CN213244462U - Circuit waterproof circuit board - Google Patents

Abstract

The utility model provides a waterproof circuit board of circuit, including insulating substrate, insulating substrate is last to be equipped with conducting wire layer, first insulating layer and second insulating layer in proper order, is equipped with n conductive adhesive posts in the first insulating layer, is equipped with n welding hole of stepping down in the second insulating layer, and the both ends of conductive adhesive post are connected welding hole of stepping down and conducting wire layer respectively; the top surface of second insulating layer is the curved surface structure of downward sloping all around, all is connected with the elastic glue ring on every welding abdication hole, and the top surface of all elastic glue rings is all on the coplanar, and the top surface of elastic glue ring lies in the top surface top of second insulating layer, all is fixed with waterproof swash plate around the first insulating layer. The utility model discloses can effectively avoid steam to gather in the surface, elasticity is glued the ring and can be provided a flat stable basis for the welding installation, and overall structure's waterproof performance can be ensured to multiple waterproof construction, and the conductive adhesive post can realize that the electric conduction between conducting wire layer and the electronic component is connected simultaneously.

Description

Circuit waterproof circuit board

Technical Field

The utility model relates to a circuit board field specifically discloses a waterproof circuit board of circuit.

Background

The circuit board, also called PCB, circuit board, is used for providing various electronic components such as integrated circuit to fix, assemble and mechanically support, for realizing wiring and electrical connection or electrical insulation between various electronic components such as integrated circuit, and for providing required electrical characteristics, and has the characteristics of high wiring density, light weight, thin thickness and good bending property.

When being applied to electronic products such as notebook computer with the circuit board, the circuit board is the tiling and sets up, steam accumulates easily in the surface of circuit board under the action of gravity, among the prior art, the circuit board all is the structure that mainly includes insulating substrate, conducting wire layer and prevent welding the printing ink layer, in case a large amount of moisture is accumulated in its surface, moisture permeates into the conducting wire layer from preventing the clearance between welding printing ink layer and the welded structure easily, influences the performance on conducting wire layer, still can lead to the conducting wire layer to become invalid even.

SUMMERY OF THE UTILITY MODEL

Based on this, it is necessary to provide a waterproof circuit board of circuit to solve the prior art problem, can realize comprehensive coverage protection to the upper surface on conducting wire layer, can form electrically conductive connection structure simultaneously, and overall structure's waterproof performance is good.

In order to solve the prior art problem, the utility model discloses a circuit board with waterproof circuit, which comprises an insulating substrate, wherein the insulating substrate is sequentially provided with a conductive circuit layer, a first insulating layer and a second insulating layer, n conductive adhesive columns are arranged in the first insulating layer, n is an integer larger than 1, n welding abdicating holes are arranged in the second insulating layer, and two ends of each conductive adhesive column are respectively connected with the welding abdicating holes and the conductive circuit layer;

the top surface of second insulating layer is the curved surface structure of downward sloping all around, all is connected with the elastic glue ring on every welding abdication hole, and the top surface of all elastic glue rings is all on the coplanar, and the top surface of elastic glue ring lies in the top surface top of second insulating layer, all is fixed with waterproof swash plate around the first insulating layer.

Further, the first insulating layer is a heat-conducting silica gel layer.

Furthermore, the conductive adhesive column is a conductive silver adhesive column.

Further, the bottom surface of waterproof swash plate covers has the drying layer.

Further, the second insulating layer is a solder mask ink layer.

Furthermore, the welding abdicating hole is a round hole with the diameter of D, the conductive adhesive column is a cylinder with the diameter of D, and D is larger than D.

Furthermore, a radiating base plate is fixed at the bottom of the insulating substrate.

Further, the heat dissipation backing plate is a heat dissipation ceramic plate.

The utility model has the advantages that: the utility model discloses a waterproof circuit board of circuit, the upper surface that sets up the second insulating layer is the curved surface structure of downwarping all around, can effectively avoid steam to gather in the surface of circuit board, waterproof swash plate all around can avoid steam to flow through the side end face on conducting wire layer, glue the ring through elasticity and can provide a flat stable basis for electronic component's welding installation, the ring is glued to elasticity can avoid steam to get into the welding hole of stepping down, and the first insulation layer cooperation electrically conductive gluey post can realize comprehensive coverage protection to the upper surface on conducting wire layer, overall structure's waterproof performance can be ensured to multiple waterproof construction, simultaneously electrically conductive gluey post can cooperate the electrically conductive connection between conducting wire layer and the electronic component such as welding structure realization conducting wire layer and electronic component such as tin cream.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic top view of the present invention.

Fig. 3 is a schematic cross-sectional view of a-a' in fig. 2 according to the present invention.

The reference signs are: the heat dissipation plate comprises an insulating substrate 10, a conductive circuit layer 20, a first insulating layer 30, a conductive adhesive column 31, a waterproof sloping plate 32, a drying layer 321, a second insulating layer 40, a welding abdicating hole 41, an elastic adhesive ring 42 and a heat dissipation base plate 50.

Detailed Description

For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.

Refer to fig. 1 to 3.

The embodiment of the utility model discloses a circuit board with waterproof circuit, which comprises an insulating substrate 10, a conductive circuit layer 20 fixedly connected with the insulating substrate 10, the insulation substrate 10 is a glass fiber board, the conductive circuit layer 20 is a copper circuit layer, n conductive glue columns 31 are arranged in the first insulation layer 30, n is an integer greater than 1, n welding abdicating holes 41 are arranged in the second insulation layer 40, the upper end and the lower end of each conductive glue column 31 are respectively connected with the welding abdicating hole 41 and the conductive circuit layer 20, each conductive glue column 31 is respectively correspondingly connected with each welding abdicating hole 41, the conductive glue columns 31 can effectively block the welding abdicating holes 41, the insulation substrate has good conductive performance, and the conductive circuit layer 20 can be effectively prevented from being directly contacted with the external environment due to corrosion damage, so that the performance of the conductive circuit layer 20 is prevented from being affected;

the top surface of the second insulating layer 40 is a curved surface structure with the periphery inclined downwards, that is, the top surface of the second insulating layer 40 is a curved surface structure with the center arched upwards, and has a good water draining function, each welding abdicating hole 41 is connected with an elastic rubber ring 42, preferably, the elastic rubber ring 42 is an elastic rubber ring, the top surfaces of all the elastic rubber rings 42 are on the same plane, the top surface of the elastic rubber ring 42 is located above the top surface of the second insulating layer 40, the elastic rubber ring 42 can provide a flat and stable installation base for each electronic element, so as to ensure convenient installation operation and stable and firm installation structure, the periphery of the first insulating layer 30 is fixed with the waterproof inclined plates 32, preferably, the waterproof inclined plates 32 are epoxy resin insulating plates, the edges of the waterproof inclined plates 32 far away from the first insulating layer 30 are inclined towards the side far away from the top surface of the second insulating layer 40, and the waterproof inclined plates 32 can guide the moisture on the, the moisture is prevented from directly contacting the side end surface of the conductive circuit layer 20, thereby improving the waterproof performance of the whole structure of the circuit board.

When the solder paste is applied, the elastic rubber ring 42 is used for injecting the solder paste into the welding abdicating hole 41, then pins of the electronic element are attached to the elastic rubber ring 42, the electronic element is reliably fixed on the circuit board after the solder paste is solidified, each pin of the electronic element is positioned on each elastic rubber ring 42 with the coplanar top surface, the installation is convenient, the connection structure is firm and stable, a reliable conductive structure is formed between the solder paste and the conductive rubber column 31, a reliable conductive connection relation is formed between the electronic element and the conductive circuit layer 20, the elastic rubber ring 42 can surround the periphery of the solder paste, corrosive substances such as water vapor and the like can be effectively prevented from entering the circuit board from a gap between the solder paste and the circuit board to influence the performance of the circuit board, the conductive rubber column 31 can further prevent the water vapor from entering the conductive circuit layer 20 from the welding abdicating hole 41, and multiple waterproof protection structures are formed above the conductive circuit layer, it can effectively prevent the vapor from entering from the top and eroding the conductive circuit layer 20. The curved surface structure of the top surface of the second insulating layer 40 can guide the moisture on the surface of the circuit board to the periphery, so that the moisture accumulation is avoided, the waterproof sloping plate 32 can prevent the moisture from flowing down along the side end surface of the conductive circuit layer 20, and the conductive circuit layer 20 can be effectively prevented from being corroded.

In this embodiment, the first insulating layer 30 is a thermal conductive silica gel layer, and the thermal conductive silica gel has good thermal conductivity and insulating property, so that the heat dissipation performance of the overall structure of the circuit board can be effectively improved.

In this embodiment, the conductive adhesive column 31 is a conductive silver adhesive column, has good sealing and bonding functions and conductive performance through the conductive silver adhesive, has good corrosion resistance, and can ensure that the conductive relationship between the conductive circuit layer 20 and the electronic element is reliable after the electronic element is mounted by welding, and meanwhile, can effectively prevent moisture from entering the conductive circuit layer 20 from the bottom of the welding abdicating hole 41.

In this embodiment, the bottom surface of waterproof swash plate 32 covers and is fixed with dry layer 321, and preferably, dry layer 321 is the straw fiber layer, and straw fiber environmental protection, water absorption, and the cost is lower, can effectively realize the drying to conducting wire layer 20 air all around through dry layer 321, can provide a dry good environment for it.

In the present embodiment, the second insulating layer 40 is a solder resist ink layer.

In this embodiment, the welding hole of stepping down 41 is the round hole that the diameter is D, and electrically conductive gluey post 31 is the cylinder that the diameter is D, and D > D enlarges the diameter that welding hole of stepping down 41 and can effectively improve its inside tin cream volume that can hold, can effectively ensure to form reliable contact between tin cream and the electrically conductive gluey post 31, can effectively reduce connection structure's impedance simultaneously to improve connection structure's electric conductive property.

In this embodiment, the bottom of the insulating substrate 10 is fixed with a heat dissipation pad 50, and the heat dissipation performance of the circuit board can be effectively improved by the heat dissipation pad 50.

Based on the above embodiment, the heat radiation base plate 50 is a heat radiation ceramic plate having good heat radiation performance and corrosion resistance, and preferably, the heat radiation ceramic plate is a heat radiation ceramic.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (8)

1. The waterproof circuit board for the circuit is characterized by comprising an insulating substrate (10), wherein a conductive circuit layer (20), a first insulating layer (30) and a second insulating layer (40) are sequentially arranged on the insulating substrate (10), n conductive adhesive columns (31) are arranged in the first insulating layer (30), n is an integer greater than 1, n welding yielding holes (41) are arranged in the second insulating layer (40), and two ends of each conductive adhesive column (31) are respectively connected with the corresponding welding yielding hole (41) and the conductive circuit layer (20);

the top surface of second insulating layer (40) is the curved surface structure of downward sloping all around, every all be connected with elastic glue ring (42) on welding abdicating hole (41), all the top surface of elastic glue ring (42) all is on the coplanar, the top surface of elastic glue ring (42) is located the top surface top of second insulating layer (40), all be fixed with waterproof swash plate (32) around first insulating layer (30).

2. The circuit board of claim 1, wherein the first insulating layer (30) is a thermally conductive silicone layer.

3. The circuit board of claim 1, wherein the conductive adhesive posts (31) are conductive silver adhesive posts.

4. The circuit board of claim 1, wherein the bottom surface of the waterproof sloping plate (32) is covered with a dry layer (321).

5. A circuit board with waterproofing according to claim 1, wherein the second insulating layer (40) is a solder resist ink layer.

6. The circuit board of claim 1, wherein the solder-yielding hole (41) is a circular hole with a diameter D, the conductive adhesive column (31) is a cylinder with a diameter D, and D > D.

7. The circuit board of claim 1, wherein a heat sink (50) is fixed to the bottom of the insulating substrate (10).

8. The circuit board of claim 7, wherein said heat sink pad (50) is a heat sink ceramic plate.

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