CN220965269U - Moistureproof circuit board - Google Patents
Moistureproof circuit board Download PDFInfo
- Publication number
- CN220965269U CN220965269U CN202322762215.4U CN202322762215U CN220965269U CN 220965269 U CN220965269 U CN 220965269U CN 202322762215 U CN202322762215 U CN 202322762215U CN 220965269 U CN220965269 U CN 220965269U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board body
- sponge
- moisture
- moistureproof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims abstract description 19
- 229910001628 calcium chloride Inorganic materials 0.000 claims abstract description 19
- 239000001110 calcium chloride Substances 0.000 claims abstract description 19
- 239000002245 particle Substances 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 239000008187 granular material Substances 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 238000010521 absorption reaction Methods 0.000 description 17
- 238000005457 optimization Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of circuit boards, and particularly discloses a moistureproof circuit board which comprises a circuit board body, wherein a moistureproof assembly is arranged on the circuit board body; the dampproofing subassembly is including setting up the fin of rectangle frame shape on the circuit board body, and the fin is connected with the heating element in the circuit board body through heat conduction copper wire, is provided with the sponge that absorbs water on the fin, is provided with a plurality of calcium chloride granule in the sponge that absorbs water. According to the utility model, the calcium chloride particles in the water-absorbing sponge arranged on the circuit board body are used for absorbing moisture near the circuit board body, and the calcium chloride particles can be used for absorbing the moisture near the circuit board body, so that the moisture is prevented from corroding the circuit board body, the circuit board body has a dampproof function, the circuit board body can be kept dry when in use, the circuit board body is prevented from being affected by moisture when in use, and the protection of the circuit board body is improved.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a moistureproof circuit board.
Background
The circuit board may be referred to as a printed wiring board or a printed circuit board; the circuit board consists of an integrated circuit, a quartz vibrator, a trimming capacitor and a printed circuit board; the names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, and the like; the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances.
The Chinese patent with the application number of 202320697666.1 discloses a circuit board, which comprises a circuit board and further comprises: antistatic plate for being directed at static on the circuit board is eliminated, and antistatic plate passes through fixed subassembly and can dismantle the connection on the bottom of circuit board, a plurality of louvres have been seted up to antistatic plate's inner wall to the realization can dispel the heat to the circuit board, antistatic plate includes: the current conducting plate, the current conducting plate with the bottom of circuit board contacts, first antistatic backing is established on the bottom of current conducting plate, the second antistatic backing is established on the bottom of first antistatic backing, fixed subassembly includes: the backup pad, both sides of antistatic board are two sets of backup pads of fixed mounting. "; however, the circuit board has no moisture-proof function when in use, which causes the circuit board to be easy to be wetted under long-time use, so in order to solve the problems, a moisture-proof circuit board is provided.
Disclosure of utility model
The utility model aims to solve the defects in the prior art and provides a moistureproof circuit board.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
A moistureproof circuit board comprises a circuit board body, wherein a moistureproof assembly is arranged on the circuit board body;
The dampproofing subassembly is including setting up the fin of rectangle frame shape on the circuit board body, and the fin is connected with the heating element in the circuit board body through heat conduction copper wire, is provided with the sponge that absorbs water on the fin, is provided with a plurality of calcium chloride granule in the sponge that absorbs water, absorbs water sponge bottom and fin top contact.
Preferably, the circuit board body is provided with a rectangular frame-shaped mounting groove, the radiating fin is mounted in the mounting groove, and the upper surface of the radiating fin is flush with the upper surface of the circuit board body.
Preferably, the top of the radiating fin is welded with a heat conducting copper sheet, the heat conducting copper sheet is positioned above the circuit board body, and the bottom of the water absorbing sponge is contacted with the top of the heat conducting copper sheet.
Preferably, the top of the heat conducting copper sheet is provided with two limit frames, and the water absorbing sponge is arranged between the two limit frames.
Preferably, two sides of the limiting frames, which are close to the water absorbing sponge, are provided with protrusions, and the protrusions are in contact with the water absorbing sponge.
Preferably, the water-absorbing sponge is provided with a plurality of grid holes, and the calcium chloride particles are arranged in the grid holes on the water-absorbing sponge.
Preferably, two groups of mounting holes are diagonally arranged on the circuit board body.
