CN110798981A - Carrier film for improving expansion and shrinkage of flexible circuit board - Google Patents
Carrier film for improving expansion and shrinkage of flexible circuit board Download PDFInfo
- Publication number
- CN110798981A CN110798981A CN201911079717.9A CN201911079717A CN110798981A CN 110798981 A CN110798981 A CN 110798981A CN 201911079717 A CN201911079717 A CN 201911079717A CN 110798981 A CN110798981 A CN 110798981A
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- carrier film
- circuit board
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- reticular
- rubber
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention relates to a carrier film for improving the expansion and shrinkage of a flexible circuit board, and belongs to the technical field of flexible circuit boards. The flexible printed circuit board comprises an adhesive layer and a film coating layer, wherein the adhesive layer and the film coating layer are sequentially bonded to the bottom of a PI substrate of the flexible printed circuit board, and the adhesive layer is of a hollow structure. The adhesive layer is a reticular adhesive layer with a reticular structure. The reticular rubber layer is formed by brushing grid rubber wires at the bottom of the PI base material at a certain angle. The invention has the beneficial effects that: the reticular rubber layer bearing film can properly increase the thickness and the hardness of the base material, so that the originally flexible base material is not easy to wrinkle and deform, the flatness of the product is kept, and the production efficiency is improved; the expansion and shrinkage influence of the thermal expansion and shrinkage of the bearing film on the flexible circuit board in the production process is reduced; protecting the surface of the substrate from scratching; the viscosity is adjusted by changing colloidal figures, angles, line widths and line distances; after the working procedure of the flexible circuit board is completed, the tension on the product is reduced during stripping, and the occurrence of defects is reduced.
Description
Technical Field
The invention relates to a carrier film for improving the expansion and shrinkage of a flexible circuit board, and belongs to the technical field of flexible circuit boards.
Background
With the continuous development and innovation of electronic products and technologies, the design concept of electronic products has turned to the field of light, thin and narrow frames, and circuit boards are also developed towards the directions of light, thin and high flexibility in order to meet the requirements of markets and technologies. The more the circuit board is thinner and thinner, the more difficulty of subsequent production and processing is increased by the development of high flexibility.
To more frivolous flexible printed circuit board, in order to keep the level and smooth of product in the production process, prevent the fold, generally can be at the attached carrier film of the bottom of flexible printed circuit board base material, flexible printed circuit board production processes accomplishes the back, peels off the carrier film again. The rubber surface of the traditional carrier film is coated on the whole surface, the material characteristics of the carrier film and the flexible circuit board base material have different thermal expansion and contraction coefficients, and the size stability of the produced flexible circuit product is poor in the production process due to the adhesion of the carrier film and the flexible circuit board base material. The traditional glue surface of the bearing film is coated on the whole surface, and the traditional glue surface is formed by coating a special pressure-sensitive adhesive on the whole surface of an ultra-transparent polyester film (PET) or Polyimide (PI) and then attaching a PET protective film on a hardened surface. The flexible printed circuit board is used for a flexible printed circuit board. The production is started after the bearing film is completely adhered to the bottom of the base material of the flexible circuit board.
Since the whole surface is coated, the thickness and hardness of the flexible circuit board are increased. However, the dimensional stability of the produced flexible circuit board product is poor in the production process due to the difference of the thermal expansion coefficient of the material characteristics of the base materials of the carrier film and the flexible circuit board. Due to its adhesiveness, a large tension is generated when the film is peeled from the product after the production process is completed, which further affects the size of the product.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the universal or special carrier film designed by the mesh glue layer, which properly increases the thickness and the hardness of the flexible base material and simultaneously reduces the expansion and contraction influence of the thermal expansion and contraction of the carrier film on the flexible circuit board in the production process.
The invention is realized by the following technical scheme: the utility model provides a carrier film of flexible line way board harmomegathus which characterized in that: the flexible printed circuit board comprises an adhesive layer and a film coating layer, wherein the adhesive layer and the film coating layer are sequentially bonded to the bottom of a PI substrate of the flexible printed circuit board, and the adhesive layer is of a hollow structure.
The adhesive layer is a reticular adhesive layer with a reticular structure.
The reticular rubber layer is formed by brushing grid rubber wires at the bottom of the PI base material at a certain angle.
The net glue line width of net glue layer be 50um ~100mm, the net glue line interval is 50um ~100 mm.
The width of the grid rubber lines is the same as the space between the grid rubber lines, square hollow patterns are formed, and the hollow patterns are arranged on the net-shaped rubber layer in an array mode.
The grid rubber lines are different in width and spacing, and regular or irregular hollowed-out patterns are formed, and the regular or irregular hollowed-out patterns include, but are not limited to, circular hollowed-out patterns, hexagonal hollowed-out patterns or triangular hollowed-out patterns.
The angle α between the grid glue line and the MD direction is 0-180 degrees.
The reticular rubber layer is closed reticular rubber.
The coating layer is a PET film or PI.
The invention has the beneficial effects that: the reticular rubber layer bearing film can properly increase the thickness and the hardness of the base material, so that the originally flexible base material is not easy to wrinkle and deform, the flatness of the product is kept, and the production efficiency is improved; the expansion and shrinkage influence of the thermal expansion and shrinkage of the bearing film on the flexible circuit board in the production process is reduced; protecting the surface of the substrate from scratching; the viscosity is adjusted by changing colloidal figures, angles, line widths and line distances; after the working procedure of the flexible circuit board is completed, the tension on the product is reduced during stripping, and the occurrence of defects is reduced.
Drawings
The invention is further illustrated below with reference to the figures and examples.
FIG. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic view of the inventive reticulated adhesive layer;
FIG. 3 is a schematic view of the adhesive layer of example 1 of the present invention;
FIG. 4 is a schematic view of the adhesive layer of example 2 of the present invention;
fig. 5 is a schematic view of the mesh adhesive layer of embodiment 3 of the present invention.
In the figure: 1. glue layer, 2, coating layer.
Detailed Description
The carrier film for improving the expansion and contraction of the flexible circuit board shown in fig. 1 to fig. 2 is characterized in that: including glue film 1 and tectorial membrane layer 2, glue film 1 and tectorial membrane layer 2 bond in proper order in the PI substrate bottom of flexible line way board, glue film 1 be hollow out construction.
The adhesive layer 1 is a reticular adhesive layer with a reticular structure.
The reticular rubber layer is formed by brushing grid rubber wires at the bottom of the PI base material at a certain angle.
The net glue line width of net glue layer be 50um ~100mm, the net glue line interval is 50um ~100 mm.
The width of the grid rubber lines is the same as the space between the grid rubber lines, square hollow patterns are formed, and the hollow patterns are arranged on the net-shaped rubber layer in an array mode.
The grid rubber lines are different in width and spacing, and regular or irregular hollowed-out patterns are formed, and the regular or irregular hollowed-out patterns include, but are not limited to, circular hollowed-out patterns, hexagonal hollowed-out patterns or triangular hollowed-out patterns.
The angle α between the grid glue line and the MD direction is 0-180 degrees.
The reticular rubber layer is closed reticular rubber.
The coating layer 2 is a PET film or PI.
Example 1: circular fretwork netted glue film.
Example 2: hexagonal hollow mesh glue layer.
Example 3: triangular hollow mesh-shaped adhesive layer.
Claims (9)
1. The utility model provides a carrier film of flexible line way board harmomegathus which characterized in that: including glue film (1) and tectorial membrane layer (2), glue film (1) and tectorial membrane layer (2) bond in proper order in the PI substrate bottom of flexible line way board, glue film (1) be hollow out construction.
2. The carrier film according to claim 1, wherein the carrier film is characterized in that: the adhesive layer (1) is a reticular adhesive layer with a reticular structure.
3. The carrier film according to claim 2, wherein the carrier film is characterized in that: the reticular rubber layer is formed by brushing grid rubber wires at the bottom of the PI base material at a certain angle.
4. The carrier film according to claim 3, wherein the carrier film is characterized in that: the net glue line width of net glue layer be 50um ~100mm, the net glue line interval is 50um ~100 mm.
5. The carrier film according to claim 4, wherein the carrier film is characterized in that: the width of the grid rubber lines and the space between the grid rubber lines form square hollow patterns, and the hollow patterns are arranged on the net-shaped rubber layer in an array mode.
6. The carrier film according to claim 4, wherein the carrier film is characterized in that: the grid rubber lines are different in width and space, regular or irregular hollowed-out patterns are formed, and the regular or irregular hollowed-out patterns comprise circular hollowed-out, hexagonal hollowed-out or triangular hollowed-out.
7. The carrier film for improving the harmomegathus of the flexible printed circuit board as claimed in claim 3, wherein the angle α between the grid glue line and the MD direction is 0-180 °.
8. The carrier film according to claim 2, wherein the carrier film is characterized in that: the reticular rubber layer is closed reticular rubber.
9. The carrier film according to claim 1, wherein the carrier film is characterized in that: the coating layer (2) is a PET film or PI.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911079717.9A CN110798981A (en) | 2019-11-07 | 2019-11-07 | Carrier film for improving expansion and shrinkage of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911079717.9A CN110798981A (en) | 2019-11-07 | 2019-11-07 | Carrier film for improving expansion and shrinkage of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110798981A true CN110798981A (en) | 2020-02-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911079717.9A Pending CN110798981A (en) | 2019-11-07 | 2019-11-07 | Carrier film for improving expansion and shrinkage of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110798981A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113845853A (en) * | 2021-08-09 | 2021-12-28 | 深圳市鑫达辉软性电路科技有限公司 | Bearing film and laminating method thereof |
| CN114364126A (en) * | 2020-10-13 | 2022-04-15 | 昆山圆裕电子科技有限公司 | Laminating type material supplementing and laminating method for flexible circuit board |
| CN117858362A (en) * | 2024-03-07 | 2024-04-09 | 厦门源乾电子有限公司 | Automobile-used FPC plate structure and film pressing equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2934232Y (en) * | 2006-06-23 | 2007-08-15 | 林泉源 | Improved obstructing glue film |
| CN201426212Y (en) * | 2009-05-11 | 2010-03-17 | 昆山亿富达电子有限公司 | Hollow double-sided flexible printed circuit board |
| CN103927941A (en) * | 2013-12-23 | 2014-07-16 | 上海天马有机发光显示技术有限公司 | Display device and manufacturing method thereof |
| US9445502B2 (en) * | 2013-05-30 | 2016-09-13 | Nanchang O-Film Tech Co., Ltd. | Flexible circuit connecting device |
| CN108449880A (en) * | 2018-04-08 | 2018-08-24 | 珠海市凯诺微电子有限公司 | Flexible circuit board cover film applying method |
-
2019
- 2019-11-07 CN CN201911079717.9A patent/CN110798981A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2934232Y (en) * | 2006-06-23 | 2007-08-15 | 林泉源 | Improved obstructing glue film |
| CN201426212Y (en) * | 2009-05-11 | 2010-03-17 | 昆山亿富达电子有限公司 | Hollow double-sided flexible printed circuit board |
| US9445502B2 (en) * | 2013-05-30 | 2016-09-13 | Nanchang O-Film Tech Co., Ltd. | Flexible circuit connecting device |
| CN103927941A (en) * | 2013-12-23 | 2014-07-16 | 上海天马有机发光显示技术有限公司 | Display device and manufacturing method thereof |
| CN108449880A (en) * | 2018-04-08 | 2018-08-24 | 珠海市凯诺微电子有限公司 | Flexible circuit board cover film applying method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364126A (en) * | 2020-10-13 | 2022-04-15 | 昆山圆裕电子科技有限公司 | Laminating type material supplementing and laminating method for flexible circuit board |
| CN113845853A (en) * | 2021-08-09 | 2021-12-28 | 深圳市鑫达辉软性电路科技有限公司 | Bearing film and laminating method thereof |
| CN117858362A (en) * | 2024-03-07 | 2024-04-09 | 厦门源乾电子有限公司 | Automobile-used FPC plate structure and film pressing equipment |
| CN117858362B (en) * | 2024-03-07 | 2024-05-10 | 厦门源乾电子有限公司 | Automobile-used FPC plate structure and film pressing equipment |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200214 |
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| RJ01 | Rejection of invention patent application after publication |