CN209420193U - A kind of power supply adaptor radiator structure - Google Patents
A kind of power supply adaptor radiator structure Download PDFInfo
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- CN209420193U CN209420193U CN201821649592.XU CN201821649592U CN209420193U CN 209420193 U CN209420193 U CN 209420193U CN 201821649592 U CN201821649592 U CN 201821649592U CN 209420193 U CN209420193 U CN 209420193U
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Abstract
本实用新型公开了一种电源适配器散热结构，包括壳体和壳体盖，所述壳体底部设置有通风槽，所述通风槽的上面设置有散热块，所述散热块的底面和侧面分别设置有底面散热槽和侧面散热槽，所述底面散热槽和侧面散热槽的背面分别安装有电路板，所述电路板与所述散热块之间设置有导热层，所述电路板上设置有三极管散热片，所述壳体侧面设置有通风孔，所述壳体盖安装在壳体上。本实用新型结构简单，结构设计合理，及时将电源适配器的热量散发出去，能够实现电路板的热量快速降低，从而降低电源适配器的内部温度，有效提高电源适配器工作的可靠性和安全性。
The utility model discloses a heat dissipation structure for a power adapter, which comprises a casing and a casing cover. A ventilation groove is arranged at the bottom of the casing, and a heat dissipation block is arranged on the top of the ventilation groove. The bottom surface and the side surface of the heat dissipation block are respectively Bottom heat dissipation grooves and side heat dissipation grooves are provided, circuit boards are respectively installed on the backs of the bottom surface heat dissipation grooves and side heat dissipation grooves, a heat conduction layer is arranged between the circuit board and the heat dissipation block, and the circuit board is provided with The heat sink of the triode, the side of the housing is provided with ventilation holes, and the housing cover is installed on the housing. The utility model has a simple structure and a reasonable structural design. The heat of the power adapter can be dissipated in time, and the heat of the circuit board can be quickly reduced, thereby reducing the internal temperature of the power adapter and effectively improving the reliability and safety of the power adapter.
Description
技术领域technical field
本实用新型涉及电源适配器技术领域，具体为一种电源适配器散热结构。The utility model relates to the technical field of power adapters, in particular to a heat dissipation structure for power adapters.
背景技术Background technique
电源适配器已经普遍运用在当前的各种类型的便携式电子设备上，一般由外壳、变压器、电感、电容、控制IC、PCB板等元器件组成，它的工作原理由交流输入转换为直流输出，而电源适配器在进行电压转换时,有一部分能量被损耗掉,其中除了一小部分以波的形式损耗外,大部分是以热的方式散发出来，电源适配器的功率越大，损耗的能量也就越多，电源的发热量也就越大，这就是由于电源适配器中使用了大量的大功率半导体器件，如整流桥堆、大电流整流管、大功率三极管或场效应管等器件，它们工作时会产生大量的热量，如果不能把这些热量及时地排出并使之处于一个合理的水平将会影响电源适配器的正常工作，严重时会损坏电源适配器。目前，使用的电源适配器的散热结构，对功率较大的适配器散热效果不理想，为了提高电源适配器工作的可靠性，设计出一款结构简单，便于散热的电源适配器散热结构就显得非常重要。Power adapters have been widely used in various types of portable electronic devices. They are generally composed of housings, transformers, inductors, capacitors, control ICs, PCB boards and other components. Its working principle is converted from AC input to DC output. When the power adapter performs voltage conversion, a part of the energy is lost, except for a small part of which is lost in the form of waves, most of which are dissipated in the form of heat. The greater the power of the power adapter, the greater the energy loss. The higher the power supply, the greater the calorific value of the power supply. This is because a large number of high-power semiconductor devices are used in the power adapter, such as rectifier bridge stacks, high-current rectifier tubes, high-power triodes or field effect tubes. When they work, they will A large amount of heat is generated. If the heat cannot be discharged in time and kept at a reasonable level, it will affect the normal operation of the power adapter, and in severe cases, the power adapter will be damaged. At present, the heat dissipation structure of the power adapter used is not ideal for the heat dissipation effect of the adapter with large power. In order to improve the reliability of the power adapter, it is very important to design a heat dissipation structure of the power adapter with a simple structure and easy to dissipate heat.
实用新型内容Utility model content
本实用新型针对上述现有技术存在的问题，提供一种电源适配器散热结构。The utility model provides a heat dissipation structure of a power adapter aiming at the problems existing in the above-mentioned prior art.
为实现以上目的，本实用新型通过以下技术方案予以实现：一种电源适配器散热结构，包括壳体和壳体盖，所述壳体底部设置有通风槽，所述通风槽的上面设置有散热块，所述散热块的底面和侧面分别设置有底面散热槽和侧面散热槽，所述底面散热槽和侧面散热槽的背面分别安装有电路板，所述电路板与所述散热块之间设置有导热层，所述电路板上设置有三极管散热片，所述壳体的侧面设置有通风孔，所述壳体盖安装在壳体上。In order to achieve the above objectives, the utility model is achieved through the following technical solutions: a heat dissipation structure for a power adapter, including a housing and a housing cover, the bottom of the housing is provided with a ventilation slot, and a heat dissipation block is provided on the top of the ventilation slot , the bottom surface and the side of the heat dissipation block are respectively provided with a bottom heat dissipation groove and a side heat dissipation groove, and a circuit board is respectively installed on the back of the bottom surface heat dissipation groove and the side heat dissipation groove, and a circuit board is arranged between the circuit board and the heat dissipation block. A thermal conduction layer, the circuit board is provided with triode cooling fins, the side of the housing is provided with ventilation holes, and the housing cover is installed on the housing.
进一步地：所述散热块设置成T型形状。Further: the heat dissipation block is set in a T-shape.
进一步地：所述散热块的底面散热槽与所述壳体底面的通风槽相互平行。Further: the heat dissipation grooves on the bottom surface of the heat dissipation block are parallel to the ventilation grooves on the bottom surface of the housing.
进一步地：所述散热块与电路板之间设置有导热层，所述导热层与电路板上的元件相贴合。Further: a heat conduction layer is arranged between the heat dissipation block and the circuit board, and the heat conduction layer is attached to the components on the circuit board.
进一步地：所述电路板包括第一电路板、第二电路板和第三电路板，所述第一电路板安装贴片元件，所述第二电路板和第三电路板安装插件元件。Further: the circuit board includes a first circuit board, a second circuit board and a third circuit board, the first circuit board is mounted with patch components, and the second circuit board and the third circuit board are mounted with plug-in components.
进一步地：所述第三电路板安装有三极管散热片，所述三极管散热片设置成凹型结构。Further: the third circuit board is equipped with triode cooling fins, and the triode cooling fins are arranged in a concave structure.
进一步地：所述第一电路板在壳体内部沿竖直方向安装。Further: the first circuit board is installed vertically inside the casing.
进一步地：所述第二电路板和第三电路板在壳体内部沿水平方向安装。Further: the second circuit board and the third circuit board are installed in the housing along the horizontal direction.
本实用新型的有益效果：The beneficial effects of the utility model:
1.与现有技术相比，本发明提供一种电源适配器散热结构，该电源适配器散热结构的壳体底部设置有多条通风槽，通风槽的上面设置有散热块，散热块设置成T型形状，散热块的底面和侧面分别设置有底面散热槽和侧面散热槽，底面散热槽与通风槽相互平行，底面散热槽和侧面散热槽的背面分别安装有第二电路板和第一电路板，第一电路板与散热块之间设置有导热层，第三电路板上设置有三极管散热片，三极管散热片包裹着三极管，壳体的两侧面设置有通风孔。当适配器通电工作时，电路中的元器件产生大量的热量，热量通过导热层传递到散热块上，散热快把热量快速地散发出去，外部空气通过壳体底部的通风槽吹向散热块的底部散热槽，把热量带到壳体内部空气中，热量再从壳体侧面的通风孔散发到壳体的外部环境，从而有效地降低适配器壳体内部的环境温度，有效提高电源适配器工作的可靠性。1. Compared with the prior art, the present invention provides a heat dissipation structure for a power adapter. The bottom of the housing of the power adapter heat dissipation structure is provided with a plurality of ventilation slots, and a heat dissipation block is arranged on the top of the ventilation slot, and the heat dissipation block is arranged in a T shape. Shape, the bottom and side surfaces of the cooling block are respectively provided with a bottom heat dissipation groove and a side heat dissipation groove, the bottom surface heat dissipation groove and the ventilation groove are parallel to each other, the back of the bottom surface heat dissipation groove and the side heat dissipation groove are respectively installed with a second circuit board and a first circuit board, A heat conduction layer is arranged between the first circuit board and the heat dissipation block, and a triode cooling fin is arranged on the third circuit board, and the triode cooling fin wraps the triode, and ventilation holes are arranged on both sides of the casing. When the adapter is powered on, the components in the circuit generate a lot of heat, and the heat is transferred to the heat dissipation block through the heat conduction layer, and the heat is dissipated quickly, and the external air is blown to the bottom of the heat dissipation block through the ventilation groove at the bottom of the housing The heat dissipation groove brings the heat to the air inside the housing, and then dissipates the heat from the ventilation holes on the side of the housing to the external environment of the housing, thereby effectively reducing the ambient temperature inside the adapter housing and effectively improving the reliability of the power adapter. .
