CN107466165A - A kind of method of the FR4 plate reinforcement of flexible PCB - Google Patents
A kind of method of the FR4 plate reinforcement of flexible PCB Download PDFInfo
- Publication number
- CN107466165A CN107466165A CN201710838426.8A CN201710838426A CN107466165A CN 107466165 A CN107466165 A CN 107466165A CN 201710838426 A CN201710838426 A CN 201710838426A CN 107466165 A CN107466165 A CN 107466165A
- Authority
- CN
- China
- Prior art keywords
- stiffening plates
- reinforcement
- flexible pcb
- present
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
The present invention relates to a kind of method of the FR4 plate reinforcement of flexible PCB, it may include following steps：S1. by being machined the FR4 stiffening plates by FR4 plate cuttings into required shape；S2. the FR4 stiffening plates that step S1 is obtained are put into the roll cast machine equipped with abrasive grains and clear water and carry out the roll cast cleaning scheduled time；S3. processing is dried in the FR4 stiffening plates after step S2 processing；S4. reinforcement region, which carries out standby glue, is treated to flexible PCB；S5. the FR4 stiffening plates that step S3 is obtained are fitted to and treated by the step S4 flexible PCBs handled on reinforcement region；S6. pressing baking is carried out to the FR4 stiffening plates of fitting.The present invention be able to ensure that FR4 stiffening plates will not residual particles, burr and chip, improve FPC quality, reduce the scrappage in production process, avoid downstream client quality hidden danger that may be present.
Description
Technical field
The present invention relates to the manufacturing field of flexible PCB, is mended more particularly to a kind of FR4 plates of flexible PCB
Strong method.
Background technology
The main material of flexible PCB typically uses polyimide film (PI), sheet material be applied on PI epoxy resin or
Acrylic-based adhesives, copper-clad laminate, abbreviation soft board or FPC is made, there is high Distribution density, in light weight, thickness of thin, body
The features such as product is small, resistant to bending.FPC application is more and more broader, Computers and Communication, consumer electronics, automobile, it is military with
The fields such as space flight, medical treatment are all widely used, such as：Video camera, mobile phone, CD-audio player, notebook computer, medicine equipment etc.
There is substantial amounts of demand, promote printed circuit design largely to use flexible PCB.FPC has the bent characteristic of flexing, because
This FPC individual sites for needing SMT at some, increase FR4 plates reinforcement can be used to be supported.Existing flexible PCB
FR4 plate reinforcement processes are, carry out standby glue to FPC first, then by milling side, punching by FR4 plate cuttings into required shape
FR4 stiffening plates, FR4 stiffening plates are then fitted into the treating on reinforcement region of FPC, finally carry out pressing baking.And FR4 plates belong to
Glass-epoxy material, in the mechanical processing process such as milling side, punching, it may appear that substantial amounts of dust granules and its hole
Groove and outline edge can remain jagged or chip.These particles, burr or chip can not only cause weighing wounded for rear procedures
Or golden face pollution, and client's production operation is influenced whether, there is very big quality hidden danger.
The content of the invention
The present invention is intended to provide a kind of method of the FR4 plate reinforcement of flexible PCB, to solve the side of existing FR4 plates reinforcement
The quality hidden danger as caused by particle, burr or chip that method occurs.Therefore, concrete technical scheme provided by the invention is as follows：
A kind of method of the FR4 plate reinforcement of flexible PCB, it may include following steps：
S1. by being machined the FR4 stiffening plates by FR4 plate cuttings into required shape；
S2. it is clear the FR4 stiffening plates that step S1 is obtained to be put into progress roll cast in the roll cast machine equipped with abrasive grains and clear water
The clean scheduled time；
S3. processing is dried in the FR4 stiffening plates after step S2 processing；
S4. reinforcement region, which carries out standby glue, is treated to flexible PCB；
S5. the FR4 stiffening plates that step S3 is obtained are fitted to and treats reinforcement area by the step S4 flexible PCBs handled
On domain；
S6. pressing baking is carried out to the FR4 stiffening plates of fitting.
Further, the step S1 is carried out by mould or milling machine.
Further, the abrasive grains are diamond dust.
Further, the scheduled time in the step S2 is 4 hours.
Further, the step S3 is carried out by thousand layer frames.
The present invention uses above-mentioned technical proposal, has an advantageous effect in that, the present invention is able to ensure that FR4 stiffening plates will not be residual
Particle, burr and chip are stayed, improves FPC quality, the scrappage in production process is reduced, avoids downstream client from there may be
Quality hidden danger.
Brief description of the drawings
Fig. 1 is the flow chart of embodiments of the invention；
Fig. 2 a and 2b are the FR4 stiffening plates of prior art and the micro image of FR4 stiffening plates of the invention respectively.
Embodiment
To further illustrate each embodiment, the present invention is provided with accompanying drawing.These accompanying drawings are the invention discloses the one of content
Point, it can coordinate the associated description of specification to explain the operation principles of embodiment mainly to illustrate embodiment.Coordinate ginseng
These contents are examined, those of ordinary skill in the art will be understood that other possible embodiments and advantages of the present invention.
In conjunction with the drawings and specific embodiments, the present invention is further described.
A kind of as shown in figure 1, method of the FR4 plate reinforcement of flexible PCB, it may include following steps：
S1. by being machined FR4 stiffening plates by FR4 plate cuttings into required shape, for example, can by mould or
The machining operations such as milling machine is punched out, milling side.
S2. it is clear the FR4 stiffening plates that step S1 is obtained to be put into progress roll cast in the roll cast machine equipped with abrasive grains and clear water
The clean scheduled time (in one embodiment, 4 hours), to remove burr, particle or chip on FR4 stiffening plates etc..Abrasive grains
Can be diamond dust, quartz sand or sandstone etc., it is therefore preferable to diamond dust.
