CN220041875U - Optoelectronic device packaging structure - Google Patents

Abstract

The utility model discloses an optoelectronic device packaging structure, which comprises a base, wherein a shell is arranged on the upper side of the base, an optoelectronic element is arranged on the upper surface of the base, a heat-conducting graphite film is arranged on the upper side of the optoelectronic element, a heat-conducting carbon fiber layer is arranged on the upper side of the heat-conducting graphite film, the heat-conducting carbon fiber layer, the heat-conducting graphite film and the optoelectronic element are all positioned in the shell, a heat dissipation cover is arranged at the upper end of the shell, heat dissipation patterns are uniformly distributed in the heat dissipation cover, and the heat dissipation cover and the heat dissipation patterns are attached to the heat-conducting carbon fiber layer; through the radiating line, heat conduction carbon fiber layer and the heat conduction graphite film of design, optoelectronic component gives off heat when using, can absorb and the level leads out through the heat conduction graphite film, reduces the phenomenon that appears local overheated, and cooperation heat conduction carbon fiber layer and the directional heat conduction's of radiating line effect make the heat distribute away fast simultaneously, thereby reduces the inside temperature and guarantees optoelectronic component's life.

Description

Optoelectronic device packaging structure

Technical Field

The utility model belongs to the technical field of packaging, and particularly relates to an optoelectronic device packaging structure.

Background

With the continued development of mems devices and microelectronic integrated circuits, electronic packaging plays a number of roles, meeting the requirements of chemical and atmospheric environments. With the rapid development of the microelectronics industry, the application of electronic packaging and electronic sintering technology in the field will have to be greatly increased. The importance of packaging to protect circuit functions is decreasing due to the improved quality of the passivation layer of the chip.

Along with the increasing speed of chips and increasing power in the existing optoelectronic device packaging technology, the heat dissipation problem of the chips is more and more serious, the heat dissipation effect is poorer after packaging, and the service life of electronic elements is influenced by long-time operation in an environment with higher temperature, so that the optoelectronic device packaging structure needs to be designed to solve the problems.

Disclosure of Invention

The present utility model is directed to an optoelectronic device package structure, which solves the above-mentioned problems of the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an optoelectronic device packaging structure, includes the base, the upside of base is provided with the shell, the upper surface of base is provided with optoelectronic component, optoelectronic component's upside is provided with the heat conduction graphite membrane, the upside of heat conduction graphite membrane is provided with the heat conduction carbon fiber layer, heat conduction graphite membrane and optoelectronic component all are located inside the shell, the upper end of shell is provided with the heat dissipation lid, the inside evenly distributed of heat dissipation lid has the heat dissipation line, heat dissipation lid and heat dissipation line all laminate on the heat conduction carbon fiber layer.

Preferably, the lower surface of the heat-conducting graphite film is attached to the upper surface of the optoelectronic element.

Preferably, pins are arranged on two sides of the optoelectronic element, and one end of each pin penetrates through the optoelectronic element.

Preferably, the lower side of the shell is provided with a mounting groove corresponding to the position of the pin, the upper side of the pin is provided with a limiting protrusion, and the limiting protrusion is clamped in the mounting groove.

Preferably, the upper side edge of the base is provided with a limiting piece, and the limiting piece and the mounting groove are arranged in a staggered mode.

Preferably, a clamping groove is formed in the inner side of the lower end of the shell and corresponds to the position of the limiting piece.

Compared with the prior art, the utility model has the beneficial effects that:

1. through the radiating line, heat conduction carbon fiber layer and the heat conduction graphite film of design, optoelectronic component gives off heat when using, can absorb and the level leads out through the heat conduction graphite film, reduces the phenomenon that appears local overheated, and cooperation heat conduction carbon fiber layer and the directional heat conduction's of radiating line effect make the heat distribute away fast simultaneously, thereby reduces the inside temperature and guarantees optoelectronic component's life.

2. Through spacing arch and spacing piece of design, fix a position the shell through spacing piece when using, it is spacing to the pin through spacing arch to make pin and shell more stable when the installation is used.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the internal structure of the present utility model;

FIG. 3 is a schematic diagram of a lead mounting structure according to the present utility model;

in the figure: 1. a base; 2. a housing; 3. pins; 4. a heat-dissipating cover; 5. heat dissipation lines; 6. a thermally conductive carbon fiber layer; 7. a thermally conductive graphite film; 8. an optoelectronic component; 9. a limiting piece; 10. a mounting groove; 11. and a limit protrusion.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Embodiment one:

referring to fig. 1 to 3, the present utility model provides a technical solution: the utility model provides an optoelectronic device packaging structure, including base 1, the upside of base 1 is provided with shell 2, the upper surface of base 1 is provided with optoelectronic component 8, the upside of optoelectronic component 8 is provided with heat conduction graphite film 7, the upside of heat conduction graphite film 7 is provided with heat conduction carbon fiber layer 6, heat conduction graphite film 7 and optoelectronic component 8 all are located shell 2 inside, the upper end of shell 2 is provided with heat dissipation lid 4, the inside evenly distributed of heat dissipation lid 4 has heat dissipation line 5, heat dissipation lid 4 and heat dissipation line 5 all laminate on heat conduction carbon fiber layer 6, optoelectronic component 8 gives off heat and absorbs and gives off horizontally through heat conduction graphite film 7, then outwards heat conduction through heat conduction carbon fiber layer 6 orientation, then cooperate heat dissipation lid 4 and heat dissipation line 5 to give off fast; the lower surface of the heat-conducting graphite film 7 is attached to the upper surface of the optoelectronic element 8, so that the heat absorption of the heat-conducting graphite film 7 on the optoelectronic element 8 is convenient during use; pins 3 are arranged on two sides of the optoelectronic element 8, and one end of each pin 3 penetrates through the optoelectronic element 8, so that the optoelectronic element is conveniently connected to a using position during use.

From the above description, the present utility model has the following advantageous effects: when the photoelectric element 8 emits heat in use, the heat can be absorbed through the heat-conducting graphite film 7 and horizontally led out, the phenomenon of local overheating is reduced, meanwhile, the heat is rapidly emitted by matching with the directional heat conduction effect of the heat-conducting carbon fiber layer 6 and the heat dissipation patterns 5, and the internal temperature is reduced, so that the service life of the photoelectric element 8 is ensured.

Embodiment two:

referring to fig. 1 to 3, on the basis of the first embodiment, the present utility model provides a technical solution: the lower side of the shell 2 is provided with a mounting groove 10 corresponding to the position of the pin 3, the upper side of the pin 3 is provided with a limiting protrusion 11, the limiting protrusion 11 is clamped in the mounting groove 10, and the pin 3 is positioned and limited by the limiting protrusion 11 clamped in the mounting groove 10, so that the phenomenon that the pin 3 is damaged due to stress is reduced, the upper side edge of the base 1 is provided with limiting sheets 9, and the limiting sheets 9 and the mounting groove 10 are arranged in a staggered manner, so that the limiting sheets 9 are convenient to be matched with the mounting groove 10 to position the pin 3; the clamping groove is formed in the inner side of the lower end of the shell 2 and corresponds to the position of the limiting piece 9, so that the shell 2 is positioned more stably when the device is used.

By adopting the technical scheme, the limiting protrusion 11 and the limiting piece 9 are used for positioning the shell 2 through the limiting piece 9, and the pin 3 is limited through the limiting protrusion 11, so that the pin 3 and the shell 2 are more stable in installation and use.

The working principle and the using flow of the utility model are as follows: when the photoelectric element 8 is packaged in use, the photoelectric element 8 is only required to be mounted on the base 1, the shell 2 is covered on the edge of the base 1, the limiting sheets 9 are clamped on the inner side of the lower end of the shell 2 and positioned, meanwhile, the pins 3 on two sides of the photoelectric element 8 are clamped in the mounting grooves 10, the pins 3 are positioned and limited in the mounting grooves 10 through the limiting protrusions 11, so that the damage phenomenon of the pins 3 is reduced, the heat conducting graphite film 7 and the heat conducting carbon fiber layer 6 are sequentially attached to the upper surface of the photoelectric element 8, the heat radiating cover 4 is covered on the shell 2, the heat radiating cover 4 and the internal heat radiating grains 5 are attached to the upper surface of the heat conducting carbon fiber layer 6, and when the photoelectric element 8 is used, heat is absorbed and horizontally radiated through the heat conducting graphite film 7, then is outwards conducted through the orientation of the heat conducting carbon fiber layer 6, and then the heat radiating cover 4 and the heat radiating grains 5 are matched to be radiated rapidly.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The foregoing is merely illustrative of the present utility model and not restrictive, and other modifications and equivalents thereof may occur to those skilled in the art without departing from the spirit and scope of the present utility model.

Claims (6)

1. An optoelectronic device package structure comprising a base (1), characterized in that: the upper side of base (1) is provided with shell (2), the upper surface of base (1) is provided with photoelectron element (8), the upside of photoelectron element (8) is provided with heat conduction graphite membrane (7), the upside of heat conduction graphite membrane (7) is provided with heat conduction carbon fiber layer (6), heat conduction graphite membrane (7) and photoelectron element (8) all are located inside shell (2), the upper end of shell (2) is provided with heat dissipation lid (4), the inside evenly distributed of heat dissipation lid (4) has heat dissipation line (5), heat dissipation lid (4) and heat dissipation line (5) all laminate on heat conduction carbon fiber layer (6).

2. An optoelectronic device package as set forth in claim 1 wherein: the lower surface of the heat-conducting graphite film (7) is attached to the upper surface of the optoelectronic element (8).

3. An optoelectronic device package as set forth in claim 1 wherein: pins (3) are arranged on two sides of the optoelectronic element (8), and one end of each pin (3) penetrates through the optoelectronic element (8).

4. An optoelectronic device package as set forth in claim 1 wherein: the lower side of shell (2) corresponds the position of pin (3) and is provided with mounting groove (10), the upside of pin (3) is provided with spacing protruding (11), spacing protruding (11) block is in mounting groove (10).

5. An optoelectronic device package as set forth in claim 1 wherein: the upper side edge of the base (1) is provided with a limiting piece (9), and the limiting piece (9) and the mounting groove (10) are arranged in a staggered mode.

6. An optoelectronic device package as set forth in claim 1 wherein: the inner side of the lower end of the shell (2) is provided with a clamping groove corresponding to the position of the limiting piece (9).