CN201426212Y - Hollow double-sided flexible printed circuit board - Google Patents

Hollow double-sided flexible printed circuit board Download PDF

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Publication number
CN201426212Y
CN201426212Y CN2009200388897U CN200920038889U CN201426212Y CN 201426212 Y CN201426212 Y CN 201426212Y CN 2009200388897 U CN2009200388897 U CN 2009200388897U CN 200920038889 U CN200920038889 U CN 200920038889U CN 201426212 Y CN201426212 Y CN 201426212Y
Authority
CN
China
Prior art keywords
coverlay
circuit board
flexible printed
bottom side
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2009200388897U
Other languages
Chinese (zh)
Inventor
陆申林
彭罗华
王恒忠
汤彩明
耿侠
丁毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Yifuda Electronics Co Ltd
Original Assignee
Kunshan Yifuda Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Yifuda Electronics Co Ltd filed Critical Kunshan Yifuda Electronics Co Ltd
Priority to CN2009200388897U priority Critical patent/CN201426212Y/en
Application granted granted Critical
Publication of CN201426212Y publication Critical patent/CN201426212Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The utility model discloses a hollow double-sided flexible printed circuit board which comprises a substrate and a coverlay, and is characterized in that the substrate is a pure copper foil; a surfacecoverlay pressed with welding point openings and a bottom side coverlay with guide holes are respectively arranged on the surface and the bottom side of the substrate; copper bars are respectively pressed on the parts of the surface of the bottom side coverlay on which wires need to be distributed; the copper bars and the surface of the bottom side coverlay are provided with figures which form circuits; a copper coverlay only with the welding point openings exposed is pressed on the surface of each circuit; and pure adhesive is adhered between the copper bars and the bottom side coverlay. Thehollow double-sided flexible printed circuit board has the advantages of free bending, folding and winding, random moving and expansion in a three-dimensional space, good radiating performance, sizereducing with the flexible circuit board, realization of lightweight, small size and thinner shape realization of film-to-film pressure screen process, integrated connection of parts and devices withlead wires, realization of the design concept of flexible thickness, and the thinnest part reaches 0.07mm.

Description

Hollow-out double-sided flexible printed circuit board
Technical field
The utility model relates to a kind of flexible circuit board, relates in particular to a kind of hollow-out double-sided flexible printed circuit board that is applicable to handset touch panel.
Background technology
As everyone knows, along with development of science and technology, the applying electronic product develops towards direction frivolous, multifunction gradually, especially along with development of Communication Technique, mobile phone has become a part indispensable in people's daily life, and people require constantly to increase to the personalization of mobile phone, and the mobile phone that has a touch-screen also just comes out thereupon.Traditional pcb board is a hardboard, because of itself characteristic is that hardboard is not bent, so, will inevitably occupy certain space, can increase the weight of product simultaneously, more than two bad points restricted the strategy that product develops to frivolous, smart little direction.In addition, from the angle of technology, handset touch panel adopts the technology of compacting AG lead to realize being communicated with, and what hardboard was too thick after can't realizing suppressing is smooth, and the step that produces is also bigger, the situation of AG wire fracture can occur.In addition, the demand in market is exquisitenessization constantly, and general double-faced flexible printed board also can be restricted because of the relation of its thickness, can not design more exquisite, the more reliable product of quality selectively.
The utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model be to provide a kind of be convenient to design, press screen position solder joint thinner and be applicable to a kind of hollow-out double-sided flexible printed board of film to mould screen technology.
The utility model is achieved through the following technical solutions:
A kind of hollow-out double-sided flexible printed circuit board, comprise substrate and coverlay, substrate is a pure copper foil, the surface of substrate and bottom surface are suppressed with the surface coverage film that has the solder joint opening respectively and are provided with the bottom surface coverlay of guide hole, the position that needs on the surface of bottom surface coverlay to connect up is pressed with copper bar, cover in copper bar and bottom surface and to have the figure that forms circuit on the film formed surface, be shaped on the copper bar coverlay that one deck only reveals the solder joint opening, post pure glue between copper bar and the bottom surface coverlay in the surface pressure of circuit.
Contain the Adhesive solid on described surface coverage film, bottom surface coverlay and the copper bar coverlay.
Described surface coverage film, bottom surface coverlay and copper bar coverlay are PI film or polyester film.
The beneficial effects of the utility model are:
But free bend, folding, reel, can arbitrarily move and flexible at three dimensions;
2. perfect heat-dissipating can be utilized the flexible circuit board reduced volume;
3. realize lightweight, miniaturization, slimming, be connected integrated with lead thereby reach component arrangement;
4. be convenient to design, solder joint position thickness is thinner, and thinnest part can reach 0.07mm, can carry out film mould is shielded technology.
Description of drawings
Fig. 1 is the side structure schematic diagram of the utility model one embodiment.
Main Reference numeral implication is among the figure:
1, surface coverage film 2, substrate 3, bottom surface coverlay
4, copper bar 5, copper bar coverlay 6, guide hole
Embodiment
Below in conjunction with accompanying drawing, describe embodiment of the present utility model in detail:
Fig. 1 is the side structural scheme of mechanism of the utility model one embodiment.
A kind of hollow-out double-sided flexible printed circuit board, comprise substrate 2, surface coverage film 1, bottom surface coverlay 3, copper bar 4 and copper bar coverlay 5, wherein surface coverage film 1 and bottom surface coverlay 3 are compressed on respectively on the surface and ground of substrate 2, surface coverage film 1 is provided with solder joint opening (not shown), on bottom surface coverlay 3, have guide hole 6, realize the two sides conducting, copper bar 4 is compressed on needs the position of connecting up on the bottom surface coverlay 3, post pure glue between itself and the bottom surface coverlay 3, have the figure that forms circuit on the surface of bottom surface coverlay 3 and copper bar 4, the circuit surface is suppressed with the copper bar coverlay 5 that one deck only reveals the solder joint opening.
Described surface coverage film 1, bottom surface coverlay 3 and copper bar coverlay 5 are PI film or polyester film, and they all contain the Adhesive solid.
At first substrate 2 and bottom surface coverlay 3 are left material respectively, boring thereon then, the substrate 2 bottom surfaces registration holes of coincideing is pasted, form middle insulated medium by high temperature compacting and curing back, copper bar 4 is sticked at the position of required wiring on bottom surface coverlay 3, make the whole double sided board structure that forms, but two ends also have the hollow out solder joint, 4 places get out guide hole at copper bar, make guide hole 6 metallization, light-sensitive surface in the compacting by electrochemical process, carry out figure transfer by the photograph principle, on the copper bar 4 of on another layer copper foil surface and bottom surface, form required circuit,, carry out the circuit video picture by the DES work station, corrode residual copper, reduction circuit copper face, two sides circuit hollow out forms adjacent and wiring board not short circuit, the thinnest 0.07mm that reaches in solder joint place, and the middle part exists the two sides to jump the hole circuit.In surface coverage film and the compacting of copper coverlay, realize that inexpensive design, the hollow-out double-sided flexible printed board that solder joint is thinner form.
Below disclose the utility model with preferred embodiment, so it is not in order to restriction the utility model, and all employings are equal to replaces or technical scheme that the equivalent transformation mode is obtained, all drops within the protection range of the present utility model.

Claims (3)

1, a kind of hollow-out double-sided flexible printed circuit board, comprise substrate and coverlay, it is characterized in that: substrate is a pure copper foil, the surface of substrate and bottom surface are suppressed with the surface coverage film that has the solder joint opening respectively and are provided with the bottom surface coverlay of guide hole, the position that needs on the surface of bottom surface coverlay to connect up is pressed with copper bar, cover the figure that has the formation circuit on the film formed surface at copper bar and bottom surface, surface pressure at circuit is shaped on the copper bar coverlay that one deck only reveals the solder joint opening, posts pure glue between copper bar and the bottom surface coverlay.
2, according to claim 1 hollow-out double-sided in conjunction with flexible printed circuit board, it is characterized in that containing the Adhesive solid on described surface coverage film, bottom surface coverlay and the copper bar coverlay.
3, according to claim 1 and 2 hollow-out double-sided in conjunction with flexible printed circuit board, it is characterized in that described surface coverage film, bottom surface coverlay and copper bar coverlay are PI film or polyester film.
CN2009200388897U 2009-05-11 2009-05-11 Hollow double-sided flexible printed circuit board Expired - Lifetime CN201426212Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009200388897U CN201426212Y (en) 2009-05-11 2009-05-11 Hollow double-sided flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009200388897U CN201426212Y (en) 2009-05-11 2009-05-11 Hollow double-sided flexible printed circuit board

Publications (1)

Publication Number Publication Date
CN201426212Y true CN201426212Y (en) 2010-03-17

Family

ID=42025670

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009200388897U Expired - Lifetime CN201426212Y (en) 2009-05-11 2009-05-11 Hollow double-sided flexible printed circuit board

Country Status (1)

Country Link
CN (1) CN201426212Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110798981A (en) * 2019-11-07 2020-02-14 江苏上达电子有限公司 Carrier film for improving expansion and shrinkage of flexible circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110798981A (en) * 2019-11-07 2020-02-14 江苏上达电子有限公司 Carrier film for improving expansion and shrinkage of flexible circuit board

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20100317

Effective date of abandoning: 20090511