CN218632015U

CN218632015U - Semiconductor packaging assembly

Info

Publication number: CN218632015U
Application number: CN202222800631.4U
Authority: CN
Inventors: 李晶
Original assignee: Sichuan Sichip Micro Technologies Co ltd
Current assignee: Sichuan Sichip Micro Technologies Co ltd
Priority date: 2022-10-24
Filing date: 2022-10-24
Publication date: 2023-03-14
Anticipated expiration: 2032-10-24

Abstract

The application discloses a semiconductor packaging assembly, which comprises a heat conducting fin, wherein two ends of the heat conducting fin are connected in a square hole formed in the top of a packaging shell through screws; a plurality of radiating fins penetrate through the outer side of the heat conducting fin at equal intervals; the upper side and the lower side of the radiating fin are respectively attached with a first waterproof breathable film and a packaging chip. This application can utilize conducting strip and heat radiation fins to derive the inside heat of encapsulation casing through the inside first waterproof ventilated membrane of quad slit, conducting strip and heat radiation fins to the outside is discharged through the round hole on first waterproof ventilated membrane and the roof to dispel the heat fast to the inside chip of encapsulation casing, utilize first waterproof ventilated membrane, can avoid water to enter into inside the encapsulation casing.

Description

Semiconductor packaging assembly

Technical Field

The application relates to the technical field of semiconductors, in particular to a semiconductor packaging assembly.

Background

The semiconductor is a material technology which is fast in progress in the prior art at present, a material between a conductor and an insulator can be simply called as a semiconductor, and the semiconductor packaging refers to a process of processing a wafer which passes a test according to a product model and a functional requirement to obtain an independent chip.

Patent No. CN201921096572.9 discloses a semiconductor package subassembly, including base plate and encapsulation chip, the up end of base plate is connected with the packaging shell, and the packaging shell comprises marginal zone and central zone to marginal zone and central zone are fixed connection, the below of packaging shell is provided with the encapsulation chip, and the half section down of encapsulating chip is located the holding tank, the surface of base plate is provided with the joint pad, and the joint pad corresponds from top to bottom with the chip pin, and the chip pin sets up the lower terminal surface at the encapsulation chip, the avris of base plate is provided with total pin, and total pin is connected with total pin. This semiconductor packaging subassembly when guaranteeing that packaging structure fully protects internal chip, has increased the whole heat dispersion of packaging shell, uses more high-efficiently to through the structural design of total pin and total pin, increased the holistic installation welded structure variety of the device, adaptability is better.

Currently, existing semiconductor package assemblies suffer from deficiencies, such as; the existing semiconductor packaging assembly has the advantages that in the using process, although the integral heat dissipation performance of the packaging shell is increased, the heat in the packaging shell cannot be directly discharged, the integral heat dissipation effect of the packaging shell is not good, the internal packaging chip is easily overheated, and the use of the packaging chip is affected.

Content of application

An object of the present application is to provide a semiconductor package assembly that solves the problems set forth in the background art.

In order to achieve the above purpose, the present application provides the following technical solutions: a semiconductor package assembly includes a thermally conductive sheet,

two ends of the heat conducting fin are connected in a square hole formed in the top of the packaging shell by screws;

a plurality of radiating fins penetrate through the outer side of the heat conducting fin at equal intervals;

the upper side and the lower side of the radiating fin are respectively attached with a first waterproof breathable film and a packaging chip.

In this kind of technical scheme, can utilize conducting strip and heat radiation fins to derive the inside heat of encapsulation casing, the round hole through on first waterproof ventilated membrane and the roof is discharged the outside to fast dispel the heat to the chip of encapsulation casing inside, utilize first waterproof ventilated membrane, can avoid water to enter into inside the encapsulation casing.

As an alternative of this application technical scheme, the louvre has all been seted up at encapsulation casing front side both ends, the heat conduction hole has been seted up to louvre inner wall one side, the waterproof ventilated membrane of heat conduction hole inside fixedly connected with second.

In this kind of technical scheme, can utilize the heat conduction hole in with the encapsulation casing heat conduction to the louvre, discharge the outside through the louvre, utilize the waterproof ventilated membrane of second, can avoid water to enter into inside the encapsulation casing, further promoted radiating effect.

As an alternative of this application technical scheme, there is the roof on the inside top of quad slit adopts the screw connection, a plurality of round holes have been seted up to roof top equidistance.

As an optional scheme of the technical scheme, the bottom of the packaging shell is connected with a substrate through screws, and a packaging chip is placed on the top of the substrate.

As an alternative of this application technical scheme, the equal electrically connected of encapsulation chip bottom both sides has the chip pin, the base plate top can be dismantled and be connected with the bonding pad.

As an alternative of the technical solution of the present application, both sides of the bonding pad are connected with one end of a conductive wire, and the other end of the conductive wire penetrates through the substrate and is electrically connected with a main pin.

Compared with the prior art, the beneficial effects of this application are as follows:

1. this application can utilize conducting strip and heat radiation fins to derive the inside heat of encapsulation casing through the inside first waterproof ventilated membrane of quad slit, conducting strip and heat radiation fins to the outside is discharged through the round hole on first waterproof ventilated membrane and the roof to dispel the heat fast to the inside chip of encapsulation casing, utilize first waterproof ventilated membrane, can avoid water to enter into inside the encapsulation casing.

2. This application can utilize the heat conduction hole to lead out the heat in the encapsulation casing in through louvre and heat conduction hole in the encapsulation casing, through louvre discharge outside, utilizes the waterproof ventilated membrane of second, can avoid water to enter into inside the encapsulation casing, has further promoted radiating effect.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments with reference to the attached drawings in which:

fig. 1 is an interior view of a semiconductor package assembly of the present application;

fig. 2 is a top view of a package housing of a semiconductor package assembly according to the present application.

In the figure: 1. a substrate; 101. packaging the chip; 102. a master pin; 103. a chip pin; 104. a bonding pad; 105. a wire guide; 2. packaging the shell; 201. a square hole; 202. a heat conductive sheet; 203. heat dissipation fins; 204. a first waterproof breathable film; 205. a top plate; 206. heat dissipation holes; 207. a heat conduction hole; 208. a second waterproof, breathable film; 209. a circular hole.

Detailed Description

Referring to fig. 1-2, the present application provides a technical solution: the utility model provides a semiconductor package subassembly, package chip 101 has been put into at 1 top of base plate, 1 top detachable construction of base plate has package casing 2, quad slit 201 has been seted up at package casing 2 top, quad slit 201 inner wall adopts screw connection to have conducting strip 202, conducting strip 202 outside equidistance runs through has a plurality of heat radiation fins 203, first waterproof ventilated membrane 204 and package chip 101 have been laminated respectively to both sides about heat radiation fins 203, the equal fixedly connected with quad slit 201 in first waterproof ventilated membrane 204 outside, there is roof 205 on the inside top of quad slit 201 adoption screw connection, a plurality of round holes 209 have been seted up to roof 205 top equidistance, utilize conducting strip 202 and heat radiation fins 203 to derive the inside heat of package casing 2, through round hole 209 on first waterproof ventilated membrane 204 and the roof 205 outside of discharging to carry out quick heat dissipation to the inside chip of package casing 2, utilize first waterproof ventilated membrane 204, can avoid water to enter into inside package casing 2.

Referring to fig. 1, heat dissipation holes 206 are formed at two ends of the front side of the package housing 2, a heat conduction hole 207 is formed at one side of the inner wall of the heat dissipation hole 206, a second waterproof breathable film 208 is fixedly connected inside the heat conduction hole 207, heat in the package housing 2 is conducted out of the heat dissipation hole 206 through the heat conduction hole 207 and is discharged to the outside through the heat dissipation hole 206, and water can be prevented from entering the package housing 2 through the second waterproof breathable film 208, so that the heat dissipation effect is further improved.

Referring to fig. 1, both sides of the bottom of the packaged chip 101 are electrically connected to chip pins 103, and the top of the substrate 1 is detachably connected to bonding pads 104.

Referring to fig. 1, one end of a conductive wire 105 is connected to both sides of the bonding pad 104, and the other end of the conductive wire 105 is electrically connected to a global pin 102 through the substrate 1.

When using a semiconductor package subassembly, can utilize conducting strip 202 and heat radiation fins 203 to derive the inside heat of encapsulation casing 2, round hole 209 through on first waterproof ventilated membrane 204 and the roof 205 discharges the outside, thereby dispel the heat fast to the inside chip of encapsulation casing 2, utilize first waterproof ventilated membrane 204, can avoid water to enter into inside the encapsulation casing 2, louvre 206 and the heat conduction hole 207 of setting, can utilize heat conduction hole 207 to derive the louvre 206 with the heat in the encapsulation casing 2 in, discharge the outside through louvre 206, utilize waterproof ventilated membrane 208 of second, can avoid water to enter into inside the encapsulation casing 2, further promoted radiating effect.

Claims

1. A semiconductor package assembly comprising a thermally conductive sheet (202), characterized by:

two ends of the heat conducting fin (202) are connected into a square hole (201) formed in the top of the packaging shell (2) through screws;

a plurality of radiating fins (203) penetrate through the outer side of the heat conducting fin (202) at equal intervals;

the upper side and the lower side of the radiating fin (203) are respectively attached with a first waterproof breathable film (204) and a packaging chip (101).

2. The semiconductor package assembly of claim 1, wherein: heat dissipation hole (206) have all been seted up at encapsulation casing (2) front side both ends, heat conduction hole (207) have been seted up to heat dissipation hole (206) inner wall one side, the inside fixedly connected with second waterproof ventilated membrane (208) of heat conduction hole (207).

3. The semiconductor package assembly of claim 1, wherein: the inside top of quad slit (201) adopts the screw connection to have roof (205), a plurality of round holes (209) have been seted up to roof (205) top equidistance.

4. The semiconductor package assembly of claim 1, wherein: the packaging structure is characterized in that the bottom of the packaging shell (2) is connected with a substrate (1) through screws, and a packaging chip (101) is placed on the top of the substrate (1).

5. The semiconductor package of claim 1, wherein: the packaging structure is characterized in that both sides of the bottom of the packaging chip (101) are electrically connected with chip pins (103), and the top of the substrate (1) is detachably connected with a bonding pad (104).

6. The semiconductor package of claim 5, wherein: the two sides of the joint pad (104) are both connected with one end of a conductive wire (105), and the other end of the conductive wire (105) penetrates through the substrate (1) and is electrically connected with a main pin (102).