KR101747810B1

KR101747810B1 - Backup boards for punching holes of printed circuit board and manufacturing method thereof

Info

Publication number: KR101747810B1
Application number: KR1020150137647A
Authority: KR
Inventors: 이숙
Original assignee: 주식회사 유원
Priority date: 2015-09-30
Filing date: 2015-09-30
Publication date: 2017-06-14
Also published as: KR20170038362A

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a backup board for a printed circuit board hole processing and a method of manufacturing the same.
A backup board for processing printed circuit board holes according to the present invention comprises: a base material (10); A surface stacked body 20 located above the substrate 10; And a back side laminate body 30 located below the base material 10 and the surface side laminate body 20 includes a lubricant layer 22, a paper 24 and a silicone resin layer Wherein the backing laminate 30 includes a lubricant layer 32, a paper 34, and a lubricant layer 32 which are stacked in order from bottom to top in a symmetrical manner with respect to the surface- And a silicon resin layer (36).
According to the present invention, it is possible to extend the service life of the drill bit by minimizing the wear of the drill bit and to improve the uniformity and accuracy of the drilled holes. It is possible to minimize the wear of the drill bit due to the cooling effect of the heat of melting of the thermoplastic resin during drilling with the drill bit and to prevent the chip from adhering to the drill bit.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a backup board for a printed circuit board hole processing, and a method of manufacturing the same. BACKGROUND OF THE INVENTION [

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backup board for a printed circuit board hole and a method of manufacturing the same, and more particularly, BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backup board for circuit board hole processing and a manufacturing method thereof.

A printed circuit board is a printed circuit board on which a plurality of wires to be connected by a wire are printed on a wide plate instead of a wire. An electronic chip is densely mounted on a flat insulating plate made of phenol resin or epoxy resin, Function.

Such printed circuit boards are used in various industrial electric control devices, mobile phones, computers, electronic products, and the like, and they are being designed with increasingly higher precision, functionality, and lighter weight over time. This printed circuit board is preceded by fixing the electronic chip and drilling the hole with a drill bit for electrical connection.

However, when drilling a hole with a drill bit, the printed circuit board has a high hardness and is hard, so it is very difficult to process the hole at an accurate position, resulting in a defect in the hole position. In addition, a large amount of heat is generated due to the speed of the drill bit rotated at a high speed during drilling of the hole. Such heat causes problems such as abrasion and warping of the drill bit and damage to the substrate.

In order to solve this problem, the aluminum sheet having a high thermal conductivity is covered on the printed circuit board and the hole is processed. The aluminum sheet used at this time is called an entry board.

However, since the hardness of aluminum is too low to place the drill bit in the correct position, a sheet having a high hardness is used for positional accuracy, and a method of processing a hole by coating a water-soluble wax is also used.

Among them, when a hole is processed using an entry board coated with a water-soluble wax, the wax residue generated at the time of hole processing not only protects the inner wall of the hole, but also cleans the wafer with water, thereby easily removing chips.

However, the water-soluble wax is very vulnerable to moisture, so that when the humidity is high, especially in the rainy season, water is absorbed from the surface, The wax is adhered to the coating film, and the coating film is peeled off.

In case of using an entry board in which a film made of PET (poly ethylene terephthlate), NY (nylon), OPP (Oriented Polypropylene) or PE (polyethylene) is adhered to an aluminum sheet through an adhesive, There is a problem that the adhesive adheres to the drill bit.

If the adhesive adheres to the drill bit as described above, eccentricity is generated, which causes breakage of the drill bit or failure in hole processing.

In addition, the conventional entry board has a problem that the cooling function is deteriorated when the drill hole is drilled and high heat is generated and the drill is worn. In the entry board made of aluminum plate, there is a problem that the hole accuracy is lowered due to slipping of the aluminum surface. In addition, the entry board made of an aluminum plate coated with a thermoplastic resin (water-soluble) is inconvenient for breakage and use during transportation and storage, and the hole accuracy is lowered due to the lack of hardness of the surface. There is a problem that the accuracy of the hole is deteriorated.

By applying the lubricating resin to the backup board, it is possible to compensate for the disadvantages of applying the lubricating resin to the entry board as described above.

