CN220985922U - PCB printed circuit board resin hole plugging structure - Google Patents
PCB printed circuit board resin hole plugging structure Download PDFInfo
- Publication number
- CN220985922U CN220985922U CN202322626062.0U CN202322626062U CN220985922U CN 220985922 U CN220985922 U CN 220985922U CN 202322626062 U CN202322626062 U CN 202322626062U CN 220985922 U CN220985922 U CN 220985922U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- plate
- heat
- pcb printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011347 resin Substances 0.000 title claims abstract description 38
- 229920005989 resin Polymers 0.000 title claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000741 silica gel Substances 0.000 claims abstract description 16
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 16
- 230000001681 protective effect Effects 0.000 claims abstract description 11
- 238000001816 cooling Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 230000002950 deficient Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229920002379 silicone rubber Polymers 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a resin plug hole structure of a PCB (printed circuit board), which comprises a metal substrate for manufacturing a circuit board, an aluminum sheet plate fixedly arranged at the top end of the metal substrate, and a protective plate arranged at the bottom end of the metal substrate, wherein an air guide base plate is fixedly arranged at the bottom end of the protective plate, through holes are formed in the inner walls of the metal substrate and the aluminum sheet plate, a cavity is formed in the protective plate, and heat-conducting silica gel strips are fixedly arranged at the top end and the bottom end in the protective plate. This PCB printed circuit board resin hole plugging structure through setting up protection shield, heat conduction silica gel strip, heat collecting plate, outer guide arm and fin for this device can play good heat dissipation effect when using, can give off the heat on the metal substrate fast, reduces metal substrate's temperature, avoids the resin to be in the high temperature state for a long time, reduces the defective rate of hole plugging, brings convenience for the user, has improved the practicality of this device.
Description
Technical Field
The utility model relates to the technical field of a PCB (printed circuit board) resin plug hole structure, in particular to a PCB resin plug hole structure.
Background
With the continuous update of electronic product technology, the structure and mounting mode of electronic chips are also continuously improved and changed. The development has been essentially from components with package pins to highly dense integrated circuit modules employing ball-type matrix arrangement of solder joints, thereby extending the POFV process which uses resin to plug vias.
The patent number (CN 219514293U) discloses a PCB printed circuit board resin hole plugging structure, which is characterized in that a blocking film is arranged below a main board part and is used for supporting resin columns in small-aperture through holes and large-aperture through holes, and the blocking film is provided with air holes corresponding to the positions of the small-aperture through holes and the large-aperture through holes, so that the problem of adhesion of surface resin of dense small holes during hole plugging can be solved, and the problem that hole plugging cannot be realized due to the outflow of large-aperture through hole plugging resin can be solved.
However, when the PCB printed circuit board resin plug hole structure is used, the PCB printed circuit board resin plug hole structure does not have a corresponding heat dissipation structure, and as the resin needs to be dried and solidified, the resin is in a high-temperature state for a long time after being heated, the resin can be lost, so that the poor situation of the plug hole is caused, inconvenience is brought to a user, and the use requirement of the user cannot be met.
Disclosure of utility model
The utility model aims to provide a resin plug hole structure of a PCB (printed circuit board) so as to solve the problems that the prior art provides a resin plug hole structure of the PCB, when in use, the resin is required to be dried and solidified, and the resin is in a high-temperature state for a long time after being heated, so that the resin is lost, the situation of poor plug hole is caused, inconvenience is brought to a user, and the use requirement of the user cannot be met.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a PCB printed circuit board resin jack structure, includes the metal base plate that is used for making the circuit board, fixed aluminum sheet board that sets up in metal base plate top, sets up the protection shield in metal base plate bottom, the bottom mounting of protection shield is provided with the air guide backing plate, the through-hole has all been seted up to the inner wall of metal base plate and aluminum sheet board, the cavity has been seted up to the inside of protection shield, the top in the protection shield and the bottom are all fixed to be provided with heat conduction silica gel strip, and the fixed heat collecting plate that is provided with in one side that two upper and lower heat conduction silica gel strips are relative, the front and back surface of heat collecting plate is all fixed and is provided with outer guide arm.
Further, the number of the through holes is a plurality of, and the through holes, the metal base plate and the aluminum sheet are integrally designed.
Further, an exhaust groove is formed in the air guide base plate at a position corresponding to the through hole.
Further, an air flow groove is formed in the protective plate, and the air flow groove and the through hole are in an intercommunication type design.
Further, the number of the heat-conducting silica gel strips is a plurality of, and every two heat-conducting silica gel strips are designed at equal distance.
Further, the heat collecting plate is made of aluminum, and the thickness of the heat collecting plate is 0.5MM.
