CN101772289A - Mould fixing seal heat dissipating device - Google Patents
Mould fixing seal heat dissipating device Download PDFInfo
- Publication number
- CN101772289A CN101772289A CN200810088889A CN200810088889A CN101772289A CN 101772289 A CN101772289 A CN 101772289A CN 200810088889 A CN200810088889 A CN 200810088889A CN 200810088889 A CN200810088889 A CN 200810088889A CN 101772289 A CN101772289 A CN 101772289A
- Authority
- CN
- China
- Prior art keywords
- air channel
- heat dissipating
- channel barrier
- module
- fixing seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention provides a mould fixing seal heat dissipating device, which solves the problems that in the traditional mould fixing device, the sealing property is poor, impurities enter the mould easily and the heat dissipating efficiency is low. The mould fixing sealed heat dissipating device comprises a chassis, a cover board, an air duct, the mould and a mould limiting device. The air duct in the invention is sealed so that the mould work environment can not be influenced by cooling air. A mould outer shell is blocked in the limiting device in order to improve the heat dissipating efficiency of the mould. The heat dissipating device is added inside the chassis and at the outer side of the cover board and the heat dissipating efficiency is improved further.
Description
Technical field
The present invention relates to a kind of module fixture, be specifically related to a kind of mould fixing seal heat dissipating device.
Background technology
Raising along with development of electronic technology and integrated circuit scale, the power density of each functional module of electronic equipment internal is also in continuous increase, the operate as normal of high power function module is relatively strict to environmental requirement, needs suitable temperature conditions and can not have impurity such as dust to invade.
At present, various to the heat radiation and the Design of Reinforcement mode of high power module, but the functional module heat dissipation design of high reliability is mainly passed through the direct wind-cooling heat dissipating of module.
The electronic functionalities module is carried out routine directly during wind-cooling heat dissipating, and cooling air enters flow through after the electronic equipment internal functional module surface and electronic device, and the motherboard of the bottom of flowing through is then taken away heat by motherboard.But general electronic equipment internal is not carried out complete closed to all modules, and a large amount of impurity such as dust that can cause in the cooling air like this being contained enter inside modules, influences the operate as normal of functional module, the useful life of reduction functional module.
Simultaneously, the electronic equipment internal functional module is installed on the module position-limit mechanism, and functional module and position-limit mechanism shackle portion are printed board, and the position-limit mechanism outside is the air channel.The heat conductivility of printed board own is poor, when cooling air was flowed through the air channel, module self produced heat and is difficult for being passed to position-limit mechanism again by cooling air consumption of calorie in the air channel by printed board, reduces radiating efficiency, influence the operate as normal of functional module, reduce the useful life of functional module.
Summary of the invention
The objective of the invention is to: provide a kind of mould fixing seal heat dissipating device, to solve the problem that sealing in the existing module fixture is poor, impurity easily enters inside modules, heat transfer efficiency is lower.
Technical solution of the present invention is as follows:
The invention provides a kind of mould fixing seal heat dissipating device, comprise cabinet and the cover plate that is arranged at the cabinet top, the cabinet inside both sides are respectively equipped with first air channel barrier, second air channel barrier that is parallel to the cabinet sidewall, passage between the cabinet sidewall of first air channel barrier and the first air channel barrier side constitutes first air channel, passage between the cabinet sidewall of second air channel barrier and the second air channel barrier side constitutes second air channel, and first air channel barrier and second air channel barrier are sealing baffles; Be provided with the guide vane end stop of at least one pair of position symmetry in the middle of first air channel barrier and second air channel barrier, guide vane end stop is fixedly connected on first air channel barrier and second air channel barrier, first air channel barrier, second air channel barrier and a pair of guide vane end stop composition module position-limit mechanism.
Be provided with module in the above-mentioned position-limit mechanism, module comprises shell and functional part, and module is connected in the position-limit mechanism by the shell of this module.
Above-mentioned guide vane end stop is two identical shaped rectangular preiections, and an end of guide vane end stop Clamp connecting block side is provided with the module latch device.
Above-mentioned cover plate is provided with heat abstractor, and heat abstractor is to be arranged at the concavo-convex radiating ribs of top blind flange outer surface.
The upper inner of above-mentioned cabinet or cover plate inboard are provided with heat-conducting layer, and heat-conducting layer can be located at cabinet upper inner or cover plate inboard separately, also can be located at simultaneously on the two, and heat-conducting layer generally is the insulating heat-conductive film.
Above-mentioned cabinet is horizontal chassis or vertical chassis.
Advantage of the present invention is as follows:
1. air channel and electronic equipment internal functional module are isolated.
Air channel and electronic equipment internal functional module are isolated, only the flow through sealing air channel of electronic equipment internal of cooling air, do not contact with functional module, impurity such as the interior contained dust of cooling air can't enter inside modules, have guaranteed the operate as normal and the normal useful life of functional module.
2. module housing replaces printed board to be connected in the module position-limit mechanism.
Module position-limit mechanism Clamp connecting block part replaces printed board by module housing, and the module housing heat conductivility is far above printed board, and the module position-limit mechanism outside is the air channel, under the prerequisite that does not change the functional module own vol, effectively improves radiating effect.
3. heat-conducting layer sets up the raising radiating efficiency.
Preset clearance between mould fixing seal heat dissipating device top and the module, in this gap or the cover plate inboard set up heat-conducting layer, heat-conducting layer can be flexible heat carrier or insulating heat-conductive film, the conduction of distribute heat when having improved the work of high power function module effectively.
4. radiator structure is set up in the cabinet top blind flange outside.
The cabinet top blind flange is carried out structural adjustment, set up concavo-convex radiating ribs on its outer surface, further improve radiating efficiency.
Description of drawings
Fig. 1 is the mould fixing seal heat dissipating device structure chart;
Fig. 2 is a mould fixing seal heat dissipating device ventilation state structure chart.
Embodiment
Below in conjunction with accompanying drawing content of the present invention is illustrated.
As shown in Figure 1 and Figure 2: the present invention includes cabinet 1 and the cover plate 2 that is arranged at the cabinet top, the cabinet inside both sides are respectively equipped with first air channel barrier 3 and second air channel barrier 4 that is parallel to the cabinet sidewall, first air channel barrier 3 and second air channel barrier 4 are sealing baffles, passage between the cabinet sidewall of first air channel barrier 3 and the first air channel barrier side constitutes first air channel 11, and the passage between the cabinet sidewall of described second air channel barrier 3 and second air channel barrier, 4 sides constitutes second air channel 12.Sealing baffle is isolated air channel and module, and only the flow through sealing air channel of electronic equipment internal of cooling air contact with module, and impurity such as the interior contained dust of cooling air can't enter inside modules, have guaranteed the operate as normal of functional module.
First air channel barrier 3 is provided with first guide vane end stop 5, second air channel barrier 4 is provided with second guide vane end stop 6, be connected with module 7 between first guide vane end stop 5 and second guide vane end stop 6, module 7 comprises that shell 71 and functional part 72, the first guide vane end stops 5 and second guide vane end stop 6 and shell 71 joint ends of module 7 are provided with locking device 8.Cause rate of heat dispation to reduce after the sealing of air channel, shell 71 has good heat-conducting, the heat that produces during functional part 72 work passes and is passed to position-limit mechanism by shell 71, position-limit mechanism self is connected with air channel barrier, rapidly heat is taken out of by cooling air in the air channel, locking device 8 is with more stable being fixed in the position-limit mechanism of module.
Cover plate 2 inner surfaces are provided with insulating heat-conductive film 13, the sealing air channel barrier makes that the module working space is a seal cavity, preset clearance between mould fixing seal heat dissipating device top and the module, the setting of insulating heat-conductive film 13, effectively utilized this gap, by insulating heat-conductive film self performance, heat is passed to cabinet fast, effectively improved radiating efficiency.Also can between cabinet upper inner mould fixing seal heat dissipating device top and module, improve radiating efficiency by preset clearance filling flexible heat-conducting layer.
Cover plate 2 outer surfaces are provided with concavo-convex mechanism 21, and being provided with of concavo-convex mechanism 21 increased cover plate 2 exterior surface area, effectively improved radiating efficiency.Also can set up concavo-convex radiating ribs at cover plate 2 outer surfaces.
Claims (8)
1. mould fixing seal heat dissipating device, comprise cabinet and the cover plate that is arranged at the cabinet top, described cabinet inside both sides are respectively equipped with first air channel barrier, second air channel barrier that is parallel to the cabinet sidewall, passage between the cabinet sidewall of described first air channel barrier and the first air channel barrier side constitutes first air channel, passage between the cabinet sidewall of described second air channel barrier and the second air channel barrier side constitutes second air channel, it is characterized in that: described first air channel barrier and second air channel barrier are sealing baffles; Be provided with the guide vane end stop of at least one pair of position symmetry in the middle of described first air channel barrier and second air channel barrier, described guide vane end stop is fixedly connected on first air channel barrier and second air channel barrier; Described first air channel barrier, second air channel barrier and a pair of guide vane end stop composition module position-limit mechanism.
2. according to the described mould fixing seal heat dissipating device of claim 1, it is characterized in that: be provided with module in the described position-limit mechanism; Described module comprises shell and functional part; Described module is connected in the position-limit mechanism by the shell of this module.
3. according to claim 1 or 2 described mould fixing seal heat dissipating devices, it is characterized in that: described guide vane end stop is two identical shaped rectangular preiections; One end of described guide vane end stop Clamp connecting block side is provided with the module latch device.
4. according to the described mould fixing seal heat dissipating device of claim 3, it is characterized in that: described cover plate is provided with heat abstractor.
5. according to the described mould fixing seal heat dissipating device of claim 4, it is characterized in that: the upper inner of described cabinet is provided with heat-conducting layer; Described cover plate inboard is provided with heat-conducting layer.
6. according to the described mould fixing seal heat dissipating device of claim 5, it is characterized in that: described heat abstractor is to be arranged at the concavo-convex radiating ribs of top blind flange outer surface.
7. according to the described mould fixing seal heat dissipating device of claim 6, it is characterized in that: described heat-conducting layer is the insulating heat-conductive film.
8. according to the described mould fixing seal heat dissipating device of claim 7, it is characterized in that: described cabinet is horizontal chassis or vertical chassis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810088889A CN101772289A (en) | 2008-12-31 | 2008-12-31 | Mould fixing seal heat dissipating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810088889A CN101772289A (en) | 2008-12-31 | 2008-12-31 | Mould fixing seal heat dissipating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101772289A true CN101772289A (en) | 2010-07-07 |
Family
ID=42504743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810088889A Pending CN101772289A (en) | 2008-12-31 | 2008-12-31 | Mould fixing seal heat dissipating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101772289A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109990451A (en) * | 2017-12-29 | 2019-07-09 | 南通华信中央空调有限公司 | Radiator and the air conditioner for using the radiator |
| CN112255802A (en) * | 2020-11-13 | 2021-01-22 | Oppo广东移动通信有限公司 | Main body device of head-mounted equipment and head-mounted equipment |
| CN112291977A (en) * | 2020-11-13 | 2021-01-29 | Oppo广东移动通信有限公司 | Main body device of head-mounted equipment and head-mounted equipment |
-
2008
- 2008-12-31 CN CN200810088889A patent/CN101772289A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109990451A (en) * | 2017-12-29 | 2019-07-09 | 南通华信中央空调有限公司 | Radiator and the air conditioner for using the radiator |
| CN112255802A (en) * | 2020-11-13 | 2021-01-22 | Oppo广东移动通信有限公司 | Main body device of head-mounted equipment and head-mounted equipment |
| CN112291977A (en) * | 2020-11-13 | 2021-01-29 | Oppo广东移动通信有限公司 | Main body device of head-mounted equipment and head-mounted equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2649248C (en) | A multi-position housing made of metal extruded section member for manufacturing a waterproof power electronic device | |
| CN101600325B (en) | Combination heat sink of closed shell electronic equipment | |
| CN101662921B (en) | Heat radiation device and computer equipment with same | |
| CN206165063U (en) | Unmanned aerial vehicle and cooling system thereof | |
| CN201467613U (en) | Combined radiator for electronic device with enclosed shell | |
| CN202050634U (en) | Sealing water cooling device for cooling electronic equipment | |
| CN207604129U (en) | A kind of PCB circuit board cabinet cooling device | |
| CN106550587A (en) | A kind of air flows through the radiator structure inside sealed machine box | |
| CN101772289A (en) | Mould fixing seal heat dissipating device | |
| CN209420193U (en) | A kind of power supply adaptor radiator structure | |
| CN203561928U (en) | 1/2ATR ruggedized case with 3U module and 6U module mounted in mixed manner | |
| CN208113186U (en) | A kind of Full-sealed air cooling low pressure work cabinet | |
| CN201332566Y (en) | Module fixing sealed heat radiator | |
| CN209088800U (en) | A kind of frequency converter | |
| CN201590988U (en) | Electric box heat radiation structure, electric box and blower set | |
| CN202855727U (en) | Combination type heat dissipation box | |
| CN203537687U (en) | Case | |
| CN205565810U (en) | No fan -type electric vehicle charging ware | |
| CN210405072U (en) | Converter with directional heat dissipation function | |
| CN115103578A (en) | External internal circulation air duct assembly and inverter using same | |
| CN204929519U (en) | Integration heat radiation structure | |
| CN210465771U (en) | High-efficient radiating optical module | |
| CN215496802U (en) | Fuel cell power supply based on silicon carbide technology | |
| CN217956028U (en) | Waterproof radiating power battery box | |
| CN217011584U (en) | Outdoor switch power IP65 heat treatment structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100707 |