CN115339204B - Combined backing plate - Google Patents

Combined backing plate Download PDF

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Publication number
CN115339204B
CN115339204B CN202111482056.1A CN202111482056A CN115339204B CN 115339204 B CN115339204 B CN 115339204B CN 202111482056 A CN202111482056 A CN 202111482056A CN 115339204 B CN115339204 B CN 115339204B
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China
Prior art keywords
layer
deformation
plate
pcb
thickness
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CN202111482056.1A
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Chinese (zh)
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CN115339204A (en
Inventor
魏美晓
张伦强
王万兵
蒲强
杨柳
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Kunshan Liuxin Electronics Co ltd
Shenzhen Newccess Industrial Co ltd
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Kunshan Liuxin Electronics Co ltd
Shenzhen Newccess Industrial Co ltd
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Priority to CN202111482056.1A priority Critical patent/CN115339204B/en
Publication of CN115339204A publication Critical patent/CN115339204A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/32—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed at least two layers being foamed and next to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0214—Materials belonging to B32B27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a combined backing plate, which is used for drilling a PCB deformation plate with the thickness of more than 3.0mm, and comprises a deformation layer and a flash suppressing layer arranged on the deformation layer. The combined backing plate provided by the invention comprises the flash inhibiting layer and the deformation layer which are arranged in a stacked manner, so that the combined backing plate has the characteristics of easy deformability, strong support and high hardness, when in drilling, the PCB deformation plate and the combined backing plate are locked, the combined backing plate can deform and be tightly attached to the warping surface of the PCB deformation plate at the moment, the effect of inhibiting the generation of the flash in drilling is achieved, the flash inhibiting layer is replaced after drilling, and the combined backing plate is recombined with the original deformation layer, so that the formed combined backing plate can be reused. The use mode of the combined backing plate provided by the invention is the same as that of a conventional backing plate, the use is simple and convenient, but part of materials can be repeatedly used after recombination; compared with the existing method for inhibiting the burrs by coating the coating on the PCB deformation plate, the method does not need to add new technology and equipment, and increases the production efficiency.

Description

Combined backing plate
Technical Field
The invention relates to the technical field of PCB drilling, in particular to a combined backing plate.
Technical Field
The backing plate is a material which is arranged below a board to be processed when a printed circuit board (PCB for short) is mechanically drilled, and improves the drilling effect. The main functions of the PCB backing plate are as follows: (1) inhibiting burrs at the outlet of the drill hole; (2) improving vacancy accuracy; (3) reducing the temperature of the drill point; (4) protecting the drilling machine. The PCB backing plate is mainly of the following types: medium density wood pulp board, high density wood pulp board, melamine wood backing board, phenolic paper backing board, composite wood backing board, etc. At present, in the printed circuit board processing process, the PCB board of processing and manufacturing produces slight deformation by the influence of a plurality of uncertain factors such as raw materials, processing technology, equipment, human factors, and the like, forms the board warp, can not hug closely the backing plate, causes the drilling to drape over a knife edge too big, appear breaking needle scheduling problem, and consequently PCB board warp can produce great influence to drilling processing. If the PCB is thinner (less than 3.0 mm), the warp deformation of the drilling position of the PCB can be changed by properly increasing the pressure of the pressure pin during drilling, so that the PCB is clung to the backing plate, and the drilling cannot generate excessive burrs; if the PCB is thicker (more than 3.0 mm), the pressure of the pressure pin is difficult to change the warp deformation of the PCB, the PCB and the backing plate cannot be clung to each other, gaps exist, and the drilling is easy to generate larger burrs and other drilling problems, so that the quality is affected. Therefore, when the PCB is thicker, the pressure pins cannot improve the deformation of the PCB, and the inhibition effect of the common backing plate on the burrs of the PCB is weakened. At present, the problem of the burr of the drilling of the PCB deformation plate is not solved effectively. Although the related art proposes that a coating layer can be coated on the surface of a PCB deformation plate to inhibit drilling burrs, new procedures such as coating, curing, film stripping and the like and related equipment are required to be added, and the method is complex in operation, time-consuming, labor-consuming, high in cost and easy to produce more waste water and waste residues.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention aims to provide a combined pad, which aims to solve the problem that when the pad is used for drilling a warp PCB deformation plate with a thickness of more than 3.0mm, the pad and the PCB deformation plate cannot be tightly attached, resulting in a larger burr.