Domestic Registration No. 10-1098011 (registered on December 16, 2011) Domestic registered patent No. 10-1041924 (registered on June 09, 2011) Domestic Registration No. 10-1205230 (registered on November 21, 2012)

The present invention provides a backup board for hole processing of a printed circuit board, which is excellent in uniformity and accuracy of perforated holes and which can provide excellent hole processability and minimize wear of a drill bit and prolong its service life, and a method for manufacturing the same.

In addition, the present invention can prevent the warpage of the substrate by coating the surface of the substrate with a silicone resin, minimize the wear of the drill bit due to the cooling effect by the heat of melting of the thermoplastic resin during drilling with the drill bit, And a method for manufacturing the same.

The various problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

A backup board for processing printed circuit board holes according to the present invention comprises: a base material (10); A surface stacked body 20 located above the substrate 10; And a back side laminate body 30 located below the base material 10 and the surface side laminate body 20 includes a lubricant layer 22, a paper 24 and a silicone resin layer Wherein the backing laminate 30 includes a lubricant layer 32, a paper 34, and a lubricant layer 32 which are stacked in order from bottom to top in a symmetrical manner with respect to the surface- And a silicon resin layer (36).

The substrate 10 is formed of HDF (High Density Fiberboard), which is a wood, and can be formed to have a thickness of 1.5 to 3 mm.

The lubricant layer 22, 32 may be coated using a comma coater and dried in an oven at 60-120 ° C after the coating.

The lubricant layer 22, 32 has a melting point Tm in the range of 55 to 75 占 폚 and may be formed of a polyurethane resin which is a thermoplastic resin.

200 g of polyethylene glycol (PEG) 8000 was placed in a 500 ml reactor equipped with a stirrer and a thermometer. The temperature of the lubricant layer 22 was elevated to 130 캜 and the water was removed under vacuum for 1 hour (hr) After cooling to 75 to 85 ° C, 125 g of methyl ethyl ketone (MEK) with water removed was added to dissolve the water-removed polyethylene glycol (PEG). In the reactor, 5.86 g of MDI Diluted in 25 g of MEK, added over 2 hours (hr), and the reactant whose viscosity has been increased after completion of the addition can be prepared by diluting with 50 g of purified water.

The silicone resin layers 26 and 36 are formed of a thermosetting resin, and the thermosetting resin may be a phenol resin or an epoxy resin.

The thickness of the silicone resin layers 26 and 36 is 0.1 to 2 탆 and the silicone resin layers 26 and 36 can be coated and dried using a gravure printing method.

A method of manufacturing a backup board for hole processing of printed circuit boards according to the present invention comprises the steps of preparing wood as a base material 10 and placing a surface layered body 20 on the base material 10, (10) and the backing laminate (30) by thermocompression bonding the surface layer laminate (20), wherein the surface laminate body (20) (24) and a silicone resin layer (26), wherein the backing laminate (30) is formed by laminating the surface layer laminate (30) on the substrate (10) A lubricant layer 32, paper 34, and a silicone resin layer 36 which are stacked in order symmetrically with respect to the base 20,

The thermocompression bonding of the surface laminate 20, the base material 10 and the back side laminate 30 can be performed by pressing at a temperature of 50 to 150 DEG C at a pressure of 5 to 100 kgf / cm < ² >.

The substrate 10 is formed of high density fiberboard (HDF) as wood and is formed to a thickness of 1.5 to 2 mm. The lubricant layer 22 and 32 are formed by using a comma coater The lubricant layer 22, 32 has a melting point (Tm) in a range of 55 to 65 占 폚 and is formed of a polyurethane resin which is a thermoplastic resin, 200 g of polyethylene glycol (PEG) 8000 was placed in a 500 ml reactor equipped with a stirrer and a thermometer. The temperature of the lubricant layer 22 was elevated to 130 캜 and the water was removed under vacuum for 1 hour (hr) After cooling to 75 to 85 ° C, 125 g of methyl ethyl ketone (MEK) with water removed was added to dissolve the water-removed polyethylene glycol (PEG). In the reactor, 5.86 g of MDI Diluted in 25 g of MEK and added over 2 hours (hr) , The reactant having the viscosity increased after completion of the addition is diluted with 50 g of purified water, the silicone resin layers 26 and 36 are formed of a thermosetting resin, and a phenol resin or an epoxy resin is used as the thermosetting resin , The thickness of the silicone resin layers 26 and 36 is 0.1 to 2 탆, and the silicone resin layers 26 and 36 can be coated and dried using a gravure printing method.

