CN211979605U - Radiating assembly of control chip and control device - Google Patents
Radiating assembly of control chip and control device Download PDFInfo
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- CN211979605U CN211979605U CN202020884985.XU CN202020884985U CN211979605U CN 211979605 U CN211979605 U CN 211979605U CN 202020884985 U CN202020884985 U CN 202020884985U CN 211979605 U CN211979605 U CN 211979605U
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- heat
- control chip
- heat conducting
- fan
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Abstract
The utility model discloses a control chip's radiator unit and controlling means, control chip places on the system board, radiator unit includes: the heat conducting piece is arranged on one side of the control chip, which is far away from the system board; the heat conducting piece comprises a heat conducting plate, a raised line and a plurality of heat radiating grooves, wherein the raised line is arranged at the edge of the bottom surface of the heat conducting plate and extends towards the system plate to surround the control chip, and the heat radiating grooves are arranged on the top surface of the heat conducting plate. The utility model discloses can dispel the heat to control chip.
Description
Technical Field
The utility model relates to a show technical field. And more particularly, to a heat dissipation assembly for a control chip.
Background
As shown in fig. 1, the current OLED display product mainly includes a display screen 1 and a control device, wherein a control chip 2 on a system board 3 in the control device controls power and communication display on the display screen 1, the data processing amount thereof will vary according to the displayed image, when the image is clear, the brightness is white, the corresponding energy consumption is increased, and if the overall display is high definition display such as 2K and 4K image quality, the operation function thereof will be correspondingly increased. With the progress of scientific and technological technology, high-definition display is gradually commercialized at present, and a certain protection mechanism exists for safety when a control chip operates, for example, when the temperature is too hot, the display product is brought into a dormant state by going down, and the display product needs to be started again after being manually restarted. It can be seen that in order to enable the display product to display for a long time without downtime, reasonable heat dissipation needs to be performed on the control chip 2.
The heat dissipation of the control chip 2 depends on the environment, fig. 2 is a schematic diagram of a heat dissipation scheme of the control chip in the prior art, and it can be seen that the control chip 2 is in contact with the external shielding case 4 through the heat conductive colloid 5 and then is dissipated into the box body 6, and the upper surface corresponding to the cover plate 7 is provided with a heat dissipation hole 8. The scheme has poor heat dissipation effect and is difficult to meet the daily requirement of a display product.
Disclosure of Invention
In order to solve the technical problem that proposes among the background art, the utility model provides a control chip's radiator unit, control chip places on the system board, radiator unit includes:
the system board is used for placing the control chip;
the heat conducting piece is arranged on one side of the control chip, which is far away from the system board;
the heat conducting piece comprises a heat conducting plate, a raised line and a plurality of heat radiating grooves, wherein the raised line is arranged at the edge of the bottom surface of the heat conducting plate and extends towards the system plate to surround the control chip, and the heat radiating grooves are arranged on the top surface of the heat conducting plate.
Alternatively,
and a fan is arranged on one side of the heat conducting piece, which deviates from the control chip.
Alternatively,
the heat conducting member is bolted to the fan.
Alternatively,
the fan is characterized by further comprising a power supply connecting wire, wherein one end of the power supply connecting wire is electrically connected with the fan, and the other end of the power supply connecting wire is electrically connected with a power supply.
Alternatively,
and a heat-conducting colloid is arranged on one side of the control chip close to the heat-conducting piece.
Alternatively,
the side walls of the two sides of the heat conducting piece are respectively provided with a fixing piece, the system board is provided with support columns positioned on the two sides of the heat conducting piece, and the fixing piece and the support columns positioned on the same side of the heat conducting piece are fixedly connected.
Alternatively,
the fixing piece is an L-shaped fixing piece, the L-shaped fixing piece comprises a first portion and a second portion perpendicular to the second portion, the first portion is fixedly connected with the supporting column, and the second portion is fixedly connected with the side wall of the heat conducting piece.
The second aspect of the utility model provides a control device,
comprises a box body for accommodating the heat radiation component provided by the first aspect of the invention; and
the cover plate is used for packaging the box body;
wherein, be provided with a plurality of first ventilation holes on the apron.
Alternatively,
and a plurality of second ventilation holes are formed in the bottom wall of the box body.
Alternatively,
and a plurality of third ventilation holes are formed in the side wall of the box body.
The invention has the following beneficial effects:
technical scheme has the principle and makes clear, the advantage of simple design, when using, the heat conduction spare is through contacting with control chip, come to transmit the produced heat of control chip, thereby play radiating effect, and, the sand grip of setting in the bottom surface edge of heat-conducting plate, through surrounding control chip and play the shielding effect to control chip, satisfy control chip's shielding external disturbance's requirement, and a plurality of radiating grooves that set up on the top surface of heat-conducting plate then can be corresponding increase the heat radiating area of heat-conducting plate, thereby further strengthen the radiating action of heat conduction spare.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 shows a schematic structural diagram of a display product in the prior art;
FIG. 2 illustrates a schematic diagram of a heat dissipation scheme of a control chip in the prior art;
fig. 3 is a cross-sectional view of a heat dissipation assembly of a control chip according to an embodiment of the present invention;
FIG. 4 is a schematic structural view of the heat-conducting member and the fan in the present embodiment;
fig. 5 shows a cross-sectional view between the control chip and the heat conductive member in the present embodiment;
fig. 6 shows a schematic structural diagram of a control device according to another embodiment of the present invention.
In the figure: 1. a display screen; 2. a control chip; 3. a system board; 4. a shield case; 5. a thermally conductive gel; 6. a box body; 7. sealing the cover; 8. heat dissipation holes; 9-A, a heat conducting plate; 9-B, convex strips; 9-C, a heat dissipation groove; 10. a fan; 11. a through hole; 12. bolt holes; 12. a first bolt; 13. a power connection line; 14. an L-shaped firmware; 15. a first part; 16. a second section; 17. a support pillar; 18. a second bolt; 19. a third bolt; 20. a shielding cover; 21. a first opening; 22. a second opening; 23. a first vent hole; 24. a second vent hole; 25. and a third vent hole.
Detailed Description
In order to make the technical solutions and advantages of the present invention clearer, the following will describe the embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 3 shows a cross-sectional view of a heat dissipation assembly of a control chip 2 according to an embodiment of the present invention, as shown in fig. 3, the control chip 2 is placed on a system board 3, and the heat dissipation assembly includes a heat conducting member.
Specifically, in the example of fig. 3, the heat conducting member is disposed on a side of the control chip 2 away from the system board 3, where the heat conducting member mainly plays a role of heat dissipation, and the heat conducting member is in contact with the control chip 2 to transfer heat generated by the control chip 2, so as to play a role of heat dissipation, further, a heat conducting colloid 5 is further disposed on a side of the control chip 2 close to the heat conducting member, in an embodiment, the heat conducting colloid 5 not only can fix the control chip 2 and the heat conducting member between them, so that the assembly is convenient and firm, but also can quickly transfer heat generated by the control chip 2 to the heat conducting member based on the heat conducting performance of the heat conducting colloid 5 itself, so as to enhance the heat dissipation capability.
In this embodiment, the heat conducting member may be made of a material with high thermal conductivity, such as: the aluminum material, and heat-conducting colloid 5 then can adopt the silica gel of high heat conduction, it should be explained that, the skilled person in the art should know that, the concrete material of heat-conducting piece is not only limited to foretell aluminum material, and is the same, and heat-conducting colloid 5's material is not limited to foretell silica gel yet, and other materials that have high heat conduction can belong to the utility model discloses a within the protection scope, the staff can set for by oneself according to actual need when producing, and this embodiment does not specifically limit this.
Further, in the present embodiment, as shown in fig. 3 and 4, the heat conductive member includes a heat conductive plate 9-a, a rib 9-B provided at the edge of the bottom surface of the heat conductive plate 9-a and extending toward the system board 3 to surround the control chip 2, and a plurality of heat dissipation grooves 9-C provided on the top surface of the heat conductive plate 9-a.
Specifically, the raised lines 9-B arranged at the bottom edge of the heat conducting plate 9-A play a role in shielding the control chip 2 by surrounding the control chip 2, so that the requirement of shielding the external interference of the control chip 2 is met, and the plurality of heat dissipation grooves 9-C arranged on the top surface of the heat conducting plate 9-A can correspondingly increase the heat dissipation area of the heat conducting plate 9-A, so that the heat dissipation effect of the heat conducting piece is enhanced.
In order to achieve better heat dissipation in a limited space, after the heat conducting member rapidly transfers the heat generated by the control chip 2, the heat conducting member needs to be further diffused to the external environment, and therefore, in this embodiment, as shown in fig. 5, a fan 10 is further disposed on a side of the heat conducting member away from the control chip 2.
Specifically, the fan 10 is arranged to dissipate heat from the heat conducting member during operation, and dissipate the heat to the external environment, so as to improve the heat dissipation effect of the control chip 2, and in order to achieve the fixation between the fan 10 and the heat conducting member, in the example of fig. 4, the fan 10 is provided with a through hole 11, the heat conducting member is also provided with a bolt hole 12 at a position corresponding to the through hole 11 of the fan 10, the fan 10 is bolted to the heat conducting member by passing a first bolt 12 through the through hole 11 and the bolt hole 12 in sequence, in the example of fig. 4, the fan 10 is electrically connected to a power connection line 13, and the other end of the power connection line 13 is electrically connected to a power supply (not shown in fig. 4) for supplying power to the fan 10.
It should be noted that, in the example of fig. 4, the heat dissipation grooves 9-C disposed on the top surface of the heat conduction plate 9-a are long, and those skilled in the art should understand that the specific shape of the heat dissipation grooves 9-C is not limited to the above shape, and other shapes of the heat dissipation grooves 9-C capable of increasing the heat dissipation area of the heat conduction plate 9-a should also fall within the protection scope of the present invention, such as: circular and well-shaped.
In the present embodiment, as can be seen from the above, the heat conducting member is fixed to the control chip 2 through the heat conducting colloid 5, and in order to further enhance the structural stability, in the example of fig. 5, the side walls at both sides of the heat conducting member are respectively provided with a fixing member, and the system board 3 is provided with supporting pillars 17 at both sides of the heat conducting member, wherein the fixing member and the supporting pillars 17 at the same side of the heat conducting member are fixedly connected.
Specifically, two ends of the fixing member are respectively fixed to the supporting pillar 17 and the heat conducting member, so that the fixing of the heat conducting member can be ensured, and the stability of the overall structure is enhanced, and in a preferred implementation manner of this embodiment, the fixing member is an L-shaped fixing member 14, the L-shaped fixing member 14 includes a first portion 15 and a second portion 16 perpendicular to the second portion 16, the first portion 15 is fixedly connected to the supporting pillar 17, the second portion 16 is fixedly connected to the side wall of the heat conducting member, and by setting the fixing member as the L-shaped fixing member 14, the structural strength of the fixing member can be enhanced, and the stability of the overall structure can be further enhanced.
Here, the L-shaped fixing member 14 is fixed to the support column 17 and the heat-conducting member by bolts, and in the example of fig. 5, it can be seen that the first portion 15 of the L-shaped fixing member 14 is bolted to the support column 17 by the second bolt 18, and the second portion 16 is bolted to the heat-conducting member by the third bolt 19.
Technical scheme has the principle and makes clear, the advantage of simple design, when using, the heat conduction spare is through contacting with control chip 2, come to transmit the produced heat of control chip 2, thereby play radiating effect, and, the sand grip 9-B of setting in the bottom surface edge of heat-conducting plate 9-A, through surrounding control chip 2 and play the shielding effect to control chip 2, satisfy the requirement of the external interference of shielding of control chip 2, and a plurality of radiating grooves 9-C that set up on the top surface of heat-conducting plate 9-A then can be corresponding increase heat-conducting plate 9-A's heat radiating area, thereby further strengthen the radiating effect of heat conduction spare.
Fig. 6 shows a schematic structural diagram of a control device according to another embodiment of the present invention, as shown in fig. 6, the control device includes a box body 6 for accommodating the heat dissipation assembly according to the previous embodiment of the present invention and a cover 7 for sealing the box body 6.
Specifically, in the example of fig. 6, the system board 3, the heat conducting member, and the fan 10 are all accommodated in the box body 6, a shielding cover 207 is further disposed in the box body 6, the shielding cover 207 is used for encapsulating the heat dissipation assembly, a first opening 21 corresponding to the size of the fan 10 is disposed on the shielding cover 207, a second opening 22 corresponding to the first opening 21 is disposed on the cover 7 to expose the fan 10, so that heat generated by the control chip 2 can be diffused into the box body 6 sequentially through the heat conducting member and the fan 10, correspondingly, a plurality of first ventilation holes 23 are also disposed on the cover 7, and the first ventilation holes 23 can further diffuse heat in the box body 6 into the external environment, so as to further improve the corresponding heat dissipation effect.
In a preferred implementation manner of this embodiment, a plurality of second ventilation holes 24 are disposed on the bottom of the box body 6, and the positions of the second ventilation holes 24 may correspond to the positions of the first ventilation holes 23, so as to implement air convection and improve the heat dissipation effect, and correspondingly, a plurality of third ventilation holes 25 are also disposed on the side walls of the box body 6, in the example of fig. 6, the box body 6 is rectangular, and the rectangular box body 6 has four side walls, so that the third ventilation holes 25 may be disposed on all four side walls to increase the heat dissipation effect, and in order to implement air convection, the positions of the third ventilation holes 25 on the opposite side walls may correspond to each other.
It should be noted that, in the present embodiment, it should be understood by those skilled in the art that the shape of the box body 6 is not limited to the rectangle shown in fig. 6, and other shapes of the box body 6 should also fall within the protection scope of the present invention, for example: circular, hexagonal, etc.
Obviously, the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it is obvious for those skilled in the art to make other variations or changes based on the above descriptions, and all the embodiments cannot be exhausted here, and all the obvious variations or changes that belong to the technical solutions of the present invention are still in the protection scope of the present invention.
Claims (10)
1. A heat dissipation assembly for a control chip, the control chip being disposed on a system board, the heat dissipation assembly comprising:
the heat conducting piece is arranged on one side of the control chip, which is far away from the system board;
the heat conducting piece comprises a heat conducting plate, a raised line and a plurality of heat radiating grooves, wherein the raised line is arranged at the edge of the bottom surface of the heat conducting plate and extends towards the system plate to surround the control chip, and the heat radiating grooves are arranged on the top surface of the heat conducting plate.
2. The heat dissipating component of a control chip of claim 1,
and a fan is arranged on one side of the heat conducting piece, which deviates from the control chip.
3. The heat dissipating component of a control chip of claim 2,
the heat conducting member is bolted to the fan.
4. The heat dissipating component of a control chip of claim 2,
the fan is characterized by further comprising a power supply connecting wire, wherein one end of the power supply connecting wire is electrically connected with the fan, and the other end of the power supply connecting wire is electrically connected with a power supply.
5. The heat dissipating component of a control chip of claim 1,
and a heat-conducting colloid is arranged on one side of the control chip close to the heat-conducting piece.
6. The heat dissipating component of a control chip of claim 1,
the side walls of the two sides of the heat conducting piece are respectively provided with a fixing piece, the system board is provided with support columns positioned on the two sides of the heat conducting piece, and the fixing piece and the support columns positioned on the same side of the heat conducting piece are fixedly connected.
7. The heat dissipating component of a control chip of claim 6,
the fixing piece is an L-shaped fixing piece, the L-shaped fixing piece comprises a first portion and a second portion perpendicular to the first portion, the first portion is fixedly connected with the supporting column, and the second portion is fixedly connected with the side wall of the heat conducting piece.
8. A control device is characterized in that a control unit,
a case comprising a housing for receiving the heat dissipation assembly of any of claims 1-7; and
the cover plate is used for packaging the box body;
wherein, be provided with a plurality of first ventilation holes on the apron.
9. The control device according to claim 8,
and a plurality of second ventilation holes are formed in the bottom wall of the box body.
10. The control device according to claim 8,
and a plurality of third ventilation holes are formed in the side wall of the box body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020884985.XU CN211979605U (en) | 2020-05-22 | 2020-05-22 | Radiating assembly of control chip and control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020884985.XU CN211979605U (en) | 2020-05-22 | 2020-05-22 | Radiating assembly of control chip and control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211979605U true CN211979605U (en) | 2020-11-20 |
Family
ID=73371245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020884985.XU Active CN211979605U (en) | 2020-05-22 | 2020-05-22 | Radiating assembly of control chip and control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211979605U (en) |
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2020
- 2020-05-22 CN CN202020884985.XU patent/CN211979605U/en active Active
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