CN111712054B - Rapid laminating method for soft board cover film - Google Patents
Rapid laminating method for soft board cover film Download PDFInfo
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- CN111712054B CN111712054B CN202010748921.1A CN202010748921A CN111712054B CN 111712054 B CN111712054 B CN 111712054B CN 202010748921 A CN202010748921 A CN 202010748921A CN 111712054 B CN111712054 B CN 111712054B
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- soft board
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- glue solution
- cutting
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/04—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of metal, e.g. skate blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Milling Processes (AREA)
Abstract
The invention discloses a method for quickly attaching a soft board cover film, which relates to the technical field of preparation of a rigid-flexible board, and comprises three operation steps of soft board cover film treatment, hard board treatment and pressing; according to the invention, through roughening the surface of the hard plate, an uneven micro-plane is formed on the surface of the hard plate, so that the contact area between the hard plate and glue solution is increased, and the glue solution is more firmly adhered; the soft board cover film and the hard board are combined to be subjected to coarsening treatment, so that the adhesion strength of the soft board cover film and the hard board is improved, and the degumming probability of the soft board cover film and the hard board is reduced; by arranging the milling groove and the trapezoidal platform, and enabling the sum of the height of the trapezoidal platform and the thickness of the soft board covering film to be smaller than the depth of the milling groove, the periphery of the raised milling groove has a certain blocking effect on the glue solution, and the overflow of the glue solution can be basically controlled; through the translation formula cover pressure, can catch up the air between soft board cover film and the glue solution contact out, avoid appearing the gas pocket and influence the adhesion effect.
Description
Technical Field
The invention relates to the technical field of preparation of rigid-flexible boards, in particular to a method for quickly attaching a cover film of a flexible board.
Background
The development of electronic products is not separated from the integration technology. With the development of integration technology in reducing the installation volume, the change of electronic products in form is changing day by day, and the most remarkable improvement is that electronic equipment is developing in the direction of light weight, thin thickness and small volume. The existing integration technology is mainly based on flexible printed circuits. The main problem of the flexible printed board in the use process is that the heat dissipation is slower, so the metal substrate which is convenient for heat dissipation is adopted as a bearing to support the rigid-flex board, and the heat dissipation problem can be effectively solved. The metal substrate used in the prior art mainly includes an aluminum substrate, a rigid substrate, a copper substrate, a nickel alloy substrate, and the like. The existing metal substrate and soft film connection process is mainly characterized in that the following technical problems exist in the actual use process of the substrates: firstly, in the soft film laminating process, the glue solution overflows, so that the actual adhesive solution amount for adhesion is reduced, the thickness of the glue layer is reduced, and the adhesion strength is insufficient; secondly, bubbles are easily formed in the glue solution, so that the adhesive strength of the glue solution is insufficient; the two problems finally cause the problem that the soft board covering film is separated from the hard board as the result of insufficient adhesion strength, which is commonly called board explosion. Therefore, a method for quickly attaching a cover film of a flexible printed circuit board is needed to solve the above technical problems.
Disclosure of Invention
The invention aims to provide a method for quickly attaching a soft board cover film, which aims to solve the problems in the background technology.
The invention provides a method for quickly attaching a soft board covering film, which comprises the following steps:
the method comprises the following steps of firstly, overlapping and paving the packing paper and the soft board covering film, cutting the packing paper and the soft board covering film into the same shape by adopting a laser cutting method, flushing the soft board covering film with running water, airing, and then roughening the adhesive-coated surface. The soft board covering film adhesive surface is coarsened, an uneven micro-plane is formed on the surface, the contact area of the soft board covering film and the adhesive liquid is increased, and the adhesive liquid is connected more firmly.
Step two, laying packing paper on the hard board rubber-coated surface, positioning and milling grooves by adopting a scribing method, and then preprocessing the hard board rubber-coated surface: comprises the steps of groove milling, grinding, acid washing, alkali washing, water washing, roughening treatment and airing for later use. Burrs and spikes generated on the surface of the metal plate in the hard groove milling process are removed through polishing, so that the soft plate covering film is prevented from being pierced.
And step three, coating glue solution in the milling groove, wherein the height difference between the glue solution and the milling groove is about the thickness of one soft board cover film, covering the soft board cover film on the glue solution, translating a pressing film from left to right by a pressing roller, wherein the pressure of the pressing roller is 0.1MPa, and the moving speed is 0.1-0.3 m/s.
As a preferable scheme, in the first step, the laser cutting frequency is 50-60kHz, the cutting rate is 350-450mm/s, the cutting power is 3-5W, nitrogen is used as a protective gas in the cutting process, and the preset nitrogen pressure before cutting is 1.0 MPa.
As a preferable scheme, the depth of the milling groove is 0.5-0.6mm, trapezoidal support platforms which are mutually perpendicular and staggered are arranged in the milling groove, the height of each trapezoidal support platform is 0.1-0.3mm, the trapezoidal support platforms divide the inside of the milling groove into equal glue containing pits, and the distance between two adjacent parallel trapezoidal support platforms is 0.5-1.0 cm; the periphery of the milling groove is tightly connected with the periphery of the soft board covering film.
Preferably, the thickness of the soft board covering film is 0.3-0.4, and the sum of the thickness of the soft board covering film and the thickness of the trapezoid supporting platform is less than the depth of the milling groove.
The milling groove is arranged, the sum of the height of the supporting platform and the thickness of the soft board covering film is smaller than the depth of the milling groove, and the peripheral side walls in the milling groove are in close contact with the periphery of the soft board covering film, so that glue solution can be prevented from overflowing from the milling groove, and the bonding thickness of the glue solution is ensured; through set up trapezoidal supporting platform in milling flutes inside, divide into one by one and hold gluey hole through trapezoidal supporting platform in with milling flutes, can increase the adhesive solution use amount and glue bonding strength. The soft board covering film can be protected in the pressing process by arranging the trapezoidal platform.
As a preferable scheme, the grinding and roughening areas in the second step are a bottom area of the milling groove, an upper bottom surface and a side surface of the trapezoidal platform, the roughening tool is a steel brush, and the grinding tool is sand paper.
All polish through the steel brush to bottom surface and side on milling flutes bottom region, the trapezoidal platform, can make hardboard surface form unevenness's micro-plane, increase hardboard and glue solution area of contact, improve glue solution and hardboard adhesion strength.
As a preferred scheme, the groove milling operation in the second step adopts an MX230 milling cutter with the diameter of 1mm, the rotation speed of the milling cutter of 4500-; and after each cutting, adopting tap water to spray the cutter face and the hard plate for cooling.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the soft board covering film adhesive surface is subjected to roughening treatment, and an uneven micro-plane is formed on the surface, so that the contact area of the soft board covering film and the adhesive is increased; the surface of the hard plate is roughened, so that an uneven micro-plane is formed on the surface of the hard plate, the contact area of the hard plate and the glue solution is increased, and the glue solution is more firmly adhered; the soft board cover film and the hard board are combined to be subjected to coarsening treatment, so that the adhesion strength of the soft board cover film and the hard board is improved, and the degumming probability of the soft board cover film and the hard board is reduced; by arranging the milling groove and the trapezoidal platform, and enabling the sum of the height of the trapezoidal platform and the thickness of the soft board covering film to be smaller than the depth of the milling groove, the periphery of the raised milling groove has a certain blocking effect on the glue solution, and the overflow of the glue solution can be basically controlled; through the translation formula cover pressure, can catch up the air between soft board cover film and the glue solution contact out, avoid appearing the gas pocket and influence the adhesion effect.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In one embodiment, the hard plate is an aluminum substrate
The method comprises the following steps of (1) overlapping and paving packing paper and a soft board covering film, cutting the packing paper and the soft board covering film into the same shape by adopting a laser cutting method, wherein the laser cutting frequency is 50kHz, the cutting rate is 350mm/s, the cutting power is 3W, nitrogen is adopted as a protective gas in the cutting process, and the preset nitrogen pressure is 1.0Mpa before cutting; flushing the soft board covering film for 30s with running water, drying, brushing hairs on the glue-coated area of the soft board covering film by using a steel brush, wherein the thickness of the hair layer is 0.3 mm;
laying the cut packing paper on the hard board rubber-covered surface, positioning and milling the groove by adopting a scribing method, and then carrying out the following pretreatment on the hard board rubber-covered surface:
groove milling: fixing the hard plate on a clamp, and adopting an MX230 milling cutter with the diameter of 1mm, the rotation speed of the milling cutter of 5000r/min, the feed per tooth of 0.6um/z and the cutting depth of 30 um; after each cutting, adopting tap water to spray the cutter face and the hard plate for cooling;
the long limit of milling flutes and broadside all flush with the rule, and the milling flutes degree of depth is 0.5mm, and milling flutes inside is equipped with the crisscross trapezoidal brace table of mutually perpendicular, and trapezoidal supporting platform height is 0.1mm, and trapezoidal brace table separates into the gluey hole that holds of one by one impartial in milling flutes inside, and the trapezoidal brace table distance of two adjacent parallels is 0.5cm, and the soft board cover film thickness sum of thickness and trapezoidal brace table is less than the milling flutes degree of depth.
Washing with 0.1mol/L hydrochloric acid, 0.1mol/L sodium hydroxide and deionized water, and then polishing with sand paper for 5 min; after being dried, the hair is coarsened by a steel brush, and the coarsened hair layer is 0.2 mm; airing the ventilated part for later use;
coating glue solution in the milling groove, covering the soft board covering film on the glue solution, wherein the height difference between the glue solution and the milling groove is about the thickness of one soft board covering film, the pressure of a compression roller is 0.1Mpa, and the moving speed is 0.1 m/s.
Meanwhile, the aluminum substrate was used as a hard plate, wherein the aluminum substrate and the soft plate cover film were not subjected to roughening treatment, and as comparative example one, tensile strength, yield strength and peel strength of the two products were measured, and the results are shown in the following table.
Example two copper substrates are hard plates
The method comprises the following steps of (1) overlapping and paving packing paper and a soft board covering film, cutting the packing paper and the soft board covering film into the same shape by adopting a laser cutting method, wherein the laser cutting frequency is 60kHz, the cutting rate is 450mm/s, the cutting power is 5W, nitrogen is adopted as a protective gas in the cutting process, and the preset nitrogen pressure is 1.0Mpa before cutting; flushing the soft board covering film for 30s with running water, drying, brushing hairs on the glue-coated area of the soft board covering film by using a steel brush, wherein the thickness of the hair layer is 0.5 mm;
laying the cut packing paper on the hard board rubber-covered surface, positioning and milling the groove by adopting a scribing method, and then carrying out the following pretreatment on the hard board rubber-covered surface:
groove milling: fixing the hard plate on a clamp by adopting an MX230 milling cutter, wherein the diameter is 1mm, the rotation speed of the milling cutter is 6000r/min, the feed per tooth is 0.7um/z, and the cutting depth is 30 um; after each cutting, adopting tap water to spray the cutter face and the hard plate for cooling;
the long limit of milling flutes and broadside all flush with the rule, and the milling flutes degree of depth is 0.6mm, and milling flutes inside is equipped with the crisscross trapezoidal brace table of mutually perpendicular, and trapezoidal supporting platform height is 0.3mm, and trapezoidal brace table separates into the gluey hole that holds of one by one impartial in milling flutes inside, and the trapezoidal brace table distance of two adjacent parallels is 1.0cm, and the soft board cover film thickness sum of thickness and trapezoidal brace table is less than the milling flutes degree of depth.
Washing with 0.1mol/L hydrochloric acid, 0.1mol/L sodium hydroxide and deionized water, and then polishing with sand paper for 5 min; after being dried, the hair is coarsened by a steel brush, and the coarsened hair layer is 0.5 mm; airing the ventilated part for later use;
coating glue solution in the milling groove, covering the soft board covering film on the glue solution, wherein the height difference between the glue solution and the milling groove is about the thickness of one soft board covering film, the pressure of a compression roller is 0.1Mpa, and the moving speed is 0.3 m/s.
Meanwhile, the copper substrate is adopted as a hard plate, wherein the copper substrate is not subjected to groove milling treatment, the glue solution is directly coated on the surface of the copper substrate, the copper substrate is taken as a comparative example II, the tensile strength, the yield strength and the peeling strength of the two products are measured, and the results are shown in the following table.
Example III Nickel base plate as a hard plate
The method comprises the following steps of (1) overlapping and paving packing paper and a soft board covering film, cutting the packing paper and the soft board covering film into the same shape by adopting a laser cutting method, wherein the laser cutting frequency is 55kHz, the cutting rate is 400mm/s, the cutting power is 4W, nitrogen is adopted as a protective gas in the cutting process, and the preset nitrogen pressure is 1.0Mpa before cutting; flushing the soft board covering film for 30s with running water, drying, brushing hairs on the glue-coated area of the soft board covering film by using a steel brush, wherein the thickness of the hair layer is 0.4 mm;
laying the cut packing paper on the hard board rubber-covered surface, positioning and milling the groove by adopting a scribing method, and then carrying out the following pretreatment on the hard board rubber-covered surface:
groove milling: fixing the hard plate on a clamp by adopting an MX230 milling cutter, wherein the diameter is 1mm, the rotating speed of the milling cutter is 4500r/min, the feed per tooth is 0.5um/z, and the cutting depth is 30 um; after each cutting, adopting tap water to spray the cutter face and the hard plate for cooling;
the long limit of milling flutes and broadside all flush with the rule, and the milling flutes degree of depth is 0.5mm, and milling flutes inside is equipped with the crisscross trapezoidal brace table of mutually perpendicular, and trapezoidal supporting platform height is 0.2mm, and trapezoidal brace table separates into the gluey hole that holds of one by one impartial in milling flutes inside, and the trapezoidal brace table distance of two adjacent parallels is 0.8cm, and the soft board cover film thickness sum of thickness and trapezoidal brace table is less than the milling flutes degree of depth.