The technical scheme of the invention is as follows:
a composite pad for drilling a PCB deforming plate having a thickness greater than 3.0mm, the composite pad comprising a deforming layer and a flash suppressing layer disposed on the deforming layer.
When the thickness of the PCB deformation plate is 3-8mm and the warping degree is less than or equal to 2mm, the deformation layer is a single-layer deformation layer, and the single-layer deformation layer is made of one of sponge, EVA and EPE.
The combined backing plate, wherein the hardness of the sponge is 65-99HF, and the density of EVA is 10-50kg/m 3 The EPE has a density of 15-30kg/m 3 。
The thickness of the deformation layer is larger than or equal to the warpage of the PCB deformation plate.
The combined backing plate, wherein when the thickness of the PCB deformation plate is 3-8mm and the warp degree is less than or equal to 2 and less than or equal to 6mm, the deformation layer is a double-layer deformation layer, the double-layer deformation layer consists of an easily deformable layer, an adhesive layer and a high-strength supporting layer which are sequentially laminated, the easily deformable layer is made of a sponge with the hardness of 25-65HF, the high-strength supporting layer is made of a sponge with the hardness of 75-99HF, and the density of 38-85kg/m 3 EVA of 15-40kg/m 3 EPE and density of 30-60kg/m 3 Is one of EPS.
The material of the adhesive layer is one of hot melt adhesive, epoxy adhesive, polyurethane adhesive, acrylic ester AB adhesive, alpha-cyanoacrylate adhesive, photosensitive adhesive, organic silicon rubber adhesive, UV ultraviolet adhesive and anaerobic adhesive.
The thickness of the deformable layer is larger than the warping degree of the PCB deformation plate, and the thickness of the high-strength supporting layer is 1-5mm; the thickness of the adhesive layer is 3-50um.
The combined backing plate is characterized in that the flash inhibiting layer is one of an aluminum sheet, a PET (polyethylene terephthalate), a cold-punching plate, a PP (polypropylene), a PVC (polyvinyl chloride), an acrylic plate and an iron sheet.
The combined backing plate is characterized in that the hardness of the flash inhibiting layer is 2B-9H, and the thickness is 0.1-1.0mm.
The beneficial effects are that: the invention provides a combined backing plate, which comprises a flash suppressing layer and a deformation layer arranged on the flash suppressing layer. According to the invention, the characteristics of easy deformability, strong support and high hardness of the combined backing plate are utilized, the PCB deformation plate is locked with the backing plate during drilling, so that the PCB deformation plate is tightly attached to the backing plate, the effect of inhibiting the generation of a burr of drilling is achieved, the burr inhibiting layer is replaced after drilling, and the PCB deformation plate is recombined with the deformation layer, so that the formed combined backing plate can be reused.
Drawings
FIG. 1 is a schematic view of a composite pad according to the present invention.
Detailed Description
The invention provides a combined backing plate, which is further described in detail below for the purpose, technical scheme and effect of the invention to be clearer and more definite. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Because the PCB board and the current backing plate that thickness is more than 3mm are the rigid body, so when the PCB board drilling, this kind of thicker PCB board warp the district and is difficult to closely laminate with the backing plate, the backing plate at this moment can't effectively restrain the burr, and the place that does not have the backing plate to support is draped over one's shoulders the burr is great, needs the manual work to get rid of, and consuming time and effort and increase cost. In the prior art, a layer of coating is coated on the surface of a PCB deformation plate to inhibit drilling burrs, but the treatment mode needs to add new procedures of coating, curing, film removal and other related equipment, is complex in operation, consumes time and labor, is high in cost, and is easy to produce more waste water and waste residues to pollute the environment.
Based on this, the present invention provides a composite pad for drilling a PCB deforming plate having a thickness of more than 3.0mm, as shown in fig. 1, which includes a deforming layer 10 and a flash suppressing layer 20 disposed on the deforming layer 10.
The combined backing plate provided by the invention comprises the flash inhibiting layer and the deformation layer which are arranged in a stacked manner, so that the combined backing plate has the characteristics of easy deformability, strong support and high hardness, when in drilling, the PCB deformation plate and the combined backing plate are locked, the combined backing plate can deform and be tightly attached to the warping surface of the PCB deformation plate at the moment, the effect of inhibiting the generation of the flash in drilling is achieved, the flash inhibiting layer is replaced after drilling, and the combined backing plate is recombined with the original deformation layer, so that the formed combined backing plate can be reused. The use mode of the combined backing plate provided by the invention is the same as that of a conventional backing plate, the use is simple and convenient, but part of materials can be repeatedly used after recombination; compared with the existing method for inhibiting the burrs by coating the coating on the PCB deformation plate, the method does not need to add new technology and equipment, and increases the production efficiency.
In some embodiments, when the thickness of the PCB deforming plate is 3-8mm and the warping degree is less than or equal to 2mm, the deforming layer is a single-layer deforming layer, and the material of the single-layer deforming layer is one of sponge, EVA and EPE.
In this embodiment, since the thickness of the PCB deformation plate is 3-8mm and the warpage is less than or equal to 2mm, it is indicated that the PCB deformation plate is a rigid plate and the deformation degree is small, and at this time, the deformation layer of the combined pad may be a single deformation layer, and the material of the single deformation layer is one of sponge, EVA (ethylene-vinyl acetate copolymer) and EPE (expandable polyethylene, also called pearl wool), but not limited thereto.
In this embodiment, if the material of the single-layer deformation layer is a sponge, the hardness of the sponge is 65-99HF. The deformation layer defined in the embodiment has better deformability and support, and if the hardness of the deformation layer is too low (less than 65 HF), the combination backing plate has weaker flash inhibition capability; if the hardness of the deformation layer is too high (greater than 99 HF), the deformation amplitude of the combined backing plate is smaller, so that the bonding degree of the PCB deformation plate and the combined backing plate becomes low, and the burr inhibition effect of the combined backing plate is poor.
In this embodiment, if the material of the single-layer deformation layer is EVA, the EVA has a density of 10-50kg/m 3 The method comprises the steps of carrying out a first treatment on the surface of the If the material of the single-layer deformation layer is EPE, the density of the EPE is 15-30kg/m 3 。
In some embodiments, the thickness of the deformation layer may be selected according to the warpage of the PCB deformation plate, and the thickness of the deformation layer is equal to or greater than the warpage of the PCB deformation plate. Because, if the thickness of the deformation layer is smaller than the warp of the PCB deformation plate, the deformation amplitude of the deformation layer is smaller, which can cause the lamination degree of the PCB deformation plate and the combined backing plate to be lower, so that the combined backing plate has poor burr inhibition effect. For example, the thickness of the deformation layer is 1-10mm, and the thickness of the deformation layer is not easy to be too thick, because the too thick deformation layer can influence the penetration depth of the drill point.
In some embodiments, when the thickness of the PCB deforming plate is 3-8mm and the warp degree is less than or equal to 2 and less than or equal to 6mm, the deforming layer is a double-layer deforming layer, the double-layer deforming layer consists of a deformable layer, an adhesive layer and a high-strength supporting layer which are sequentially stacked, the deformable layer is made of a material selected from sponge with the hardness of 25-65HF, the high-strength supporting layer is made of a material selected from sponge with the hardness of 75-99HF and the density is 38-85kg/m 3 EVA of 15-40kg/m 3 EPE and density of 30-60kg/m 3 Is one of EPS.
In this embodiment, since the thickness of the PCB deformation plate is 3-8mm and the warpage is 2-6 mm, this indicates that the PCB deformation plate is a rigid plate and the deformation degree is large, and at this time, the deformation layer of the combined pad plate may be a double-layer deformation layer. The combined backing plate formed by the double-layer deformation layer and the flash suppression layer has larger deformation amplitude, and can be tightly attached to the PCB deformation plate during drilling, so that the combined backing plate has excellent flash suppression effect.
In this embodiment, the deformable layer is a sponge with a hardness of 25-65HF, and the thickness of the deformable layer is greater than the warpage of the PCB deformation plate. The deformable layer in this embodiment has excellent deformability, if the hardness of the deformable layer is too high (greater than 65 HF), the deformation amplitude is small, so that the adhesion degree between the PCB deformation plate and the combined pad is reduced, the combined pad flash suppression capability is easily weak, and if the hardness of the deformable layer is too low (less than 25 HF), the supporting property is low, so that the combined pad flash suppression capability is easily weak. In this embodiment, the thickness of the deformable layer may be selected according to the warpage of the PCB deformation plate, and the thickness of the deformable layer is equal to or greater than the warpage of the PCB deformation plate. Because, if the thickness of the deformable layer is smaller than the warp of the PCB deformation plate, the deformation amplitude of the deformable layer is smaller, which can cause the lamination degree of the PCB deformation plate and the combined backing plate to be lower, thereby easily causing the poor burr inhibition effect of the combined backing plate. By way of example, the thickness of the deformable layer is 2-10mm, and the thickness of the deformable layer is not too thick, as the too thick deformable layer affects the penetration depth of the drill point.
