CN215183952U

CN215183952U - LED packaging chip and connecting structure thereof

Info

Publication number: CN215183952U
Application number: CN202120660934.3U
Authority: CN
Inventors: 陈林; 董川; 陶贤文
Original assignee: Anhui Ruituo Electronics Co ltd
Current assignee: Anhui Ruituo Electronics Co ltd
Priority date: 2021-03-30
Filing date: 2021-03-30
Publication date: 2021-12-14
Anticipated expiration: 2031-03-30

Abstract

The utility model discloses a LED encapsulates connection structure of chip and LED encapsulation chip, this LED encapsulates the chip and includes base plate, LED chip, bonding wire and encapsulation and glues, is equipped with the support on the base plate, and the LED chip is installed on the base plate, the bonding wire lead the lower surface of end at least partially regional through first solder joint gold ball with LED chip and/or the upper surface of support is LED and is connect, the bonding wire lead the upper surface of end at least partially regional through second solder joint gold ball with LED chip and/or the upper surface of support is LED and is connected, encapsulation adhesive splice on the base plate and will LED chip, bonding wire, first solder joint gold ball, second solder joint gold ball parcel. The utility model discloses can realize the reliable of LED chip and lead the connecing, improve the qualification rate of product.

Description

LED packaging chip and connecting structure thereof

Technical Field

The utility model belongs to the illumination field, concretely relates to LED encapsulates chip and LED encapsulates connection structure of chip.

Background

The LED chip packaging technology is characterized in that a die bond adhesive is used for fixing a chip on a substrate, and then the positive electrode and the negative electrode of the chip are connected through a bonding wire, so that the chip on the whole light emitting surface can be lightened, but the LED packaged chip can generate heat in the lightening process, so that the whole packaging colloid expands when heated, a pulling force is applied to the bonding wire, the existing LED packaged chip is unreliable in guide connection with the LED chip, lamps can be frequently turned off, and the qualification rate of products is greatly reduced.

Disclosure of Invention

An object of the utility model is to provide a LED encapsulates chip and LED encapsulates connection structure of chip, the utility model discloses can realize the reliable of LED chip and lead and connect, improve the qualification rate of product.

The technical scheme is as follows:

the utility model provides a LED encapsulates chip, glue including base plate, LED chip, bonding wire and encapsulation, be equipped with the support on the base plate, the LED chip is installed on the base plate, the lower surface of the end of leading of bonding wire at least part regional through first solder joint gold ball with the LED chip and/or the upper surface of support is LED and is connect, the upper surface of the end of leading of bonding wire at least part regional through second solder joint gold ball with the LED chip and/or the upper surface of support is LED and is connected, and encapsulation adhesive joint is on the base plate and will LED chip, bonding wire, first solder joint gold ball, second solder joint gold ball parcel.

In one embodiment, the number of the LED chips is at least two, the LED chips are connected by the bonding wires, and the connection ends of the bonding wires are provided with the first and second solder joint gold balls.

In one embodiment, a cofferdam glue is further arranged on the substrate close to the periphery, and the LED chip is located within the area surrounded by the cofferdam glue.

In one embodiment, a tip is formed by extending the connection end of the bonding wire to the side, the lower surface of the second solder gold ball is connected with the tip of the bonding wire, and the lower surface of the second solder gold ball is connected with the first solder gold ball in a manner of being connected with the two side areas of the tip of the bonding wire.

In one embodiment, the bonding wire lead end has two tips extending to both sides and forming a fishtail shape.

In one embodiment, the second solder gold balls are smaller than the first solder gold balls.

The utility model also provides a connection structure of LED encapsulation chip, including LED chip and bonding wire, the bonding wire lead the lower surface of end at least part regional through first solder joint gold ball with the upper surface of LED chip is LED and is connect, the bonding wire lead the upper surface of end at least part regional through second solder joint gold ball with the upper surface of LED chip is LED and is connected.