Further, one side of the front outer guide rod and the rear outer guide rod, which are opposite, penetrate through the protection plate and extend to the outside of the protection plate, and the outer guide rods are fixedly connected with the protection plate.
Further, the outer surface of the outer guide rod is provided with cooling fins in a surrounding mode.
Compared with the prior art, the utility model has the beneficial effects that:
This PCB printed circuit board resin hole plugging structure through setting up protection shield, heat conduction silica gel strip, heat collecting plate, outer guide arm and fin for this device can play good heat dissipation effect when using, can give off the heat on the metal substrate fast, reduces metal substrate's temperature, avoids the resin to be in the high temperature state for a long time, reduces the defective rate of hole plugging, brings convenience for the user, has improved the practicality of this device, has satisfied user's user demand.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a cross-sectional view of the structure of the present utility model;
FIG. 3 is an enlarged schematic view of a portion of FIG. 1A;
Fig. 4 is an enlarged partial schematic view of B in fig. 2.
In the figure: 1. a metal substrate; 2. an aluminum sheet plate; 3. a protective plate; 4. an air guide pad; 5. a through hole; 6. a thermally conductive silicone strip; 7. a heat collecting plate; 8. an outer guide rod; 9. an exhaust groove; 10. a gas flow groove; 11. a heat sink.
Detailed Description
The utility model will now be further described by way of specific examples with reference to the accompanying drawings, which are given by way of illustration only and not by way of limitation.
Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a PCB printed circuit board resin jack structure, including the metal base plate 1 that is used for making the circuit board, metal base plate 1 is used for setting up corresponding subassembly, the fixed aluminum sheet board 2 that sets up in metal base plate 1 top, aluminum sheet board 2 is used for playing the effect of protecting metal base plate 1, the protection shield 3 of setting in metal base plate 1 bottom, protection shield 3 can play the effect of protection, the bottom mounting of protection shield 3 is provided with air guide cushion board 4, air guide cushion board 4 plays the effect of supporting and air guide, through-hole 5 has all been seted up to the inner wall of metal base plate 1 and aluminum sheet board 2, through-hole 5 is used for setting up the circuit, the cavity has been seted up to the inside of protection shield 3, the top and the bottom in the protection shield 3 are all fixed and are provided with heat conduction silicon rubber strip 6, heat conduction silicon rubber strip 6 plays the effect of heat conduction, the fixed heat collecting plate 7 that is provided with in the relative one side of upper and lower two heat conduction silicon rubber strips 6, the front and back surface of heat collecting plate 7 is all fixed and is provided with outer guide arm 8, outer guide arm 8 plays the effect of heat conduction.
Further, the number of the through holes 5 is a plurality, and the through holes 5, the metal substrate 1 and the aluminum sheet 2 are integrally designed, wherein the through holes 5 can be used for arranging circuits.
Further, an exhaust slot 9 is provided in the air guiding plate 4 corresponding to the through hole 5, wherein the exhaust slot 9 plays an exhaust role.
Furthermore, the protection board 3 is provided with an air flow groove 10 inside, and the air flow groove 10 and the through hole 5 are in an intercommunication design, wherein the air flow groove 10 is convenient for air circulation.
Furthermore, the number of the heat-conducting silica gel strips 6 is a plurality of, and each two heat-conducting silica gel strips 6 are designed at equal distance, wherein the heat-conducting silica gel strips 6 can play a role in heat conduction.
Further, the heat collecting plate 7 is made of aluminum, and the thickness of the heat collecting plate 7 is 0.5MM, wherein the heat collecting plate 7 can function to collect heat.
Further, the opposite sides of the front and rear outer guide rods 8 penetrate through the protection plate 3 and extend to the outside thereof, and the outer guide rods 8 are fixedly connected with the protection plate 3, wherein the outer guide rods 8 can transfer heat.
Further, the outer surface of the outer guide rod 8 is circumferentially provided with cooling fins 11, wherein the cooling fins 11 can play a role in heat dissipation.
Working principle: when the device is used, the protective plate 3 is arranged at the bottom end of the metal substrate 1, resin can be prevented from losing, heat transmitted to the protective plate 3 can be guided by the heat conducting silica gel strip 6, the heat is transmitted to the heat collecting plate 7, and the heat transmitted to the heat collecting plate 7 can be emitted outwards through the radiating fins 11 of the outer guide rod 8, so that the resin can be cooled rapidly.