In this embodiment, the high strength support layer is made of a material selected from the group consisting of a sponge having a hardness of 75-99HF and a density of 38-85kg/m 3 EVA of 15-40kg/m 3 EPE and density of 30-60kg/m 3 Is one of EPS. When the material of the high-strength supporting layer is selected from sponge with the hardness of 75-99HF, the high-strength supporting layer has high supporting property and flexibility, if the hardness of the high-strength supporting layer is low, the poor supporting capability of the high-strength supporting layer easily causes weak combined backing plate flash inhibition capability, and if the hardness of the high-strength supporting layer is high, the small bending amplitude of the high-strength supporting layer can enable the fitting degree of a PCB deformation plate and the combined backing plate to be low, and the weak combined backing plate flash inhibition capability is also easily caused. In this embodiment, the thickness of the high-strength supporting layer is 1-5mm, if the thickness of the high-strength supporting layer is thinner, the supporting property of the high-strength supporting layer is low, so that the base plate flash suppression capability is weak, and if the thickness of the high-strength supporting layer is thicker, the bending amplitude of the high-strength supporting layer is small, so that the bonding degree between the PCB deformation plate and the base plate is low, so that the base plate flash suppression capability is weak. In this embodiment, the material of the high strength support layer may also be selected from EVA (ethylene-vinyl acetate copolymer with a density of 38-85kg/m 3 ) EPE (expandable polyethylene, also known as pearl cotton, density 15-40kg/m 3 ) And EPS (Expandable polystyrene, density 30-60 kg/m) 3 ) But is not limited thereto. The high-strength supporting layer made of the materials also has high supporting property and flexibility, if the density of the high-strength supporting layer is low, the poor supporting capability of the high-strength supporting layer easily leads to weak combined pad flash inhibition, and if the density of the high-strength supporting layer is high, the small bending amplitude of the high-strength supporting layer can lead to low bonding degree of a PCB deformation plate and the combined pad, and the poor combined pad flash inhibition is also easily caused.
In this embodiment, the material of the adhesive layer is selected from one of a hot melt adhesive, an epoxy adhesive, a polyurethane adhesive, an acrylate AB adhesive, an α -cyanoacrylate adhesive, a photosensitive adhesive, a silicone rubber adhesive, a UV ultraviolet adhesive, and an anaerobic adhesive, but is not limited thereto. The adhesive layer is mainly used for adhering the easily deformable layer and the high-strength supporting layer together. In this embodiment, the thickness of the adhesive layer is 3-50um, the adhesive layer needs to have strong adhesion, if the thickness of the adhesive layer is thinner, the adhesion is poor, and if the thickness of the adhesive layer is thicker, the cost is high, winding is easy to occur during drilling, and the drilling quality of the PCB deformation plate is affected.
In this embodiment, the manufacturing process of the double-layer deformation layer is as follows: the adhesive is coated on the easily deformable layer, then adhered together with the high-strength supporting layer, and cured to prepare a double-layer deformable layer, wherein the coating modes include, but are not limited to, brushing, spraying, roller coating and the like.
In some embodiments, the flash suppressing layer is one of aluminum sheet, PET, cold-stamping sheet, PP, PVC, acryl sheet, and iron sheet, but is not limited thereto. The hardness of the flash inhibiting layer is 2B-9H, and the thickness is 0.1-1.0mm. The flash suppressing layer defined in this embodiment should have high hardness, flexibility and high support. If the hardness of the flash suppressing layer is softer (less than 2B), the flash suppressing capability of the pad is weak, and if the hardness of the flash suppressing layer is harder (more than 9H), the bending amplitude of the flash suppressing layer is small, which causes the adhesion degree between the PCB deforming plate and the pad to be reduced, and the flash suppressing capability of the pad is easily weak. Similarly, if the thickness of the flash suppressing layer is thinner (less than 0.1 mm), the low support property of the flash suppressing layer is easy to cause the weak flash suppressing capability of the base plate, and if the thickness of the flash suppressing layer is thicker (more than 1.0 mm), the small bending amplitude of the flash suppressing layer can reduce the fitting degree of the PCB deformation plate and the base plate, so that the weak flash suppressing capability of the base plate is easy to cause.
