CN115339185A - Composite base plate and preparation method thereof - Google Patents

Composite base plate and preparation method thereof Download PDF

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Publication number
CN115339185A
CN115339185A CN202111482208.8A CN202111482208A CN115339185A CN 115339185 A CN115339185 A CN 115339185A CN 202111482208 A CN202111482208 A CN 202111482208A CN 115339185 A CN115339185 A CN 115339185A
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layer
composite
deformation
adhesive
thickness
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CN115339185B (en
Inventor
魏美晓
张伦强
王万兵
蒲强
杨柳
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Kunshan Liuxin Electronics Co ltd
Shenzhen Newccess Industrial Co ltd
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Kunshan Liuxin Electronics Co ltd
Shenzhen Newccess Industrial Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a composite base plate and a preparation method thereof, wherein the composite base plate is used for drilling a PCB deformed plate with the thickness larger than 3.0mm, and comprises a first burr inhibiting layer, a first adhesive layer, a deformed layer, a second adhesive layer and a second burr inhibiting layer which are sequentially stacked from bottom to top. The composite base plate provided by the invention has the characteristics of easy deformation, strong support property and high hardness, and when a hole is drilled, the PCB deformation plate and the composite base plate are locked, and the composite base plate can deform and is tightly attached to the warped surface of the PCB deformation plate, so that the effect of inhibiting the burr of the drilled hole is achieved. The use mode of the composite backing plate provided by the invention is the same as that of a conventional backing plate, and both sides of the composite backing plate can be used.

Description

Composite base plate and preparation method thereof
Technical Field
The invention relates to the technical field of PCB drilling, in particular to a composite base plate and a preparation method thereof.
Technical Field
The backing plate is a material which is arranged below a board to be processed when a printed circuit board (PCB for short) is mechanically drilled to improve the drilling effect. The PCB backing plate has the following main effects: (1) suppressing burrs at the outlet of the drill hole; (2) improving vacancy accuracy; (3) reducing the temperature of the drill point; and (4) protecting the drilling machine table. The types of the PCB backing plate mainly include: medium density wood pulp board, high density wood pulp board, melamine wood base plate, phenolic paper base plate, composite wood base plate, etc. At present, in the processing process of a printed circuit board, the PCB board which is processed and manufactured is slightly deformed under the influence of various uncertain factors such as raw materials, processing technology, equipment, human factors and the like, the board is warped and cannot be tightly attached to a base plate, the problems of overlarge burr of a drilling hole, broken pins and the like are caused, and therefore the deformation of the PCB board can greatly influence the drilling processing. If the PCB is thin (less than 3.0 mm), the warping deformation of the drilling position of the PCB can be changed by properly increasing the pressure of the pressure pin during drilling processing, so that the PCB is tightly attached to the base plate, and the drilling hole cannot generate an overlarge burr; if the PCB is thick (more than 3.0 mm), the pressure of the pressure pin is difficult to change the warping deformation of the PCB, the PCB cannot be tightly attached to the backing plate, so that a gap exists, and drilling easily generates a large burr and other drilling problems, thereby affecting the quality. Therefore, when the PCB is thick, the pressure foot can not improve the deformation of the PCB, and the inhibition effect of the common base plate on the flash can be weakened. At present, the problem of burr of the PCB deformed plate during drilling is not effectively solved. Although the related art proposes to coat a layer of coating on the surface of a PCB deformation board to inhibit the burr of a drilling hole, new processes such as coating, curing, stripping and the like and related equipment are required to be added, the operation is complex, the time and the labor are consumed, the cost is high, and more waste water and waste residue are easily generated.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a composite base plate and a preparation method thereof, and aims to solve the problem that when the base plate is used for drilling a warped PCB (printed circuit board) deformed plate with the thickness of more than 3.0mm, the base plate and the PCB deformed plate cannot be tightly attached to each other, so that a large flash is generated.
The technical scheme of the invention is as follows:
the utility model provides a composite backing plate, wherein, is used for the PCB deformation board drilling that thickness is greater than 3.0mm, composite backing plate includes that the supreme first cutting edge of a knife or a sword suppression layer, first gluing agent layer, deformation layer, second gluing agent layer and the second that stacks gradually from down drape over a knife or a sword suppression layer.
The composite base plate is used for drilling the PCB deformed plate with the thickness of 3-8mm and the warping degree of less than or equal to 2mm.
The composite backing plate is characterized in that the deformation layer is made of one material selected from sponge, EVA and EPE.
The composite backing plate is characterized in that the hardness of the sponge is 65-99HF, and the density of the EVAIs 10-50kg/m 3 The density of the EPE is 15-30kg/m 3 。
The composite backing plate is characterized in that the thickness of the deformation layer is greater than or equal to the warping degree of the PCB deformation plate.
The composite backing plate is characterized in that the first and second flash inhibiting layers are independently selected from one of aluminum sheets, PET (polyethylene terephthalate), cold punching plates, PP (polypropylene), PVC (polyvinyl chloride), acrylic plates and iron sheets.
The composite base plate is characterized in that the hardness of the first flash inhibition layer is 2B-9H, and the thickness of the first flash inhibition layer is 0.1-1.0mm; the hardness of the second burr inhibition layer is 2B-9H, and the thickness of the second burr inhibition layer is 0.1-1.0mm.
The composite base plate is characterized in that the first adhesive layer and the second adhesive layer are made of one material independently selected from hot melt adhesive, epoxy adhesive, polyurethane adhesive, acrylate AB adhesive, alpha-cyanoacrylate adhesive, photosensitive adhesive, organic silicon rubber adhesive, UV ultraviolet and anaerobic adhesive.
A method for preparing a composite backing plate comprises the following steps:
providing a deformation layer, and coating an adhesive on the lower surface of the deformation layer;
attaching the first flash suppression layer to the lower surface of the deformation layer and carrying out curing treatment;
coating an adhesive on the upper surface of the deformation layer;
and attaching the second flash suppression layer to the upper surface of the deformation layer and carrying out curing treatment to obtain the composite base plate.
The preparation method of the composite base plate comprises the step of coating in a brush coating, spraying or roller coating mode.
Has the advantages that: the invention provides a composite base plate which comprises a first flash inhibition layer, a first adhesive layer, a deformation layer, a second adhesive layer and a second flash inhibition layer which are sequentially stacked from bottom to top. According to the invention, by utilizing the characteristics of easy deformation, strong support property and high hardness of the composite base plate, the PCB deformation plate and the composite base plate are locked during drilling, so that the composite base plate is bent and deformed and is tightly attached to the warping part of the PCB deformation plate, the effect of inhibiting the burr generation of drilling is achieved, the composite base plate is mainly suitable for the PCB with small warping deformation amplitude, the thickness is 3-8mm, and the warping is less than or equal to 2mm.
Drawings
Fig. 1 is a schematic structural diagram of a composite tie plate according to the present invention.
Detailed Description
The invention provides a composite base plate and a preparation method thereof, and the invention is further explained in detail below in order to make the purpose, technical scheme and effect of the invention clearer and more clear. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Because the PCB board that thickness is more than 3mm all is the rigid body with current backing plate, so when the drilling of PCB board, this kind of thick PCB board deformation region is difficult to closely laminate with the backing plate, and backing plate this moment can't effectively restrain and drape over one's shoulders the cutting edge of a knife or a sword, and the place that does not have the backing plate to support drapes over one's hair greatly, needs the manual work to get rid of, and consuming time and wasting force and increase cost. The prior art usually inhibits the burr of the drilled hole by coating a layer of coating on the surface of a PCB deformation plate, but the treatment mode needs to add new processes such as coating, curing, stripping and the like and related equipment, so that the operation is complex, the time and the labor are consumed, the cost is high, more waste water and waste residue are easily generated, and the environment is polluted.
Based on this, the invention provides a composite pad plate, which is used for drilling a deformed PCB with a thickness greater than 3.0mm, and as shown in fig. 1, the composite pad plate comprises a first flash suppression layer 10, a first adhesive layer 20, a deformation layer 30, a second adhesive layer 40 and a second flash suppression layer 50 which are sequentially stacked from bottom to top.
The composite backing plate comprises a deformation layer 30 arranged in the middle, and a second flash inhibition layer 50 and a first flash inhibition layer 10 which are bonded on the upper surface and the lower surface of the deformation layer 30 through adhesives, and has the characteristics of easy deformability, strong support and high hardness. The use mode of the composite backing plate provided by the invention is the same as that of a conventional backing plate, and both sides of the composite backing plate can be used.
