CN211425746U - Differential pressure sensor - Google Patents
Differential pressure sensor Download PDFInfo
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- CN211425746U CN211425746U CN201922240462.1U CN201922240462U CN211425746U CN 211425746 U CN211425746 U CN 211425746U CN 201922240462 U CN201922240462 U CN 201922240462U CN 211425746 U CN211425746 U CN 211425746U
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- 238000007789 sealing Methods 0.000 claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 7
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 6
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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- Pressure Sensors (AREA)
Abstract
The utility model provides a differential pressure sensor, which comprises a packaging structure formed by a shell with an opening at one end and a PCB arranged at the opening end of the shell, wherein a second air inlet hole is arranged on the PCB; a groove is formed in one end, facing the external space of the packaging structure, of the second air inlet hole; a sealing ring is arranged in the groove; and the line diameter of the sealing ring is larger than the depth of the groove. One end, facing the outer space of the packaging structure, of the second air inlet hole in the PCB is changed into a concave structure, so that the second air inlet hole of the differential pressure sensor and the substrate to be tested have extremely high air tightness as long as a small force is applied to the shell of the differential pressure sensor.
Description
Technical Field
The utility model relates to an acoustoelectric technology field, more specifically relates to a differential pressure sensor, especially relates to a novel differential pressure sensor.
Background
The differential pressure sensor is used for testing the pressure difference value as the name implies, the assembly design of the differential pressure sensor needs the two ends of the sensitive membrane to be respectively connected with different air pressure atmospheres, and in order to achieve higher precision, air passages at the two ends need to keep good connectivity with the environment where the differential pressure sensor is located as far as possible, namely when the tightness is good, the air pressure difference can be effectively detected.
The structure of the existing differential pressure sensor mainly depends on applying external force to the shell so as to realize communication and airtightness between the PCB hole of the differential pressure sensor and the substrate to be tested, if the pressure is too small, the communication and airtightness between the PCB hole of the differential pressure sensor and the substrate to be tested are poor, air leakage is easy to occur, the testing precision is low, and even the differential pressure sensor fails, if the pressure is too large, the shell of the differential pressure sensor deforms, the shell collapses, and even the connecting metal wire is short-circuited, so that the product fails.
Fig. 1 illustrates an existing differential pressure sensor structure, as shown in fig. 1, the differential pressure sensor structure includes a package structure formed by a housing 1 ' with an opening at one end and a PCB 2 ', a first air inlet hole 3 ' is formed in the housing 1 ', a second air inlet hole 4 ' is formed in the PCB 2 ', the second air inlet hole 4 ' is cylindrical, and an electronic component 5 ' and a differential pressure MEMS chip 6 ' are arranged on the PCB 2 ', and the electronic component 5 ' and the differential pressure MEMS chip 6 ' are connected by a wire 8 '.
In the differential pressure sensor shown in fig. 1, the second air inlet 4 'is cylindrical, when an external force is applied to the housing 1', if the pressure is too small, the communication and air tightness between the second air inlet 4 'of the differential pressure sensor and the substrate to be tested are poor, air leakage is easy to occur, the test precision is low, and even the test precision is invalid, and if the pressure is too large, the housing 1' of the differential pressure sensor is deformed, the housing is collapsed, even a short circuit of a connecting metal wire is caused, and the product is invalid.
To solve the above problems, a new differential pressure sensor design is needed.
SUMMERY OF THE UTILITY MODEL
In view of the above problem, the utility model aims at providing a new differential pressure sensor to solve when adding external force in the shell, if pressure undersize, then differential pressure sensor's second inlet port and the base plate UNICOM nature and the gas tightness of awaiting measuring are not good, if pressure is too big, then cause the problem that differential pressure sensor shell warp, the shell sinks.
The differential pressure sensor provided by the utility model comprises a packaging structure formed by a shell with an opening at one end and a PCB arranged at the opening end of the shell, and is characterized in that,
a second air inlet hole is formed in the PCB;
a groove is formed in one end, facing the outer space of the packaging structure, of the second air inlet hole;
a sealing ring is arranged in the groove; and the line diameter of the sealing ring is larger than the depth of the groove.
Preferably, an electronic component and a differential pressure MEMS chip are disposed on the PCB.
Preferably, the second air inlet hole corresponds to a position of the differential pressure MEMS chip.
Preferably, a first air inlet hole is arranged on the shell, and the first air inlet hole is arranged in a manner of deviating from the differential pressure MEMS chip.
Preferably, the electronic component and the differential pressure MEMS chip are connected through a lead.
Preferably, the wire is a gold wire.
Preferably, the housing is a metal housing.
Preferably, the housing and the PCB board are fixed to each other by a conductive adhesive.
According to the above technical scheme, the utility model provides a differential pressure sensor changes the spill structure into through the second inlet port on the PCB board towards packaging structure exterior space's one end to be provided with the sealing washer that the line footpath is greater than the groove depth in the recess of spill structure, and the external diameter of sealing washer guarantees to get into the recess, so that as long as through adding external force slightly, just can effectively improve differential pressure sensor's second inlet port and the gas tightness that awaits measuring between the base plate.
