CN218772555U

CN218772555U - Thick copper multilayer circuit board

Info

Publication number: CN218772555U
Application number: CN202222711907.1U
Authority: CN
Inventors: 黄享名; 周敏; 黄享武; 黄祥旭
Original assignee: Dongguan Hongxin Circuit Co ltd
Current assignee: Dongguan Hongxin Circuit Co ltd
Priority date: 2022-10-14
Filing date: 2022-10-14
Publication date: 2023-03-28
Anticipated expiration: 2032-10-14

Abstract

The utility model discloses a thick copper multilayer circuit board, including the inner plating, outer plywood, lower part are all installed to inner plating upper end and lower extreme outer plywood lower extreme support device is installed to outer plywood lower extreme, inner plating and two outer plywood left ends and right-hand member install jointly and prevent inclined to one side device, prevent that inclined to one side device left end lower part and right-hand member lower part all install the mounting panel, two the installation screw is all installed at the anterior and upper end rear portion in mounting panel upper end, prevent that inclined to one side device upper end left part and upper end right part install heat abstractor jointly. A thick copper multilayer circuit board, not only make things convenient for the circuit board to carry out the pressfitting through preventing inclined to one side device, also prevent simultaneously that multilayer circuit board from the inclined to one side phenomenon of layer can appear when the pressfitting, have better rigidity through a reinforcing plate on the strutting arrangement and No. two reinforcing plates, and then can reduce the crooked degree of circuit board, through radiator fan on graphite fin and the heat abstractor and then improved the heat dispersion of circuit board.

Description

Thick copper multilayer circuit board

Technical Field

The utility model relates to a circuit board technical field, in particular to thick copper multilayer circuit board.

Background

The circuit board is also called as a circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper plate, an impedance board and the like, and the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. Especially, in the rapid development of electronic information technology, the multilayer circuit board has better performance than the single-layer board, and thus the multilayer circuit board is used more and more.

The prior patent (application number 202122912050.5) discloses an ultra-thick copper high-temperature-resistant multilayer circuit board, wherein the phenomena of structural offset and inaccurate installation of the multilayer circuit board during superposition and pressing operation are also provided, and an auxiliary positioning and installation reinforcing penetrating structure is not provided, so that the accuracy of the circuit board structure in operation pressing is reduced, and the structural firmness of circuit board installation overlapping heating is also reduced; in addition, as the circuits on the circuit board are more and more precise, once the circuit board is scratched or bent by force, the circuits on the circuit board are affected, and the using effect of the circuit board is further affected. In summary, the conventional multilayer wiring board has the following problems:

1. the phenomena of structural deviation and inaccurate installation easily occur during the overlapping and pressing operation of the multilayer circuit board; 2. once the circuit board is scratched or bent by force, the circuit board can be affected, and the using effect of the circuit board is further affected.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims at providing a thick copper multilayer circuit board, which can effectively solve the problems that the multilayer circuit board is easy to have structural deviation and inaccurate installation during the superposition and pressing operation; once the circuit board is scratched or bent by force, the circuit board can be affected, and the using effect of the circuit board is further affected.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a thick copper multilayer circuit board, includes the inner plating, outer plywood is all installed to inner plating upper end and lower extreme, the lower part strutting arrangement is installed to outer plywood lower extreme, inner plating and two outer plywood left ends and right-hand member are installed jointly and are prevented inclined to one side device, the mounting panel is all installed to prevent inclined to one side device left end lower part and right-hand member lower part, two the installation screw is all installed at mounting panel upper end front portion and upper end rear portion, prevent that inclined to one side device upper end left part and upper end right part install heat abstractor jointly.

Preferably, the anti-deviation device comprises a mounting frame and a mounting frame II, screw holes are formed in the front portion of the upper end of the mounting frame and the rear portion of the upper end of the mounting frame II, a supporting plate and two clamping columns are installed on the front portion of the upper end of the supporting plate and the rear portion of the upper end of the supporting plate respectively, and the mounting frame II are installed at the left end and the right end of the inner layer plate respectively. Carry out the chucking spacing to a plurality of circuit boards through the card post, not only make things convenient for the circuit board to carry out the pressfitting, also prevent simultaneously that multilayer circuit board from the phenomenon that the layer is inclined to one side can appear when the pressfitting, and then improved the pressfitting quality of device.

Preferably, the supporting device comprises a graphite radiating fin, the front end and the rear end of the graphite radiating fin are both provided with two reinforcing plates, the left end and the right end of the graphite radiating fin are both provided with one reinforcing plate, the upper ends of the two reinforcing plates are both provided with an adhesive layer, and the graphite radiating fin is arranged at the lower end of the lower outer plate. The first reinforcing plate and the second reinforcing plate are fixed at the lower end of the circuit board through the bonding layers on the first reinforcing plate and the second reinforcing plate, and when the circuit board is bent under the action of external force, the first reinforcing plate and the second reinforcing plate have good rigidity, so that the bending degree of the circuit board can be reduced.

Preferably, heat abstractor is including protecting the support body, two fixed screws are all installed to protection support body upper end left part and upper end right part, protection support body upper end mid-mounting has radiator fan, the protection support body passes through fixed screw and installs in mounting bracket and No. two mounting bracket upper ends. Can protect circuit board upper portion through the protection support body to improve the life of circuit board, rotate through radiator fan moreover and blow, and then dispel the heat to circuit board upper portion, and then improved the heat dispersion of circuit board.

Preferably, a gap is formed between the heat dissipation fan and the upper outer plate.

Preferably, the fixing screw corresponds to the screw hole up and down.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. when the circuit board need carry out coincidence, pressfitting operation, place required circuit board in proper order four card post upper ends on preventing inclined to one side device, carry out the chucking through the card post to a plurality of circuit boards spacing, not only make things convenient for the circuit board to carry out the pressfitting, also prevent that multilayer circuit board can appear the inclined to one side phenomenon of layer when the pressfitting simultaneously, and then improved the pressfitting quality of device.

2. The first reinforcing plate and the second reinforcing plate on the supporting device are fixed at the lower end of the circuit board through the bonding layers on the first reinforcing plate and the second reinforcing plate, when the circuit board is bent by external force, the first reinforcing plate and the second reinforcing plate have good rigidity, so that the bending degree of the circuit board can be reduced, and when the upper portion of the circuit board is rubbed by the outside, the upper portion of the circuit board can be protected through the protection frame body on the heat dissipation device, so that the service life of the circuit board is prolonged.

3. When the circuit board is hot, the graphite radiating fins are a brand-new heat conducting and radiating material, have unique crystal grain orientation, conduct heat uniformly along two directions, and the lamellar structure can be well adapted to any surface, can radiate the lower part of the circuit board, and simultaneously rotates and blows through the radiating fan to radiate the upper part of the circuit board, so that the radiating performance of the circuit board is improved.

Drawings

Fig. 1 is a schematic view of the overall structure of a thick copper multilayer circuit board of the present invention;

fig. 2 is a schematic view of the whole structure of the anti-deviation device of the thick copper multilayer circuit board of the present invention;

fig. 3 is a schematic view of the overall structure of the supporting device of the thick copper multilayer circuit board of the present invention;

fig. 4 is a schematic view of the overall structure of the heat dissipation device of the thick copper multilayer circuit board of the present invention.

In the figure: 1. an inner layer board; 2. a deviation prevention device; 3. a support device; 4. a heat sink; 6. an outer plate; 7. mounting a plate; 8. mounting screws; 20. a first mounting rack; 21. a second mounting rack; 22. a screw hole; 23. a support plate; 24. clamping the column; 30. a graphite heat sink; 31. a first reinforcing plate; 32. a second reinforcing plate; 33. an adhesive layer; 40. a protective frame body; 41. fixing screws; 42. a heat dissipation fan.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "provided," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

As shown in fig. 1-4, a thick copper multilayer circuit board comprises an inner layer board 1, outer laminates 6 are installed at the upper end and the lower end of the inner layer board 1, a supporting device 3 is installed at the lower end of the lower outer laminate 6, an anti-deviation device 2 is installed at the left end and the right end of the inner layer board 1 and the left ends and the right ends of the two outer laminates 6 together, mounting plates 7 are installed at the lower part of the left end and the lower part of the right end of the anti-deviation device 2, mounting screws 8 are installed at the front parts and the rear parts of the upper ends of the two mounting plates 7, and heat dissipation devices 4 are installed at the left part and the right part of the upper end of the anti-deviation device 2 together.

Prevent inclined to one side device 2 and include mounting bracket 20 and No. two mounting brackets 21, screw hole 22 has all been opened to the anterior and upper end rear portion in the upper end of mounting bracket 20 and No. two mounting brackets 21, and backup pad 23 is all installed to the one end lower part that mounting bracket 20 and No. two mounting brackets 21 correspond, and card post 24 is all installed to anterior and the upper end rear portion in two backup pads 23 upper ends, and mounting bracket 20 and No. two mounting brackets 21 are installed respectively at 1 left end of inner plating and right-hand member. As a specific implementation manner, in this embodiment, the plurality of circuit boards are clamped and limited by the clamping columns 24, so that the circuit boards are not only convenient to press, but also prevented from being laminated partially when the multilayer circuit boards are pressed, and the pressing quality of the device is further improved.

Strutting arrangement 3 includes graphite fin 30, and No. two reinforcing plates 32 are all installed to graphite fin 30 front end and rear end, and No. one reinforcing plate 31 is all installed to graphite fin 30 left end and right-hand member, and bond line 33 is all installed to two reinforcing plates 31 and No. two reinforcing plates 32 upper ends, and graphite fin 30 is installed at the outer 6 lower extremes of plates in lower part. As a specific implementation manner, in the present embodiment, the first reinforcing plate 31 and the second reinforcing plate 32 are fixed at the lower end of the circuit board through the adhesive layer 33 thereon, and when the circuit board is bent by an external force, the first reinforcing plate 31 and the second reinforcing plate 32 have better rigidity, so that the bending degree of the circuit board can be reduced.

The heat dissipation device 4 comprises a protection frame body 40, two fixing screws 41 are respectively arranged at the left part and the right part of the upper end of the protection frame body 40, a heat dissipation fan 42 is arranged in the middle of the upper end of the protection frame body 40, and the protection frame body 40 is arranged at the upper ends of the first mounting frame 20 and the second mounting frame 21 through the fixing screws 41; in a specific embodiment, the protective frame body 40 is mounted on the upper ends of the first mounting frame 20 and the second mounting frame 21 in a screw fixing manner; a gap is formed between the heat radiation fan 42 and the upper outer plate 6; the fixing screw 41 is vertically aligned with the screw hole 22. As a specific implementation manner, in this embodiment, the upper portion of the circuit board can be protected by the protection frame body 40, so that the service life of the circuit board is prolonged, and the heat dissipation fan 42 rotates to blow air, so as to dissipate heat from the upper portion of the circuit board, thereby improving the heat dissipation performance of the circuit board.

It should be noted that, the utility model relates to a thick copper multilayer circuit board, when the circuit board needs to coincide, when the pressfitting operation, place required circuit board in proper order in four card post 24 upper ends on preventing inclined to one side device 2, it is spacing to carry out the chucking to a plurality of circuit boards through card post 24, not only make things convenient for the circuit board to carry out the pressfitting, also prevent multilayer circuit board simultaneously and can appear the phenomenon that the layer is inclined to one side when the pressfitting, and then the pressfitting quality of device has been improved, and fix the lower extreme at the circuit board through bond line 33 on first reinforcing plate 31 and No. two reinforcing plates 32 on strutting arrangement 3, when the circuit board receives external force and buckles, have better rigidity through first reinforcing plate 31 and No. two reinforcing plates 32, and then can reduce the bending degree of circuit board, and when circuit board upper portion receives outside to cut and rub, can protect circuit board upper portion through protection support body 40 on heat abstractor 4, thereby the life of circuit board has been improved, dispel the heat through graphite cooling fin 30 and radiator fan 42 to circuit board upper portion simultaneously, and then improved the heat dispersion of circuit board.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A thick copper multilayer circuit board, includes inner plating (1), its characterized in that: outer plywood (6) are all installed to inner plating (1) upper end and lower extreme, the lower part strutting arrangement (3) are installed to outer plywood (6) lower extreme, install anti-deviation device (2) jointly with two outer plywood (6) left ends and right-hand member to inner plating (1), mounting panel (7), two are all installed to anti-deviation device (2) left end lower part and right-hand member lower part mounting panel (7) upper end front portion and upper end rear portion all install installation screw (8), prevent that heat abstractor (4) are installed jointly to anti-deviation device (2) upper end left part and upper end right part.

2. The thick copper multilayer circuit board of claim 1, wherein: prevent inclined to one side device (2) including mounting bracket (20) and No. two mounting bracket (21), screw hole (22) have all been opened to mounting bracket (20) and No. two mounting bracket (21) upper end front portion and upper end rear portion, backup pad (23), two are all installed to the one end lower part that mounting bracket (20) and No. two mounting bracket (21) correspond backup pad (23) upper end front portion and upper end rear portion all install card post (24), mounting bracket (20) and No. two mounting bracket (21) are installed respectively at inner plating (1) left end and right-hand member.

3. The thick copper multilayer circuit board of claim 1, wherein: strutting arrangement (3) include graphite fin (30), no. two reinforcing plates (32) are all installed to graphite fin (30) front end and rear end, reinforcing plate (31) are all installed to graphite fin (30) left end and right-hand member, two bond line (33) are all installed to reinforcing plate (31) and No. two reinforcing plate (32) upper ends, install outer plywood (6) lower extreme in lower part in graphite fin (30).

4. A thick copper multilayer circuit board according to claim 2, wherein: heat abstractor (4) is including protection support body (40), two fixed screws (41) are all installed to protection support body (40) upper end left part and upper end right part, protection support body (40) upper end mid-mounting has radiator fan (42), protection support body (40) are installed in mounting bracket (20) and No. two mounting bracket (21) upper ends through fixed screw (41).

5. The thick copper multilayer circuit board of claim 4, wherein: a gap is formed between the heat radiation fan (42) and the upper outer plate (6).

6. The thick copper multilayer circuit board of claim 4, wherein: the fixing screws (41) correspond to the screw holes (22) up and down.