In some embodiments, the composite backing plate provided by the invention is mainly used for drilling the PCB deformation plate with the thickness of 3-8mm and the warping degree of less than or equal to 2mm, and the material of the deformation layer is selected from 65-99HF sponge with hardness and the density of 10-50kg/m 3 Has a density of 15-30kg/m 3 One of the EPEs of (1).
In this embodiment, since the thickness of the PCB deformation plate is 3 to 8mm, and the warping degree is less than or equal to 2mm, it indicates that the PCB deformation plate is a rigid plate and has a small deformation degree, and if the material of the deformation layer is selected from sponge, the hardness of the deformation layer is 65 to 99HF. The deformation layer defined in this embodiment has better deformability and support, and if the hardness of the deformation layer is too low (less than 65 HF), the flash suppression capability of the composite backing plate is weak; if the hardness of the deformation layer is too high (greater than 99 HF), the deformation amplitude of the composite base plate is small, so that the attaching degree of the PCB deformation plate and the composite base plate is low, and the burr suppression effect of the composite base plate is poor.
In this embodiment, if the material of the deformation layer is selected from EVA, the density is 10-50kg/m 3 (ii) a If the material of the deformation layer is selected from EPE, its density is 15-30kg/m 3 。
In some embodiments, the thickness of the deformation layer may be selected according to a warpage of a PCB deformation board, and the thickness of the deformation layer is greater than or equal to the warpage of the PCB deformation board. Because, if the thickness of deformation layer is less than the angularity of PCB deformation board, it is less to explain the deformation range of deformation layer, can cause PCB deformation board and compound backing plate laminating degree step-down to lead to compound backing plate to drape over one's shoulders the cutting edge of a knife or a sword suppression effect poor easily. By way of example, the thickness of the deformation layer is 1-10mm, and the thickness of the deformation layer is not too thick, because too thick deformation layer affects the drilling depth of the drill point.
In some embodiments, the first and second flash suppression layers are independently selected from one of aluminum sheet, PET, cold punching sheet, PP, PVC, acrylic sheet, and iron sheet, but are not limited thereto. Preferably PET, cold-drawn plate.
In some embodiments, the first flash suppression layer has a hardness of 2B to 9H and a thickness of 0.1 to 1.0mm; the hardness of the second flash inhibition layer is 2B-9H, and the thickness is 0.1-1.0mm. The first flash suppressing layer and the second flash suppressing layer defined in this embodiment both have to have high hardness, flexibility, and high support. If the hardness of the first and second flash suppression layers is soft (less than 2B), the flash suppression capability of the pad plate is weak, and if the hardness of the first and second flash suppression layers is hard (greater than 9H), the bending amplitude is small, the bonding degree of the PCB deformation plate and the pad plate is reduced, and the flash suppression capability of the pad plate is easily weak. Similarly, if the thicknesses of the first and second burr suppressing layers are too thin (less than 0.1 mm), the support performance is low, which tends to weaken the burr suppressing capability of the pad, and if the thicknesses of the first and second burr suppressing layers are too thick (greater than 1.0 mm), the bending width is small, which tends to weaken the burr suppressing capability of the pad due to the reduction in the degree of adhesion between the PCB deformation plate and the composite pad.
In some embodiments, the material of the first adhesive layer and the second adhesive layer is independently selected from one of a hot melt adhesive, an epoxy adhesive, a polyurethane adhesive, an acrylate AB adhesive, an α -cyanoacrylate adhesive, a photosensitive adhesive, a silicone rubber adhesive, a UV ultraviolet ray, and an anaerobic adhesive, but is not limited thereto. In this embodiment, the thickness of first gluing agent layer with the second gluing agent layer is 3-50um, first gluing agent layer with the second gluing agent layer must have strong adhesion, if the thickness of first gluing agent layer with the second gluing agent layer is thin then the adhesion is poor, if the thickness of first gluing agent layer with the second gluing agent layer is thick, then not only with high costs and appear kinking easily when drilling, influence PCB deformation board drilling quality.
In some embodiments, there is also provided a method of making a composite mat, comprising the steps of: providing a deformation layer, and coating an adhesive on the lower surface of the deformation layer; attaching the first flash suppression layer to the lower surface of the deformation layer and carrying out curing treatment; then coating an adhesive on the upper surface of the deformation layer; and attaching a second flash suppression layer to the upper surface of the deformation layer and carrying out curing treatment to obtain the composite base plate. In this embodiment, the coating is performed by brushing, spraying or rolling.