2.电路板包括第一电路板、第二电路板和第三电路板，第一电路板安装贴片元件，第二电路板和第三电路板安装插件元件，第一电路板沿竖直方向安装进一步提高了电路板的散热面积，有利于空气流动带走元器件表面的热量，使热量能够快速的散发。第二电路板和第三电路板在壳体内部沿水平方向安装，插件元件三极管设置有包裹的三极管散热片更有利于元器件的热量散发，通过上述合理结构的设计，能够实现电路板的热量快速降低，从而及时将电源适配器的热量散发出去，降低电源适配器的内部温度，提高产品的可靠性及安全性。2. The circuit board includes a first circuit board, a second circuit board and a third circuit board. The first circuit board is installed with patch components, and the second circuit board and the third circuit board are installed with plug-in components. The first circuit board is along the vertical direction The installation further improves the heat dissipation area of the circuit board, which is conducive to the air flow to take away the heat on the surface of the components, so that the heat can be dissipated quickly. The second circuit board and the third circuit board are installed along the horizontal direction inside the housing. The triode of the plug-in component is provided with a wrapped triode heat sink, which is more conducive to the heat dissipation of the components. Through the design of the above-mentioned reasonable structure, the heat of the circuit board can be realized. Rapid reduction, so as to dissipate the heat of the power adapter in time, reduce the internal temperature of the power adapter, and improve the reliability and safety of the product.
附图说明Description of drawings
图1为电源适配器散热结构的拆分结构示意图；Figure 1 is a schematic diagram of a disassembled structure of a heat dissipation structure of a power adapter;
图2为电源适配器散热结构的壳体结构示意图；FIG. 2 is a schematic diagram of the shell structure of the heat dissipation structure of the power adapter;
图3为电源适配器散热结构的散热块结构示意图；FIG. 3 is a schematic structural diagram of a heat dissipation block of a power adapter heat dissipation structure;
图4为电源适配器散热结构的第三电路板结构示意图。FIG. 4 is a schematic structural diagram of a third circuit board of the heat dissipation structure of the power adapter.
图中：1-壳体，2-壳体盖，3-散热块，4-底面散热槽，5-侧面散热槽，6-通风槽，7-通风孔，8-三极管散热片，9-导热层，10-第一电路板，11-第二电路板，12-第三电路板，13-三极管。In the figure: 1-housing, 2-housing cover, 3-heat dissipation block, 4-bottom heat dissipation groove, 5-side heat dissipation groove, 6-ventilation groove, 7-ventilation hole, 8-transistor heat sink, 9-heat conduction layer, 10-the first circuit board, 11-the second circuit board, 12-the third circuit board, 13-transistor.
