CN212033008U - Electronic chip with dampproofing function - Google Patents
Electronic chip with dampproofing function Download PDFInfo
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- CN212033008U CN212033008U CN202021141144.6U CN202021141144U CN212033008U CN 212033008 U CN212033008 U CN 212033008U CN 202021141144 U CN202021141144 U CN 202021141144U CN 212033008 U CN212033008 U CN 212033008U
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- stitch
- silica gel
- chip body
- electronic chip
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Abstract
The utility model discloses an electronic chip with dampproofing function, including the chip body, the chip body upper surface is provided with the connection stitch, the chip body openly is fixed with the heating panel, the heating panel openly integrated into one piece has the fin, fin one side surface is fixed with the connecting block, the connecting block inboard is provided with absorbent silica gel, absorbent silica gel one side surface is fixed with the moisture absorption sponge, the chip body upper surface is provided with the dog corresponding to connecting the stitch below; through being provided with heating panel, absorbent silica gel, fin, connecting block and moisture absorption sponge, be convenient for avoid the more moist air of all ring edge borders and connect the stitch contact, cause to its corrosion damage, be convenient for dampproofing, through being provided with the dog, when being convenient for avoid connecting the stitch and buckling downwards, the angle of buckling is too big to cause and connects the stitch and take place to roll over and decrease.
Description
Technical Field
The utility model belongs to the technical field of the electronic chip, concretely relates to electronic chip with dampproofing function.
Background
Chips are a way to miniaturize circuits (mainly including semiconductor devices and passive components) in electronics, and are often manufactured on the surface of a semiconductor wafer, and the whole chip manufacturing process includes several links, such as chip design, chip manufacturing, package manufacturing, and testing, wherein the chip manufacturing process is particularly complex.
Present electronic chip adopts the encapsulation preparation more, it is dampproofing dustproof effectual, but in the use, the connection stitch that exposes outside easily receives outside humid air to influence, more humid air can cause corrosion damage to connecting the stitch, be not convenient for fine moisture absorption is dampproofing, connect the stitch in addition when buckling downwards, can be because of the operator's pressing force is too big to cause connecting the stitch angle of buckling big, great angle of buckling can lead to connecting the stitch to roll over and decrease, the result of use is not good, we provide an electronic chip with dampproofing function for this reason.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic chip with dampproofing function, in order to solve to propose among the above-mentioned background art that current electronic chip adopts the encapsulation preparation more, it is dampproofing dustproof effectual, but in the use, the connection stitch that exposes outside is easily influenced by outside humid air, humid air can lead to the fact the corruption to damage to connecting the stitch, it is dampproofing to be not convenient for fine moisture absorption, connect the stitch when buckling downwards in addition, can be too big because of operator's pressing force causes the connection stitch angle of buckling to be big, great angle of buckling can lead to connecting the stitch to break down, the not good problem of result of use.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an electronic chip with dampproofing function, includes the chip body, chip body upper surface is provided with the connection stitch, the chip body openly is fixed with the heating panel, the heating panel openly integrated into one piece has the fin, fin one side fixed surface has the connecting block, the connecting block inboard is provided with absorbent silica gel, absorbent silica gel one side fixed surface has the moisture absorption sponge, chip body upper surface is provided with the dog corresponding to connection stitch below.
Preferably, the cross section of the block is fan-shaped, and the outer surface of the block is fixed with insulating rubber.
Preferably, the stopper is provided at two positions, and the thickness of the insulating rubber is one millimeter to eight millimeters.
Preferably, the radiating fins are equidistantly provided with two to twenty along the length direction of the radiating plate, and one side surface of each radiating fin is provided with a convex block.
Preferably, the connecting blocks are L-shaped, and the number of the connecting blocks is twice that of the radiating fins.
Preferably, the thickness of the water-absorbing silica gel is two millimeters to twelve millimeters.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) through being provided with heating panel, absorbent silica gel, fin, connecting block and moisture absorption sponge, be convenient for avoid the more moist air of all ring edge borders and connect the stitch contact, cause to its corrosion damage, be convenient for carry on dampproofing, carry out the drying to absorbent silica gel and moisture absorption sponge when the chip body of being convenient for dispels the heat simultaneously, the recycling of being convenient for has improved the result of use of device.
(2) Through being provided with the dog, when being convenient for avoid connecting the stitch and buckling downwards, the angle of buckling too big causes the connection stitch to take place to roll over and decreases, is convenient for restrict the angle of buckling of connecting the stitch, and device simple structure has increased the practicality of device.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic cross-sectional view at a in fig. 1 according to the present invention;
FIG. 3 is a schematic view of the stopper structure of the present invention;
in the figure: 1. a chip body; 2. a heat dissipation plate; 3. water-absorbing silica gel; 4. a heat sink; 5. connecting pins; 6. a bump; 7. connecting blocks; 8. a moisture-absorbing sponge; 9. a stopper; 10. and (3) insulating rubber.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides an electronic chip with dampproofing function, including chip body 1, 1 upper surface of chip body is provided with connection stitch 5, 1 front of chip body is fixed with heating panel 2, 2 front integrated into one piece of heating panel have fin 4, be convenient for chip body 1 dispels the heat, 4 side fixed surface of fin have connecting block 7, 7 inboard connecting block are provided with absorbent silica gel 3, be convenient for absorb moist air, 3 side fixed surface of absorbent silica gel have moisture absorption sponge 8, be convenient for better absorption effect, 1 upper surface of chip body is provided with dog 9 corresponding to connection stitch 5 below, be convenient for the restriction connect the angle of buckling of stitch 5.
In this embodiment, preferably, the cross section of the stopper 9 is fan-shaped, and the outer surface of the stopper 9 is fixed with the insulating rubber 10, so as to facilitate a better insulating effect.
In this embodiment, it is preferable that the stopper 9 is provided at two places, and the thickness of the insulating rubber 10 is one millimeter to eight millimeters.
In this embodiment, preferably, the number of the heat dissipation fins 4 is two to twenty along the length direction of the heat dissipation plate 2 at equal intervals, and the protrusion 6 is disposed on the surface of one side of the heat dissipation fin 4, so as to facilitate a better contact area.
In this embodiment, preferably, the connecting blocks 7 are L-shaped, and the number of the connecting blocks 7 is twice that of the heat dissipation fins 4, so that the plurality of water-absorbing silica gels 3 can be mounted better.
In this embodiment, the thickness of the water-absorbing silica gel 3 is preferably two millimeters to twelve millimeters, which facilitates better effect of absorbing moist air.
The utility model discloses a theory of operation and use flow: when in use, the water absorption silica gel 3 and the moisture absorption sponge 8 are convenient for absorbing the moist air around, the moist air is reduced to be directly contacted with the connecting pins 5, the connecting pins 5 are corroded, the temperature of the chip body 1 during working is further transmitted to the outside through the radiating fins 4, the contact area with natural wind is improved through the radiating fins 4 and the radiating plate 2, the air cooling effect is improved, meanwhile, the hygroscopic water-absorbing silica gel 3 and the hygroscopic sponge 8 are heated by the radiating fins 4 to evaporate water vapor to the outside, thereby ensuring the drying effect of the silica gel and the hygroscopic sponge 8, being convenient for recycling, further being capable of regularly pumping the hygroscopic silica gel 3 and the hygroscopic sponge 8 from the inner side of the connecting block 7, change it, maintain simply, when reducing connecting stitch 5 and buckling downwards through dog 9, buckle great too big, cause connecting stitch 5's the book damage, be convenient for improve the security that the device used.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an electronic chip with dampproofing function, includes chip body (1), chip body (1) upper surface is provided with connecting stitch (5), its characterized in that: chip body (1) openly is fixed with heating panel (2), heating panel (2) openly integrated into one piece have fin (4), fin (4) one side fixed surface has connecting block (7), connecting block (7) inboard is provided with absorbent silica gel (3), absorbent silica gel (3) one side fixed surface has moisture absorption sponge (8), chip body (1) upper surface is provided with dog (9) corresponding to connection stitch (5) below.
2. The electronic chip with moisture-proof function as claimed in claim 1, wherein: the cross section of the stop block (9) is fan-shaped, and the outer surface of the stop block (9) is fixed with insulating rubber (10).
3. The electronic chip with moisture-proof function as claimed in claim 2, wherein: the stop block (9) is provided with two positions, and the thickness of the insulating rubber (10) is one millimeter to eight millimeters.
4. The electronic chip with moisture-proof function as claimed in claim 1, wherein: the radiating fin (4) is provided with two to twenty along heating panel (2) length direction equidistance, radiating fin (4) side surface is provided with lug (6).
5. The electronic chip with moisture-proof function as claimed in claim 4, wherein: the connecting blocks (7) are L-shaped, and the number of the connecting blocks (7) is twice that of the radiating fins (4).
6. The electronic chip with moisture-proof function as claimed in claim 1, wherein: the thickness of the water-absorbing silica gel (3) is two millimeters to twelve millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021141144.6U CN212033008U (en) | 2020-06-18 | 2020-06-18 | Electronic chip with dampproofing function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021141144.6U CN212033008U (en) | 2020-06-18 | 2020-06-18 | Electronic chip with dampproofing function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212033008U true CN212033008U (en) | 2020-11-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021141144.6U Active CN212033008U (en) | 2020-06-18 | 2020-06-18 | Electronic chip with dampproofing function |
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| Country | Link |
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| CN (1) | CN212033008U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130409A (en) * | 2021-04-22 | 2021-07-16 | 牛桂平 | Face detection chip for face recognition device |
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2020
- 2020-06-18 CN CN202021141144.6U patent/CN212033008U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130409A (en) * | 2021-04-22 | 2021-07-16 | 牛桂平 | Face detection chip for face recognition device |
| CN113130409B (en) * | 2021-04-22 | 2022-06-03 | 济南法诺商贸有限公司 | Face detection chip for face recognition device |
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