S3. processing is dried in the FR4 stiffening plates after step S2 processing, such as FR4 stiffening plates can be placed
Baking box drying is placed into thousand layer frames, or directly spreads placement natural air drying etc. in atmosphere out.
S4. reinforcement region, which carries out standby glue, is treated to flexible PCB, i.e. glue is treated into reinforcement coated in flexible PCB
On region.
S5. the FR4 stiffening plates that step S3 is obtained are fitted to and treats reinforcement area by the step S4 flexible PCBs handled
On domain.
S6. pressing baking is carried out to the FR4 stiffening plates of fitting.
Fig. 2 a and 2b be respectively prior art FR4 stiffening plates and the present invention FR4 stiffening plates micro image, Cong Zhongke
To find out, hole slot, the outline edge chip of the FR4 stiffening plates of prior art are a lot, and the hole slot of the FR4 stiffening plates of the present invention,
Outline edge is smooth, without chip.
The present invention fills diamond dust to carry out roll cast cleaning, Yi Jibian to the dust granules of FR4 stiffening plates by roll cast machine
The method that more reinforcement is bonded flow, to eliminate inevitable dust granules in FR4 process, and then FPC quality is improved,
The scrappage of production process is reduced, avoids client's quality hidden danger that may be present.
Although specifically showing and describing the present invention with reference to preferred embodiment, those skilled in the art should be bright
In vain, do not departing from the spirit and scope of the present invention that appended claims are limited, in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (5)
1. the method for the FR4 plate reinforcement of a kind of flexible PCB, it is characterised in that comprise the following steps：
S1. by being machined the FR4 stiffening plates by FR4 plate cuttings into required shape；
S2. the FR4 stiffening plates that step S1 is obtained are put into the roll cast machine equipped with abrasive grains and clear water and carry out roll cast cleaning in advance
Fix time；
S3. processing is dried in the FR4 stiffening plates after step S2 processing；
S4. reinforcement region, which carries out standby glue, is treated to flexible PCB；
S5. the FR4 stiffening plates that step S3 is obtained are fitted to and treated by the step S4 flexible PCBs handled on reinforcement region；
S6. pressing baking is carried out to the FR4 stiffening plates of fitting.
2. the method for the FR4 reinforcement of flexible PCB as claimed in claim 1, it is characterised in that the step S1 passes through mould
Tool or milling machine are carried out.
3. the method for the FR4 reinforcement of flexible PCB as claimed in claim 1, it is characterised in that the abrasive grains are gold
Emery.
4. the method for the FR4 reinforcement of flexible PCB as claimed in claim 1, it is characterised in that pre- in the step S2
Fix time as 4 hours.
5. the method for the FR4 reinforcement of flexible PCB as claimed in claim 1, it is characterised in that the step S3 passes through thousand
Layer frame is carried out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710838426.8A CN107466165A (en) | 2017-09-18 | 2017-09-18 | A kind of method of the FR4 plate reinforcement of flexible PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710838426.8A CN107466165A (en) | 2017-09-18 | 2017-09-18 | A kind of method of the FR4 plate reinforcement of flexible PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107466165A true CN107466165A (en) | 2017-12-12 |
Family
ID=60552622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710838426.8A Pending CN107466165A (en) | 2017-09-18 | 2017-09-18 | A kind of method of the FR4 plate reinforcement of flexible PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107466165A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958763A (en) * | 2019-11-22 | 2020-04-03 | 盐城维信电子有限公司 | Reinforcing automatic laminating method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060938A (en) * | 2005-02-16 | 2007-10-24 | 日本电气硝子株式会社 | Glass substrate washing device and glass substrate washing method |
| CN102300409A (en) * | 2011-07-08 | 2011-12-28 | 深圳市精诚达电路有限公司 | Method for bonding between flexible circuit board base material and reinforcing material and product manufactured by method |
| CN104869757A (en) * | 2015-06-02 | 2015-08-26 | 遂宁市广天电子有限公司 | COB thermoelectric separation copper substrate production process |
| CN205648175U (en) * | 2016-04-13 | 2016-10-12 | 凯普金业电子科技（昆山）有限公司 | Stiffening plate that full position was arranged |
-
2017
- 2017-09-18 CN CN201710838426.8A patent/CN107466165A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060938A (en) * | 2005-02-16 | 2007-10-24 | 日本电气硝子株式会社 | Glass substrate washing device and glass substrate washing method |
| CN102300409A (en) * | 2011-07-08 | 2011-12-28 | 深圳市精诚达电路有限公司 | Method for bonding between flexible circuit board base material and reinforcing material and product manufactured by method |
| CN104869757A (en) * | 2015-06-02 | 2015-08-26 | 遂宁市广天电子有限公司 | COB thermoelectric separation copper substrate production process |
| CN205648175U (en) * | 2016-04-13 | 2016-10-12 | 凯普金业电子科技（昆山）有限公司 | Stiffening plate that full position was arranged |
Non-Patent Citations (2)
| Title |
|---|
| 叶尹中: "滚桶抛光", 《机械制造》 * |
| 杨义录，王明帮，马建文: "滚抛磨具及若干使用实例", 《磨料磨具与磨削》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958763A (en) * | 2019-11-22 | 2020-04-03 | 盐城维信电子有限公司 | Reinforcing automatic laminating method |
| CN110958763B (en) * | 2019-11-22 | 2021-09-21 | 盐城维信电子有限公司 | Reinforcing automatic laminating method |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171212 |
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| RJ01 | Rejection of invention patent application after publication |