The details of other embodiments are included in the detailed description.

The backup board for a hole for printed circuit boards and the method of manufacturing the same according to the present invention are excellent in uniformity and accuracy of perforated holes and provide excellent hole processability and minimized wear of drill bits and prolong life.

The present invention also provides a backup board for a printed circuit board hole processing method and a method of manufacturing the same, which can prevent the substrate from being warped by coating the surface of a substrate with a silicone resin and, when drilling with a drill bit, The wear of the drill bit can be minimized and the chip can be prevented from adhering to the drill bit.

It will be appreciated that embodiments of the technical idea of the present invention can provide various effects not specifically mentioned.

1 is a cross-sectional view schematically showing a backup board for a printed circuit board hole processing according to the present invention.

Advantages and features of the present invention, and methods of accomplishing the same, will be apparent from and elucidated with reference to the embodiments described hereinafter in detail. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be construed as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a backup board for a printed circuit board hole processing according to the present invention will be described in detail with reference to the accompanying drawings.

The backup board for hole processing of printed circuit board according to the present invention is applied together with an entry board when a drill of a known printed circuit board is drilled. The backup board for hole processing of the printed circuit board includes an entry board disposed on a top surface of a printed circuit board, So that the drill can be performed.

1, a back-up board for a printed circuit board hole processing according to the present invention includes a substrate 10, a surface laminate 20 disposed on the substrate 10, and a back- The surface layered body 20 includes a lubricant layer 22, a paper 24 and a silicone resin layer 26 which are sequentially stacked from the lower portion to the upper portion, Paper 34 and a silicone resin layer 36 which are laminated in this order from the top to the bottom in a direction symmetrical to the surface laminate 20 about the base 10.

The substrate 10 is provided for imparting mechanical strength to dissipate heat generated during drilling and reduce the impact of a drill bit. In the present invention, the substrate 10 has a high density And may be formed of a high density fiberboard (HDF).

The substrate 10 is disposed on the printed circuit board at the time of hole machining of the printed circuit board to facilitate hole machining through the drill bit and is used for quickly dissipating heat generated at a drill bit rotated at high speed for hole machining (High Density Fiberboard).

In the present invention, the substrate 10 may be formed to a thickness of 1 to 3 mm, preferably 1.5 to 2 mm, thereby facilitating heat dissipation due to workability and drilling. In addition, a high density fiberboard (HDF) ) Can be minimized.

The surface laminate 20 and the back laminate 30 are disposed on the base 10 and the back laminate 3 is located below the base 10, (24, 34) and a silicone resin layer (26, 36) which are laminated symmetrically with respect to the base material (10). The lubricant layer The constitution of the paper layers 24 and 34 and the silicone resin layers 26 and 36 will not be described as the surface layered body 20 and the backside laminated body 30 and will be described below in the same manner.

The lubricant layer 22, 32 is formed of a thermoplastic resin, and an additive may be added to improve the adhesiveness. The thermoplastic resin and the additive may be mixed in a weight ratio of 70:30 to 95: 5, respectively .

In the present invention, a polyurethane resin may be used as the thermoplastic resin, and the additive may be added to compensate for the disadvantages of the polyurethane resin. In the present invention, the additive is copolymerized with acrylic acid, And a resin having excellent adhesive strength can be synthesized and used.

The thermoplastic resin can lubricate and impart excellent hole-forming property, and the wear of the drill bit can be minimized by the cooling effect by the heat of fusion of the thermoplastic resin upon drilling. In the present invention, the lubricant layer 22, 32 may be formed to a thickness of 10 to 100 mu m by drying.

Also, in the present invention, the lubricant layer 22, 32 may be coated using a comma coater, and may be dried in an oven at 60 to 120 ° C. after the coating.

In the present invention, the lubricant layer 22 or 32 has a melting point (Tm) in a range of 55 to 75 ° C and may be produced by reacting polyethylene glycol (PEG) with a urethane reaction. Will be described in detail as follows.

First, polyethylene glycol (PEG) is charged into a reactor equipped with a stirrer, and then the temperature is raised to 100 to 120 ° C to dissolve the polyethylene glycol. Next, water contained in the polyethylene glycol is removed in a vacuum atmosphere, and acetone (Acetone) and methyl ethyl ketone (MEK), which are solvents, and a catalyst can be added together. Next, the temperature in the reactor was maintained at 60 to 100 ° C., and isocyanate (TDI, MDI, HDI) diluted with acetone (Acetone) and methyl ethyl ketone (MEK) It may be diluted with acetone, methyl ethyl ketone (MEK) or purified water.

Hereinafter, embodiments of the method of manufacturing the lubricant layer 22 and 32 will be described in detail.

First, 200 g of polyethylene glycol (PEG) 8000 was placed in a 500 ml reactor equipped with a stirrer and a thermometer, and the temperature was raised to 130 캜 and water was removed under vacuum for 1 hour (hr). Next, after releasing the vacuum, it was cooled to 75 to 85 캜, and 125 g of methyl ethyl ketone (MEK) sufficiently removed moisture was added to dissolve the water-removed polyethylene glycol (PEG). Next, while maintaining the temperature in the reactor at 75 to 85 캜, 5.86 g of MDI was diluted in 25 g of MEK and slowly added over 2 hours (hr). Subsequently, the reactant whose viscosity increased after completion of addition was diluted with 50 g of purified water (Water) to complete the lubricant layer 22, 32.

The additive may be prepared through a radical addition reaction. The radical addition reaction will be described in detail as follows.

First, water and caustic soda are introduced into a reactor equipped with a stirrer, and after the temperature is raised to 70 to 90 ° C, acrylic acid and KPS may be dissolved in water and added. Next, it is maintained at 70 to 90 ° C for 30 to 60 minutes (min), and acrylic acid, hydrogen peroxide and water are gradually added at 70 to 90 ° C over 1 to 2 hours (hr). Then, the temperature can be raised to 90 to 95 캜 and maintained for 30 to 50 minutes (min).

Hereinafter, examples of the method for producing the additive will be described in detail.

First, 170.38 g of purified water and 1.23 g of caustic soda were placed in a 500 ml reactor equipped with a stirrer and a thermometer, and the temperature was raised to 70 캜. After heating to 70 ° C, 14.09 g of acrylic acid was added, and 0.17 g of KPS was dissolved in 11.47 g of purified water and the initial reaction was started. Next, the reaction temperature was maintained, that is, held for 35 minutes (min), and then the temperature was raised to 90 ° C again. Next, 51.44 g of acrylic acid and 133.33 g of purified water were mixed, and 0.85 g of hydrogen peroxide and 17.04 g of water were diluted with each monomer and the catalyst was gradually added over 1 hour (hr) at the same rate Respectively. After the monomer and the catalyst were both charged, the temperature was raised to 95 ° C. and maintained for 30 minutes to minimize unreacted monomers, and the reaction was terminated.

The silicone resin layers 26 and 36 may be coated on the paper 30 to prevent warpage of the high density fiberboard HDF which is wood. , 36 can be made of a thermosetting resin, and as the thermosetting resin, a phenol resin, an epoxy resin, or the like can be used, and the thermosetting resin can have excellent surface adhesion with the paper (24, 34).

In the present invention, in order to minimize the warpage of the substrate 10 made of high density fiberboard (HDF) as a wood, silicone resin layers 26 and 36 are formed on the paper 24 and 34 Paper 24, 34 may also be used.

In the present invention, the silicone resin layers 26 and 36 may be dried to a thickness of 0.1 to 2 탆, and the silicone resin layers 26 and 36 may be coated and dried using a gravure printing method. have.

Hereinafter, a method of manufacturing a backup board for hole processing of printed circuit board according to the present invention will be described in detail.

First, wood, which is the substrate 10, can be prepared. As the substrate 10, a high density fiberboard (HDF), which is a wood, may be used.

The surface layered body 20 and the backside laminate body 30 may be manufactured respectively on the upper and lower portions of the substrate 10 and the surface layered body 20 may include a lubricant layer Wherein the backing laminate 30 is laminated on the base material 10 in a symmetrical manner with respect to the base material 10 in a downward direction from an upper portion of the backing laminate 30, A lubricant layer 32, a paper 34, and a silicone resin layer 36. [

The backing board for hole processing of printed circuit boards according to the present invention can be manufactured by positioning the base material 10 between the surface laminate 20 and the backing laminate 30 and then thermocompression bonding, Lt; 0 > C to 150 [deg.] C at a pressure of 5 to 100 kgf / cm < ² >.

The substrate 10 is provided for imparting mechanical strength to dissipate heat generated during drilling and to reduce the impact of the drill bit. The substrate 10 has a printed circuit board And can be manufactured using a high density fiberboard so that heat generated from a drill bit rotated at high speed for hole machining can be rapidly dissipated. have.

In the present invention, the lubricant layer 22, 32 has a melting point (Tm) in a range of 55 to 75 ° C and can be produced through a urethane reaction of polyethylene glycol (PEG).

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be possible. It is therefore to be understood that one embodiment described above is illustrative in all aspects and not restrictive.

10; A substrate 20; Surface superstructure
22, 32; A lubricant layer 24, 34; paper
26, 36; A silicon resin layer 30; If the laminated body

Claims

A substrate 10; A surface stacked body 20 located above the substrate 10; And a back side laminate body 30 located below the base material 10 and the surface side laminate body 20 includes a lubricant layer 22, a paper 24 and a silicone resin layer Wherein the backing laminate 30 includes a lubricant layer 32, a paper 34, and a lubricant layer 32 which are stacked in order from bottom to top in a symmetrical manner with respect to the surface- And a silicon resin layer (36)
The substrate 10 is formed of HDF (High Density Fiberboard), which is a wood, and is formed to a thickness of 1.5 to 3 mm,
The lubricant layer 22, 32 is coated using a comma coater, dried in an oven at 60 to 120 DEG C after the coating,
The lubricant layer 22, 32 has a melting point Tm in the range of 55 to 75 DEG C and is formed of a polyurethane resin which is a thermoplastic resin,
200 g of polyethylene glycol (PEG) 8000 was placed in a 500 ml reactor equipped with a stirrer and a thermometer. The temperature of the lubricant layer 22 was elevated to 130 캜 and the water was removed under vacuum for 1 hour (hr) After cooling to 75 to 85 ° C, 125 g of methyl ethyl ketone (MEK) with water removed was added to dissolve the water-removed polyethylene glycol (PEG). In the reactor, 5.86 g of MDI And diluted with 25 g of MEK and added over 2 hours (hr), and the reactant whose viscosity has been increased after completion of the addition is diluted with 50 g of purified water.

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A method of manufacturing a semiconductor device comprising the steps of preparing wood as a base material 10 and placing the surface layered body 20 on the base material 10 and placing the backing laminate 30 on the bottom of the base material 10, Wherein the surface layered body 20 is formed by thermocompression bonding the layered body 20, the base material 10 and the backside laminated body 30, wherein the surface layered body 20 comprises a lubricant layer 22, a paper 24, And a resin layer 26. The back layer laminate 30 includes a lubricant layer 32 laminated in order from the top to the bottom in a direction symmetrical to the surface laminate 20 about the base 10, And a silicone resin layer 36,
The thermocompression bonding of the surface laminated body 20, the base material 10 and the back side laminate 30 is carried out by pressing at a pressure of 5 to 100 kgf / cm ² at a temperature of 50 to 150 ° C,
The substrate 10 is formed of high density fiberboard (HDF) as wood and is formed to a thickness of 1.5 to 2 mm. The lubricant layer 22 and 32 are formed by using a comma coater The lubricant layer 22, 32 has a melting point (Tm) in a range of 55 to 65 占 폚 and is formed of a polyurethane resin which is a thermoplastic resin, 200 g of polyethylene glycol (PEG) 8000 was placed in a 500 ml reactor equipped with a stirrer and a thermometer. The temperature of the lubricant layer 22 was elevated to 130 캜 and the water was removed under vacuum for 1 hour (hr) After cooling to 75 to 85 ° C, 125 g of methyl ethyl ketone (MEK) with water removed was added to dissolve the water-removed polyethylene glycol (PEG). In the reactor, 5.86 g of MDI Diluted in 25 g of MEK and added over 2 hours (hr) , The reactant having the viscosity increased after completion of the addition is diluted with 50 g of purified water, the silicone resin layer (26, 36) is formed of a thermosetting resin, and the thermosetting resin is a phenol resin or an epoxy resin , The thickness of the silicone resin layers (26, 36) is 0.1 to 2 탆, and the silicone resin layers (26, 36) are coated and dried by a gravure printing method Gt;

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