The working process can be known as follows:
This PCB printed circuit board resin hole plugging structure through setting up protection shield 3, heat conduction silica gel strip 6, heat collecting plate 7, outer guide arm 8 and fin 11 for this device can play good heat dissipation effect when using, can give off the heat on the metal substrate 1 fast, reduces the temperature of metal substrate 1, avoids the resin to be in the high temperature state for a long time, reduces the defective rate of hole plugging, brings convenience for the user, has improved the practicality of this device, has satisfied user's user demand.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a PCB printed circuit board resin hole plugging structure, is including being used for making metal base plate (1) of circuit board, fixed aluminum sheet board (2) that set up in metal base plate (1) top, protection shield (3) of setting in metal base plate (1) bottom, its characterized in that: the bottom mounting of protection shield (3) is provided with air guide backing plate (4), through-hole (5) have all been seted up to the inner wall of metal base plate (1) and aluminum sheet board (2), the cavity has been seted up to the inside of protection shield (3), the top in protection shield (3) and the bottom are all fixed to be provided with heat conduction silica gel strip (6), and the fixed heat collecting plate (7) that is provided with in one side that upper and lower two heat conduction silica gel strips (6) are relative, the front and back surface of heat collecting plate (7) is all fixed and is provided with outer guide arm (8).
2. The PCB printed circuit board resin plug hole structure of claim 1, wherein: the number of the through holes (5) is a plurality, and the through holes (5) are designed integrally with the metal base plate (1) and the aluminum sheet plate (2).
3. The PCB printed circuit board resin plug hole structure of claim 1, wherein: an exhaust groove (9) is formed in the air guide base plate (4) at a position corresponding to the through hole (5).
4. The PCB printed circuit board resin plug hole structure of claim 1, wherein: the inside of the protection board (3) is provided with a flow groove (10), and the flow groove (10) and the through hole (5) are in an intercommunication design.
5. The PCB printed circuit board resin plug hole structure of claim 1, wherein: the number of the heat-conducting silica gel strips (6) is a plurality of, and every two heat-conducting silica gel strips (6) are designed at equal distance.
6. The PCB printed circuit board resin plug hole structure of claim 1, wherein: the heat collecting plate (7) is made of aluminum, and the thickness of the heat collecting plate (7) is 0.5MM.
7. The PCB printed circuit board resin plug hole structure of claim 1, wherein: the front and rear outer guide rods (8) penetrate through the protective plate (3) from opposite sides and extend to the outer parts of the protective plate, and the outer guide rods (8) are fixedly connected with the protective plate (3).
8. The PCB printed circuit board resin plug hole structure of claim 1, wherein: the outer surface of the outer guide rod (8) is circumferentially provided with cooling fins (11).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322626062.0U CN220985922U (en) | 2023-09-27 | 2023-09-27 | PCB printed circuit board resin hole plugging structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322626062.0U CN220985922U (en) | 2023-09-27 | 2023-09-27 | PCB printed circuit board resin hole plugging structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN220985922U true CN220985922U (en) | 2024-05-17 |
Family
ID=91061630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202322626062.0U Active CN220985922U (en) | 2023-09-27 | 2023-09-27 | PCB printed circuit board resin hole plugging structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN220985922U (en) |
-
2023
- 2023-09-27 CN CN202322626062.0U patent/CN220985922U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN220985922U (en) | PCB printed circuit board resin hole plugging structure | |
CN208110512U (en) | A kind of radiator for PCH chip | |
CN210692518U (en) | Heat radiation structure of power amplifier device | |
CN201278625Y (en) | Heat radiation apparatus for power amplifier | |
CN213213952U (en) | PCB assembly with good heat dissipation performance | |
CN214901442U (en) | High-precision PCB metallized half-hole circuit board | |
CN213583756U (en) | Electronic chip packaging structure | |
CN211671048U (en) | Composite multilayer PCB with heat radiation structure | |
CN201418229Y (en) | A radiation device | |
CN217114373U (en) | Integrated circuit packaging heat dissipation device | |
CN220774347U (en) | Integrated circuit chip packaging structure | |
CN221379354U (en) | Semiconductor chip structure | |
CN220858733U (en) | Direct contact type heat radiation module | |
CN218217806U (en) | Integrated circuit substrate capable of conducting heat in double layers | |
CN221575896U (en) | Aluminum radiator structure with pocked pits on surface | |
CN218004833U (en) | IC packaging carrier plate | |
CN215991724U (en) | Circuit board with heat dissipation function | |
CN219577349U (en) | Auxiliary heat dissipation device for circuit board installation | |
CN218888762U (en) | Circuit board with heat dissipation function | |
CN211980601U (en) | Circuit board convenient to heat dissipation | |
CN219718875U (en) | Clamping type processor | |
CN218299507U (en) | Breakdown-preventing network transformer shell | |
CN216744266U (en) | Heat radiation structure and circuit board used by LED lamp | |
CN220965269U (en) | Moistureproof circuit board | |
CN221886786U (en) | Circuit board convenient to heat dissipation |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |