CN215774093U - Packaging structure for flip chip of printed circuit board with heat dissipation block with protruded surface - Google Patents
Packaging structure for flip chip of printed circuit board with heat dissipation block with protruded surface Download PDFInfo
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- CN215774093U CN215774093U CN202122410613.0U CN202122410613U CN215774093U CN 215774093 U CN215774093 U CN 215774093U CN 202122410613 U CN202122410613 U CN 202122410613U CN 215774093 U CN215774093 U CN 215774093U
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- Prior art keywords
- circuit board
- chip
- packaging
- shell
- packaging shell
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 45
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 19
- 238000005538 encapsulation Methods 0.000 claims abstract description 17
- 239000002131 composite material Substances 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 238000009423 ventilation Methods 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000005485 electric heating Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A packaging structure with a printed circuit board, a chip, an inverted radiating block and a protruded surface belongs to the field of circuit board packaging, aims to solve the problems of dense packaging and poor radiating of a circuit board and a chip, and comprises a packaging shell; a protruding groove is formed in the middle of the front side of the packaging shell, and a top radiating strip hole and a bottom radiating strip hole are formed in the top and the bottom of the protruding groove respectively; the circuit board, the composite control panel and the display screen are sequentially placed in the packaging shell; the sealing cover is clamped at the top of the packaging shell; this printed circuit board chip flip-chip radiating block surface protrusion packaging structure sets up protruding groove through department in the middle of the encapsulation shell front side to both sides are seted up top heat dissipation strip hole and bottom heat dissipation strip hole and are guaranteed the ventilation in the encapsulation shell about protruding groove, dispel the heat for circuit board and chip, ensure that circuit board and chip can not produce high temperature, are favorable to guaranteeing the operating condition of circuit board and chip, improve the safety in utilization.
Description
Technical Field
The utility model relates to the technical field of circuit board packaging, in particular to a printed circuit board chip flip radiating block surface protrusion packaging structure.
Background
The electric heating table is a combination of electric heating and desk, collect desk and room heater novel heating utensil as an organic whole, the electric heating table needs to control the heating temperature through the controller of constituteing by printed wiring board, the controller that printed wiring board constitutes usually need encapsulate, in order to guarantee the safety of circuit board, current printed wiring board chip flip-chip radiating block surface protrusion packaging structure is in order to reduce the encapsulation volume, almost with whole circuit board and chip combination together, lead to the unable quick conduction of heat that circuit board and chip produced outside the encapsulation body, very easily lead to the condition that chip life-span descends or the chip burns out.
Therefore, the structure and the defect of the prior art are researched and improved, and the packaging structure with the printed circuit board, the flip chip and the heat dissipation block with the protruded surface is provided, so that the purpose of higher practical value is achieved.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a surface protruded packaging structure of a printed circuit board chip flip radiating block, which aims to solve the problems that the prior surface protruded packaging structure of the printed circuit board chip flip radiating block proposed in the background technology almost combines all circuit boards and chips together in order to reduce the packaging volume, so that the heat generated by the circuit boards and the chips cannot be timely and quickly conducted out of a packaging body, and the service life of the chips is very easy to reduce or the chips are easy to burn out.
The purpose and the effect of the packaging structure with the printed circuit board, the flip chip and the heat dissipation block with the surface protruding are achieved by the following specific technical means:
the surface of the printed circuit board chip is provided with a heat dissipation block which protrudes out of the packaging structure, wherein the surface of the printed circuit board chip is provided with a packaging shell;
a protruding groove is formed in the middle of the front side of the packaging shell, and a top radiating strip hole and a bottom radiating strip hole are formed in the top and the bottom of the protruding groove respectively;
the circuit board, the composite control panel and the display screen are sequentially placed in the packaging shell;
and the sealing cover is clamped at the top of the packaging shell.
Furthermore, six positioning columns are symmetrically distributed at the bottom of the inner cavity of the packaging shell.
Furthermore, a convex pad is arranged in the middle of the bottom of the inner cavity of the packaging shell, and the top of the convex pad is in contact with the bottom of the circuit board.
Furthermore, eight supporting pads are installed at the outside bottom of encapsulation shell, and the left and right sides wall of encapsulation shell is seted up the couple draw-in groove.
Further, the welding of department has the chip in the middle of the top of circuit board, and the left and right sides of chip is connected with six elastic support piece respectively, and elastic support piece's top is connected with the composite control board bottom.
Furthermore, the bottom of the left side and the bottom of the left side of the sealing cover are provided with connecting hooks, the bottoms of the connecting hooks are clamped in hook clamping grooves of the left side wall and the right side wall of the packaging shell, and limiting columns are arranged at four corners of the end face of the bottom of the sealing cover.
Compared with the prior structure, the utility model has the following beneficial effects:
1. according to the utility model, the protruding groove is arranged in the middle of the front side of the packaging shell, and the top radiating strip hole and the bottom radiating strip hole are arranged on the upper side and the lower side of the protruding groove to ensure ventilation in the packaging shell, so that heat is radiated for the circuit board and the chip, the circuit board and the chip are ensured not to generate high temperature, the working state of the circuit board and the chip is ensured, and the use safety is improved.
2. The composite control panel and the display screen are fixed through the limiting columns of the sealing cover, then the connecting hooks of the sealing cover are clamped in the hook clamping grooves, the sealing cover and the packaging shell are fixed, the packaging operation of the circuit board, the composite control panel and the display screen is realized, and the circuit board and the chip can be better protected.
Drawings
FIG. 1 is a schematic front side plan view of the present invention;
FIG. 2 is a schematic view of the overall split structure of the present invention;
FIG. 3 is a schematic view of a disassembled structure of the package housing and the cover of the present invention;
FIG. 4 is a schematic front bottom view of the present invention.
In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:
1. a package housing; 101. a bottom heat dissipation bar hole; 102. a protruding groove; 103. a top heat dissipating bar hole; 104. a positioning column; 105. a convex pad; 106. a support pad; 107. a hook clamping groove; 2. a circuit board; 201. an elastic support member; 202. a chip; 3. a composite control panel; 4. a display screen; 5. sealing the cover; 501. a connecting hook; 502. a limiting column.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example (b):
as shown in figures 1 to 4:
the utility model provides a printed circuit board chip flip heat dissipation block surface protrusion packaging structure, which comprises: a package housing 1;
referring to fig. 1 and 3, encapsulation shell 1 is rectangular rectangle form, the inside of encapsulation shell 1 is the cavity, department is provided with protruding groove 102 in the middle of the front side of encapsulation shell 1, top heat dissipation strip hole 103 and bottom heat dissipation strip hole 101 have been seted up respectively to the top and the bottom of protruding groove 102, concrete effect, the ventilation in encapsulation shell 1 is guaranteed through top heat dissipation strip hole 103 and bottom heat dissipation strip hole 101 of protruding groove 102 upper and lower both sides to encapsulation shell 1, ensure to be circuit board 2, composite control board 3 and display screen 4 dispel the heat, avoid circuit board 2, the high temperature condition appears in composite control board 3 and display screen 4, improve the safety in utilization.
Referring to fig. 2 and 4, six positioning columns 104 are symmetrically distributed at the bottom of the inner cavity of the package housing 1 in a triangular shape, five convex pads 105 are arranged at the middle of the bottom of the inner cavity of the package housing 1, the tops of the convex pads 105 are in contact with the bottom of the circuit board 2, eight L-shaped supporting pads 106 are arranged at the bottom of the outer side of the package housing 1, triangular hook clamping grooves 107 are arranged in the left and right outer side walls of the package housing 1, and specifically, the positioning columns 104 arranged at the bottom of the inner cavity of the package housing 1 can conveniently fix the circuit board 2 on the package housing 1 to prevent the circuit board 2 from moving in the package housing 1, thereby preventing the circuit board 2 from being damaged, the convex pads 105 are arranged between the circuit board 2 and the bottom of the package housing 1, so that a gap is reserved between the circuit board 2 and the package housing 1, the circuit board 2 is conveniently cooled, the circuit board 2 is prevented from being burnt due to high temperature, and the supporting pads 106 are arranged at the bottom of the outer side of the package housing 1, the distance between the bottom of the packaging shell 1 and other articles can be increased, the heat dissipation space is increased, and the heat dissipation effect is convenient to improve.
Referring to fig. 2, circuit board 2, composite control panel 3 and display screen 4 place in proper order in encapsulation shell 1, and department's welding has chip 202 in the middle of the top of circuit board 2, and the left and right sides of chip 202 is connected with six elastic support member 201 respectively, and elastic support member 201's top is connected with composite control panel 3 bottom, concrete effect, circuit board 2 passes through elastic support member 201 and composite control panel 3 electric connection to receive control signal, and synchronous display on display screen 4, conveniently control the operation.
Referring to fig. 2 and 3, the sealing cover 5 is clamped at the top of the packaging shell 1, the connecting hooks 501 are arranged at the bottoms of the left side and the right side of the sealing cover 5, the bottoms of the connecting hooks 501 are clamped in the hook clamping grooves 107 of the left side wall and the right side wall of the packaging shell 1, the limiting columns 502 are arranged at the four corners of the bottom end face of the sealing cover 5, and the sealing cover 5 is specifically used, the limiting columns 502 of the sealing cover 5 are inserted into the composite control panel 3, the composite control panel 3 and the display screen 4 are sequentially fixed, then the connecting hooks 501 of the sealing cover 5 are clamped in the hook clamping grooves 107, the sealing cover 5 is fixed with the packaging shell 1, the packaging operation of the circuit board 2, the composite control panel 3 and the display screen 4 is realized, and the circuit board 2 and the chip 202 can be better protected.
The specific use mode and function of the embodiment are as follows:
when using this printed circuit board chip flip-chip radiating block surface protrusion packaging structure, at first place encapsulation shell 1 with circuit board 2, and make circuit board 2 peg graft on the reference column 104 of encapsulation shell 1 inboard bottom through the round hole, then place compound control board 3 at circuit board 2 top, place display screen 4 at compound control board 3 top again, align display screen 4 with the opening of closing cap 5 at last, then press the closing cap 5 downwards hard, make the hookup 501 joint in couple draw-in groove 107, it is fixed with encapsulation shell 1 to accomplish closing cap 5.
In summary, although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the technical solutions described in the foregoing embodiments or equivalent substitutions for some technical features, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (6)
1. Printed wiring board chip flip radiating block surface protrusion packaging structure includes: a package housing (1);
the method is characterized in that: a protruding groove (102) is formed in the middle of the front side of the packaging shell (1), and a top heat dissipation strip hole (103) and a bottom heat dissipation strip hole (101) are formed in the top and the bottom of the protruding groove (102) respectively;
the circuit board (2), the composite control panel (3) and the display screen (4) are sequentially placed in the packaging shell (1);
and the sealing cover (5), wherein the sealing cover (5) is clamped at the top of the packaging shell (1).
2. The printed wiring board flip chip heat slug surface bump package structure of claim 1 wherein: six positioning columns (104) are symmetrically distributed at the bottom of the inner cavity of the packaging shell (1).
3. The printed wiring board flip chip heat slug surface bump package structure of claim 1 wherein: a convex pad (105) is arranged in the middle of the bottom of the inner cavity of the packaging shell (1), and the top of the convex pad (105) is in contact with the bottom of the circuit board (2).
4. The printed wiring board flip chip heat slug surface bump package structure of claim 1 wherein: eight supporting pads (106) are installed to the outside bottom of encapsulation shell (1), have seted up couple draw-in groove (107) in the two left and right sides lateral walls of encapsulation shell (1).
5. The printed wiring board flip chip heat slug surface bump package structure of claim 1 wherein: the welding of department has chip (202) in the middle of the top of circuit board (2), and the left and right sides of chip (202) is connected with six elastic support piece (201) respectively, and the top of elastic support piece (201) is connected with composite control board (3) bottom.
6. The printed wiring board flip chip heat slug surface bump package structure of claim 1 wherein: the bottom of the left side and the right side of the sealing cover (5) is provided with a connecting hook (501), the bottom of the connecting hook (501) is clamped in a hook clamping groove (107) of the left side wall and the right side wall of the packaging shell (1), and four corners of the end face of the bottom of the sealing cover (5) are provided with limiting columns (502).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122410613.0U CN215774093U (en) | 2021-10-08 | 2021-10-08 | Packaging structure for flip chip of printed circuit board with heat dissipation block with protruded surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122410613.0U CN215774093U (en) | 2021-10-08 | 2021-10-08 | Packaging structure for flip chip of printed circuit board with heat dissipation block with protruded surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215774093U true CN215774093U (en) | 2022-02-08 |
Family
ID=80092769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122410613.0U Active CN215774093U (en) | 2021-10-08 | 2021-10-08 | Packaging structure for flip chip of printed circuit board with heat dissipation block with protruded surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215774093U (en) |
-
2021
- 2021-10-08 CN CN202122410613.0U patent/CN215774093U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231218 Address after: 528306, 4th Floor, Building 1, No. 16 Xinfa Road, Rongli Community, Ronggui Street, Shunde District, Foshan City, Guangdong Province (Residence Declaration) Patentee after: Foshan Pushcheng Electronics Co.,Ltd. Address before: 528000 5 / F, No. 8, Zone 8, Rongshan Industrial Zone, Ronggang Road, Ronggui Desheng neighborhood committee, Shunde District, Foshan City, Guangdong Province Patentee before: Foshan Guixin electronic appliance manufacturing Co.,Ltd. |
|
| TR01 | Transfer of patent right |