CN214627463U - Circuit board assembly heat abstractor - Google Patents
Circuit board assembly heat abstractor Download PDFInfo
- Publication number
- CN214627463U CN214627463U CN202023312441.5U CN202023312441U CN214627463U CN 214627463 U CN214627463 U CN 214627463U CN 202023312441 U CN202023312441 U CN 202023312441U CN 214627463 U CN214627463 U CN 214627463U
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- circuit board
- fixedly connected
- heat
- soaking
- soaking plate
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a circuit board assembly heat abstractor, including soaking plate, play tuber pipe, a plurality of heat radiation fins of the even fixedly connected with in top of soaking plate, the both ends lateral wall of soaking plate is close to the equal fixedly connected with location arch in position of edge, the soaking plate is kept away from the bellied one end in location and is seted up the location opening, positioning groove has all been seted up to the both ends inside wall of location opening. The utility model discloses in, each soaking board that will make up together aligns respectively and lays the top side at each chip, then get some bolts and aim at respectively and imbed the location screw hole that is located edge and well side soaking board, twist respectively in corresponding location screw hole and the appointed screw hole on the circuit board with these bolts after that to be convenient for make each soaking board extrude each other, make each soaking board detain the top side at the chip steadily, thereby the volume of the bolt that needs to be twisted that has significantly reduced is favorable to promoting work efficiency.
Description
Technical Field
The utility model relates to a circuit board heat dissipation technical field especially relates to a circuit board assembly heat abstractor.
Background
The Printed circuit Board PCB is an english (Printed circuit Board) Printed PCB, and a conductive pattern formed by making a Printed circuit, a Printed element, or a combination of both on an insulating material according to a predetermined design is generally called a Printed circuit, and a conductive pattern providing electrical connection between components on an insulating substrate is called a Printed circuit, so that a Printed circuit or a finished Board of the Printed circuit is called a Printed circuit Board, also called a Printed Board or a Printed circuit Board;
at present, the soaking plate is directly additionally arranged on the specification chip of the circuit board when the existing circuit board assembly dissipates heat, so that the heat of the chip body is led out, but the soaking plate is required to be sequentially arranged on each chip in the mode, the installation workload is larger, and the heat dissipation efficiency of the passive heat dissipation structure is not high.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a circuit board assembly heat dissipation device.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a circuit board assembly heat dissipation device comprises a soaking plate and an air outlet pipe, wherein the top end of the soaking plate is uniformly and fixedly connected with a plurality of heat dissipation fins, the positions, close to the edges, of the outer side walls of the two ends of the soaking plate are fixedly connected with positioning bulges, one end, far away from the positioning bulges, of the soaking plate is provided with a positioning opening, the inner side walls of the two ends of the positioning opening are provided with positioning grooves, and the middle position of the bottom end of the soaking plate is fixedly connected with a heat conduction copper sheet;
the utility model discloses a wind-out pipe, including wind-out pipe, connecting groove, wind-out pipe, wind-guiding pipe, wind-out pipe, wind-guiding cover, wind-guiding pipe, wind-guiding cover, and heat, wind-guiding cover, and heat, wind-guiding cover, and heat-guiding cover, wind-guiding cover, and heat, wind-guiding cover, and.
As a further description of the above technical solution:
and the bottom end of the heat-conducting copper sheet is attached with a heat-conducting silicone pad.
As a further description of the above technical solution:
and the edge of the outer side wall of the rotary joint is fixedly connected with a sealing rubber gasket.
As a further description of the above technical solution:
the top of vapor chamber is close to the position of four corners department and all has seted up the location screw, and the bottom of location screw and vapor chamber link up each other.
As a further description of the above technical solution:
and the edge of one side of the heat radiation fan, which is close to the air guide cover, and the edge of one side of the heat radiation fan, which is far away from the air guide cover are fixedly connected with mounting frames.
As a further description of the above technical solution:
the wind scooper is fixedly connected with the adjacent mounting rack through bolts.
The utility model discloses following beneficial effect has:
1. this a circuit board assembly heat abstractor, each soaking board that will combine together aligns respectively and paves the top side at each chip, then get some bolts and aim at respectively and imbed in the location screw that is located edge and well side soaking board, screw into respectively with these bolts after that and correspond in the appointed screw on location screw and the circuit board, thereby be convenient for make each soaking board extrude each other, make each soaking board detain the top side at the chip steadily, thereby the volume of the bolt that needs to be twisted has significantly reduced, be favorable to promoting work efficiency.
2. This circuit board assembly heat abstractor rotates the air outlet on each air-out pipe of intercombination to the one side that corresponds each soaking board, bloies in the air guide housing through radiator fan, makes outside cold wind pass through air guide housing and air guide duct and is led into in each air-out pipe and appear on the cooling fin of each soaking board through the air outlet on the air-out pipe to the heat dissipation of chip is convenient for accelerate.
Drawings
FIG. 1 is a schematic view of the vapor chamber structure of the present invention;
fig. 2 is a schematic view of the structure of the air outlet pipe of the present invention;
fig. 3 is a schematic structural view of the position a of the present invention;
FIG. 4 is a schematic view of the top view of the vapor chamber of the present invention;
fig. 5 is a schematic view of the bottom structure of the vapor chamber of the present invention.
Illustration of the drawings: 1. a vapor chamber; 2. an air outlet pipe; 3. heat dissipation fins; 4. a thermally conductive copper sheet; 5. a thermally conductive silicone pad; 6. a heat radiation fan; 7. positioning the projection; 8. positioning the opening; 9. a positioning groove; 10. positioning the screw hole; 11. an air outlet; 12. connecting grooves; 13. a rotating joint; 14. sealing the rubber gasket; 15. an air guide pipe; 16. a wind scooper; 17. and (7) mounting frames.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-5, the present invention provides an embodiment: a circuit board assembly heat dissipation device comprises a soaking plate 1 and an air outlet pipe 2, wherein the top end of the soaking plate 1 is uniformly and fixedly connected with a plurality of heat dissipation fins 3, the positions, close to the edges, of the outer side walls of the two ends of the soaking plate 1 are fixedly connected with positioning protrusions 7, one end, away from the positioning protrusions 7, of the soaking plate 1 is provided with a positioning opening 8, the inner side walls of the two ends of the positioning opening 8 are provided with positioning grooves 9, and the middle position of the bottom end of the soaking plate 1 is fixedly connected with a heat conduction copper sheet 4;
a plurality of air outlets 11 have evenly been seted up to the lateral wall of play tuber pipe 2, spread groove 12 has been seted up to the one end intermediate position of play tuber pipe 2, the one side that goes out tuber pipe 2 and be close to spread groove 12 is provided with guide duct 15, guide duct 15 is close to the one end intermediate position of spread groove 12 and goes out the one end fixedly connected with rotary joint 13 that spread groove 12 was kept away from to tuber pipe 2, and the embedding is rotated between spread groove 12 and the adjacent rotary joint 13 and is connected, rotary joint 13's one end fixedly connected with wind scooper 16 is kept away from to guide duct 15, the top of wind scooper 16 is provided with radiator fan 6.
The bottom end of the heat conduction copper sheet 4 is provided with the heat conduction silicone grease pad 5 in a fitting manner, so that the heat conduction silicone grease pad 5 can be used for filling a gap between the heat conduction copper sheet 4 and the chip, and the temperature on the surface of the chip can be led into the heat conduction copper sheet 4 more uniformly.
The edge of the outer side wall of the rotary joint 13 is fixedly connected with a sealing rubber gasket 14, which is beneficial to preventing gas from seeping through the gap between the rotary joint 13 and the connecting groove 12.
The top of vapor chamber 1 all has seted up location screw 10 near the position of four corners departments, and location screw 10 link up each other with the bottom of vapor chamber 1, is favorable to aligning the bolt to twist in the appointed screw on location screw 10 and the circuit board to be convenient for make vapor chamber 1 detain the top side at the chip steadily.
The edge of one side of the heat dissipation fan 6 close to the air guiding cover 16 and the edge of one side far away from the air guiding cover 16 are both fixedly connected with mounting frames 17, which is beneficial to fixing the heat dissipation fan 6 in the shell of the circuit board assembly and on the air guiding cover 16.
The wind scooper 16 is fixedly connected with the adjacent mounting rack 17 through bolts, which is beneficial to fixing the heat dissipation fan 6 on the wind scooper 16, so that the heat dissipation fan 6 can flow outside cold wind into and out of the wind scooper 16.
The working principle is as follows: when the circuit board assembly heat dissipation device is used, a corresponding number of soaking plates 1 are selected according to the number of chips to be dissipated on a circuit board, then the positioning protrusions 7 on each soaking plate 1 are embedded into the positioning grooves 9 on the adjacent soaking plates 1, then each soaking plate 1 is laid on the top side of each chip in an aligned mode, then bolts are taken to be respectively aligned and embedded into the positioning screw holes 10 on the edge and the middle soaking plate 1, then the bolts are respectively screwed into the corresponding positioning screw holes 10 and the designated screw holes on the circuit board, so that the soaking plates 1 are conveniently extruded with each other, each soaking plate 1 is stably buckled on the top side of the chip, the quantity of the bolts needing to be screwed is greatly reduced, the work efficiency is improved, each heat conduction silicone pad 5 is tightly attached to the top side of the corresponding chip, and gaps between the heat conduction copper sheets 4 and the chip are filled through the heat conduction silicone pads 5, thereby be convenient for make the temperature on chip surface leading-in heat conduction copper sheet 4 more evenly, turn to the one side that corresponds each soaking board 1 with each air outlet 11 on the play tuber pipe 2 of intercombination after that, then, will go out tuber pipe 2 through the viscose and fix in the casing of circuit board, blow in the fan housing 16 through radiator fan 6, make external cold wind pass through in wind scooper 16 and guide duct 15 are leading-in each play tuber pipe 2 and appear on the heat radiation fin 3 of each soaking board 1 through the air outlet 11 on the play tuber pipe 2, thereby be convenient for accelerate the heat dissipation of chip, there is certain practicality.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the principles of the present invention.
Claims (6)
1. The utility model provides a circuit board assembly heat abstractor, includes soaking board (1), goes out tuber pipe (2), its characterized in that: the heat-conducting heat-dissipating plate is characterized in that a plurality of heat-dissipating fins (3) are uniformly and fixedly connected to the top end of the soaking plate (1), positioning protrusions (7) are fixedly connected to the positions, close to the edges, of the outer side walls of the two ends of the soaking plate (1), positioning openings (8) are formed in the ends, far away from the positioning protrusions (7), of the soaking plate (1), positioning grooves (9) are formed in the inner side walls of the two ends of each positioning opening (8), and a heat-conducting copper sheet (4) is fixedly connected to the middle position of the bottom end of the soaking plate (1);
the utility model discloses a fan, including air-out pipe (2), connecting groove (12), air-out pipe (2) are provided with guide duct (15) near one side of connecting groove (12), the one end intermediate position that guide duct (15) are close to connecting groove (12) and the one end fixedly connected with rotary joint (13) of connecting groove (12) are kept away from to air-out pipe (2), and embedding rotation is connected between connecting groove (12) and adjacent rotary joint (13), the one end fixedly connected with wind scooper (16) of rotary joint (13) are kept away from to guide duct (15), the top of wind scooper (16) is provided with radiator fan (6).
2. The heat sink device for circuit board assembly according to claim 1, wherein: and the bottom end of the heat conduction copper sheet (4) is provided with a heat conduction silicone grease pad (5) in an attaching manner.
3. The heat sink device for circuit board assembly according to claim 1, wherein: the edge of the outer side wall of the rotating joint (13) is fixedly connected with a sealing rubber gasket (14).
4. The heat sink device for circuit board assembly according to claim 1, wherein: the top of the soaking plate (1) is provided with positioning screw holes (10) at positions close to four corners, and the positioning screw holes (10) are communicated with the bottom end of the soaking plate (1).
5. The heat sink device for circuit board assembly according to claim 1, wherein: and the edge of one side of the heat radiation fan (6) close to the air guide cover (16) and the edge of one side far away from the air guide cover (16) are fixedly connected with mounting frames (17).
6. The heat sink device for circuit board assembly according to claim 5, wherein: the wind scooper (16) is fixedly connected with the adjacent mounting rack (17) through bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023312441.5U CN214627463U (en) | 2020-12-31 | 2020-12-31 | Circuit board assembly heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023312441.5U CN214627463U (en) | 2020-12-31 | 2020-12-31 | Circuit board assembly heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214627463U true CN214627463U (en) | 2021-11-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023312441.5U Active CN214627463U (en) | 2020-12-31 | 2020-12-31 | Circuit board assembly heat abstractor |
Country Status (1)
| Country | Link |
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| CN (1) | CN214627463U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114585228A (en) * | 2022-03-09 | 2022-06-03 | 嵊州天脉导热科技有限公司 | Foldable soaking plate suitable for flexible screen |
-
2020
- 2020-12-31 CN CN202023312441.5U patent/CN214627463U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114585228A (en) * | 2022-03-09 | 2022-06-03 | 嵊州天脉导热科技有限公司 | Foldable soaking plate suitable for flexible screen |
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