具体实施方式Detailed ways
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本实用新型保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
如图1-4图所示，一种电源适配器散热结构，包括壳体1和壳体盖2，所述壳体1底部设置有通风槽6，所述通风槽6的上面设置有散热块3，所述散热块3的底面和侧面分别设置有底面散热槽4和侧面散热槽5，所述底面散热槽4和侧面散热槽5的背面分别安装有电路板，所述电路板与所述散热块3之间设置有导热层9，所述电路板上设置有三极管散热片8，所述壳体1的侧面设置有通风孔7，所述壳体盖2安装在壳体1上。As shown in Figures 1-4, a power adapter heat dissipation structure includes a housing 1 and a housing cover 2, the bottom of the housing 1 is provided with a ventilation slot 6, and the top of the ventilation slot 6 is provided with a heat dissipation block 3 , the bottom surface and the side of the heat dissipation block 3 are respectively provided with a bottom heat dissipation groove 4 and a side heat dissipation groove 5, and the back sides of the bottom surface heat dissipation groove 4 and the side heat dissipation groove 5 are respectively equipped with circuit boards, and the circuit board and the heat dissipation A heat conduction layer 9 is arranged between the blocks 3 , a triode cooling fin 8 is arranged on the circuit board, a ventilation hole 7 is arranged on the side of the casing 1 , and the casing cover 2 is installed on the casing 1 .
优选地，所述散热块3设置成T型形状。Preferably, the heat dissipation block 3 is arranged in a T-shape.
优选地，所述散热块3的底面散热槽4与所述壳体1底面的通风槽6相互平行。Preferably, the heat dissipation groove 4 on the bottom surface of the heat dissipation block 3 and the ventilation groove 6 on the bottom surface of the housing 1 are parallel to each other.
优选地，所述散热块与电路板之间设置有导热层，所述导热层9与电路板上的元件相贴合。Preferably, a heat conduction layer is provided between the heat dissipation block and the circuit board, and the heat conduction layer 9 is attached to the components on the circuit board.
优选地，所述电路板包括第一电路板10、第二电路板11和第三电路板12，所述第一电路板10安装贴片元件，所述第二电路板11和第三电路板12安装插件元件。Preferably, the circuit board includes a first circuit board 10, a second circuit board 11 and a third circuit board 12, the first circuit board 10 is equipped with patch components, and the second circuit board 11 and the third circuit board 12 Install the plug-in element.
优选地，所述第三电路板12安装有三极管散热片8，所述三极管散热片8设置成凹型结构。Preferably, the third circuit board 12 is equipped with triode cooling fins 8, and the triode cooling fins 8 are arranged in a concave structure.
优选地，所述第一电路板10在壳体1内部沿竖直方向安装。Preferably, the first circuit board 10 is vertically installed inside the casing 1 .
优选地，所述第二电路板11和第三电路12板在壳体1内部沿水平方向安装。Preferably, the second circuit board 11 and the third circuit board 12 are installed in the housing 1 along a horizontal direction.
具体实施原理：该电源适配器散热结构的壳体1底部设置有多条通风槽6，通风槽6的上面设置有散热块3，散热块3设置成T型形状，散热块3的底面和侧面分别设置有底面散热槽4和侧面散热槽5，底面散热槽4与通风槽6相互平行，底面散热槽4和侧面散热槽5的背面分别安装有第二电路板11和第一电路板10，第一电路板10与散热块3之间设置有导热层9，第三电路板12上设置有三极管散热片8，三极管散热片8包裹着三极管13，壳体1的两侧面设置有通风孔7。当适配器通电工作时，电路中的元器件产生大量的热量，热量通过导热层9传递到散热块3上，散热快3把热量快速地散发出去，外部空气通过壳体1底部的通风槽6吹向散热块3的底部散热槽4，把热量带到壳体1内部空气中，热量再从壳体1侧面的通风孔7散发到壳体1的外部环境，从而有效地降低适配器壳体1内部的环境温度，有效提高电源适配器工作的可靠性。The specific implementation principle: the bottom of the housing 1 of the heat dissipation structure of the power adapter is provided with a plurality of ventilation slots 6, and the top of the ventilation slots 6 is provided with a heat dissipation block 3, and the heat dissipation block 3 is arranged in a T shape. Bottom heat dissipation groove 4 and side heat dissipation groove 5 are provided, bottom surface heat dissipation groove 4 and ventilation groove 6 are parallel to each other, and the back sides of bottom surface heat dissipation groove 4 and side heat dissipation groove 5 are respectively equipped with second circuit board 11 and first circuit board 10. A heat conduction layer 9 is provided between the first circuit board 10 and the cooling block 3 , a triode cooling fin 8 is provided on the third circuit board 12 , and the triode cooling fin 8 wraps the triode 13 , and ventilation holes 7 are provided on both sides of the casing 1 . When the adapter is powered on, the components in the circuit generate a lot of heat, and the heat is transferred to the heat dissipation block 3 through the heat conduction layer 9, and the heat dissipation fast 3 dissipates the heat quickly, and the external air is blown through the ventilation slot 6 at the bottom of the housing 1 To the heat sink 4 at the bottom of the heat dissipation block 3, the heat is brought to the air inside the housing 1, and then the heat is dissipated from the ventilation holes 7 on the side of the housing 1 to the external environment of the housing 1, thereby effectively reducing the internal temperature of the adapter housing 1. The ambient temperature can effectively improve the reliability of the power adapter.
电路板包括第一电路板10、第二电路板11和第三电路板12，第一电路板10安装贴片元件，第二电路板11和第三电路板12安装插件元件，第一电路板10沿竖直方向安装进一步提高了电路板的散热面积，有利于空气流动带走元器件表面的热量，使热量能够快速的散发。第二电路板11和第三电路板12在壳体1内部沿水平方向安装，插件元件三极管13设置有包裹的三极管散热片8更有利于元器件的热量散发，通过上述合理结构的设计，能够实现电路板的热量快速降低，从而及时将电源适配器的热量散发出去，降低电源适配器的内部温度，提高产品的可靠性及安全性。The circuit board includes a first circuit board 10, a second circuit board 11 and a third circuit board 12, the first circuit board 10 is equipped with patch components, the second circuit board 11 and the third circuit board 12 are equipped with plug-in components, and the first circuit board 10 Installing along the vertical direction further improves the heat dissipation area of the circuit board, which is conducive to the air flow to take away the heat on the surface of the components, so that the heat can be dissipated quickly. The second circuit board 11 and the third circuit board 12 are installed along the horizontal direction inside the housing 1, and the triode 13 of the plug-in component is provided with a packaged triode cooling fin 8, which is more conducive to the heat dissipation of the components. Through the design of the above-mentioned reasonable structure, it can Realize the rapid reduction of the heat of the circuit board, so as to dissipate the heat of the power adapter in time, reduce the internal temperature of the power adapter, and improve the reliability and safety of the product.
以上内容是结合具体的优选实施方式对本实用新型所作的进一步详细说明，不能认定本实用新型的具体实施只局限于这些说明。对于本实用新型所属技术领域的普通技术人员来说，在不脱离本实用新型构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本实用新型的保护范围。The above content is a further detailed description of the utility model in combination with specific preferred embodiments, and it cannot be assumed that the specific implementation of the utility model is only limited to these descriptions. For a person of ordinary skill in the technical field to which the utility model belongs, without departing from the concept of the utility model, some simple deduction or substitutions can also be made, which should be regarded as belonging to the protection scope of the utility model.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111741653A (en) * | 2020-06-28 | 2020-10-02 | 南京汉业科技实业有限公司 | Small size power adapter |
| CN112803191A (en) * | 2021-04-12 | 2021-05-14 | 南昌嘉信高科技有限公司 | A transformable power adapter |
| CN113242670A (en) * | 2021-04-16 | 2021-08-10 | 华为技术有限公司 | Power adapter and manufacturing method thereof |
-
2018
- 2018-10-11 CN CN201821649592.XU patent/CN209420193U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111741653A (en) * | 2020-06-28 | 2020-10-02 | 南京汉业科技实业有限公司 | Small size power adapter |
| CN111741653B (en) * | 2020-06-28 | 2022-06-14 | 南京汉业科技实业有限公司 | Small-size power adapter |
| CN112803191A (en) * | 2021-04-12 | 2021-05-14 | 南昌嘉信高科技有限公司 | A transformable power adapter |
| CN112803191B (en) * | 2021-04-12 | 2021-06-25 | 南昌嘉信高科技有限公司 | A transformable power adapter |
| CN113242670A (en) * | 2021-04-16 | 2021-08-10 | 华为技术有限公司 | Power adapter and manufacturing method thereof |
| CN113242670B (en) * | 2021-04-16 | 2023-07-14 | 华为数字能源技术有限公司 | A kind of power adapter and manufacturing method thereof |
| US12114461B2 (en) | 2021-04-16 | 2024-10-08 | Huawei Digital Power Technologies Co., Ltd. | Power adapter and manufacturing method thereof |
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