Washing with 0.1mol/L hydrochloric acid, 0.1mol/L sodium hydroxide and deionized water, and then polishing with sand paper for 5 min; after being dried, the hair is coarsened by a steel brush, and the coarsened hair layer is 0.3 mm; airing the ventilated part for later use;
coating glue solution in the milling groove, covering the soft board covering film on the glue solution, wherein the height difference between the glue solution and the milling groove is about the thickness of one soft board covering film, the pressure of a compression roller is 0.1Mpa, and the moving speed is 0.2 m/s.
Meanwhile, the nickel-based plate is used as a hard plate, wherein no trapezoidal platform is arranged in the milling groove of the nickel-based plate, and the nickel-based plate is used as a comparative example, and the tensile strength, the yield strength and the peeling strength of two products are measured, and the results are shown in the following table.
As can be seen from the table, the hard board and soft board covering films are subjected to roughening treatment, so that the adhesion between the glue solution and the hard board and the soft board covering films can be effectively improved, and the tensile strength, the peel strength and the yield strength are obviously improved; the milling groove is arranged, so that the glue solution consumption can be increased, and the adhesion strength between the soft board covering film and the hard board is improved; the setting of trapezoidal platform can cover the effect that the membrane played the bearing to the soft board, also prevents simultaneously that the glue solution from spilling over at the pressfitting in-process, so also be favorable to improving the adhesion strength between soft board complex film and the hardboard.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (3)
1. A method for quickly attaching a soft board covering film is characterized by comprising the following steps:
the method comprises the following steps of firstly, stacking packing paper and a soft board covering film, cutting the packing paper and the soft board covering film into the same shape by a laser cutting method, flushing the soft board covering film with running water, airing, and then roughening the adhesive-coated surface;
the laser cutting frequency is 50-60kHz, the cutting rate is 350-450mm/s, the cutting power is 3-5W, nitrogen is used as protective gas in the cutting process, and the preset nitrogen pressure is 1.0Mpa before cutting;
step two, laying packing paper on the hard board rubber-coated surface, positioning and milling grooves by adopting a scribing method, and then preprocessing the hard board rubber-coated surface: comprises the steps of groove milling, grinding, acid washing, alkali washing, water washing, roughening treatment and airing for standby;
the milling groove depth is 0.5-0.6mm, trapezoidal support platforms which are mutually perpendicular and staggered are arranged in the milling groove, the height of each trapezoidal support platform is 0.1-0.3mm, the trapezoidal support platforms divide the inside of the milling groove into equal glue containing pits, and the distance between two adjacent parallel trapezoidal support platforms is 0.5-1.0 cm; the periphery of the milling groove is tightly connected with the periphery of the soft board covering film;
the groove milling operation adopts an MX230 milling cutter with the diameter of 1mm, the rotational speed of the milling cutter of 4500-6000r/min, the feed rate of each tooth of 0.5-0.7um/z and the cutting depth of 30 um; after each cutting, adopting tap water to spray the cutter face and the hard plate for cooling;
and step three, coating glue solution in the milling groove, wherein the height difference between the glue solution and the milling groove is about the thickness of one soft board cover film, covering the soft board cover film on the glue solution, translating a pressing film from left to right by a pressing roller, wherein the pressure of the pressing roller is 0.1MPa, and the moving speed is 0.1-0.3 m/s.
2. The method for rapidly attaching the soft board cover film according to claim 1, wherein the thickness of the soft board cover film is 0.3-0.4, and the sum of the thickness of the soft board cover film and the thickness of the trapezoidal support platform is less than the depth of the milling groove.
3. The method for quickly attaching the cover film to the flexible printed circuit board as claimed in claim 1, wherein the grinding and roughening areas in the second step are a bottom area of the milling groove, a bottom surface and side surfaces of the trapezoidal platform, the roughening tool is a steel brush, and the grinding tool is sand paper.
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| CN202010748921.1A CN111712054B (en) | 2020-07-29 | 2020-07-29 | Rapid laminating method for soft board cover film |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010748921.1A CN111712054B (en) | 2020-07-29 | 2020-07-29 | Rapid laminating method for soft board cover film |
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| CN111712054B true CN111712054B (en) | 2021-09-28 |
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