The invention is further illustrated by the following specific examples:
example 1
Selecting sponge with the thickness of 3mm and the hardness of 85HF as a deformation layer, selecting PET with the thickness of 0.5mm as a higher-hardness burring inhibition layer, and selecting polyurethane glue as an adhesive;
coating polyurethane adhesive on the lower surface of a sponge with the thickness of 3mm and the hardness of 85HF (hydrogen fluoride), coating the polyurethane adhesive on the lower surface of the sponge with the thickness of 30um, then attaching a piece of PET with the thickness of 0.5mm to the lower surface of the sponge, and baking the PET for 10min at 80 ℃ for curing;
the polyurethane adhesive is coated on the upper surface of a sponge with the thickness of 3mm and the hardness of 85HF in a roller mode, the coating thickness is 30 microns, then another piece of PET with the thickness of 0.5mm is attached to the upper surface of the sponge in a laminating mode, the PET is baked for 10min at the temperature of 80 ℃ and solidified, a composite base plate (1) is manufactured, the thickness is about 4mm, the thickness of a PCB used for testing is 5mm, and the warping is 2mm.
Example 2
Selecting sponge with the thickness of 3mm and the hardness of 95HF as a deformation layer, selecting a cold punching plate with the thickness of 0.3mm as a burr inhibition layer with higher hardness, and selecting epoxy glue as an adhesive;
coating an epoxy rubber roller on the lower surface of a sponge with the thickness of 3mm and the hardness of 95HF, coating the lower surface of the sponge with the thickness of 30 micrometers, then attaching a cold punching plate with the thickness of 0.3mm to the lower surface of the sponge, baking for 5min at 100 ℃, and curing;
the epoxy rubber roller is coated on the upper surface of a sponge with the thickness of 3mm and the hardness of 95HF in a roller manner, the coating thickness is 30 microns, then another cold punching plate with the thickness of 0.3mm is attached to the upper surface of the sponge in a laminating manner, the cold punching plate is baked at 100 ℃ for 5min and solidified, and a composite base plate (2) with the thickness of about 3.6mm, the thickness of a PCB (printed circuit board) used for testing is 7.5mm, and the warping is 2mm is prepared.
Example 3
The density of the selected thickness is 3mm and 38kg/m 3 The EVA is used as a deformation layer, a cold punching plate with the thickness of 0.3mm is used as a flash suppression layer with higher hardness, and epoxy glue is used as an adhesive;
coating an epoxy rubber roller on a rubber roller with the thickness of 3mm and the density of 38kg/m 3 Coating the lower surface of the EVA with the thickness of 30um, then attaching a cold punching plate with the thickness of 0.3mm to the lower surface of the EVA, baking for 5min at 100 ℃ and curing;
the epoxy rubber roller is coated on the roller with the thickness of 3mm and the density of 38kg/m 3 Coating thickness is 30um, then with another piece thickness be 0.3 mm's cold punching plate laminating adhesion at the EVA upper surface, 100 ℃ toasts 5min solidification, makes composite backing plate (3), and thickness is about 3.6mm, and the used PCB board of test is thick 5mm, warpage 1mm.
Example 4
The density of the product is 25kg/m and the thickness is 3mm 3 The EPE is used as a deformation layer, a cold punching plate with the thickness of 0.3mm is used as a flash suppression layer with higher hardness, and epoxy glue is used as an adhesive;
the epoxy rubber roller is coated on a thickness of 3mm and the density is 25kg/m 3 Coating the lower surface of the EPE with the thickness of 30um, then attaching a cold punching plate with the thickness of 0.3mm to the lower surface of the EPE, baking for 5min at 100 ℃ and curing;
coating the epoxy rubber roller on a roller with the thickness of 3mm and the density of 25kg/m 3 The upper surface of the EPE is coated with a coating thickness of 30um, then another cold punching plate with the thickness of 0.3mm is adhered to the upper surface of the EPE, the composite backing plate (3) is prepared by baking for 5min at 100 ℃ and curing, the thickness is about 3.6mm, and the thickness of the PCB used for testing is 5mm, and the warping is 1mm.
