CN209282186U - A kind of water proof type chip diode - Google Patents
A kind of water proof type chip diode Download PDFInfo
- Publication number
- CN209282186U CN209282186U CN201920097374.8U CN201920097374U CN209282186U CN 209282186 U CN209282186 U CN 209282186U CN 201920097374 U CN201920097374 U CN 201920097374U CN 209282186 U CN209282186 U CN 209282186U
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- CN
- China
- Prior art keywords
- conductive pin
- chip diode
- conductive
- proof type
- type chip
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model system provides a kind of water proof type chip diode, including insulation-encapsulated body, conductive pin there are two being set in insulation-encapsulated body, diode wafer is connected on one of conductive pin, diode wafer also passes through conducting wire and connect with another conductive pin, and the bottom surface of conductive pin and the bottom surface of insulation-encapsulated body are located in same level；The top of insulation-encapsulated body is equipped with several heat dissipation grooves, the bottom surface of conductive pin is equipped with a conductive water repellent structure, conductive water repellent structure includes waterproof buffer layer, several welding connecting holes are equipped in waterproof buffer layer, elargol articulamentum is equipped in welding connecting hole, elargol articulamentum is contacted with the bottom of conductive pin to be connected.The utility model can be avoided conductive pin and directly contact with external environment, can effectively avoid metal structure and is etched, and waterproof construction can effectively prevent steam to enter chip diode from connection structure, so that it is guaranteed that the performance of chip diode entirety.
Description
Technical field
The utility model relates to diodes, specifically disclose a kind of water proof type chip diode.
Background technique
Diode is a kind of electronic device that can unidirectionally conduct electric current, is equipped with PN junction inside diode, the two of PN junction
End is equipped with lead terminal, if having the unilateral conductivity of electric current according to the direction of applied voltage, most of diode is had
Current direction we be normally referred to as rectification function.
SOD is a kind of surface-pasted packing forms, there are two pin is set.Chip diode mainly includes diode crystalline substance
One electrode of diode wafer when production, is directly welded at one of conductive pin by piece, conductive pin and packaging body
On, then by conducting wire another electrode of diode wafer is connected with another conductive pin, finally the structure being welded is put into
It is molded in injection mold, obtains chip diode after completing injection molding.In use, in conductive pin and applied pcb board
Pad connection, the corrosivity steam in air is easy to the gap between pad and conductive pin and penetrates into patch type two
Pole pipe causes the performance of chip diode to decline.
Utility model content
Based on this, it is necessary to be directed to prior art problem, provide a kind of water proof type chip diode, can effectively prevent
Steam enters chip diode from the gap of connection structure, it can be ensured that chip diode is not by moisture attacks.
To solve prior art problem, the utility model discloses a kind of water proof type chip diode, including insulation-encapsulated
Body is set in insulation-encapsulated body there are two conductive pin, is connected with diode wafer, diode wafer on one of conductive pin
It is also connect by conducting wire with another conductive pin, the bottom surface of conductive pin and the bottom surface of insulation-encapsulated body are located at same level
On；
The top of insulation-encapsulated body is equipped with several heat dissipation grooves, and the bottom surface of conductive pin is equipped with a conductive water repellent structure, leads
Electric waterproof construction includes the waterproof buffer layer with a thickness of D, and several welding connecting holes are equipped in waterproof buffer layer, are equipped in welding connecting hole
With a thickness of the elargol articulamentum of P, P < D, elargol articulamentum is contacted with the bottom of conductive pin to be connected.
Further, the radiate bottom of groove is equipped with dry water absorption layer.
Further, dry water absorption layer is silica gel water absorption layer.
Further, the section of conductive pin is in inverted L-shaped.
Further, waterproof buffer layer is thermal grease layer.
Further, elargol articulamentum is fixed with the graphite guide electric layer with a thickness of Q, P+Q < D far from the side of conductive pin.
Further, the waterproof grommet that conductive water repellent structure peripheral is wound with a thickness of H, H > D.
Further, waterproof grommet is rubber seal.
The utility model has the following beneficial effects: the utility model discloses a kind of water proof type chip diode, setting is reliable
Waterproof construction, can be avoided conductive pin and directly contacted with external environment, while can be substantially reduced for conductive connection
Metal structure is exposed to the area in external environment, can effectively avoid metal structure and is etched, and waterproof construction can be effectively prevent
Steam enters chip diode from connection structure, it can be ensured that chip diode is not by moisture attacks, so that it is guaranteed that patch
The performance of formula diode entirety.
Detailed description of the invention
Fig. 1 is the overlooking structure diagram of the utility model.
Fig. 2 is the schematic diagram of the section structure of the utility model A-A ' along Fig. 1.
Fig. 3 is the enlarged structure schematic diagram of the utility model B in Fig. 2.
Fig. 4 is that the utility model removes the schematic perspective view after insulation-encapsulated body.
Appended drawing reference are as follows: insulation-encapsulated body 10, heat dissipation groove 11, dry water absorption layer 12, conductive pin 20, diode wafer
30, conducting wire 31, conductive water repellent structure 40, waterproof buffer layer 41, welding connecting hole 42, elargol articulamentum 43, graphite guide electric layer 44, anti-
Waterstop ring 50.
Specific embodiment
For the feature, technological means and specific purposes achieved, function that can further appreciate that the utility model, below
The utility model is described in further detail in conjunction with attached drawing and specific embodiment.
Referring to figs. 1 to Fig. 4.
The utility model embodiment discloses a kind of water proof type chip diode, including insulation-encapsulated body 10, insulation-encapsulated
It is set in body 10 there are two conductive pin 20, is connected with diode wafer 30, diode wafer 30 on one of conductive pin 20
It is also connect by conducting wire 31 with another conductive pin 20, the bottom surface of conductive pin 20 and the bottom surface of insulation-encapsulated body 10 are positioned at same
On horizontal plane, at this point, conductive pin 20 only has bottom surface to be exposed in outside air, it can effectively avoid conductive pin 20 except bottom
Structure in addition is etched；
The top of insulation-encapsulated body 10 is equipped with several heat dissipation grooves 11, and the bottom surface of conductive pin 20 is equipped with a conductive water repellent knot
Structure 40, conductive water repellent structure 40 include the waterproof buffer layer 41 with a thickness of D, and waterproof buffer layer 41 is connected in conductive pin 20
Bottom surface, waterproof buffer layer 41 have good crashworthiness, can be avoided conductive pin 20 transport, installation etc. during because
Misoperation and be worn, several welding connecting holes 42 are equipped in waterproof buffer layer 41, the silver with a thickness of P is equipped in welding connecting hole 42
Glue connection layer 43, elargol have good electric conductivity and switching performance, P < D, the bottom of elargol articulamentum 43 and conductive pin 20
Contact is connected, and the bottom surface of 41 effective protection conductive pin 20 of waterproof buffer layer avoids the corrosivity steam in air from drawing conduction
Foot 20 causes to corrode, setting welding connecting hole 42 can be for fill solders such as scolding tin, it is ensured that applied pcb board pad can with lead
Electric pin 20 realizes effectively reliable connection, at the same corrosivity steam can be effectively prevent to penetrate into insulation-encapsulated body 10 and
Diode wafer 30 is caused to corrode, can effectively ensure the working performance of diode wafer 30.
When using the utility model, the solders such as scolding tin are coated on applied pcb board pad, then by conductive water repellent structure
40 alignment pcb board pads simultaneously depress connection, and part scolding tin enters in welding connecting hole 42 to be connect with elargol articulamentum 43, scolding tin solidification
Installation operation is completed afterwards.
Reliable waterproof construction is arranged in the utility model, can be avoided conductive pin 20 and directly contacts with external environment, together
When can be substantially reduced the area being exposed in external environment for the metal structure of conductive connection, can effectively avoid metal structure
It is etched, waterproof construction can effectively prevent steam to enter chip diode from connection structure, it can be ensured that two pole of patch type
Pipe is not by moisture attacks, so that it is guaranteed that the performance of chip diode entirety.
In the present embodiment, the bottom of heat dissipation groove 11 is equipped with dry water absorption layer 12, it is preferable that dry water absorption layer 12 is silicon
Glue water absorption layer, absorbent drying layer 12 can effectively absorb moisture, prevent the water transport in heat dissipation groove 11 to other structures pair
It causes to corrode.
In the present embodiment, the section of conductive pin 20 is in inverted L-shaped, and the notch section of two conductive pins 20 is oppositely arranged,
The distance between two 20 bottoms of conductive pin are capable of increasing, short circuit occurs to be effectively reduced between two conductive pins 20
Probability, while can effectively save material cost.
In the present embodiment, waterproof buffer layer 41 is thermal grease layer, can effectively improve dissipating for conductive water repellent structure 40
Hot property, to effectively improve the heat dissipation performance of chip diode entirety.
In the present embodiment, the graphite that elargol articulamentum 43 is fixed with a thickness of Q far from the side of conductive pin 20
Layer 44, P+Q < D, graphite guide electric layer 44 have good waterproof performance and electric conductivity, install and use in chip diode
Before, can be avoided 43 being corroded property moisture attacks of elargol articulamentum, while can ensure chip diode and pcb board pad it
Between conduction connecting structure reliability.
In the present embodiment, the waterproof grommet 50 with a thickness of H is surrounded with outside conductive water repellent structure 40, it is preferable that waterproof
Sealing ring 50 is rubber seal, H > D, diameter of the diameter greater than pcb board pad of waterproof grommet 50, waterproof grommet 50
The pad of pcb board can be effectively wrapped up, H > D is set, squeezing chip diode can effectively improve inside waterproof grommet 50
The leakproofness of structure can effectively avoid corrosivity steam and enter the inside of waterproof grommet 50, to avoid corrosivity steam pair
Conductive water repellent structure 40 is that pcb board pad impacts, and can further protect the performance of chip diode.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (8)
1. a kind of water proof type chip diode, including insulation-encapsulated body (10), set in the insulation-encapsulated body (10) there are two
Conductive pin (20) is connected with diode wafer (30), the diode wafer on one of them described conductive pin (20)
(30) it is also connect by conducting wire (31) with another conductive pin (20), which is characterized in that the bottom of the conductive pin (20)
Face and the bottom surface of the insulation-encapsulated body (10) are located in same level；
The top of the insulation-encapsulated body (10) is equipped with several heat dissipation grooves (11), and the bottom surface of the conductive pin (20) is equipped with one
Conductive water repellent structure (40), the conductive water repellent structure (40) include the waterproof buffer layer (41) with a thickness of D, the waterproof buffering
Several welding connecting holes (42) are equipped in layer (41), the interior elargol articulamentum (43) being equipped with a thickness of P of the welding connecting hole (42), P <
D, the elargol articulamentum (43) contacts with the bottom of the conductive pin (20) to be connected.
2. a kind of water proof type chip diode according to claim 1, which is characterized in that heat dissipation groove (11)
Bottom is equipped with dry water absorption layer (12).
3. a kind of water proof type chip diode according to claim 2, which is characterized in that the dry water absorption layer (12)
For silica gel water absorption layer.
4. a kind of water proof type chip diode according to claim 1, which is characterized in that the conductive pin (20)
Section is in inverted L-shaped.
5. a kind of water proof type chip diode according to claim 1, which is characterized in that the waterproof buffer layer (41)
For thermal grease layer.
6. a kind of water proof type chip diode according to claim 1, which is characterized in that the elargol articulamentum (43)
Side far from the conductive pin (20) is fixed with the graphite guide electric layer (44) with a thickness of Q, P+Q < D.
7. a kind of water proof type chip diode according to claim 1, which is characterized in that the conductive water repellent structure
(40) waterproof grommet (50) with a thickness of H, H > D are surrounded with outside.
8. a kind of water proof type chip diode according to claim 7, which is characterized in that the waterproof grommet (50)
For rubber seal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920097374.8U CN209282186U (en) | 2019-01-21 | 2019-01-21 | A kind of water proof type chip diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920097374.8U CN209282186U (en) | 2019-01-21 | 2019-01-21 | A kind of water proof type chip diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209282186U true CN209282186U (en) | 2019-08-20 |
Family
ID=67605529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920097374.8U Active CN209282186U (en) | 2019-01-21 | 2019-01-21 | A kind of water proof type chip diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209282186U (en) |
-
2019
- 2019-01-21 CN CN201920097374.8U patent/CN209282186U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Room 103, building 1, No.76, Baiye Road, Liaobu Town, Dongguan City, Guangdong Province 523430 Patentee after: Xianzhike semiconductor technology (Dongguan) Co.,Ltd. Address before: No. 18, Baiye Avenue, shangtun Industrial Zone, Liaobu Town, Dongguan City, Guangdong Province, 523430 Patentee before: Zhongzhi Semiconductor Technology (Dongguan) Co.,Ltd. |
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| CP03 | Change of name, title or address |