Drawings
Other objects and results of the invention will be more apparent and readily appreciated by reference to the following specification taken in conjunction with the accompanying drawings, and as the invention is more fully understood. In the drawings:
FIG. 1 is a schematic cross-sectional view of a conventional differential pressure sensor;
fig. 2 is a schematic cross-sectional structure diagram of a differential pressure sensor according to an embodiment of the present invention;
fig. 3A is a schematic cross-sectional view of a second inlet hole of a differential pressure sensor according to an embodiment of the present invention;
fig. 3B is a top view of a seal ring in a differential pressure sensor according to an embodiment of the present invention.
Wherein the reference numerals include: 1. the device comprises a shell, 2, a PCB (printed Circuit Board), 3, a first air inlet hole, 4, a second air inlet hole, 5, an electronic component, 6, a differential pressure MEMS (micro-electromechanical systems) chip, 7, a lead, 8, a lead, 9, a lead, 10 and a sealing ring; 1 ', a shell, 2 ', a PCB board, 3 ', a first air inlet hole, 4 ', a second air inlet hole, 5 ', an electronic component, 6 ', a differential pressure MEMS chip, 7 ', a lead, 8 ', a lead, 9 ' and a lead.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
Among the current differential pressure sensor, the second inlet port is cylindrical, and when adding external force in the shell, if pressure undersize, then differential pressure sensor's second inlet port and the base plate UNICOM nature and the gas tightness of awaiting measuring are not good, leak gas easily, lead to the measuring accuracy low, and the inefficacy even, if pressure is too big, then cause the differential pressure sensor shell to warp, the shell collapses, causes even to connect the metal wire short circuit, the product inefficacy.
To the above problem, the utility model provides a novel differential pressure sensor, it is right with the accompanying drawing below the specific embodiment of the utility model carries out detailed description.
In order to illustrate the differential pressure sensor provided by the present invention, fig. 2, 3A, and 3B respectively show the structure of the differential pressure sensor exemplarily from different angles. Specifically, fig. 2 shows a differential pressure sensor profile structure according to an embodiment of the present invention; fig. 3A shows a schematic cross-sectional structure view of a second inlet hole of a differential pressure sensor according to an embodiment of the present invention; fig. 3B shows a top view of a seal ring in a differential pressure sensor according to an embodiment of the present invention.
The following description of the exemplary embodiment(s) is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
As shown in fig. 2, the utility model provides a differential pressure sensor, include the packaging structure who forms by one end open-ended shell 1 and PCB board 2, be provided with first inlet port 3 on shell 1, be provided with second inlet port 4 on PCB board 2.
In the embodiment shown in fig. 2, one end of the second air inlet hole 4 facing the external space of the package structure is a concave structure, a portion of the second air inlet hole 4 near the outside is recessed relative to a portion of the inside, a portion of the second air inlet hole 4 near the outside is a large cylinder shape, and a portion of the second air inlet hole 4 near the inside is a small cylinder shape, that is, the cross-sectional view of the second air inlet hole 4 is in a shape of a Chinese character 'tu'.
In the embodiment shown in fig. 2, a sealing ring (not shown in the figure) is arranged in the groove of the concave structure, the linear diameter of the sealing ring is greater than the depth of the groove, the outer diameter of the sealing ring can enter the groove, and the sealing ring can not block the second air inlet 4 after filling the groove, because the linear diameter of the sealing ring is greater than the depth of the groove, namely the sealing ring can protrude out of a part of the groove, or the sealing ring can be higher than the surface of the PCB after filling the groove, by the design, the substrate to be tested is in contact with the differential pressure sensor, the connectivity and the air tightness between the second air inlet 4 of the differential pressure sensor and the substrate to be tested can be ensured without overlarge pressure, so that air leakage is avoided, the influence and even damage of the overlarge pressure on the shell of the differential pressure sensor are avoided from another.
In the embodiment shown in fig. 2, an electronic component 5 and a differential pressure MEMS chip 6 are disposed on a PCB 2 in a package structure, the electronic component 5 and the differential pressure MEMS chip 6 are connected by a wire 8, the electronic component 5 and the PCB 2 are connected by a wire 9, the differential pressure MEMS chip 6 and the PCB 2 are connected by a wire 7, here, the wire 7, the wire 8, the wire 9 are not limited in material, and may be a metal wire, which may be a gold wire, an aluminum wire or a copper wire, further, in order to improve the reliability, corrosion resistance and conductivity of internal signal transmission, the metal wire is a gold wire, when the differential pressure MEMS chip 6 senses the pressure difference between the first air inlet 3 and the second air inlet 4, the pressure signal is output to the ASIC chip through the wire 8.
In the embodiment shown in fig. 2, the second air intake hole 4 of the differential pressure sensor is arranged corresponding to the differential pressure MEMS chip 6, the corresponding position relationship between the second air intake hole 4 and the differential pressure MEMS chip 6 is not particularly limited, and the second air intake hole 4 may be arranged right below the differential pressure MEMS chip 6; the first air inlet 3 of the differential pressure sensor is arranged away from the differential pressure MEMS chip 6, namely the first air inlet 3 and the second air inlet 4 are not overlapped in the vertical direction, so that when the differential pressure sensor can sense pressure, light and/or dust are prevented from entering the differential pressure MEMS chip 6 through the first air inlet 3, and the sensing precision of the differential pressure MEMS chip 6 is guaranteed.
In addition, in the embodiment shown in fig. 2, the electronic component 5 and the differential pressure MEMS chip 6 may be fixed on the PCB board 2 by means of a tape bonding, and the electronic component 5 may be an ASIC chip, but is not limited to the ASIC chip.
In addition, in the embodiment shown in fig. 2, the housing 1 and the PCB board 2 are fixed to each other by conductive adhesive, and the material of the housing 1 is not limited, and is made of metal again.
In the embodiment shown in fig. 2, fig. 3A and fig. 3B, the differential pressure sensor provided by the present invention has the sealing ring 10 disposed in the groove of the concave structure, the sealing ring 10 is ring-shaped, the diameter of the sealing ring 10 is greater than the depth of the groove, that is, the cross section diameter of the sealing ring 10 is greater than the height of the outer portion of the second air inlet 4, the outer diameter of the sealing ring 10 can enter the groove, and the sealing ring 10 can not block the second air inlet 4 after filling the groove, and the sealing ring is not limited in material, because the diameter of the sealing ring 10 is greater than the depth of the groove, it is solved that when an external force is applied to the housing 1, if the pressure is too small, the communication between the second air inlet 4 of the differential pressure sensor and the substrate to be tested is poor in air tightness, air leakage is easy, the test accuracy is low, or even fails, if the pressure is too, even cause the short circuit of connecting metal wire, the problem of product inefficacy, need not too big just can guarantee the connectivity and the gas tightness between the second inlet port 4 of differential pressure sensor and the base plate that awaits measuring.
In the embodiment shown in fig. 2, 3A and 3B of the present invention, the differential pressure MEMS chip 6 deforms according to the pressure difference formed by the first inlet hole 3 and the second inlet hole 4, converts the physical quantity indicating the pressure difference into a pressure signal according to the deformation, and transmits the pressure signal to the electronic component 5 through the metal wire 8, and the pressure signal is processed by the electronic component 5, thereby performing a series of operations.
According to the above embodiment, the utility model provides a differential pressure sensor changes the one end of second inlet port orientation packaging structure exterior space on the PCB board into the spill structure to set up the sealing washer that the line footpath is greater than the groove depth in the recess of spill structure, and the external diameter of sealing washer guarantees to get into the recess, so that as long as add external force slightly to the shell, just can effectively improve differential pressure sensor's second inlet port and the gas tightness between the examination base plate that awaits measuring.
The differential pressure sensor according to the present invention is described above by way of example with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that various modifications may be made to the differential pressure sensor proposed by the present invention without departing from the scope of the invention. Therefore, the scope of the present invention should be determined by the content of the appended claims.
Claims (8)
1. A differential pressure sensor comprises a packaging structure formed by a shell with an opening at one end and a PCB arranged at the opening end of the shell,
a second air inlet hole is formed in the PCB;
a groove is formed in one end, facing the external space of the packaging structure, of the second air inlet hole;
a sealing ring is arranged in the groove; and the line diameter of the sealing ring is larger than the depth of the groove.
2. The differential pressure sensor of claim 1,
and the PCB is provided with an electronic component and a differential pressure MEMS chip.
3. The differential pressure sensor of claim 2,
the second air inlet hole corresponds to the position of the differential pressure MEMS chip.
4. The differential pressure sensor of claim 2,
and a first air inlet is arranged on the shell and deviates from the differential pressure MEMS chip.
5. The differential pressure sensor of claim 2,
and the electronic component is connected with the differential pressure MEMS chip through a lead.
6. The differential pressure sensor of claim 5,
the wire is a gold wire.
7. The differential pressure sensor according to any one of claims 1 to 6,
the shell is a metal shell.
8. The differential pressure sensor according to any one of claims 1 to 6,
the shell and the PCB are mutually fixed through conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922240462.1U CN211425746U (en) | 2019-12-13 | 2019-12-13 | Differential pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922240462.1U CN211425746U (en) | 2019-12-13 | 2019-12-13 | Differential pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211425746U true CN211425746U (en) | 2020-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922240462.1U Active CN211425746U (en) | 2019-12-13 | 2019-12-13 | Differential pressure sensor |
Country Status (1)
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| CN (1) | CN211425746U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112444339A (en) * | 2020-11-09 | 2021-03-05 | 青岛歌尔智能传感器有限公司 | Differential pressure sensor test fixture and differential pressure sensor test system |
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2019
- 2019-12-13 CN CN201922240462.1U patent/CN211425746U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112444339A (en) * | 2020-11-09 | 2021-03-05 | 青岛歌尔智能传感器有限公司 | Differential pressure sensor test fixture and differential pressure sensor test system |
| CN112444339B (en) * | 2020-11-09 | 2022-06-21 | 青岛歌尔智能传感器有限公司 | Differential pressure sensor test fixture and differential pressure sensor test system |
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