CN209310974U - A kind of pressure transmitter based on MEMS sensor - Google Patents
A kind of pressure transmitter based on MEMS sensor Download PDFInfo
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- CN209310974U CN209310974U CN201920138891.5U CN201920138891U CN209310974U CN 209310974 U CN209310974 U CN 209310974U CN 201920138891 U CN201920138891 U CN 201920138891U CN 209310974 U CN209310974 U CN 209310974U
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- mems sensor
- encapsulating housing
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Abstract
The utility model discloses a kind of pressure transmitters based on MEMS sensor, including encapsulating housing, for the MEMS sensor chip of detection pressure signal, asic chip with several circuit modules, for the single-chip microcontroller for detecting the temperature detection chip of temperature signal and dealing with to the signal detected, the intracavity bottom of the encapsulating housing is equipped with ceramic circuit-board, the MEMS sensor chip, asic chip and temperature detection chip are fixed on ceramic circuit-board, the top of the encapsulating housing is equipped with several ventilation holes, the diameter of the ventilation hole is gradually reduced by the interior of encapsulating housing, the MEMS sensor chip, temperature detection chip is electrically connected by ceramic circuit-board and asic chip, the asic chip passes through the single-chip microcontroller outside circuit and encapsulating housing It is electrically connected, the utility model has the following beneficial effects: influence of the temperature change to MEMS sensor can be reduced, while the temperature value being able to detect that around MEMS sensor working environment.
Description
Technical field
The invention belongs to pressure test technical field more particularly to a kind of pressure transmitters based on MEMS sensor.
Background technique
Improved day by day with microelectronics and micromachining technology, IC manufacturing technology is introduced into precision machinery manufacture, out
The micro-machinings such as micromechanics, microsensor, micro actuator are showed.Wherein micromachine controls processing circuit with it
It integrates, forms MEMS-MEMS ((Microelectro Mechanical Systems).Have in the system
Close minute-pressure pressure sensor, have the characteristics that small in size, light weight and cost is low, it is low in energy consumption, be easily integrated and intelligence, especially
It is that its micron dimension characteristic size makes this minute-pressure pressure sensor obtain more and more applications.
Existing MEMS pressure sensor is not usually direct to be contacted with extraneous measured medium, generally uses silicone oil or encapsulation
Flexible glue is medium transferring structure, and MEMS sensor is encapsulated in metal shell, and filling silicon oil or encapsulation flexible glue pass through silicone oil
Perhaps encapsulation flexible glue by pressure conduction to sensor core on piece since the silicone oil of filling or encapsulation flexible glue can be produced by temperature change
Raw pressure, and the heat dissipation performance of whole device is bad, is easy to have an impact measurement result, existing MEMS pressure sensor exists
Measured pressure value obtains while being unable to complete the measurement to temperature signal.
Summary of the invention
In view of the above deficiencies, the present invention provides a kind of pressure transmitter based on MEMS sensor, temperature can be reduced
Change the influence to MEMS sensor, while the temperature value being able to detect that around MEMS sensor working environment.
The present invention is achieved by the following technical solutions: a kind of pressure transmitter based on MEMS sensor, including envelope
Dress shell, the MEMS sensor chip for detection pressure signal, the asic chip with several circuit modules, for detecting temperature
The single-chip microcontroller spending the temperature detection chip of signal and dealing with to the signal detected, the intracavity bottom of the encapsulating housing
Equipped with ceramic circuit-board, the MEMS sensor chip, asic chip and temperature detection chip are fixed on ceramic circuit-board,
The top of the encapsulating housing is equipped with several ventilation holes, and the diameter of the ventilation hole is gradually subtracted by the interior of encapsulating housing
Small, the MEMS sensor chip, temperature detection chip are electrically connected by ceramic circuit-board and asic chip, the ASIC core
Piece is electrically connected by the single-chip microcontroller outside circuit and encapsulating housing.
As a preferred technical solution of the present invention, the asic chip is equipped with analog-digital converter and amplifier.
It further include for MEMS sensor chip, asic chip and monolithic as a preferred technical solution of the present invention
The power module of machine offer power supply.
It further include the alarm module being connect with single-chip microcontroller and radio communication mold as a preferred technical solution of the present invention
Block.
As a preferred technical solution of the present invention, the encapsulating housing both sides external is equipped with metal pins.
Compared with prior art, the invention has the benefit that
1, MEMS sensor chip, asic chip and temperature detection chip are arranged in the same encapsulating housing, no
It can only complete to test environment pressure detecting, while the temperature of the working environment of MEMS sensor chip can be carried out real-time
Monitoring；
2, the timely circulation of encapsulating housing inside and outside gas, MEMS sensor can effectively be realized by the way that ventilation hole is arranged
Chip is directly contacted with tested extraneous medium, can accurately incude extraneous pressure, improves the spirit of minute-pressure pressure sensor
Sensitivity, while heat dissipation performance is good, since the diameter of ventilation hole is gradually reduced by the interior of encapsulating housing, can play
Good dustproof effect.
Detailed description of the invention
Fig. 1 is the principle of the present invention block diagram；
Fig. 2 is structural schematic diagram of the invention (cross-sectional view)；
Fig. 3 is structural schematic diagram of the invention (front view).
Reference signs list: 1, encapsulating housing；2, MEMS sensor chip；3, asic chip 3；4, temperature detection chip；
5, ceramic circuit-board；6, ventilation hole；7, metal pins.
Specific embodiment
With reference to the accompanying drawings and detailed description, the present invention is furture elucidated, it should be understood that following specific embodiments are only
For illustrating the present invention rather than limiting the scope of the invention.It should be noted that word " preceding " used in the following description,
" rear ", "left", "right", "up" and "down" refer to that the direction in attached drawing, word "inner" and "outside" refer respectively to direction or remote
Direction from geometric center of specific component.
A kind of pressure transmitter based on MEMS sensor as shown in Figure 1, Figure 2 and Figure 3, including encapsulating housing 1, for visiting
The MEMS sensor chip 2 of measuring pressure signal, the asic chip 3 with several circuit modules, the temperature for detecting temperature signal
The intracavity bottom of degree detection chip 4 and the single-chip microcontroller dealt with to the signal detected, the encapsulating housing 1 is equipped with ceramics
Wiring board 5, the MEMS sensor chip 2, asic chip 3 and temperature detection chip 4 are fixed on ceramic circuit-board 5, institute
The top for stating encapsulating housing 1 is equipped with several ventilation holes 6, the diameter of the ventilation hole 6 by encapsulating housing 1 interior gradually
Reduce, can effectively realize the timely circulation of 1 inside and outside gas of encapsulating housing, MEMS sensor core by the way that ventilation hole 6 is arranged
Piece 2 is directly contacted with tested extraneous medium, can accurately incude extraneous pressure, improves the sensitive of minute-pressure pressure sensor
Degree, while heat dissipation performance is good, since the diameter of ventilation hole 6 is gradually reduced by the interior of encapsulating housing 1, can play
Good dustproof effect, the MEMS sensor chip 2, temperature detection chip 4 pass through 3 electricity of ceramic circuit-board 5 and asic chip
Property connection, the asic chip 3 is electrically connected by the single-chip microcontroller outside circuit and encapsulating housing 1.
As a kind of embodiment of the invention, the asic chip 3 is equipped with analog-digital converter and amplifier, passes through encapsulation
Ventilation hole 6 on shell, MEMS sensor chip are directly contacted with tested extraneous medium, can accurately incude extraneous pressure
Power, when MEMS sensor chip detects pressure signal, and temperature detection chip detects temperature signal, by pressure signal and temperature
Degree signal is transmitted to asic chip, and received analog signal is converted into digital signal by the analog-digital converter on asic chip, and
Amplified digital signal is passed into single-chip microcontroller, single-chip microcontroller increases by exporting current pressure value and temperature value after processing
Temperature detection chip, can monitor the temperature of the working environment of MEMS sensor chip in real time.
It further include being mentioned for MEMS sensor chip 2, asic chip 3 and single-chip microcontroller as a kind of embodiment of the invention
The power module of power supply source.
Further include the alarm module and wireless communication module being connect with single-chip microcontroller as a kind of embodiment of the invention, leads to
Cross single-chip microcontroller can preset maximum pressure value, when detect pressure value be greater than preset maximum pressure value when can start alarm module, increase
If the pressure value of output and temperature value can be transmitted to remote monitoring platform by wireless communication module, realizes that pressure value obtains and remotely supervise
Control.
As a kind of embodiment of the invention, 1 both sides external of encapsulating housing is equipped with metal pins 7.
Finally, it should be noted that being not intended to restrict the invention the foregoing is merely preferred embodiment of the invention, to the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, for those skilled in the art, still can be with
It modifies the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.It is all
Within the spirit and principles in the present invention, any modification, equivalent replacement, improvement and so on should be included in guarantor of the invention
Within the scope of shield.
Claims (5)
1. a kind of pressure transmitter based on MEMS sensor, it is characterised in that: including encapsulating housing, be used to detection pressure signal
MEMS sensor chip, the asic chip with several circuit modules, for detect the temperature detection chip of temperature signal with
And to the single-chip microcontroller that the signal detected is dealt with, the intracavity bottom of the encapsulating housing is equipped with ceramic circuit-board, described
MEMS sensor chip, asic chip and temperature detection chip are fixed on ceramic circuit-board, the top of the encapsulating housing
Equipped with several ventilation holes, the diameter of the ventilation hole is gradually reduced by the interior of encapsulating housing, the MEMS sensor
Chip, temperature detection chip are electrically connected by ceramic circuit-board and asic chip, and the asic chip passes through circuit and encapsulation
Single-chip microcontroller outside shell is electrically connected.
2. the pressure transmitter according to claim 1 based on MEMS sensor, it is characterised in that: the asic chip
It is equipped with analog-digital converter and amplifier.
3. the pressure transmitter according to claim 1 based on MEMS sensor, it is characterised in that: further include for MEMS
Sensor chip, asic chip and single-chip microcontroller provide the power module of power supply.
4. the pressure transmitter according to claim 1 based on MEMS sensor, it is characterised in that: further include and monolithic
The alarm module and wireless communication module of machine connection.
5. the pressure transmitter according to claim 1 based on MEMS sensor, it is characterised in that: the encapsulating housing
Both sides external is equipped with metal pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920138891.5U CN209310974U (en) | 2019-01-28 | 2019-01-28 | A kind of pressure transmitter based on MEMS sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920138891.5U CN209310974U (en) | 2019-01-28 | 2019-01-28 | A kind of pressure transmitter based on MEMS sensor |
Publications (1)
| Publication Number | Publication Date |
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| CN209310974U true CN209310974U (en) | 2019-08-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920138891.5U Active CN209310974U (en) | 2019-01-28 | 2019-01-28 | A kind of pressure transmitter based on MEMS sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109668678A (en) * | 2019-01-28 | 2019-04-23 | 安徽天康(集团)股份有限公司 | A kind of pressure transmitter based on MEMS sensor |
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2019
- 2019-01-28 CN CN201920138891.5U patent/CN209310974U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109668678A (en) * | 2019-01-28 | 2019-04-23 | 安徽天康(集团)股份有限公司 | A kind of pressure transmitter based on MEMS sensor |
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