In some embodiments, when the combined pad provided by the invention is used, the deformation layer is placed at the lowest position, then the flash suppression layer is placed on the deformation layer to form the combined pad, the PCB deformation plate is placed on the flash suppression layer of the combined pad, the four corners of the PCB deformation plate and the combined pad are locked, so that the combined pad is subjected to bending deformation and is tightly attached to the warping part of the PCB deformation plate, after drilling is completed, the deformation layer does not need to be replaced, and a new combined pad is formed by replacing only a new flash suppression layer, so that the combined pad can be continuously used.
The invention is further illustrated by the following examples:
example 1
Selecting a sponge with the thickness of 3mm and the hardness of 80HF as a deformation layer, selecting PET with the thickness of 0.5mm as a burr inhibiting layer with higher hardness, and directly placing the PET with the thickness of 0.5mm on the sponge with the thickness of 3mm and the hardness of 80HF to form a combined backing plate (1) when drilling;
when drilling, the PCB deformation plate is placed on the burr inhibiting layer of the combined base plate (1), the PCB deformation plate is locked with the combined base plate (1), the combined base plate (1) is subjected to bending deformation and is tightly attached to the warping part of the PCB deformation plate, after the drilling is finished, the sponge with the thickness of 3mm and the hardness of 80HF does not need to be replaced, the sponge can be continuously used after replacing new 0.5mm PET, and the thickness of the PCB plate used for testing is 6.5mm and the warping is 2mm.
Example 2
Selecting a sponge with the thickness of 5mm and the hardness of 75HF as a deformation layer, selecting a cold-punching plate with the thickness of 0.3mm as a flash suppression layer with higher hardness, and directly placing the cold-punching plate with the thickness of 0.3mm on the sponge with the thickness of 5mm and the hardness of 75HF to form a combined base plate (2) during drilling;
when drilling, the PCB deformation plate is placed on the flash inhibiting layer of the combined base plate (2), the PCB deformation plate is locked with the combined base plate (2), the combined base plate (2) is subjected to bending deformation and is tightly attached to the warping part of the PCB deformation plate, after drilling, the sponge with the thickness of 5mm and the hardness of 75HF is not required to be replaced, the sponge can be continuously used after replacing a new cold-punched plate with the thickness of 0.3mm, and the thickness of the PCB used in the test is 6mm, and the warping is 2mm.
Example 3
Selecting a sponge with the thickness of 3mm and the hardness of 95HF as a deformation layer, selecting a cold-punching plate with the thickness of 0.3mm as a flash suppression layer with higher hardness, and directly placing the cold-punching plate with the thickness of 0.3mm on the sponge with the thickness of 3mm and the hardness of 95HF to form a combined backing plate (3) during drilling;
when drilling, the PCB deformation plate is placed on the burr inhibiting layer of the combined base plate (3), the PCB deformation plate is locked with the combined base plate (3), the combined base plate (3) is subjected to shape bending deformation and is tightly attached to the warping part of the PCB deformation plate, after the drilling is finished, the sponge with the thickness of 3mm and the hardness of 95HF is not required to be replaced, the sponge can be continuously used after replacing a new cold-punched plate with the thickness of 0.3mm, and the thickness of the PCB used in the test is 6.5mm and the warping is 2mm.
Example 4
Selecting an easy-deformation layer (3 mm-hardness 50HF sponge), a high-strength support layer (3 mm-hardness 95HF sponge) and an adhesive (epoxy adhesive) with good cohesiveness, coating the epoxy adhesive on the 3 mm-hardness 50HF sponge, then adhering the epoxy adhesive and the 3 mm-hardness 95HF sponge together, baking at 100 ℃ for 5min for solidification, preparing a double-layer structure deformation layer (4), selecting a spike suppression layer (0.3 mm cold-punching plate) with high hardness, and directly placing the 0.3mm cold-punching plate on the double-layer structure deformation layer (4) during drilling to form a combined backing plate (4);
when drilling, the PCB deformation plate is placed on the flash inhibiting layer of the combined base plate (4), the PCB deformation plate is locked with the combined base plate, so that the combined base plate (4) is subjected to bending deformation and is tightly attached to the warping part of the PCB deformation plate, after the drilling is finished, the double-layer structure deformation layer (4) is not required to be replaced, the novel 0.3mm cold-punched plate can be continuously used, the thickness of the PCB used for testing is 5mm, and the warping is 3mm.
Example 5
Selecting an easy-deformation layer (3 mm-hardness 50HF sponge), a high-strength support layer (2 mm-hardness 95HF sponge) and an adhesive (epoxy adhesive) with good cohesiveness, coating the epoxy adhesive on the 3 mm-hardness 50HF sponge, coating the epoxy adhesive with the thickness of 30um, adhering the epoxy adhesive and the 2 mm-hardness 95HF sponge together, baking at 100 ℃ for 5min for solidification, preparing a double-layer structure deformation layer (5), selecting a burr suppression layer (0.3 mm aluminum sheet) with high hardness, and directly placing the 0.3mm aluminum sheet on the double-layer structure deformation layer (5) during drilling to form a combined base plate (5);
when drilling, place PCB deformation board on the drape and forward suppression layer of combination backing plate (5), will PCB deformation board and this combination backing plate locking make combination backing plate (5) take place shape bending deformation and with the warpage position of PCB deformation board closely laminate, after drilling, bilayer structure deformation layer (5) need not to change, can continue to use after changing new 0.3mm aluminum sheet, and the used PCB board thickness of test 6mm warp 3mm.
Example 6
The composite pad prepared in example 1-example 5 was subjected to drilling test under the conditions of 0.35mm diameter and 500 holes, and the experimental results are shown in table 1:
table 1 drilling test results
As can be seen from the drilling experimental results in Table 1, the combined backing plate prepared by the embodiment of the invention has an excellent burr inhibiting effect and meets the drilling standard requirements of the PCB.
It is to be understood that the invention is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.

Claims (3)

1. A combined backing plate, which is characterized by being used for drilling a PCB deformation plate with the thickness of more than 3.0mm, and comprising a deformation layer and a flash suppressing layer arranged on the deformation layer;
when drilling, the PCB deformation plate is locked with the burr inhibiting layer and the deformation layer, and the burr inhibiting layer and the deformation layer deform and are tightly attached to the warping surface of the PCB deformation plate so as to inhibit the generation of a drilling mantles;
the deformation layer is a double-layer deformation layer, wherein the double-layer deformation layer comprises an easily deformable layer, an adhesive layer and a high-strength supporting layer which are sequentially laminated;
when the thickness of the PCB deformation plate is 3-8mm and the warp degree is less than or equal to 2 and less than or equal to 6mm, the material of the deformation-facilitating layer is selected from sponge with the hardness of 25-65HF, and the material of the high-strength supporting layer is selected from one of sponge with the hardness of 75-99HF, EVA with the density of 38-85kg/m, EPE with the density of 15-40kg/m and EPS with the density of 30-60 kg/m;
the thickness of the easy-deformation layer is larger than the warping degree of the PCB deformation plate, and the thickness of the high-strength supporting layer is 1-5mm; the thickness of the adhesive layer is 3-50um;
the hardness of the flash inhibiting layer is 2B-9H, and the thickness is 0.1-1.0mm.
2. The combination mat of claim 1, wherein the adhesive layer is one of a material selected from the group consisting of hot melt adhesives, epoxy adhesives, polyurethane adhesives, acrylate AB adhesives, alpha-cyanoacrylate adhesives, photosensitive adhesives, silicone rubber adhesives, UV ultraviolet adhesives, and anaerobic adhesives.
3. The composite pad of claim 1, wherein the flash suppressing layer is one of aluminum sheet, PET, cold-punched sheet, PP, PVC, acrylic sheet, and iron sheet.
CN202111482056.1A 2021-12-06 2021-12-06 Combined backing plate Active CN115339204B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104260425A (en) * 2014-09-22 2015-01-07 烟台天奕电子有限公司 Base plate for PCB drilling and manufacturing method of base plate for PCB drilling
CN212876208U (en) * 2020-10-09 2021-04-02 深圳市宏宇辉科技有限公司 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104260425A (en) * 2014-09-22 2015-01-07 烟台天奕电子有限公司 Base plate for PCB drilling and manufacturing method of base plate for PCB drilling
CN212876208U (en) * 2020-10-09 2021-04-02 深圳市宏宇辉科技有限公司 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device

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