CN213244479U

CN213244479U - Dampproofing PCB board

Info

Publication number: CN213244479U
Application number: CN202022457021.XU
Authority: CN
Inventors: 李冠敏
Original assignee: Yunfeng Electronic Science & Technology Shenzhen Co ltd
Current assignee: Yunfeng Electronic Science & Technology Shenzhen Co ltd
Priority date: 2020-10-29
Filing date: 2020-10-29
Publication date: 2021-05-18
Anticipated expiration: 2030-10-29

Abstract

The utility model discloses a dampproof PCB board, including circuit board basic unit, be fixed with the heat conduction ceramic layer on the circuit board basic unit, heat conduction ceramic layer lower surface integrated into one piece has the lug, heat conduction ceramic layer inboard is seted up flutedly, the recess inboard is fixed with activated alumina, be provided with dry silica gel layer on the heat conduction ceramic layer, dry silica gel layer lower surface is provided with second dampproof polyethylene layer; through being provided with dry silica gel layer, first dampproofing polyethylene layer, insulating rubber and second dampproofing polyethylene layer, be convenient for avoid the moisture directly to take place the contact corrosion to circuit board basic unit, be convenient for improve circuit board basic unit's dampproofing effect, through being provided with heat conduction ceramic layer and lug, it is great to be convenient for avoid circuit board basic unit local heat, causes circuit board basic unit to take place thermal fatigue damage, is convenient for improve the radiating effect, reduces the heat accumulation.

Description

Dampproofing PCB board

Technical Field

The utility model belongs to the technical field of the PCB board, concretely relates to dampproofing PCB board.

Background

The PCB is generally a printed circuit board, also called a printed circuit board, and is a provider of electrical connection of electronic components, and before the printed circuit board appears, the interconnection between electronic components is completed by direct connection of wires. In the present generation, circuit panels exist only as effective experimental tools, and printed circuit boards have been the dominating position in the electronics industry, and the printed circuit boards have been developed from single-layer boards to double-sided boards, multi-layer boards, and flexible boards, and are continuously developed toward high precision, high density, and high reliability. The size is continuously reduced, the cost is reduced, and the performance is improved, so that the printed circuit board still keeps strong vitality in the development process of future electronic products.

Present PCB board is in the use, and external moisture and water droplet probably directly take place the contact with the PCB board, cause corrosion damage to it, are not convenient for carry out fine dampproofing effect, and the result of use is not good, and the PCB board is in the course of the work in addition, and local heat accumulation is more likely to take place, causes thermal fatigue damage, is not convenient for carry out even heat dissipation, for this reason we propose a dampproofing PCB board.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a dampproofing PCB board to propose current PCB board in solving above-mentioned background art in the use, external moisture and water droplet probably directly take place to contact with the PCB board, cause corrosion damage to it, be not convenient for carry on fine dampproofing effect, the result of use is not good, and the PCB board is in the course of the work in addition, and it is more to probably take place local heat accumulation, causes thermal fatigue damage, is not convenient for carry on even radiating problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a dampproofing PCB board, includes circuit board basic unit, be fixed with the heat conduction ceramic layer in the circuit board basic unit, heat conduction ceramic layer lower surface integrated into one piece has the lug, heat conduction ceramic layer inboard is seted up flutedly, the recess inboard is fixed with activated alumina, be provided with dry silica gel layer on the heat conduction ceramic layer, dry silica gel layer lower surface is provided with the dampproofing polyethylene layer of second, dry silica gel layer upper surface is fixed with first dampproofing polyethylene layer through gluing, circuit board basic unit side surface is provided with insulating rubber.

As an optimized technical scheme of the utility model, the heat conduction ceramic layer is provided with two, another department the heat conduction ceramic layer is located circuit board basic unit lower surface.

As an optimal technical scheme of the utility model, the lug cross section is semiellipse shape, the lug is provided with a plurality ofly along heat conduction ceramic layer length direction equidistance.

As an optimized technical scheme of the utility model, heat conduction ceramic layer thickness is three millimeters to five millimeters on a bit at zero point, active alumina thickness is the same with heat conduction ceramic layer thickness.

As an optimal technical scheme of the utility model, second dampproofing polyethylene layer thickness is the third of first dampproofing polyethylene layer thickness, second dampproofing polyethylene layer is the rectangle.

As an optimal technical scheme of the utility model, dry silica gel layer center thickness is one time to three times of edge thickness.

As the utility model discloses an optimal technical scheme, insulating rubber has four along circuit board basic unit circumference evenly distributed, insulating rubber glues glutinous fixedly through epoxy glue with circuit board basic unit.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) through being provided with dry silica gel layer, first dampproofing polyethylene layer, insulating rubber and second dampproofing polyethylene layer, be convenient for avoid moisture directly to take place the contact corrosion to circuit board basic unit, be convenient for improve circuit board basic unit's dampproofing effect, the device can be derived the water droplet that the moisture condenses to the edge from circuit board basic unit upper center, improves the result of use.

(2) Through being provided with heat conduction ceramic layer and lug, be convenient for avoid circuit board basic unit local heat great, cause circuit board basic unit to take place thermal fatigue damage, be convenient for improve the radiating effect, reduce heat accumulation, simple structure, easy to use.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of a heat-conducting ceramic layer according to the present invention;

fig. 3 is an enlarged schematic structural view of fig. 1 a according to the present invention;

in the figure: 1. a circuit board base layer; 2. an insulating rubber; 3. a thermally conductive ceramic layer; 4. a first moisture resistant polyethylene layer; 5. drying the silica gel layer; 6. activated alumina; 7. a bump; 8. a second moisture resistant polyethylene layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a dampproofing PCB board, including circuit board basic unit 1, be fixed with heat conduction ceramic layer 3 on the circuit board basic unit 1, be convenient for make the heat derive, it is even to make heat distribution, reduce the accumulation of local heat on the circuit board basic unit 1, heat conduction ceramic layer 3 lower surface integrated into one piece has lug 7, be convenient for improve and circuit board basic unit 1 area of contact, increase heat transfer effect, heat conduction ceramic layer 3 inboard is seted up flutedly, the recess inboard is fixed with activated alumina 6, be convenient for carry out the drying, be provided with dry silica gel layer 5 on the heat conduction ceramic layer 3, be convenient for carry out better moisture absorption drying effect, 5 lower surfaces on dry silica gel layer are provided with second

dampproofing polyethylene layer

8, 5 upper surfaces on dry silica gel layer are fixed with first dampproofing polyethylene layer 4 through gluing, be convenient for better dampproofing effect, 1 side surface of circuit.

In this embodiment, the heat-conducting ceramic layer 3 is disposed at two positions, and the other heat-conducting ceramic layer 3 is located on the lower surface of the circuit board substrate 1, so that the PCB has a better heat dissipation effect.

In this embodiment, the cross section of the bump 7 is semi-elliptical, and the bumps 7 are equidistantly arranged along the length direction of the heat-conducting ceramic layer 3, so that the PCB has a better heat transfer contact area.

In this embodiment, the thickness of the heat-conducting ceramic layer 3 is from three millimeters to five millimeters, and the thickness of the activated alumina 6 is the same as that of the heat-conducting ceramic layer 3, so that a better moisture absorption effect is facilitated.

In this embodiment, the thickness of the second moisture-proof polyethylene layer 8 is one third of the thickness of the first moisture-proof polyethylene layer 4, and the second moisture-proof polyethylene layer 8 is rectangular, so as to reduce the contact area between moisture and the circuit board base layer 1.

In this embodiment, the central thickness of dry silica gel layer 5 is one time to three times of edge thickness, is convenient for carry out moisture absorption drying to the PCB board.

In this embodiment, insulating rubber 2 has four along 1 circumference evenly distributed of circuit board basic unit, and insulating rubber 2 glues glutinous fixedly through epoxy glue with circuit board basic unit 1, and the staff of being convenient for installs insulating rubber 2 fixedly.

The utility model discloses a theory of operation and use flow: when the circuit board is used, the waterproof effect of the first dampproof polyethylene layer 4 and the second dampproof polyethylene layer 8 is good, the first dampproof polyethylene layer 4 and the second dampproof polyethylene layer 8 are convenient to reduce and moisture directly causes corrosion damage to the circuit board base layer 1, further, after the first dampproof polyethylene layer 4 breaks, the moisture can be absorbed through the drying silica gel layer 5, the surface drying effect of the circuit board base layer 1 is further improved, the edge thickness of the drying silica gel layer 5 is smaller than the center thickness, the gathered moisture water drops can conveniently slide to the edge of the circuit board base layer 1, the moisture water drops are reduced to be gathered at the center of the circuit board base layer 1, the heat conductivity of the heat-conducting ceramic layer 3 is good, the heat distribution of the circuit board base layer 1 is convenient to be uniform, the damage caused by local heat accumulation of the circuit board base layer 1 is reduced, a bump 7 is further integrally formed below the heat-conducting ceramic layer 3, the, the heat conduction effect is improved.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A dampproofing PCB board, includes circuit board basic unit (1), its characterized in that: be fixed with heat conduction ceramic layer (3) on circuit board basic unit (1), heat conduction ceramic layer (3) lower surface integrated into one piece has lug (7), heat conduction ceramic layer (3) inboard is seted up flutedly, the recess inboard is fixed with activated alumina (6), be provided with dry silica gel layer (5) on heat conduction ceramic layer (3), dry silica gel layer (5) lower surface is provided with second dampproofing polyethylene layer (8), dry silica gel layer (5) upper surface is fixed with first dampproofing polyethylene layer (4) through gluing, circuit board basic unit (1) side surface is provided with insulating rubber (2).

2. A moisture resistant PCB board as claimed in claim 1, wherein: the heat-conducting ceramic layer (3) is provided with two positions, and the other position is the heat-conducting ceramic layer (3) positioned on the lower surface of the circuit board base layer (1).

3. A moisture resistant PCB board as claimed in claim 1, wherein: the cross section of the lug (7) is semi-elliptical, and a plurality of lugs (7) are arranged along the length direction of the heat conduction ceramic layer (3) at equal intervals.

4. A moisture resistant PCB board as claimed in claim 1, wherein: the thickness of the heat-conducting ceramic layer (3) is from three millimeters to five millimeters, and the thickness of the activated alumina (6) is the same as that of the heat-conducting ceramic layer (3).

5. A moisture resistant PCB board as claimed in claim 1, wherein: the thickness of the second moisture-proof polyethylene layer (8) is one third of that of the first moisture-proof polyethylene layer (4), and the second moisture-proof polyethylene layer (8) is rectangular.

6. A moisture resistant PCB board as claimed in claim 1, wherein: the center thickness of the dry silica gel layer (5) is one time to three times of the edge thickness.

7. A moisture resistant PCB board as claimed in claim 1, wherein: four insulating rubbers (2) are uniformly distributed along the circumferential direction of the circuit board base layer (1), and the insulating rubbers (2) are adhered and fixed with the circuit board base layer (1) through epoxy glue.