CN214299264U - 一种mems传感器 - Google Patents
一种mems传感器 Download PDFInfo
- Publication number
- CN214299264U CN214299264U CN202022657128.9U CN202022657128U CN214299264U CN 214299264 U CN214299264 U CN 214299264U CN 202022657128 U CN202022657128 U CN 202022657128U CN 214299264 U CN214299264 U CN 214299264U
- Authority
- CN
- China
- Prior art keywords
- mems
- chip
- extending
- glue layer
- mems sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005452 bending Methods 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 42
- 239000003292 glue Substances 0.000 claims description 65
- 239000000758 substrate Substances 0.000 claims description 31
- 238000003466 welding Methods 0.000 claims description 11
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 16
- 230000008646 thermal stress Effects 0.000 abstract description 8
- 241001391944 Commicarpus scandens Species 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 230000035882 stress Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 230000008602 contraction Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022657128.9U CN214299264U (zh) | 2020-11-17 | 2020-11-17 | 一种mems传感器 |
| PCT/CN2020/133739 WO2022104930A1 (fr) | 2020-11-17 | 2020-12-04 | Capteur mems |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022657128.9U CN214299264U (zh) | 2020-11-17 | 2020-11-17 | 一种mems传感器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214299264U true CN214299264U (zh) | 2021-09-28 |
Family
ID=77842179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022657128.9U Expired - Fee Related CN214299264U (zh) | 2020-11-17 | 2020-11-17 | 一种mems传感器 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN214299264U (fr) |
| WO (1) | WO2022104930A1 (fr) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080222884A1 (en) * | 2007-03-14 | 2008-09-18 | Honeywell International Inc. | Packaging for chip-on-board pressure sensor |
| CN102275859A (zh) * | 2010-06-13 | 2011-12-14 | 苏州敏芯微电子技术有限公司 | Mems微传感器的封装结构及其制造方法 |
| CN204291390U (zh) * | 2014-11-28 | 2015-04-22 | 歌尔声学股份有限公司 | 一种mems麦克风 |
| CN204442690U (zh) * | 2015-01-27 | 2015-07-01 | 歌尔声学股份有限公司 | Mems麦克风 |
| CN204442602U (zh) * | 2015-02-15 | 2015-07-01 | 歌尔声学股份有限公司 | 一种mems传感器 |
| CN209400128U (zh) * | 2018-12-25 | 2019-09-17 | 歌尔科技有限公司 | 防水压差传感器 |
| CN111225331B (zh) * | 2020-03-16 | 2022-04-29 | 瑞声声学科技(深圳)有限公司 | Mems麦克风 |
-
2020
- 2020-11-17 CN CN202022657128.9U patent/CN214299264U/zh not_active Expired - Fee Related
- 2020-12-04 WO PCT/CN2020/133739 patent/WO2022104930A1/fr active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022104930A1 (fr) | 2022-05-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210928 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |