CN115339185B - Composite backing plate and preparation method thereof - Google Patents

Composite backing plate and preparation method thereof Download PDF

Info

Publication number
CN115339185B
CN115339185B CN202111482208.8A CN202111482208A CN115339185B CN 115339185 B CN115339185 B CN 115339185B CN 202111482208 A CN202111482208 A CN 202111482208A CN 115339185 B CN115339185 B CN 115339185B
Authority
CN
China
Prior art keywords
layer
adhesive
deformation
thickness
backing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202111482208.8A
Other languages
Chinese (zh)
Other versions
CN115339185A (en
Inventor
魏美晓
张伦强
王万兵
蒲强
杨柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Liuxin Electronics Co ltd
Shenzhen Newccess Industrial Co ltd
Original Assignee
Kunshan Liuxin Electronics Co ltd
Shenzhen Newccess Industrial Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Liuxin Electronics Co ltd, Shenzhen Newccess Industrial Co ltd filed Critical Kunshan Liuxin Electronics Co ltd
Priority to CN202111482208.8A priority Critical patent/CN115339185B/en
Publication of CN115339185A publication Critical patent/CN115339185A/en
Application granted granted Critical
Publication of CN115339185B publication Critical patent/CN115339185B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a composite backing plate and a preparation method thereof, wherein the composite backing plate is used for drilling a PCB deformation plate with the thickness of more than 3.0mm, and comprises a first burr inhibiting layer, a first adhesive layer, a deformation layer, a second adhesive layer and a second burr inhibiting layer which are sequentially laminated from bottom to top. The composite backing plate provided by the invention has the characteristics of easy deformability, strong supporting property and high hardness, and when drilling is performed, the PCB deformation plate and the composite backing plate are locked, and the composite backing plate can deform and be tightly attached to the warped surface of the PCB deformation plate at the moment, so that the effect of inhibiting the generation of drilling burrs is achieved. The use mode of the composite backing plate provided by the invention is the same as that of a conventional backing plate, and both sides of the composite backing plate can be used.

Description

Composite backing plate and preparation method thereof
Technical Field
The invention relates to the technical field of PCB drilling, in particular to a composite backing plate and a preparation method thereof.
Technical Field
The backing plate is a material which is arranged below a board to be processed when a printed circuit board (PCB for short) is mechanically drilled, and improves the drilling effect. The main functions of the PCB backing plate are as follows: (1) inhibiting burrs at the outlet of the drill hole; (2) improving vacancy accuracy; (3) reducing the temperature of the drill point; (4) protecting the drilling machine. The PCB backing plate is mainly of the following types: medium density wood pulp board, high density wood pulp board, melamine wood backing board, phenolic paper backing board, composite wood backing board, etc. At present, in the printed circuit board processing process, the PCB board of processing and manufacturing produces slight deformation by the influence of a plurality of uncertain factors such as raw materials, processing technology, equipment, human factors, and the like, forms the board warp, can not hug closely the backing plate, causes the drilling to drape over a knife edge too big, appear breaking needle scheduling problem, and consequently PCB board warp can produce great influence to drilling processing. If the PCB is thinner (less than 3.0 mm), the warp deformation of the drilling position of the PCB can be changed by properly increasing the pressure of the pressure pin during drilling, so that the PCB is clung to the backing plate, and the drilling cannot generate excessive burrs; if the PCB is thicker (more than 3.0 mm), the pressure of the pressure pin is difficult to change the warp deformation of the PCB, the PCB and the backing plate cannot be clung to each other, gaps exist, and the drilling is easy to generate larger burrs and other drilling problems, so that the quality is affected. Therefore, when the PCB is thicker, the pressure pins cannot improve the deformation of the PCB, and the inhibition effect of the common backing plate on the burrs of the PCB is weakened. At present, the problem of the burr of the drilling of the PCB deformation plate is not solved effectively. Although the related art proposes that a coating layer can be coated on the surface of a PCB deformation plate to inhibit drilling burrs, new procedures such as coating, curing, film stripping and the like and related equipment are required to be added, and the method is complex in operation, time-consuming, labor-consuming, high in cost and easy to produce more waste water and waste residues.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
In view of the shortcomings of the prior art, the invention aims to provide a composite backing plate and a preparation method thereof, and aims to solve the problem that when the backing plate is used for drilling a warp PCB deformation plate with the thickness of more than 3.0mm, the backing plate cannot be tightly attached to the PCB deformation plate, so that a larger burr is generated.
The technical scheme of the invention is as follows:
the utility model provides a compound backing plate, wherein is used for the PCB deformation board drilling that thickness is greater than 3.0mm, compound backing plate includes from bottom to top stacks gradually first burr suppression layer, first adhesive layer, deformation layer, second adhesive layer and the second burr suppression layer that sets up.
The composite backing plate is used for drilling a PCB deformation plate with the thickness of 3-8mm and the warping degree of less than or equal to 2mm.
The composite backing plate is characterized in that the material of the deformation layer is selected from one of sponge, EVA and EPE.
The hardness of the sponge is 65-99HF, and the density of EVA is 10-50kg/m 3 The EPE has a density of 15-30kg/m 3 。
The thickness of the deformation layer is larger than or equal to the warpage of the PCB deformation plate.
The composite backing plate, wherein the first flash inhibiting layer and the second flash inhibiting layer are independently selected from one of aluminum sheet, PET, cold-punching sheet, PP, PVC, acrylic sheet and iron sheet.
The hardness of the first flash inhibiting layer is 2B-9H, and the thickness of the first flash inhibiting layer is 0.1-1.0mm; the hardness of the second flash inhibiting layer is 2B-9H, and the thickness is 0.1-1.0mm.
The composite backing plate, wherein the materials of the first adhesive layer and the second adhesive layer are independently selected from one of hot melt adhesive, epoxy adhesive, polyurethane adhesive, acrylate AB adhesive, alpha-cyanoacrylate adhesive, photosensitive adhesive, organic silicon rubber adhesive, UV ultraviolet adhesive and anaerobic adhesive.
The preparation method of the composite backing plate comprises the following steps:
providing a deformation layer, and coating an adhesive on the lower surface of the deformation layer;
attaching a first burr inhibiting layer to the lower surface of the deformation layer and performing curing treatment;
coating an adhesive on the upper surface of the deformation layer;
and attaching a second burr inhibiting layer to the upper surface of the deformation layer and performing curing treatment to obtain the composite backing plate.
The preparation method of the composite backing plate comprises the step of brushing, spraying or rolling.
The beneficial effects are that: the invention provides a composite backing plate which comprises a first burr inhibiting layer, a first adhesive layer, a deformation layer, a second adhesive layer and a second burr inhibiting layer which are sequentially stacked from bottom to top. According to the invention, by utilizing the characteristics of easy deformability, strong support and high hardness of the composite backing plate, the PCB deformation plate is locked with the composite backing plate during drilling, so that the composite backing plate is subjected to bending deformation and is tightly attached to the warping part of the PCB deformation plate, the effect of inhibiting the generation of drilling burrs is achieved, and the composite backing plate is mainly suitable for PCB plates with small warping deformation amplitude, and has the thickness of 3-8mm and the warping less than or equal to 2mm.
Drawings
FIG. 1 is a schematic view of a composite backing plate according to the present invention.
Detailed Description
The invention provides a composite backing plate and a preparation method thereof, and the invention is further described in detail below in order to make the purposes, technical schemes and effects of the invention clearer and more definite. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Because the PCB board and the current backing plate that thickness is more than 3mm are the rigid body, so when the PCB board drilling, this kind of thicker PCB board warp the district and is difficult to closely laminate with the backing plate, the backing plate at this moment can't effectively restrain the burr, and the place that does not have the backing plate to support is draped over one's shoulders the burr is great, needs the manual work to get rid of, and consuming time and effort and increase cost. In the prior art, a layer of coating is coated on the surface of a PCB deformation plate to inhibit drilling burrs, but the treatment mode needs to add new procedures of coating, curing, film removal and other related equipment, is complex in operation, consumes time and labor, is high in cost, and is easy to produce more waste water and waste residues to pollute the environment.
Based on this, the present invention provides a composite pad for drilling a PCB deformation plate with a thickness greater than 3.0mm, as shown in fig. 1, the composite pad includes a first flash suppressing layer 10, a first adhesive layer 20, a deformation layer 30, a second adhesive layer 40 and a second flash suppressing layer 50 laminated in order from bottom to top.
The composite backing plate provided by the invention comprises a deformation layer 30 arranged in the middle, and a second burr inhibiting layer 50 and a first burr inhibiting layer 10 which are adhered on the upper surface and the lower surface of the deformation layer 30 through adhesives, wherein the composite backing plate has the characteristics of easy deformability, strong supporting property and high hardness, and when in drilling, a PCB deformation plate and the composite backing plate are locked, and the composite backing plate can deform and be tightly adhered to the warping surface of the PCB deformation plate at the moment, so that the effect of inhibiting the generation of a drilling burr is achieved. The use mode of the composite backing plate provided by the invention is the same as that of a conventional backing plate, and both sides of the composite backing plate can be used.
In some embodiments, the composite backing plate provided by the invention is mainly used for drilling a PCB deformation plate with the thickness of 3-8mm and the warping degree less than or equal to 2mm, and the deformation layer is made of a material selected from the group consisting of 65-99HF sponge with the hardness and 10-50kg/m density 3 EVA with a density of 15-30kg/m 3 EPE of (a) is provided.
In this embodiment, since the thickness of the PCB deforming plate is 3-8mm and the warpage is less than or equal to 2mm, it is indicated that the PCB deforming plate is a rigid plate and the deformation degree is small, and if the material of the deforming layer is selected from sponge, the hardness of the deforming layer is 65-99HF. The deformation layer defined by the embodiment has better deformability and support, and if the hardness of the deformation layer is too low (less than 65 HF), the composite backing plate has weaker flash inhibition capability; if the hardness of the deformation layer is too high (greater than 99 HF), the deformation amplitude of the composite backing plate is smaller, so that the bonding degree of the PCB deformation plate and the composite backing plate becomes low, and the burr inhibition effect of the composite backing plate is poor.
In this embodiment, if the material of the deformation layer is selected from EVA, its density is 10-50kg/m 3 The method comprises the steps of carrying out a first treatment on the surface of the If the material of the deformation layer is selected from EPE, its density is 15-30kg/m 3 。
In some embodiments, the thickness of the deformation layer may be selected according to the warpage of the PCB deformation plate, and the thickness of the deformation layer is equal to or greater than the warpage of the PCB deformation plate. Because, if the thickness of the deformation layer is smaller than the warp degree of the PCB deformation plate, the deformation amplitude of the deformation layer is smaller, so that the bonding degree of the PCB deformation plate and the composite backing plate is lower, and the composite backing plate has poor burr inhibition effect. For example, the thickness of the deformation layer is 1-10mm, and the thickness of the deformation layer is not easy to be too thick, because the too thick deformation layer can influence the penetration depth of the drill point.
In some embodiments, the first and second flash suppressing layers are independently selected from one of aluminum sheet, PET, cold-punched sheet, PP, PVC, acryl sheet, and iron sheet, but are not limited thereto. PET, cold stamping are preferred.
In some embodiments, the first flash suppressing layer has a hardness of 2B-9H and a thickness of 0.1-1.0mm; the hardness of the second flash inhibiting layer is 2B-9H, and the thickness is 0.1-1.0mm. The first and second flash suppressing layers defined in this embodiment must have high hardness, flexibility and high support. If the hardness of the first and second flash suppressing layers is softer (less than 2B), the flash suppressing capability of the pad is weak, and if the hardness of the first and second flash suppressing layers is harder (more than 9H), the bending amplitude of the first and second flash suppressing layers is small, the bonding degree between the PCB deformation plate and the pad is reduced, and the flash suppressing capability of the pad is easily weak. Similarly, if the thickness of the first and second flash suppressing layers is thin (less than 0.1 mm), the low support property thereof may easily result in the weak flash suppressing capability of the pad, and if the thickness of the first and second flash suppressing layers is thick (more than 1.0 mm), the small bending amplitude thereof may reduce the adhesion degree of the PCB deformation plate and the composite pad, which may easily result in the weak flash suppressing capability of the pad.
In some embodiments, the materials of the first adhesive layer and the second adhesive layer are independently selected from one of a hot melt adhesive, an epoxy adhesive, a polyurethane adhesive, an acrylate AB adhesive, an α -cyanoacrylate adhesive, a photosensitive adhesive, a silicone rubber adhesive, a UV ultraviolet adhesive, and an anaerobic adhesive, but are not limited thereto. In this embodiment, the thickness of the first adhesive layer and the second adhesive layer is 3-50um, the first adhesive layer and the second adhesive layer must have strong adhesion, if the thickness of the first adhesive layer and the second adhesive layer is thinner, the adhesion is poor, if the thickness of the first adhesive layer and the second adhesive layer is thicker, the cost is high, and winding is easy to occur during drilling, so that the drilling quality of the PCB deformation plate is affected.
In some embodiments, there is also provided a method of making a composite mat, comprising the steps of: providing a deformation layer, and coating an adhesive on the lower surface of the deformation layer; attaching a first burr inhibiting layer to the lower surface of the deformation layer and performing curing treatment; then coating an adhesive on the upper surface of the deformation layer; and attaching a second burr inhibiting layer to the upper surface of the deformation layer and performing curing treatment to obtain the composite backing plate. In this embodiment, the coating is performed by brushing, spraying or rolling.
The invention is further illustrated by the following examples:
example 1
Selecting sponge with the thickness of 3mm and the hardness of 85HF as a deformation layer, selecting PET with the thickness of 0.5mm as a burr inhibiting layer with higher hardness, and selecting polyurethane adhesive as an adhesive;
coating a polyurethane rubber roller on the lower surface of a sponge with the thickness of 3mm and the hardness of 85HF, coating the sponge with the thickness of 30um, adhering and adhering a piece of PET with the thickness of 0.5mm on the lower surface of the sponge, and baking at 80 ℃ for 10min for curing;
and (3) coating the polyurethane glue roller on the upper surface of a sponge with the thickness of 3mm and the hardness of 85HF, coating the polyurethane glue roller with the thickness of 30um, adhering another piece of PET with the thickness of 0.5mm on the upper surface of the sponge, baking at 80 ℃ for 10min for curing, and obtaining the composite backing plate (1), wherein the thickness of the composite backing plate is about 4mm, and the thickness of a PCB used for testing is 5mm and the warping is 2mm.
Example 2
A sponge with the thickness of 3mm and the hardness of 95HF is selected as a deformation layer, a cold-punching plate with the thickness of 0.3mm is selected as a flash suppression layer with higher hardness, and epoxy glue is selected as an adhesive;
coating the lower surface of a sponge with the thickness of 3mm and the hardness of 95HF with an epoxy glue roller, coating the lower surface of the sponge with the thickness of 30um, attaching and adhering a cold-punching plate with the thickness of 0.3mm on the lower surface of the sponge, and baking for 5min at 100 ℃ for curing;
and (3) rolling the epoxy rubber roller on the upper surface of a sponge with the thickness of 3mm and the hardness of 95HF, coating the sponge with the thickness of 30um, adhering another cold-punched plate with the thickness of 0.3mm on the upper surface of the sponge, baking at 100 ℃ for 5min for curing, and obtaining a composite backing plate (2), wherein the thickness of the composite backing plate is about 3.6mm, and the thickness of a PCB used for testing is 7.5mm and the warping is 2mm.
Example 3
The thickness is 3mm and the density is 38kg/m 3 The EVA with the thickness of 0.3mm is used as a deformation layer, a cold-punching plate with higher hardness is used as a flash suppression layer, and epoxy glue is used as an adhesive;
the epoxy glue is coated on the film with the thickness of 3mm and the density of 38kg/m 3 Coating the EVA lower surface with the thickness of 30um, then attaching a cold-punched plate with the thickness of 0.3mm on the EVA lower surface, and baking at 100 ℃ for 5min for curing;
the epoxy glue roller is coated on a roller with the thickness of 3mm and the density of 38kg/m 3 The EVA upper surface of the die is coated with a thickness of 30um, then another cold-punched plate with the thickness of 0.3mm is attached and adhered to the EVA upper surface, and the die is baked at 100 ℃ for 5min for curing, so that the composite backing plate (3) is prepared, the thickness of the composite backing plate is about 3.6mm, and the thickness of the PCB used for testing is 5mm and the warping is 1mm.
Example 4
Selecting a thickness of 3mm and a density of 25kg/m 3 The EPE of (2) is used as a deformation layer, a cold-punching plate with the thickness of 0.3mm is used as a flash inhibiting layer with higher hardness, and epoxy glue is used as an adhesive;
the epoxy glue is coated on a roller with the thickness of 3mm and the density of 25kg/m 3 Coating the lower surface of the EPE with the thickness of 30um, then attaching a cold-punching plate with the thickness of 0.3mm on the lower surface of the EPE, and baking at 100 ℃ for 5min for curing;
the epoxy glue roller is coated on a roller with the thickness of 3mm and the density of 25kg/m 3 And (3) the upper surface of the EPE is coated with a cold-punched plate with the thickness of 30um, and then the other cold-punched plate with the thickness of 0.3mm is attached and adhered to the upper surface of the EPE, and is baked at 100 ℃ for 5min for curing, so that the composite backing plate (3) is prepared, the thickness of the composite backing plate is about 3.6mm, and the thickness of the PCB used for testing is 5mm and the warping is 1mm.
Example 5
The thickness is 3mm and the density is 38kg/m 3 An EVA with the thickness of 0.3mm is selected as a deformation layer, an aluminum sheet with the thickness of 0.3mm is selected as a flash suppression layer with higher hardness, and epoxy glue is selected as an adhesive;
the epoxy glue is coated on the film with the thickness of 3mm and the density of 38kg/m 3 Coating the EVA lower surface with the thickness of 30um, attaching and adhering an aluminum sheet with the thickness of 0.3mm on the EVA lower surface, and baking at 100 ℃ for 5min for curing;
the epoxy glue roller is coated on a roller with the thickness of 3mm and the density of 38kg/m 3 The EVA upper surface of the die is coated with aluminum sheet with the thickness of 30um, another aluminum sheet with the thickness of 0.3mm is attached and adhered to the EVA upper surface, and is baked at 100 ℃ for 5min for curing, so that the composite backing plate (3) is prepared, the thickness of the composite backing plate is about 3.6mm, the thickness of the PCB used for testing is 6mm, and the warping is 1mm.
Example 6
The composite mats prepared in examples 1 to 5 were subjected to drilling test under the conditions of 0.35mm diameter and 500 holes, and the experimental results are shown in table 1:
table 1 drilling test results
Backing plate Hardness of pencil Drilling burr
Composite wood backing plate B 100.2um
Deformation backing plate (1) 2H 25.4um
Deformation backing plate (2) 6H 22.5um
Deformation backing plate (3) 6H 16.5um
Deformation backing plate (4) 6H 18.6um
Deformation backing plate (5) H 20.5um
As can be seen from the drilling experimental results in Table 1, the composite backing plate prepared by the embodiment of the invention has an excellent burr inhibiting effect and meets the drilling standard requirements of the PCB.
It is to be understood that the invention is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.

Claims (5)

1. The composite backing plate is characterized by comprising a first burr inhibiting layer, a first adhesive layer, a deformation layer, a second adhesive layer and a second burr inhibiting layer which are sequentially laminated from bottom to top;
the composite backing plate is used for drilling a PCB deformation plate with the thickness of 3-8mm and the warping degree of less than or equal to 2 mm;
the material of the deformation layer is selected from one of sponge, EVA and EPE;
the hardness of the sponge is 65-99HF, the density of the EVA is 10-50kg/m 2, and the density of the EPE is 15-30kg/m 2;
the thickness of the deformation layer is larger than or equal to the warping degree of the PCB deformation plate;
the thickness of the first adhesive layer and the second adhesive layer is 3-50 mu m; the thickness of the deformation layer is 1-10mm;
the hardness of the first flash inhibiting layer is 2B-9H, and the thickness is 0.1-1.0mm; the hardness of the second flash inhibiting layer is 2B-9H, and the thickness is 0.1-1.0mm.
2. The composite mat of claim 1, wherein the first and second flash suppressing layers are independently selected from one of aluminum sheet, PET, cold-punched sheet, PP, PVC, acrylic sheet, and iron sheet.
3. The composite backing of claim 1, wherein the material of the first adhesive layer and the second adhesive layer is independently selected from one of a hot melt adhesive, an epoxy adhesive, a polyurethane adhesive, an acrylate AB adhesive, an a-cyanoacrylate adhesive, a photosensitive adhesive, a silicone rubber adhesive, a UV ultraviolet adhesive, and an anaerobic adhesive.
4. A method of making a composite mat according to any one of claims 1 to 3, comprising the steps of:
providing a deformation layer, and coating an adhesive on the lower surface of the deformation layer;
attaching a first burr inhibiting layer to the lower surface of the deformation layer and performing curing treatment;
coating an adhesive on the upper surface of the deformation layer;
and attaching a second burr inhibiting layer to the upper surface of the deformation layer and performing curing treatment to obtain the composite backing plate.
5. The method of claim 4, wherein the coating is performed by brushing, spraying or rolling.
CN202111482208.8A 2021-12-06 2021-12-06 Composite backing plate and preparation method thereof Active CN115339185B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111482208.8A CN115339185B (en) 2021-12-06 2021-12-06 Composite backing plate and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111482208.8A CN115339185B (en) 2021-12-06 2021-12-06 Composite backing plate and preparation method thereof

Publications (2)

Publication Number Publication Date
CN115339185A CN115339185A (en) 2022-11-15
CN115339185B true CN115339185B (en) 2024-03-29

Family

ID=83977841

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111482208.8A Active CN115339185B (en) 2021-12-06 2021-12-06 Composite backing plate and preparation method thereof

Country Status (1)

Country Link
CN (1) CN115339185B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104260425A (en) * 2014-09-22 2015-01-07 烟台天奕电子有限公司 Base plate for PCB drilling and manufacturing method of base plate for PCB drilling
CN212876208U (en) * 2020-10-09 2021-04-02 深圳市宏宇辉科技有限公司 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104260425A (en) * 2014-09-22 2015-01-07 烟台天奕电子有限公司 Base plate for PCB drilling and manufacturing method of base plate for PCB drilling
CN212876208U (en) * 2020-10-09 2021-04-02 深圳市宏宇辉科技有限公司 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device

Also Published As

Publication number Publication date
CN115339185A (en) 2022-11-15

Similar Documents

Publication Publication Date Title
CN212876208U (en) 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device
CN110099515B (en) Method for improving PCB drilling
JP2011506139A (en) High temperature composite tape and method for producing the same
WO2003025078A1 (en) Easily stuck adhesive sheet and its manufacture method
CN115339185B (en) Composite backing plate and preparation method thereof
JP5657373B2 (en) Adhesive label for hard disk drive and method for producing adhesive label for hard disk drive
CN115339205B (en) Deformation backing plate and preparation method thereof
JP2013528322A (en) Method of attaching member plate to FPC product and member plate tape
CN115339204B (en) Combined backing plate
JP3766304B2 (en) Heat release type adhesive sheet
CN203661404U (en) Bonding structure of high-smoothness step blind slot circuit board
CN111016337B (en) Preparation method of aluminum foil reinforcing plate applied to FFC cable and reinforcing plate
JP2023036666A (en) Float-tone wood decorative material
CN111712054B (en) Rapid laminating method for soft board cover film
CN107825797A (en) A kind of compound PET film of decorative panel
JP2004303313A (en) Sticky label for hard disk drive
JP2006186398A5 (en)
CN211567171U (en) High-strength graphene material cover gasket
CN105517360B (en) A method of improving copper-based copper-clad laminate and drills copper-based bottom peak
CN219600602U (en) Copper-aluminum transfer film with high polymer adhesive layer
CN217149047U (en) Adhesive tape
CN214004490U (en) Shielding type strong-adhesion double-sided adhesive tape
CN214839351U (en) Flat plate support frame with leather paste
CN211240296U (en) Super-smooth high-hardness PCB substrate
KR100413292B1 (en) Precious stone sheet

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant