CN217239178U - Anti-static thick film chip resistor - Google Patents

Abstract

The utility model discloses an antistatic thick film wafer resistor, including casing and resistor subassembly, the casing comprises upper casing and lower casing, and upper casing and lower casing are fixed through the screw, are provided with the resistor subassembly in upper casing and lower casing, the resistor subassembly includes porcelain base plate and cermet layer, and the upper end of porcelain base plate is equipped with the cermet layer, has the pin at the lower extreme fixed mounting of porcelain base plate, the surface and the internal surface of upper casing and lower casing all are scribbled antistatic layer, have L type stabilizer blade in the both ends welding of lower casing, have seted up the mounting hole that is used for fixing on two L type stabilizer blades; the utility model discloses an all scribble antistatic layer and played antistatic effect to the device at the surface of last casing and lower casing and internal surface, played syllable-dividing effect through setting up the cavity, during the noise that the utilization sound absorption hole can produce the device during operation was poured into the cavity, carries out noise absorption by the abatvoix in the cavity again.

Description

Anti-static thick film chip resistor

Technical Field

The utility model relates to a thick film resistance equipment technical field especially relates to antistatic thick film wafer resistor.

Background

The thick film resistor is mainly a resistor printed by adopting a thick film process, has a rectangular shape, a strip shape, a curved shape or other shapes, is commonly used in the manufacture of precision resistors and power resistors, and comprises a ceramic substrate, pins and paste with a resistor effect, wherein the paste mainly comprises an adhesive and metal ceramics;

traditional thick film resistor can receive the influence of static when storing or installing and lead to electronic component to damage and influence the use, is not convenient for noise absorption, is not convenient for dispel the heat, consequently, the utility model provides an antistatic thick film wafer resistor is in order to solve the problem that exists among the prior art.

SUMMERY OF THE UTILITY MODEL

To the above problem, the utility model aims to provide an antistatic thick film wafer resistor, this antistatic thick film wafer resistor is convenient for antistatic, the noise absorption of being convenient for, the heat dissipation of being convenient for.

For realizing the purpose of the utility model, the utility model discloses a following technical scheme realizes: antistatic thick film wafer resistor, including casing and resistor subassembly, the casing comprises last casing and lower casing, goes up the casing and fixes through the screw with lower casing, is provided with the resistor subassembly in the inside of last casing with casing down, the resistor subassembly includes porcelain base plate and cermet layer, and the upper end of porcelain base plate is equipped with the cermet layer, has the pin at the lower extreme fixed mounting of porcelain base plate, go up the casing and the surface and the internal surface of casing down all have coated the antistatic layer, and L type stabilizer blade has all been welded at the both ends of casing down, offers on two L type stabilizer blades to be used for fixed mounting hole.

The further improvement lies in that: the inside of lower casing is seted up the tray that is used for installing the porcelain base plate, offers the spacing groove that is used for fixed porcelain base plate at the tray and porcelain base plate's contact surface.

The further improvement lies in that: the lower extreme fixed mounting of going up the casing has the fixture block, goes up the casing and carries out the block through counterpoint piece cooperation draw-in groove and lower casing and be connected, and the internal surface size of draw-in groove matches each other with the surface size of fixture block.

The further improvement lies in that: the mounting groove that is used for installing radiator unit is seted up at the both ends of going up the casing, and radiator unit includes heat-conducting plate and fin, and one side fixed mounting of heat-conducting plate has the fin, the end of fin runs through the mounting groove and extends to the outside of supreme casing, has connect heat-resisting silica gel cover at the end cap of fin, the surface of heat-resisting silica gel cover closely laminates with the internal surface of mounting groove.

The further improvement lies in that: the interior of the upper shell and the interior of the lower shell are both designed in a cavity mode, sound absorption holes are formed in the inner surfaces of the upper shell and the lower shell, and sound absorption plates are fixedly mounted inside the cavities.

The further improvement lies in that: the outside of pin has cup jointed the rubber lag, the one end and the porcelain base plate fixed mounting of rubber lag, and the other end of rubber lag runs through to the outside of casing down.