Example 5
The density of the selected material is 38kg/m with the thickness of 3mm 3 The EVA is used as a deformation layer, an aluminum sheet with the thickness of 0.3mm is used as a higher-hardness flash suppression layer, and epoxy glue is used as an adhesive;
the epoxy rubber roller is coated on a thickness of 3mm and the density is 38kg/m 3 The coating thickness of the lower EVA surface is 30um, and then an aluminum sheet with the thickness of 0.3mm is adhered to the lower EVA surface at 100 DEG CBaking for 5min for curing;
roller coating an epoxy rubber roller to the thickness of 3mm and the density of 38kg/m 3 The EVA upper surface of (1) coating thickness is 30um, then with another aluminum sheet laminating adhesion that thickness is 0.3mm the EVA upper surface is toasted 5min solidification at 100 ℃ to make compound backing plate (3), and thickness is about 3.6mm, and the used PCB of test is thick 6mm, warpage 1mm.
Example 6
The composite mats prepared in examples 1 to 5 were subjected to a drilling test under conditions of a hole diameter of 0.35mm and a hole number of 500 holes, and the results of the test are shown in table 1:
TABLE 1 results of drilling experiments
Backing plate Hardness of pencil Drill flash
Composite wood base plate B 100.2um
Deformation cushion plate (1) 2H 25.4um
Deformation backing board (2) 6H 22.5um
Deformation cushion plate (3) 6H 16.5um
Deformation cushion plate (4) 6H 18.6um
Deformation cushion plate (5) H 20.5um
As can be seen from the drilling experiment results in Table 1, the composite backing plate prepared by the embodiment of the invention has an excellent burr inhibition effect and meets the PCB drilling standard requirements.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.

Claims (10)

1. The utility model provides a composite backing plate which characterized in that for the PCB deformation board drilling that thickness is greater than 3.0mm, composite backing plate includes that the supreme first front of a knife or a sword suppression layer, first gluing agent layer, deformation layer, second gluing agent layer and the second that stacks gradually of follow drape over a knife or a sword suppression layer down.
2. The composite backing plate of claim 1, wherein the composite backing plate is used for drilling a PCB deformed plate with the thickness of 3-8mm and the warping degree of less than or equal to 2mm.
3. The composite mat according to any one of claims 1 to 2, wherein the material of the deformation layer is selected from one of sponge, EVA and EPE.
4. The composite mat of claim 3, wherein the sponge has a hardness of 65-99HF and the EVA has a density of 10-50kg/m 3 The density of the EPE is 15-30kg/m 3 。
5. The composite underlay sheet of claim 3, wherein the thickness of the deformation layer is equal to or greater than the warp degree of the PCB deformation board.
6. The composite shim plate of any of claims 1-2, wherein the first and second flash suppression layers are independently selected from one of aluminum sheet, PET, cold punching sheet, PP, PVC, acrylic sheet, and iron sheet.
7. The composite tie plate of claim 6, wherein the first flash inhibiting layer has a hardness of 2B-9H and a thickness of 0.1-1.0mm; the hardness of the second flash inhibition layer is 2B-9H, and the thickness is 0.1-1.0mm.
8. The composite mat of any of claims 1-2, wherein the material of the first adhesive layer and the second adhesive layer is independently selected from one of a hot melt adhesive, an epoxy adhesive, a polyurethane adhesive, an acrylate AB adhesive, an α -cyanoacrylate adhesive, a photosensitive adhesive, a silicone rubber adhesive, a UV ultraviolet light, and an anaerobic adhesive.
9. A method of manufacturing a composite mat according to any of claims 1 to 8, comprising the steps of:
providing a deformation layer, and coating an adhesive on the lower surface of the deformation layer;
attaching the first flash suppression layer to the lower surface of the deformation layer and carrying out curing treatment;
coating an adhesive on the upper surface of the deformation layer;
and attaching the second flash suppression layer to the upper surface of the deformation layer and carrying out curing treatment to obtain the composite base plate.
10. The method for preparing the composite mat according to claim 9, wherein the coating is performed by brushing, spraying or rolling.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104260425A (en) * 2014-09-22 2015-01-07 烟台天奕电子有限公司 Base plate for PCB drilling and manufacturing method of base plate for PCB drilling
CN212876208U (en) * 2020-10-09 2021-04-02 深圳市宏宇辉科技有限公司 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104260425A (en) * 2014-09-22 2015-01-07 烟台天奕电子有限公司 Base plate for PCB drilling and manufacturing method of base plate for PCB drilling
CN212876208U (en) * 2020-10-09 2021-04-02 深圳市宏宇辉科技有限公司 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device

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