CN214014619U - Circuit board capable of dissipating heat - Google Patents
Circuit board capable of dissipating heat Download PDFInfo
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- CN214014619U CN214014619U CN202023173543.3U CN202023173543U CN214014619U CN 214014619 U CN214014619 U CN 214014619U CN 202023173543 U CN202023173543 U CN 202023173543U CN 214014619 U CN214014619 U CN 214014619U
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- circuit board
- cavity
- heat dissipation
- aluminum alloy
- alloy plate
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a circuit board that can dispel heat, which comprises a circuit board, the bottom of circuit board is provided with plastics heat dissipation cover, the inner wall of plastics heat dissipation cover is provided with the plastics space bar, plastics heat dissipation cover is provided with first cavity and second cavity through the plastics space bar, and just first cavity is located the below of second cavity. The utility model discloses in, first aluminum alloy plate and second aluminum alloy plate can carry the inside of first cavity with the inside heat of second cavity, and the inside of first cavity can absorb the heat to the inside steam of first cavity through the thermal grease who fills, and gaseous heat dissipation around the device can be accelerated to first louvre and second louvre, and simple structure can make the circuit board have better radiating effect to improve the life of circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a circuit board that can dispel heat.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board can be called as a printed circuit board or a printed circuit board, and the birth and development of the FPC and the PCB promote a new product of a soft-hard combined board. Therefore, the rigid-flexible printed circuit board is a circuit board with FPC (flexible printed circuit) and PCB (printed circuit board) characteristics formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like;
the circuit board capable of radiating heat is provided, the existing circuit board has certain disadvantages, the existing circuit board does not have a self-radiating effect, and the peripheral radiating device has a poor radiating effect, so that the circuit board is easy to burn out due to overheating, the service life of the circuit board is influenced, and certain influence is exerted.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a circuit board capable of radiating.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a circuit board capable of dissipating heat comprises a circuit board, wherein a plastic heat dissipation cover is arranged at the bottom of the circuit board, a plastic partition plate is arranged on the inner wall of the plastic heat dissipation cover, the plastic heat dissipation cover is provided with a first cavity and a second cavity through the plastic partition plate, and the first cavity is positioned below the second cavity;
a first aluminum alloy plate is arranged in the second cavity;
the bottom fixedly connected with second aluminum alloy plate of first aluminum alloy plate, and second aluminum alloy plate is a plurality of parallel to each other.
As a further description of the above technical solution:
second aluminum alloy plate and plastics space bar through connection, and the one end that first aluminum alloy plate was kept away from to second aluminum alloy plate is located the inside of first cavity.
As a further description of the above technical solution:
and the first cavity is internally provided with heat dissipation paste.
As a further description of the above technical solution:
the bottom central point of plastics heat dissipation cover puts and is provided with the filler opening, the bottom of plastics heat dissipation cover corresponds the position embedding of filler opening and is provided with the rubber buffer.
As a further description of the above technical solution:
and second heat dissipation holes are formed in the positions, corresponding to the second cavities, of the outer surface of the plastic heat dissipation cover, and are distributed annularly.
As a further description of the above technical solution:
the outer surface of the circuit board is provided with a first radiating hole and a fastening hole, the first radiating hole is a plurality of which are uniformly distributed in a rectangular shape, and the fastening hole is respectively located at the four corners of the circuit board.
The utility model discloses following beneficial effect has:
1. this circuit board that can dispel heat, when using, can carry the inside heat of second cavity to the inside of first cavity through the first aluminum alloy plate and the second aluminum alloy plate that set up, the inside of first cavity can absorb the heat to the inside steam of first cavity through the thermal grease who fills, and gaseous heat dissipation around the device can be accelerated to first louvre and second louvre, and simple structure can make the circuit board have better radiating effect to improve the life of circuit board.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
fig. 3 is an enlarged view of a in fig. 2 according to the present invention;
fig. 4 is a top view of the present invention.
Illustration of the drawings:
1. a circuit board; 2. a plastic heat dissipation cover; 3. a plastic spacer plate; 4. a first cavity; 5. a second cavity; 6. a first aluminum alloy sheet; 7. a second aluminum alloy plate; 8. a rubber plug; 9. a filling opening; 10. a first heat dissipation hole; 11. a fastening hole; 12. a second heat dissipation hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, the present invention provides an embodiment: a circuit board capable of dissipating heat comprises a circuit board 1, wherein a plastic heat dissipation cover 2 is arranged at the bottom of the circuit board 1, a plastic partition plate 3 is arranged on the inner wall of the plastic heat dissipation cover 2, the plastic heat dissipation cover 2 is provided with a first cavity 4 and a second cavity 5 through the plastic partition plate 3, and the first cavity 4 is positioned below the second cavity 5; wherein, a first aluminum alloy plate 6 is arranged in the second cavity 5; the bottom fixedly connected with second aluminium alloy plate 7 of first aluminium alloy plate 6, and second aluminium alloy plate 7 is a plurality of parallel to each other.
The second aluminum alloy plate 7 is in through connection with the plastic partition plate 3, one end, far away from the first aluminum alloy plate 6, of the second aluminum alloy plate 7 is located inside the first cavity 4, and the first aluminum alloy plate 6 and the second aluminum alloy plate 7 can convey heat inside the second cavity 5 to the inside of the first cavity 4; the first cavity 4 is internally provided with heat-dissipating paste which can absorb heat of the second aluminum alloy plate 7 and the first aluminum alloy plate 6; a filling port 9 is formed in the center of the bottom of the plastic heat dissipation cover 2, a rubber plug 8 is embedded in the position, corresponding to the filling port 9, of the bottom of the plastic heat dissipation cover 2, the filling port 9 can facilitate filling of heat dissipation paste, and the rubber plug 8 can seal the heat dissipation paste; the outer surface of the plastic heat dissipation cover 2 is provided with second heat dissipation holes 12 corresponding to the positions of the second cavity 5, the second heat dissipation holes 12 are distributed annularly, and the second heat dissipation holes 12 can dissipate the heat of the gas in the second cavity 5; the outer surface of circuit board 1 is provided with first louvre 10 and fastening hole 11, and first louvre 10 is a plurality of rectangle evenly distributed, and fastening hole 11 is located the position in 1 four corners of circuit board respectively, and first louvre 10 can be convenient for dispel the heat to the steam at 1 top of circuit board, and fastening hole 11 can be convenient for carry out fixed mounting to circuit board 1.
The working principle is as follows: when using the circuit board that can dispel the heat, at first, first aluminum alloy plate 6 and second aluminum alloy plate 7 can carry the inside heat of second cavity 5 to the inside of first cavity 4, then, the inside of first cavity 4 can be to the inside steam of first cavity 4 heat absorption through the thermal grease of packing, finally, first louvre 10 and second louvre 11 can accelerate the heat dissipation of device gas around, moreover, the steam generator is simple in structure, circuit board 1 can have better radiating effect, thereby the service life of circuit board 1 is prolonged, and the steam generator has certain practicality.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (6)
1. A circuit board capable of dissipating heat comprises a circuit board (1), and is characterized in that: the bottom of the circuit board (1) is provided with a plastic heat dissipation cover (2), the inner wall of the plastic heat dissipation cover (2) is provided with a plastic partition plate (3), the plastic heat dissipation cover (2) is provided with a first cavity (4) and a second cavity (5) through the plastic partition plate (3), and the first cavity (4) is positioned below the second cavity (5);
wherein a first aluminum alloy plate (6) is arranged in the second cavity (5);
the bottom fixedly connected with second aluminum alloy plate (7) of first aluminum alloy plate (6), and second aluminum alloy plate (7) are a plurality of parallel to each other.
2. The circuit board capable of dissipating heat according to claim 1, wherein: second aluminum alloy plate (7) and plastics space bar (3) through connection, and second aluminum alloy plate (7) keep away from the one end of first aluminum alloy plate (6) and are located the inside of first cavity (4).
3. The circuit board capable of dissipating heat according to claim 1, wherein: and the first cavity (4) is internally provided with heat dissipation paste.
4. The circuit board capable of dissipating heat according to claim 1, wherein: the bottom central point of plastics heat dissipation cover (2) puts and is provided with filler (9), the position embedding that the bottom of plastics heat dissipation cover (2) corresponds filler (9) is provided with rubber buffer (8).
5. The circuit board capable of dissipating heat according to claim 1, wherein: the outer surface of the plastic heat dissipation cover (2) is provided with second heat dissipation holes (12) corresponding to the positions of the second cavities (5), and the second heat dissipation holes (12) are distributed in an annular shape.
6. The circuit board capable of dissipating heat according to claim 1, wherein: the outer surface of the circuit board (1) is provided with a first radiating hole (10) and a fastening hole (11), the first radiating hole (10) is a plurality of which are uniformly distributed in a rectangular shape, and the fastening hole (11) is respectively located at the four corners of the circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023173543.3U CN214014619U (en) | 2020-12-25 | 2020-12-25 | Circuit board capable of dissipating heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023173543.3U CN214014619U (en) | 2020-12-25 | 2020-12-25 | Circuit board capable of dissipating heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214014619U true CN214014619U (en) | 2021-08-20 |
Family
ID=77290544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023173543.3U Active CN214014619U (en) | 2020-12-25 | 2020-12-25 | Circuit board capable of dissipating heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214014619U (en) |
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2020
- 2020-12-25 CN CN202023173543.3U patent/CN214014619U/en active Active
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