The utility model has the advantages that: the utility model has the advantages that the antistatic layer is coated on the outer surface and the inner surface of the upper shell and the lower shell to play an antistatic effect on the device, the antistatic effect of the device is further improved by coating the antistatic layer on the inner surface and the outer surface of the upper shell and the lower shell, thereby playing a protection effect on the resistor component in the device, the limit effect on the ceramic substrate is played by arranging the support block, the resistor component is convenient for a user to install, the user can align the upper shell and the lower shell conveniently by arranging the clamping block and the matching clamping groove, thereby the screw is conveniently screwed in to fix the upper shell and the lower shell at the later stage, the heat dissipation effect is played on the resistor component in the device by arranging the heat dissipation component, the influence of the overhigh temperature in the device on the resistance value of the resistor component is avoided, along with the high temperature generated during the work of the resistor component, the temperature can be collected by the heat conduction plate, the heat dissipation plate is poured into after the collection to transfer the heat dissipation plate to the outside of the device to finish the heat dissipation, playing syllable-dividing effect through setting up the cavity, utilizing the sound absorbing hole can pour the noise that the device during operation produced into the cavity, carry out noise absorption by the abatvoix in the cavity again, played the effect of protection to the pin through setting up rubber lag, avoided pin department atress fracture.

Drawings

FIG. 1 is a front sectional view of the present invention;

FIG. 2 is a schematic structural view of part A of FIG. 1;

fig. 3 is a schematic view of a part structure of the middle heat dissipation assembly of the present invention.

Wherein: 1. an upper housing; 2. a lower housing; 3. a ceramic substrate; 4. a cermet layer; 5. a pin; 6. an antistatic layer; 7. an L-shaped leg; 8. mounting holes; 9. a support block; 10. a limiting groove; 11. a clamping block; 12. a card slot; 13. mounting grooves; 14. a heat conducting plate; 15. a heat sink; 16. a heat-resistant silica gel sleeve; 17. a sound absorption hole; 18. a sound-absorbing panel; 19. a rubber protective sleeve.

Detailed Description

In order to deepen the understanding of the present invention, the following embodiments will be combined to make the present invention do further details, and the present embodiment is only used for explaining the present invention, and does not constitute the limitation of the protection scope of the present invention.

Example one

Referring to fig. 1 to 3, the present embodiment provides an antistatic thick film chip resistor, including a housing and a resistor assembly, the housing is composed of an upper housing 1 and a lower housing 2, the upper housing 1 and the lower housing 2 are fixed by screws, the resistor assembly is disposed inside the upper housing 1 and the lower housing 2, the resistor assembly includes a ceramic substrate 3 and a metal ceramic layer 4, the metal ceramic layer 4 is disposed on the upper end of the ceramic substrate 3, pins 5 are fixedly mounted on the lower end of the ceramic substrate 3, antistatic layers 6 are coated on the outer surface and the inner surface of the upper housing 1 and the lower housing 2, L-shaped support legs 7 are welded on both ends of the lower housing 2, mounting holes 8 for fixing are formed on the two L-shaped support legs 7, the antistatic effect is achieved by coating the antistatic layers 6 on the outer surface and the inner surface of the upper housing 1 and the lower housing 2, the antistatic effect of the device is further improved by coating the antistatic layers 6 on the inner surface and the outer surface, thereby protecting the resistor component inside the device.

The inside of casing 2 is offered down and is used for installing the tray 9 of porcelain base plate 3, offers the spacing groove 10 that is used for fixed porcelain base plate 3 at the contact surface of tray 9 and porcelain base plate 3, has played spacing effect to porcelain base plate 3 through setting up tray 9, has been convenient for the user to install the resistor subassembly.

Go up the lower extreme fixed mounting of casing 1 and have fixture block 11, go up casing 1 and carry out the block through counterpoint piece cooperation draw-in groove 12 and casing 2 down and be connected, and the internal surface size of draw-in groove 12 matches each other with the surface size of fixture block 11, has been convenient for the user to go up casing 1 and casing 2 down and has counterpointed through setting up fixture block 11 cooperation draw-in groove 12 to it will go up casing 1 and casing 2 down to twist the screw and fix to be convenient for the later stage.

Go up the mounting groove 13 that the both ends of casing 1 offered and be used for installing radiator unit, radiator unit includes heat-conducting plate 14 and fin 15, one side fixed mounting of heat-conducting plate 14 has fin 15, the end of fin 15 runs through mounting groove 13 and extends to the outside of casing 1, it has heat-resisting silica gel cover 16 to cup joint at the end of fin 15, the surface of heat-resisting silica gel cover 16 is closely laminated with the internal surface of mounting groove 13, radiating effect has been played device internal resistor subassembly through setting up radiator unit, the resistance value of having avoided device internal temperature too high to resistor subassembly produces the influence, along with the high temperature that resistor subassembly during operation produced, the temperature can be collected by heat-conducting plate 14, pour into fin 15 after the collection and have fin 15 to transmit to the device outside and accomplish the heat dissipation.

Go up casing 1 and casing 2's inside and be cavity formula design, all seted up sound-absorbing hole 17 at the internal surface of last casing 1 and casing 2 down, and the inside fixed mounting of cavity has sound-absorbing board 18, has played syllable-dividing effect through setting up the cavity, utilizes sound-absorbing hole 17 to pour the noise that the device during operation produced into the cavity, carries out noise absorption by sound-absorbing board 18 in the cavity again.

The rubber protection sleeve 19 has been cup jointed to pin 5's outside, and rubber protection sleeve 19's one end and 3 fixed mounting of porcelain base plate, rubber protection sleeve 19's the other end run through to casing 2's outside down, have played the effect of protection to pin 5 through setting up rubber protection sleeve 19, have avoided pin 5 department atress fracture.

When the device is used, the device is firstly fixed on a circuit board through the L-shaped support legs 7, then the resistor component in the device is welded on the circuit board through the pins 5, the installation process of the device is completed at the moment, heat is generated along with the continuous accumulation of the working duration of the resistor component, the heat can be utilized, the heat is collected by the heat conducting plate 14, the collected heat is guided into the radiating fins 15, the radiating fins 15 are transmitted to the outside of the device to complete the radiation, the pins 5 of the resistor assembly are protected by the L-shaped legs 7 in a first step in case of a crash of the device, and subsequently protected by a second step using a rubber boot 19, which is cushioned by the malleability of the rubber material, the antistatic layer 6 can be used to prevent static electricity from being applied to the outside of the device when the device is mounted or works after being mounted, so that the use process of the antistatic thick film chip resistor is completed.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. Antistatic thick film wafer resistor includes casing and resistor subassembly, its characterized in that: the casing comprises last casing (1) and casing (2) down, goes up casing (1) and fixes through the screw with casing (2) down, is provided with the resistor subassembly at the inside of last casing (1) and casing (2) down, the resistor subassembly includes porcelain base plate (3) and cermet layer (4), and the upper end of porcelain base plate (3) is equipped with cermet layer (4), has pin (5) at the lower extreme fixed mounting of porcelain base plate (3), go up the surface and the internal surface of casing (1) and casing (2) down and all scribble antistatic layer (6), all weld L type stabilizer blade (7) at the both ends of casing (2) down, offer mounting hole (8) that are used for fixing on two L type stabilizer blades (7).

2. The antistatic thick film wafer resistor of claim 1, wherein: the ceramic substrate fixing device is characterized in that a supporting block (9) used for mounting the ceramic substrate (3) is arranged in the lower shell (2), and a limiting groove (10) used for fixing the ceramic substrate (3) is formed in the contact surface of the supporting block (9) and the ceramic substrate (3).

3. The antistatic thick film wafer resistor of claim 1, wherein: go up the lower extreme fixed mounting of casing (1) and have fixture block (11), go up casing (1) and carry out the block through counterpoint piece cooperation draw-in groove (12) and be connected with lower casing (2), and the internal surface size of draw-in groove (12) matches each other with the surface size of fixture block (11).

4. The antistatic thick film wafer resistor of claim 1, wherein: go up the both ends of casing (1) and offer mounting groove (13) that are used for installing radiator unit, radiator unit includes heat-conducting plate (14) and fin (15), and one side fixed mounting of heat-conducting plate (14) has fin (15), the end of fin (15) runs through mounting groove (13) and extends to the outside of casing (1), has connect heat-resisting silica gel cover (16) at the end cap of fin (15), the surface of heat-resisting silica gel cover (16) closely laminates with the internal surface of mounting groove (13).

5. The antistatic thick film wafer resistor of claim 1, wherein: the interior of the upper shell (1) and the interior of the lower shell (2) are both designed in a cavity mode, sound absorption holes (17) are formed in the inner surfaces of the upper shell (1) and the lower shell (2), and sound absorption plates (18) are fixedly mounted in the cavities.

6. The antistatic thick film wafer resistor of claim 1, wherein: the outside of pin (5) has cup jointed rubber lag (19), the one end and the porcelain base plate (3) fixed mounting of rubber lag (19), and the other end of rubber lag (19) runs through to the outside of casing (2) down.

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