Compared with the prior art, the utility model has the beneficial effects that:
1: according to the utility model, the calcium chloride particles in the water-absorbing sponge arranged on the circuit board body are used for absorbing moisture near the circuit board body, and the calcium chloride particles can be used for absorbing the moisture near the circuit board body, so that the moisture is prevented from corroding the circuit board body, the circuit board body has a dampproof function, the circuit board body can be kept dry when in use, the circuit board body is prevented from being affected by moisture when in use, and the protection of the circuit board body is improved.
2: According to the utility model, the water-absorbing sponge absorbs heat and is subjected to heat drying treatment, so that moisture in the water-absorbing sponge can be dried, the water-absorbing sponge can continuously absorb moisture of calcium chloride particles, the calcium chloride particles and the water-absorbing sponge can continuously absorb moisture near the circuit board body, the absorbed moisture can be utilized to perform heat dissipation and cooling treatment on the heating element of the circuit board body, and the heating element of the circuit board body can be subjected to heat dissipation and cooling treatment and then can be subjected to drying treatment, so that recycling is realized, and three times are achieved.
Drawings
Fig. 1 is a schematic structural diagram of a moisture-proof circuit board according to the present utility model;
Fig. 2 is a schematic structural diagram of a circuit board body of a moisture-proof circuit board according to the present utility model;
fig. 3 is a schematic connection diagram of a circuit board body and a heat sink of a moisture-proof circuit board according to the present utility model;
fig. 4 is a schematic diagram illustrating connection between a heat sink and a heat conducting copper sheet of a moisture-proof circuit board according to the present utility model;
Fig. 5 is a schematic diagram illustrating connection between a heat conducting copper sheet and a limit frame of a moisture-proof circuit board according to the present utility model;
Fig. 6 is a cross-sectional view of a limit frame of a moisture-proof circuit board according to the present utility model.
In the figure: 1. a circuit board body; 2. a mounting hole; 3. a water absorbing sponge; 4. limiting frames; 5. a mounting groove; 6. a heat sink; 7. a thermally conductive copper sheet; 8. a protrusion; 9. calcium chloride particles.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Referring to fig. 1 to 6, a moistureproof circuit board comprises a circuit board body 1, wherein a moistureproof assembly is arranged on the circuit board body 1;
The dampproofing subassembly is including setting up the fin 6 of rectangle frame shape on circuit board body 1, and fin 6 is connected with the heating element in the circuit board body 1 through heat conduction copper wire, is provided with water absorption sponge 3 on the fin 6, is provided with a plurality of calcium chloride granule 9 in the water absorption sponge 3, and water absorption sponge 3 bottom contacts with fin 6 top.
As a technical optimization scheme of the utility model, the circuit board body 1 is provided with the rectangular frame-shaped mounting groove 5, the radiating fin 6 is mounted in the mounting groove 5, the upper surface of the radiating fin 6 is flush with the upper surface of the circuit board body 1, and the rectangular frame-shaped mounting groove 5 formed on the circuit board body 1 can provide a mounting plane for the radiating fin 6, so that the radiating fin 6 is convenient to mount.
As a technical optimization scheme of the utility model, the top of the radiating fin 6 is welded with the heat conducting copper sheet 7, the heat conducting copper sheet 7 is positioned above the circuit board body 1, the bottom of the water absorbing sponge 3 is contacted with the top of the heat conducting copper sheet 7, and the radiating fin 6 and the heat conducting copper sheet 7 are welded so as to be convenient for connection and heat transfer.
As a technical optimization scheme of the utility model, two limit frames 4 are arranged at the top of the heat conduction copper sheet 7, the water absorption sponge 3 is arranged between the two limit frames 4, and the limit frames 4 can provide limit function for the water absorption sponge 3, so that the phenomenon that the water absorption sponge 3 slides and deviates on the heat conduction copper sheet 7 is avoided.
As a technical optimization scheme of the utility model, the two limit frames 4 are provided with the bulges 8 at the sides close to the water absorption sponge 3, the bulges 8 are in contact with the water absorption sponge 3, and the bulges 8 arranged at the sides of the limit frames 4 close to the water absorption sponge 3 can increase the friction force between the limit frames 4 and the water absorption sponge 3, so that the water absorption sponge 3 is more stably arranged between the two limit frames 4.
As a technical optimization scheme of the utility model, the water-absorbing sponge 3 is provided with a plurality of grid holes, the calcium chloride particles 9 are arranged in the grid holes on the water-absorbing sponge 3, and the grid holes on the water-absorbing sponge 3 can facilitate the placement of the calcium chloride particles 9.
As a technical optimization scheme of the utility model, two groups of mounting holes 2 are diagonally formed in the circuit board body 1, and the mounting holes 2 formed in the circuit board body 1 can facilitate the mounting and fixing of the circuit board body 1.
When the circuit board is used, the calcium chloride particles 9 in the water absorbing sponge 3 arranged on the circuit board body 1 are used for absorbing moisture near the circuit board body 1, and the calcium chloride particles 9 can be used for absorbing the moisture near the circuit board body 1, so that the moisture is prevented from corroding the circuit board body 1, the circuit board body 1 has a dampproof function, the circuit board body 1 can be kept dry when in use, the circuit board body 1 is prevented from being affected by moisture when in use, normal use is prevented, and the protection of the circuit board body 1 is improved.
And utilize the moisture near the calcium chloride granule 9 absorption circuit board body 1, the moisture that its absorption gets into in the sponge 3 that absorbs water, utilize moisture to get into in the sponge 3 that absorbs water makes the sponge 3 that absorbs water moist, and the heating element of circuit board body 1 passes through the heat conduction copper wire with its heat transfer that produces when working gives fin 6, fin 6 gives the heat conduction copper sheet 7 with absorbing heat transfer, heat conduction copper sheet 7 contacts with the sponge 3 that absorbs water again, and then the heat of heat conduction copper sheet 7 can be absorbed to the sponge 3 that absorbs water after the moisture, and then carry out quick heat dissipation to the heating element of circuit board body 1, and the sponge 3 that absorbs heat is self by the heat stoving processing, can make the moisture in the sponge 3 that absorbs water is dried, and then make the sponge 3 sustainable absorption calcium chloride granule 9 that absorbs water, and the sponge 3 sustainable absorption circuit board body 1 nearby, and the usable absorption moisture carries out the heat dissipation to the heating element of circuit board body 1 again, and can carry out the heat dissipation to the heating element of heat transfer copper sheet 7 after the absorption moisture, and can carry out the heat dissipation to the sponge 3 that absorbs water, thereby realize three circulation and use.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (7)
1. The moistureproof circuit board comprises a circuit board body (1), and is characterized in that a moistureproof assembly is arranged on the circuit board body (1);
The dampproofing subassembly is including setting up fin (6) of rectangle frame shape on circuit board body (1), and fin (6) are connected with the heating element in circuit board body (1) through heat conduction copper wire, are provided with on fin (6) and absorb water sponge (3), are provided with a plurality of calcium chloride granule (9) in absorbing water sponge (3), absorb water sponge (3) bottom and fin (6) top and contact.
2. The moisture-proof circuit board according to claim 1, wherein the circuit board body (1) is provided with a rectangular frame-shaped mounting groove (5), the heat sink (6) is mounted in the mounting groove (5), and the upper surface of the heat sink (6) is flush with the upper surface of the circuit board body (1).
3. The moisture-proof circuit board according to claim 1, wherein the heat sink (6) has a heat conducting copper sheet (7) welded on top thereof, the heat conducting copper sheet (7) is located above the circuit board body (1), and the bottom of the water absorbing sponge (3) is in contact with the top of the heat conducting copper sheet (7).
4. A moisture-proof circuit board according to claim 3, characterized in that the top of the thermally conductive copper sheet (7) is provided with two spacing frames (4), and the water absorbing sponge (3) is provided between the two spacing frames (4).
5. The moistureproof circuit board according to claim 4, wherein the two limiting frames (4) are provided with protrusions (8) on one side close to the water absorbing sponge (3), and the protrusions (8) are in contact with the water absorbing sponge (3).
6. The moistureproof circuit board according to claim 1, wherein the water absorbing sponge (3) is provided with a plurality of grid holes, and calcium chloride particles (9) are arranged in the grid holes on the water absorbing sponge (3).
7. The moistureproof circuit board according to claim 1, wherein two sets of mounting holes (2) are diagonally formed in the circuit board body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322762215.4U CN220965269U (en) | 2023-10-16 | 2023-10-16 | Moistureproof circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322762215.4U CN220965269U (en) | 2023-10-16 | 2023-10-16 | Moistureproof circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220965269U true CN220965269U (en) | 2024-05-14 |
Family
ID=91014574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322762215.4U Active CN220965269U (en) | 2023-10-16 | 2023-10-16 | Moistureproof circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220965269U (en) |
-
2023
- 2023-10-16 CN CN202322762215.4U patent/CN220965269U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |