CN212876208U - 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device - Google Patents
5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device Download PDFInfo
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- CN212876208U CN212876208U CN202022230208.6U CN202022230208U CN212876208U CN 212876208 U CN212876208 U CN 212876208U CN 202022230208 U CN202022230208 U CN 202022230208U CN 212876208 U CN212876208 U CN 212876208U
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Abstract
The utility model relates to a 5G backplate drapes over one's shoulders cutting edge of a knife or a sword solution device, including multilayer circuit board main part, the export of drilling, apron to and backing plate. The backing plate main body with buffering elastic performance is arranged on the bottom surface or the back surface of the multilayer circuit board main body at the drilling outlet; the backing plate main body comprises an aluminum sheet or a sheet body with hard surface hardness and a buffer sheet with elastic performance, wherein the sheet body is directly contacted with the inside of the multi-layer circuit board main body, and the buffer sheet is arranged below the sheet body. During the use, can make backing plate main part and multilayer circuit board bottom surface contact together during drilling, be approximate to a whole, the drilling or drilling out when effectively inhibiting drilling produces shavings cutting edge of a knife or a burr, treat the drilling back, can remove unnecessary backing plate main part in multilayer circuit board to reach and lead to the phenomenon emergence of shavings cutting edge of a knife or a burr to appear because of the face distortion or the deformation of multilayer circuit board.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a backplate processingequipment specifically indicates a 5G backplate that uses when being used for processing 5G multilayer circuit board drilling and drapes over one's shoulders cutting edge of a knife or a sword solution device.
[ background of the invention ]
With the continuous forward progress and development of society, the demand for high precision of electronic products is increasing. The high-precision development of electronic products directly puts forward higher precision requirements to the processing of circuit boards, and simultaneously, the requirements on the positioning precision of hole positions and the quality in the holes of the circuit boards are higher and higher. However, in general, in the prior art, a high-end multilayer circuit board is formed by pressing in a conventional processing manner, and in the pressing process, due to technical reasons such as asymmetric thickness of an inner copper plate of the multilayer circuit board, asymmetric circuit design, non-uniform plate material, insufficient capability of a pressing machine and the like, the phenomena of distortion and deformation of the processed thicker multilayer circuit board are easily caused. During drilling, because the board distortion or the deformation position department of multilayer circuit board are located unsettled state, and if do not have corresponding support piece to support, then lead to very easily being creased and burr appear in the drilling edge on the multilayer circuit board after being bored, from this, lead to whole multilayer circuit board of processing to be scrapped.
[ Utility model ] content
In view of the above prior art, the technical problem to be solved in the present invention is to provide a 5G backboard draping edge solution apparatus capable of resulting in the appearance of draping edge and burr at the edge of a drill hole due to the distortion or deformation of the surface of the multi-layer circuit board.
Therefore, the technical scheme adopted by the utility model is a 5G backboard flash solution device, which comprises a multilayer circuit board main body, a drilling hole outlet arranged on the multilayer circuit board main body, a cover plate arranged on the multilayer circuit board main body, and a backing plate arranged on the bottom surface of the multilayer circuit board main body; a base plate main body with buffering elastic performance is arranged on the bottom surface or the back surface of the multilayer circuit board main body at the drilling outlet; the backing plate main body comprises an aluminum sheet or a sheet body with hard surface hardness and a buffer sheet with elastic performance, wherein the sheet body is directly contacted with the inside of the multi-layer circuit board main body, and the buffer sheet is arranged below the sheet body.
Further defined, the deviation of the thickness of the base plate main body is less than or equal to 0.02 mm, and the total thickness of the base plate main body is 0.5 mm to 2 mm.
The pad body comprises a removable adhesive layer directly arranged on the bottom surface of the multilayer circuit board body, and a removable pad adhesive layer arranged below the removable adhesive layer, wherein the pad adhesive layer comprises an aluminum sheet or a cold punching plate or a high-hardness plate body.
Further defined, the total thickness of the cushion gum layer is between 0.13 mm and 2 mm.
Further limited, the backing plate main body comprises a glue layer directly arranged on the bottom surface of the multilayer circuit board main body and a backing glue layer arranged below the glue layer, wherein the backing glue layer comprises a PET layer or an acrylic sheet or an organic glass sheet or a high-hardness plate body.
Further defined, the total thickness of the cushion gum layer is between 0.13 mm and 2 mm.
The utility model has the advantages of: the backing plate main body with buffering elastic performance is arranged on the bottom surface or the back surface of the multilayer circuit board main body at the drilling outlet; the backing plate main body comprises an aluminum sheet or a sheet body with hard surface hardness and a buffer sheet with elastic performance, wherein the sheet body is directly contacted with the inside of the multi-layer circuit board main body, and the buffer sheet is arranged below the sheet body. During the use, can make backing plate main part and multilayer circuit board bottom surface contact together during drilling, be approximate to a whole, the drilling or drilling out when effectively inhibiting drilling produces shavings cutting edge of a knife or a burr, treat the drilling back, can remove unnecessary backing plate main part in multilayer circuit board to reach and lead to the phenomenon emergence of shavings cutting edge of a knife or a burr to appear because of the face distortion or the deformation of multilayer circuit board.
The technical solution of the present invention will be described in further detail with reference to the accompanying drawings and embodiments.
[ description of the drawings ]
Fig. 1 is a schematic view of a 5G backplane flash solution apparatus according to embodiment 1 of the present invention;
fig. 2 is a schematic view of a device for solving the burring solution of a 5G backplate according to embodiment 2 of the present invention;
fig. 3 is a schematic diagram of a 5G backplane burring solution device according to embodiment 3 of the present invention.
[ detailed description ] embodiments
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention clearer and more obvious, the following description of the present invention with reference to the accompanying drawings and embodiments is provided for further details. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Referring to fig. 1, a device for solving the flash problem of a 5G backplane according to a first embodiment is described, which includes a multi-layer circuit board body 1, a drilling outlet 2 disposed on the multi-layer circuit board body 1, a cover plate 3 disposed on the multi-layer circuit board body 1, and a pad plate 4 disposed on the bottom surface of the multi-layer circuit board body 1. The backing plate main body comprises a sheet body 5 with hard surface hardness and directly contacting an aluminum sheet or a cold punching plate in the multilayer circuit board main body 1, and a buffer sheet 6 with elastic property and arranged below the sheet body 5. The backing plate main body is arranged on the bottom surface of the multilayer circuit board main body 1 at the drilling outlet 2. The base plate main body has buffering elastic performance. The thickness of the adopted buffer material is uniform, the thickness deviation of the cushion plate main body is less than or equal to 0.02 mm, and the total thickness of the cushion plate main body is 0.5 mm to 2 mm.
Before drilling, the pressed multilayer circuit board main body 1 carrying distortion or deformation is arranged below the cover plate 3, and then the backing plate 4 is arranged below the multilayer circuit board main body 1. Then, a sheet body 5 with hard surface hardness is inserted under the multilayer wiring board main body 1 where the drilled hole outlet 2 is provided, which directly contacts the aluminum sheet or the cold punching plate, and a buffer sheet 6 is inserted under the sheet body 5. During drilling, due to the effect of the buffer material of the buffer sheet 6, the gap between the aluminum sheet and the multi-layer circuit board main body 1 formed by deformation or distortion can be greatly offset, so that the multi-layer circuit board main body 1 is tightly attached to the aluminum sheet or the cold punching plate, and burrs during drilling can be effectively inhibited.
In summary, the pad body with buffering elastic performance is arranged on the bottom surface or the back surface of the multilayer circuit board body 1 at the drilling outlet 2; the backing plate main body comprises a sheet body 5 with hard surface hardness and directly contacting an aluminum sheet or a cold punching plate in the multilayer circuit board main body 1, and a buffer sheet 6 with elastic property and arranged below the sheet body 5. During the use, can make backing plate main part and 1 bottom surface contact of multilayer circuit board main part be in the same place during drilling, be approximate to a whole, the drilling or drilling out when effectively inhibiting drilling produces shawl and burr, treat the drilling back, can remove unnecessary backing plate main part in multilayer circuit board main part 1 to reach the phenomenon that leads to the drilling edge to appear shawl and burr because of the face distortion or the deformation of multilayer circuit board and take place.
Referring to fig. 2, the second embodiment is different from the first embodiment in that the pad body includes a removable adhesive layer 8 directly disposed on the bottom surface of the multilayer circuit board body 7, and a removable pad adhesive layer 9 disposed under the removable adhesive layer 8, wherein the pad adhesive layer 9 includes an aluminum sheet or a cold punching sheet or a high hardness board body. The thickness of the aluminum sheet or the cold punching sheet or other high-hardness plate bodies is uniform, and the total thickness of the cushion rubber layer 9 is 0.13 mm to 2 mm.
Before drilling, the pressed multilayer circuit board main body 7 carrying distortion or deformation is arranged below the cover plate 10, and then the backing plate 11 is arranged below the multilayer circuit board main body 7. Then, firstly, a removable glue layer 8 formed by rolling, spraying, curtain coating or immersing one surface of an aluminum sheet or a cold punching plate or a plate body with higher surface hardness is uniformly and flatly distributed on the plate body, and then one surface or two surfaces of the multi-layer circuit board main body 7 which is twisted or deformed after being pressed are compounded together by a compound rolling way. When drilling, because this plate body and multilayer circuit board main part 7 zonulae occludens are in the same place, form a complete whole, and possess certain hardness, can effectively restrain the production of the flash and burr when drilling. After drilling, due to the characteristic of movable glue, the board body materials attached to the single surface or double surfaces of the multilayer circuit board main body 7 can be easily and completely removed, thereby meeting the requirements of customers on the board surface quality. The Shore hardness of the surface hardness of the plate body is greater than or equal to 75. The removable adhesive layer 8 mainly comprises PU/polyurethane and is characterized by strong adhesive force and no trace when removed. The technical effects described in the first embodiment can be achieved as well.
Referring to fig. 3, the third embodiment is different from the first embodiment in that the pad body includes an adhesive layer 13 directly disposed on the bottom surface of the multilayer circuit board body 12, and a pad adhesive layer 14 disposed under the adhesive layer 13, where the pad adhesive layer 14 includes a PET layer, an acrylic sheet, an organic glass sheet, or a plate body with high surface hardness. The total thickness of the cushion gum layer 14 is between 0.13 mm and 2 mm.
Before drilling, the pressed multilayer circuit board main body 12 carrying the distortion or deformation is placed under the cover plate 15, and then the backing plate 16 is placed under the multilayer circuit board main body 12. Then, firstly, one side of the PET layer or acrylic sheet or organic glass sheet or the plate body with high surface hardness is coated by rolling, spraying, showering or immersing to form the glue layer 13, then the glue layer 13 is evenly and flatly distributed on the plate body, and then one side or two sides of the multi-layer circuit board main body 12 which is twisted or deformed after being pressed are compounded together with the aluminum sheet or the cold punching plate or the plate body by a compound rolling way. When drilling, because the board body is tightly connected with the multilayer circuit board main body and has certain hardness, burrs and burrs during drilling can be effectively inhibited. After drilling, the glue layer 13 can be decomposed after being irradiated by a light source, so that the plate materials attached to one side or both sides of the multilayer circuit board main body 12 can be easily removed, and the requirements of customers on the board surface quality can be met. The Shore hardness of the surface hardness of the plate body is greater than or equal to 75.
The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, without thereby limiting the scope of the invention. Any modification, equivalent replacement and improvement made by those skilled in the art without departing from the scope and spirit of the present invention should be within the scope of the claims of the present invention.
Claims (6)
1. A5G backboard flash solution device comprises a multilayer circuit board main body, a drilling outlet arranged on the multilayer circuit board main body, a cover plate arranged on the multilayer circuit board main body, and a base plate arranged on the bottom surface of the multilayer circuit board main body; the method is characterized in that: a base plate main body with buffering elastic performance is arranged on the bottom surface or the back surface of the multilayer circuit board main body at the drilling outlet; the backing plate main body comprises an aluminum sheet or a sheet body with hard surface hardness and a buffer sheet with elastic performance, wherein the sheet body is directly contacted with the inside of the multi-layer circuit board main body, and the buffer sheet is arranged below the sheet body.
2. The apparatus of claim 1, wherein the 5G backplane flash solution comprises: the thickness deviation of the cushion plate main body is less than or equal to 0.02 mm, and the total thickness of the cushion plate main body is 0.5 mm to 2 mm.
3. The apparatus of claim 1, wherein the 5G backplane flash solution comprises: the pad main body comprises a movable glue layer directly arranged on the bottom surface of the multilayer circuit board main body and a movable pad glue layer arranged below the movable glue layer, wherein the pad glue layer comprises an aluminum sheet or a cold punching plate or a high-hardness plate body.
4. The apparatus of claim 3, wherein the 5G backplane flash solution comprises: the total thickness of the cushion glue layer is 0.13 mm to 2 mm.
5. The apparatus of claim 1, wherein the 5G backplane flash solution comprises: the base plate main body comprises a glue layer directly arranged on the bottom surface of the multilayer circuit board main body and a base glue layer arranged below the glue layer, wherein the base glue layer comprises a PET layer, an acrylic sheet, an organic glass sheet or a high-hardness plate body.
6. The apparatus of claim 3, wherein the 5G backplane flash solution comprises: the total thickness of the cushion glue layer is 0.13 mm to 2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022230208.6U CN212876208U (en) | 2020-10-09 | 2020-10-09 | 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022230208.6U CN212876208U (en) | 2020-10-09 | 2020-10-09 | 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device |
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| Publication Number | Publication Date |
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| CN212876208U true CN212876208U (en) | 2021-04-02 |
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| CN202022230208.6U Active CN212876208U (en) | 2020-10-09 | 2020-10-09 | 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113547817A (en) * | 2021-07-30 | 2021-10-26 | 深圳市宏宇辉科技有限公司 | Anti-drape acrylic and preparation method and application thereof |
| CN115339185A (en) * | 2021-12-06 | 2022-11-15 | 深圳市柳鑫实业股份有限公司 | Composite base plate and preparation method thereof |
| CN115339205A (en) * | 2021-12-06 | 2022-11-15 | 深圳市柳鑫实业股份有限公司 | Deformation base plate and preparation method thereof |
| CN115339204A (en) * | 2021-12-06 | 2022-11-15 | 深圳市柳鑫实业股份有限公司 | Combined backing board |
-
2020
- 2020-10-09 CN CN202022230208.6U patent/CN212876208U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113547817A (en) * | 2021-07-30 | 2021-10-26 | 深圳市宏宇辉科技有限公司 | Anti-drape acrylic and preparation method and application thereof |
| CN115339185A (en) * | 2021-12-06 | 2022-11-15 | 深圳市柳鑫实业股份有限公司 | Composite base plate and preparation method thereof |
| CN115339205A (en) * | 2021-12-06 | 2022-11-15 | 深圳市柳鑫实业股份有限公司 | Deformation base plate and preparation method thereof |
| CN115339204A (en) * | 2021-12-06 | 2022-11-15 | 深圳市柳鑫实业股份有限公司 | Combined backing board |
| CN115339205B (en) * | 2021-12-06 | 2024-03-15 | 深圳市柳鑫实业股份有限公司 | Deformation backing plate and preparation method thereof |
| CN115339185B (en) * | 2021-12-06 | 2024-03-29 | 深圳市柳鑫实业股份有限公司 | Composite backing plate and preparation method thereof |
| CN115339204B (en) * | 2021-12-06 | 2024-04-02 | 深圳市柳鑫实业股份有限公司 | Combined backing plate |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230829 Address after: No. 606, Unit 2, Building 28, Taoyuanju District 10, Qianjin Second Road, Bao'an District, Shenzhen City, Guangdong Province, 518000 Patentee after: Song Yuqi Address before: 518000 409, Minzhu 99 Industrial Zone, Shajing West Ring Road, Shatou community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HONGYUHUI TECHNOLOGY CO.,LTD. |
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| TR01 | Transfer of patent right |