CN208673251U - A kind of raspberry pie CPU liquid heat radiating device - Google Patents
A kind of raspberry pie CPU liquid heat radiating device Download PDFInfo
- Publication number
- CN208673251U CN208673251U CN201821466314.0U CN201821466314U CN208673251U CN 208673251 U CN208673251 U CN 208673251U CN 201821466314 U CN201821466314 U CN 201821466314U CN 208673251 U CN208673251 U CN 208673251U
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- fluid box
- cpu
- liquid
- type
- heat radiating
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Abstract
The utility model discloses a kind of raspberry pie CPU liquid heat radiating devices, it include: buckle-type fan, upper collection T-type fluid box, the U-shaped fluid box of next part and spring, the buckle-type fan is connected by two side position card slot tangs of buckle-type fan with the card slot recess of upper collection T-type fluid box two sides, cylinder on the downside of the upper collection T-type fluid box is wrapped spring, the U-shaped fluid box upper layer interposition of next part is equipped with a round hole, and the round hole size is just wrapped in the cylinder on the downside of collection T-type fluid box.Raspberry pie CPU liquid heat radiating device installation described in the utility model is easy to operate; the efficiency of heat dissipation is enhanced using argentiferous silica gel, condensate liquid; the closeness of contact of CPU and liquid heat radiating device is enhanced using the compressible devices of spring; so that CPU radiating rate is faster; it is more efficient, to effectively protect CPU main body, have structure simple; it is easy to operate, the high advantage of radiating efficiency.
Description
Technical field
The utility model relates to CPU falling temperature technique fields, specially raspberry pie CPU radiator.
Background technique
Raspberry pie is the microcomputer for there was only credit card-sized, and since the advent of the world facilitates programming with it, is easy to change
It makes, creativity can be played, cheap advantage is pursued by numerous people, raspberry pie CPU conduct tree the same with computer CPU
The arithmetic core and control core of certain kind of berries group can generate a large amount of heat in the process of work, these heats are excessively high to will lead to raspberry
Group crashes, blue screen, restarts and waits great number of issues.With the development of science and technology a large amount of cpu heats are with its different working principle pair
CPU radiates, and reduces its temperature to guarantee the runnability of CPU, in the prior art, cpu heat or good heat dissipation effect,
But installation it is complicated for operation or, install easy to operate, but in summer high temperature period, heat dissipation effect is limited, and for tree
The certain kind of berries sends unique structure, needs a kind of a kind of efficient CPU radiator made to measure for its structure, therefore design a kind of use
In raspberry pie CPU radiator be necessary.
Summary of the invention
The purpose of this utility model is to provide a kind of raspberry pie CPU liquid heat radiating devices to solve in above-mentioned background technique
The problem of proposition.
In order to solve the above-mentioned technical problem, the utility model provides the following technical solutions: a kind of raspberry pie CPU liquid radiating
Device, comprising: buckle-type fan, upper collection T-type fluid box, the U-shaped fluid box of next part and spring, the buckle-type fan structure are one
Block cuboid plank, the middle position of the buckle-type fan are equipped with fan, and the fan has USB interface, the buckle-type
The two sides position of fan has card slot tang, and it is small that the surrounding of the upper collection T-type fluid box upper side position is respectively equipped with 4 fixations
Hole, described 4 fixed aperture middle positions are equipped with round hole, and the round hole right positions are equipped with liquid inlet/outlet pipe, it is described on
The two sides for collecting T-type fluid box upper side position are equipped with card slot recess, and the size of the card slot tang is identical with the size of card slot recess,
The buckle-type fan passes through two side position card slot tangs of buckle-type fan and the card slot recess of upper collection T-type fluid box two sides
It is connected, the cylinder on the downside of the upper collection T-type fluid box is wrapped spring, the cylindrical base on the downside of the upper collection T-type fluid box
Provided with circulation aperture, the U-shaped fluid box upper layer interposition of next part is equipped with a round hole, and the round hole size is just wrapped up
The cylinder of Zhe ShangjiTXing fluid box lower layer is to be connected to upper collection T-type fluid box and the U-shaped fluid box of next part.
Further, the upper collection T-type liquid box enclosure is made of pure copper material.
Further, the U-shaped liquid box enclosure of the next part is made of pure copper material.
Further, the spring is made of high-carbon steel material.
Further, the upper liquid for integrating T-type fluid box is condensate liquid.
Further, the U-shaped fluid box upper layer of the next part is air.
Further, the liquid of the U-shaped fluid box lower layer of the next part is condensate liquid.
Further, the bottom outer surface of the lower layer of the U-shaped fluid box of the next part is thermally conductive argentiferous silica gel plate.
Further, the bottom surface of the lower layer of the U-shaped fluid box of the next part and raspberry pie CPU pass through upper collection T-type liquid
Spring outside case squeezes the U-shaped fluid box of next part and is attached.
Further, the diameter of the circulation aperture is 6~8cm.
Compared with prior art, the utility model beneficial effect achieved is: raspberry pie CPU described in the utility model
Liquid heat radiating device installation is easy to operate, enhances the efficiency of heat dissipation using argentiferous silica gel, condensate liquid, utilizes pressing for spring
Compression apparatus enhances the closeness of contact of CPU and liquid heat radiating device, so that CPU radiating rate is faster, it is more efficient, to have
Effect protects CPU main body, has structure simple, easy to operate, the high advantage of radiating efficiency.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:
Fig. 1 is the utility model raspberry pie CPU liquid heat radiating device structural schematic diagram；
Fig. 2 is the utility model raspberry pie CPU liquid heat radiating device structure left view schematic diagram；
Fig. 3 is the buckle-type fan structure diagram of the utility model；
Fig. 4 is the U-shaped fluid box structural schematic diagram of next part of the utility model.
Main element symbol description.
| Buckle-type fan | 1 | The U-shaped fluid box of next part | 3 |
| Upper collection T-type fluid box | 2 | Spring | 4 |
| Buckle fan board | 101 | Liquid inlet/outlet pipe | 204 |
| Fan | 102 | Fixed aperture | 205 |
| USB interface | 103 | Circulate aperture | 206 |
| Card slot tang | 104 | U-shaped fluid box round hole | 301 |
| Card slot recess | 201 | U-shaped liquid box enclosure | 302 |
| T-type fluid box round hole | 202 | Thermally conductive argentiferous silica gel plate | 303 |
| T-type liquid box enclosure | 203 |
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
It removes, be fully described by, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.The embodiment of base in this present embodiment, those of ordinary skill in the art institute without making creative work
The every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-4 is please referred to, the utility model provides a kind of technical solution: a kind of raspberry pie CPU liquid heat radiating device, packet
Include: buckle-type fan 1, upper collection T-type fluid box 2, the U-shaped fluid box 3 of next part and spring 4, buckle-type fan structure are one piece rectangular
Body plank 101, the middle position of buckle-type fan are equipped with fan 102, and fan has usb 1 03, the two sides of buckle-type fan
Position has card slot tang 104, and the surrounding of upper collection T-type fluid box upper side position is respectively equipped with 4 fixed apertures, 205,4 fixations
Aperture middle position is equipped with round hole 202, and round hole right positions are equipped with liquid inlet/outlet pipe 204, position on the upside of upper collection T-type fluid box
The two sides set are equipped with card slot recess 201, and the size of the card slot tang 104 is identical with the size of card slot recess 201, buckle-type wind
Fan is connected by two side position card slot tangs 104 of buckle-type fan with the card slot recess 201 of upper collection T-type fluid box two sides,
Cylinder on the downside of upper collection T-type fluid box is wrapped spring 4, and the cylindrical base on the downside of the upper collection T-type fluid box is provided with circulation
Aperture 206, the U-shaped fluid box upper layer interposition of next part are equipped with a round hole 301, and round hole size is just wrapped in collection T-type liquid
The cylinder of Ti Xiang lower layer is to be connected to upper collection T-type fluid box and the U-shaped fluid box of next part.
Further, upper collection T-type liquid box enclosure 203 is made of pure copper material, and fine copper heating conduction is strong, and heat dissipation effect is more
It is good.
Further, the U-shaped liquid box enclosure 302 of next part is made of pure copper material.
Further, spring 4 is made of high-carbon steel material, enhances the elasticity of spring, be conducive to the compression of spring to
So that CPU and the U-shaped fluid box following table face contact of next part are more abundant, while also improving the radiating efficiency of CPU.
Further, the upper liquid for integrating T-type fluid box is condensate liquid.
Further, the U-shaped fluid box upper layer of next part is air.
Further, the liquid of the U-shaped fluid box lower layer of next part is condensate liquid.
Further, the bottom outer surface 303 of the lower layer of the U-shaped fluid box of next part is thermally conductive argentiferous silica gel plate, it is possible to increase CPU
With the contact area of fluid box inner condensat liquid, increases radiating efficiency and accelerate heat-transfer rate.
Further, the bottom surface 303 of the lower layer of the U-shaped fluid box of next part and raspberry pie CPU pass through upper collection T-type fluid box
Outer spring 4 squeezes the U-shaped fluid box of next part and is attached, so that CPU contact closer abundant with fluid box, it is hot to be conducive to CPU
Amount distributes.
Further, the diameter of the circulation aperture 206 is 6~8cm.
Working principle:
1. installation process:
(1) raspberry pie CPU liquid heat radiating device installation first is as follows:
Collect T-type fluid box 2 in the connection of buckle-type fan 1: by the card slot tang 101 of two side position of buckle-type fan with it is upper
Collect the combination of the card slot recess 201 of two side position of T-type fluid box；
Upper collection T-type fluid box 2 connects the U-shaped fluid box of next part: the cylindrical type liquid by the way that upper collection T-type fluid box 2 to be descended to part
Body case is inserted into the round hole of the U-shaped fluid box 3 of next part；
(2) raspberry pie CPU liquid heat radiating device is installed to raspberry pie:
Mounted raspberry pie CPU liquid heat radiating device is passed through into 4 fixed aperture spiral shells above upper collection T-type fluid box
Device is fixed in raspberry pie by adjusting screw, while the active force by squeezing spring pushes the argentiferous silica gel of the U-shaped fluid box of next part
Lower surface combine closely with raspberry pie CPU, thus complete raspberry pie on CPU liquid heat radiating device installation.
2. the course of work
When raspberry pie CPU liquid heat radiating device works, the operation of CPU main body generates heat, passes through the U-shaped fluid box 3 of next part
Lower layer be thermally conductive argentiferous silica gel plate bottom outer surface 303 transfer heat to the U-shaped fluid box 302 of next part, due to upper collection T-type
4 squeezing action of spring outside fluid box increases the contact area between CPU main body and the U-shaped fluid box 3 of next part, and thermally conductive
Argentiferous silica gel plate heat-transfer rate is fast, improves and radiating efficiency and accelerates radiating rate, avoid CPU because of the excessively high generation of temperature therefore
Barrier；Heat enters in the U-shaped fluid box of next part, is absorbed heat by the coolant liquid in the U-shaped fluid box of next part, and the U-shaped liquid of next part
It is to be connected to that body case, which is with upper collection T-type fluid box, and heat can gradually be dispersed with the circulation of the coolant liquid in fluid box, while on
Collect T-type fluid box upper layer and have buckle-type fan, can further achieve the effect that heat dissipation.
Finally it should be noted that: the above descriptions are merely preferred embodiments of the present invention, is not limited to
The utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For member, it is still possible to modify the technical solutions described in the foregoing embodiments, or special to part of technology
Sign is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (10)
1. a kind of raspberry pie CPU liquid heat radiating device, comprising: buckle-type fan (1), upper collection T-type fluid box (2), the U-shaped liquid of next part
Body case (3) and spring (4), it is characterised in that: the buckle-type fan structure is one piece of cuboid plank (101), the buckle
The middle position of formula fan is equipped with fan (102), and the fan has USB interface (103), the two sides position of the buckle-type fan
It sets with card slot tang (104), the surrounding of the upper collection T-type fluid box upper side position is respectively equipped with 4 fixed apertures (205),
Described 4 fixed aperture middle positions are equipped with round hole (202), and the round hole right positions are equipped with liquid inlet/outlet pipe (204),
The two sides of the upper collection T-type fluid box upper side position are equipped with card slot recess (201), the size and card of the card slot tang (104)
The size of geosynclinal concave mouth (201) is identical, the buckle-type fan by two side position card slot tangs (104) of buckle-type fan with
The card slot recess (201) of upper collection T-type fluid box two sides is connected, and the cylindrical base on the downside of the upper collection T-type fluid box is provided with
It circulates aperture (206), the cylinder on the downside of the upper collection T-type fluid box is wrapped spring (4), the U-shaped fluid box upper layer of next part
Interposition is equipped with a round hole (301), and the round hole size (301) is just wrapped in the cylinder of Shang JiTXing fluid box lower layer
To collect T-type fluid box (2) and the U-shaped fluid box of next part (3) in connection.
2. a kind of raspberry pie CPU liquid heat radiating device according to claim 1, it is characterised in that: the upper collection T-type liquid
Body box enclosure (203) is made of pure copper material.
3. a kind of raspberry pie CPU liquid heat radiating device according to claim 1, it is characterised in that: the U-shaped liquid of the next part
Body box enclosure (302) is made of pure copper material.
4. a kind of raspberry pie CPU liquid heat radiating device according to claim 1, it is characterised in that: the spring (4) by
High-carbon steel material is made.
5. a kind of raspberry pie CPU liquid heat radiating device according to claim 1, it is characterised in that: the upper collection T-type liquid
The liquid of body case is condensate liquid.
6. a kind of raspberry pie CPU liquid heat radiating device according to claim 1, it is characterised in that: the U-shaped liquid of the next part
Body case upper layer is air.
7. a kind of raspberry pie CPU liquid heat radiating device according to claim 1, it is characterised in that: the U-shaped liquid of the next part
The liquid of Ti Xiang lower layer is condensate liquid.
8. a kind of raspberry pie CPU liquid heat radiating device according to claim 1, it is characterised in that: the U-shaped liquid of next part
The bottom outer surface (303) of the lower layer of case is thermally conductive argentiferous silica gel plate.
9. a kind of raspberry pie CPU liquid heat radiating device according to claim 1, it is characterised in that: the U-shaped liquid of next part
The bottom surface of the lower layer of case squeezes the U-shaped fluid box of next part by the spring outside upper collection T-type fluid box with raspberry pie CPU and is connected
It connects.
10. a kind of raspberry pie CPU liquid heat radiating device according to claim 1, it is characterised in that: the circulation aperture
(206) diameter is 6~8cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821466314.0U CN208673251U (en) | 2018-09-08 | 2018-09-08 | A kind of raspberry pie CPU liquid heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821466314.0U CN208673251U (en) | 2018-09-08 | 2018-09-08 | A kind of raspberry pie CPU liquid heat radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208673251U true CN208673251U (en) | 2019-03-29 |
Family
ID=65841839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821466314.0U Expired - Fee Related CN208673251U (en) | 2018-09-08 | 2018-09-08 | A kind of raspberry pie CPU liquid heat radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208673251U (en) |
-
2018
- 2018-09-08 CN CN201821466314.0U patent/CN208673251U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190329 Termination date: 20190908 |