2022-07-06 2022-07-06 Pressure sensor with waterproof function Active CN217765303U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221722160.3U CN217765303U (en) 2022-07-06 2022-07-06 Pressure sensor with waterproof function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221722160.3U CN217765303U (en) 2022-07-06 2022-07-06 Pressure sensor with waterproof function

Publications (1)

Publication Number Publication Date
CN217765303U true CN217765303U (en) 2022-11-08

Family

ID=83872073

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221722160.3U Active CN217765303U (en) 2022-07-06 2022-07-06 Pressure sensor with waterproof function

Country Status (1)

Country Link
CN (1) CN217765303U (en)

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GR01 Patent grant
GR01 Patent grant
CP02 Change in the address of a patent holder

Address after: No. 100-17 Dicui Road, Liyuan Development Zone, Wuxi City, Jiangsu Province, 214000

Patentee after: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd.

Address before: 214000 north side of 3 / F podium, building A10, No. 777, Jianshe West Road, Binhu District, Wuxi City, Jiangsu Province

Patentee before: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd.

CP02 Change in the address of a patent holder