The utility model provides a technical scheme has following advantage and effect:

the utility model discloses a lead of LED chip and/or support and bonding wire lead end is met through first solder joint gold ball, second solder joint gold ball two times planting ball and is realized, the lower surface of the lead end of bonding wire at least some regions lead with the upper surface of LED chip and/or support through first solder joint gold ball, the upper surface of the lead end of bonding wire at least some regions lead with the upper surface of LED chip and/or support through second solder joint gold ball; the bonding wire can be welded and fixed in the two directions of the upper surface and the lower surface of the bonding wire, and can bear larger pulling force when the packaging adhesive deforms; meanwhile, the bonding wire and the LED chip are more reliably connected in a guiding mode, the occurrence of lamp death is reduced, and the qualified rate of products is improved.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles, principles and effects of the invention.

Unless otherwise specified or defined, the same reference numerals in different figures refer to the same or similar features, and different reference numerals may be used for the same or similar features.

Fig. 1 is an overall cross-sectional view of an LED packaged chip according to an embodiment of the present invention;

fig. 2 is an oblique view of an LED packaged chip according to an embodiment of the present invention;

FIG. 3 is a schematic view of a bond wire lead;

FIG. 4 is an exploded view of FIG. 3;

FIG. 5 is an enlarged view of a portion of FIG. 1;

FIG. 6 is an enlarged view of a portion of FIG. 3;

description of reference numerals:

10. a base plate, 11, a bracket,

20. an LED chip is arranged on the base plate,

30. a bonding wire, 31, a tip,

40. the packaging adhesive is used for packaging the glass substrate,

50. the cofferdam is made of a cofferdam glue,

60. the first welding point is a gold ball,

70. and a second solder bump.

Detailed Description

In order to facilitate an understanding of the invention, specific embodiments thereof will be described in more detail below with reference to the accompanying drawings.

Unless specifically stated or otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In combination with the present technical solution's realistic scene, all technical and scientific terms used herein may also have meanings corresponding to the purpose of realizing the technical solution of the present invention.

As used herein, unless otherwise specified or defined, "first" and "second" … are used merely for name differentiation and do not denote any particular quantity or order.

As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items, unless specified or otherwise defined.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present; when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present; when an element is referred to as being "mounted on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present.

As used herein, unless otherwise specified or defined, the terms "comprises," "comprising," and "comprising" are used interchangeably to refer to the term "comprising," and are used interchangeably herein.

It is needless to say that technical contents or technical features which are contrary to the object of the present invention or clearly contradict each other should be excluded.

As shown in fig. 1 to 6, the LED package chip includes a substrate 10, an LED chip 20, a bonding wire 30 and a package adhesive 40, wherein a support 11 is disposed on the substrate 10, the LED chip 20 is mounted on the substrate 10, and the bonding wire 30 and the LED chip are connected by a double ball-planting method, that is: at least partial area of the lower surface of the connection end of the bonding wire 30 is connected with the upper surface of the LED chip through the first solder joint gold ball 60 in a conduction manner, at least partial area of the upper surface of the connection end of the bonding wire 30 is connected with the upper surface of the LED chip 20 through the second solder joint gold ball 70 in a conduction manner, and the packaging adhesive 40 is bonded on the substrate 10 and wraps the LED chip 20, the bonding wire 30, the first solder joint gold ball 60 and the second solder joint gold ball 70.

The bonding wire 30 is also connected with the bracket 11 in a double ball-planting manner, that is: at least partial area of the lower surface of the connection end of the bonding wire 30 is connected with the upper surface of the bracket 11 through the first solder gold ball 60 in a conduction manner, and at least partial area of the upper surface of the connection end of the bonding wire 30 is connected with the upper surface of the bracket 11 through the second solder gold ball 70 in a conduction manner.

In the embodiment, the connection of the LED chip 20, the support 11 and the connection end of the bonding wire 30 is realized by twice ball-planting through the first solder joint gold ball 60 and the second solder joint gold ball 70, at least part of the area of the lower surface of the connection end of the bonding wire 30 is connected with the LED chip 20 and the upper surface of the support 11 through the first solder joint gold ball 60, and at least part of the area of the upper surface of the connection end of the bonding wire is connected with the LED chip 20 and the upper surface of the support 11 through the second solder joint gold ball 70; the bonding wire 30 can be welded and fixed in the two directions of the upper surface and the lower surface of the bonding wire 30, and the bonding wire 30 can bear larger pulling force when the packaging adhesive 40 deforms; meanwhile, the bonding wire 30 is more reliably connected with the LED chip 20 and the bracket 11 in a guiding mode, the occurrence of lamp death is reduced, and the qualified rate of products is improved.

In this embodiment, the number of the LED chips 20 is multiple, each of the LED chips 20 is connected by the bonding wire 30, and the connection ends of the bonding wire 30 are provided with the first solder joint gold ball 60 and the second solder joint gold ball 70. A cofferdam glue 50 is further arranged on the substrate 10 near the periphery, and the LED chip 20 is located within the area surrounded by the cofferdam glue 50.

In order to improve the fixing and guiding effects, the guiding end of the bonding wire 30 extends towards two side portions to form two tips 31 and forms a fish tail shape, the lower surface of the second solder gold ball 70 is guided and connected with the tips 31 of the bonding wire 30, the lower surface of the second solder gold ball 70 and the two side areas of the tips 31 of the bonding wire 30 are guided and connected with the first solder gold ball 60, and the second solder gold ball 70 is smaller than the first solder gold ball 60. The second solder joint gold ball 70 is smaller than the first solder joint gold ball 60, so that the performance of the product is prevented from being affected by overlarge solder joints, the lead end of the bonding wire 30 is in a fishtail shape, and the second solder joint gold ball 70 with a smaller size can be simultaneously connected with the bonding wire 30 and the first solder joint gold ball 60 in a lead manner, so that the lead effect can be improved.

The above embodiments are intended to be illustrative, and should not be construed as limiting the scope of the invention, and the technical solutions, objects and effects of the present invention are described in full herein.

The above examples are not intended to be exhaustive list of the present invention, and there may be many other embodiments not listed. Any replacement and improvement made on the basis of not violating the conception of the utility model belong to the protection scope of the utility model.

Claims

The LED packaging chip is characterized by comprising a substrate, an LED chip, a bonding wire and packaging glue, wherein a support is arranged on the substrate, the LED chip is installed on the substrate, at least part of the lower surface of a guide end of the bonding wire is in guide connection with the LED chip and/or the upper surface of the support through a first welding point gold ball, at least part of the upper surface of the guide end of the bonding wire is in guide connection with the LED chip and/or the upper surface of the support through a second welding point gold ball, and the packaging glue is connected to the substrate and wraps the LED chip, the bonding wire, the first welding point gold ball and the second welding point gold ball.
2. The LED packaged chip according to claim 1, wherein the number of the LED chips is at least two, the LED chips are connected by the bonding wires, and the connection ends of the bonding wires are provided with the first and second solder gold balls.
3. The LED packaged chip of claim 1, wherein a dam paste is further disposed on the substrate near the periphery of the substrate, and the LED chip is located within the area surrounded by the dam paste.
4. The LED package chip according to any one of claims 1 to 3, wherein a tip is formed at the lead end of the bonding wire extending to the side, the lower surface of the second solder gold ball is connected to the tip of the bonding wire, and the lower surface of the second solder gold ball is connected to the first solder gold ball in the area on the two sides of the tip of the bonding wire.
5. The LED package chip according to any one of claims 1 to 3, wherein the bonding wire lead end has two tips extending to both sides and forms a fishtail shape.
6. The LED package chip of any of claims 1 to 3, wherein the second solder gold balls are smaller than the first solder gold balls.
The connecting structure of the LED packaging chip is characterized by comprising an LED chip and a bonding wire, wherein at least part of the area of the lower surface of the connecting end of the bonding wire is connected with the upper surface of the LED chip in a guiding mode through a first welding point gold ball, and at least part of the area of the upper surface of the connecting end of the bonding wire is connected with the upper surface of the LED chip in a guiding mode through a second welding point gold ball.
8. The LED package chip connection structure of claim 7, wherein a tip is formed by extending the bonding wire from the lead end to the side, the lower surface of the second solder gold ball is connected to the bonding wire, and the lower surface of the second solder gold ball is connected to the first solder gold ball in the area on the two sides of the bonding wire tip.
9. The LED package chip connection structure of claim 8, wherein the bonding wire lead end has two tips extending to both sides and forms a fish tail shape.
10. The connection structure of the LED package chip according to any one of claims 7 to 9, wherein the second solder gold balls are smaller than the first solder gold balls.