CN115339204A - Combined backing board - Google Patents

Combined backing board Download PDF

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Publication number
CN115339204A
CN115339204A CN202111482056.1A CN202111482056A CN115339204A CN 115339204 A CN115339204 A CN 115339204A CN 202111482056 A CN202111482056 A CN 202111482056A CN 115339204 A CN115339204 A CN 115339204A
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Prior art keywords
layer
deformation
pcb
base plate
thickness
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CN202111482056.1A
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Chinese (zh)
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CN115339204B (en
Inventor
魏美晓
张伦强
王万兵
蒲强
杨柳
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Kunshan Liuxin Electronics Co ltd
Shenzhen Newccess Industrial Co ltd
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Kunshan Liuxin Electronics Co ltd
Shenzhen Newccess Industrial Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/32—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed at least two layers being foamed and next to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0214—Materials belonging to B32B27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a combined base plate, which is used for drilling a PCB (printed Circuit Board) deformation plate with the thickness of more than 3.0mm, and comprises a deformation layer and a flash suppression layer arranged on the deformation layer. The combined base plate provided by the invention comprises the burr inhibiting layer and the deformation layer which are arranged in a stacked mode, so that the combined base plate has the characteristics of easiness in deformation, strong support property and high hardness, the PCB deformation plate and the combined base plate are locked during drilling, the combined base plate can deform and is tightly attached to the warped surface of the PCB deformation plate at the moment, the effect of inhibiting burr generation during drilling is achieved, the burr inhibiting layer is replaced after drilling and is recombined with the original deformation layer, and the formed combined base plate can be repeatedly used. The use mode of the combined base plate provided by the invention is the same as that of the conventional base plate, the use is simple and convenient, but partial materials can be repeatedly used after being recombined; compared with the existing method for inhibiting the flash by coating the coating on the PCB deformed plate, the method does not need to add new process and equipment, and increases the production efficiency.

Description

Combined backing board
Technical Field
The invention relates to the technical field of PCB drilling, in particular to a combined base plate.
Technical Field
The backing plate is a material which is arranged below a board to be processed when a printed circuit board (PCB for short) is mechanically drilled to improve the drilling effect. The PCB backing plate has the following main effects: (1) suppressing burrs at the outlet of the drill hole; (2) improving vacancy accuracy; (3) reducing the temperature of the drill point; and (4) protecting the drilling machine. The types of the PCB backing plate mainly include: medium density wood pulp board, high density wood pulp board, melamine wood base board, phenolic paper base board, composite wood base board, etc. At present, in the process of processing a printed circuit board, the processed and manufactured PCB board is slightly deformed under the influence of various uncertain factors such as raw materials, processing technology, equipment, human factors and the like, the board is warped, and cannot be tightly attached to a base plate, so that the problems of overlarge burr of a drill hole, broken pins and the like are caused, and the deformation of the PCB board can greatly influence the drilling processing. If the PCB is thin (less than 3.0 mm), the warping deformation of the drilling position of the PCB can be changed by properly increasing the pressure of the pressure foot during drilling processing, so that the PCB is tightly attached to the base plate, and the drilling does not generate an overlarge burr; if the PCB is thick (more than 3.0 mm), the warping deformation of the PCB is difficult to change due to the pressure of the pressure foot, the PCB cannot be tightly attached to the base plate, a gap exists between the PCB and the base plate, and the drilling easily generates a large burr and other drilling problems, so that the quality is affected. Therefore, when the PCB is thick, the deformation of the PCB cannot be improved by the pressure foot, and the inhibition effect of the common base plate on the flash of the PCB is weakened. At present, the problem of burr of the PCB deformed plate during drilling is not effectively solved. Although the related art proposes to coat a layer of coating on the surface of a PCB deformation board to inhibit the burr of a drilling hole, new processes such as coating, curing, stripping and the like and related equipment are required to be added, the operation is complex, the time and the labor are consumed, the cost is high, and more waste water and waste residue are easily generated.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, an object of the present invention is to provide a combined pad plate, which aims to solve the problem that when the pad plate is used for drilling a warped PCB deformed plate with a thickness greater than 3.0mm, the pad plate and the PCB deformed plate cannot be tightly attached to each other, resulting in a large burr.
The technical scheme of the invention is as follows:
a combined base plate is used for drilling a PCB (printed circuit board) deformation plate with the thickness larger than 3.0mm, and comprises a deformation layer and a flash suppression layer arranged on the deformation layer.
The combined base plate is characterized in that when the thickness of the PCB deformation plate is 3-8mm and the warping degree is less than or equal to 2mm, the deformation layer is a single-layer deformation layer, and the single-layer deformation layer is made of one of sponge, EVA and EPE in hardness.
The combined backing plate is characterized in that the hardness of the sponge is 65-99HF, and the density of the EVA is 10-50kg/m 3 The density of the EPE is 15-30kg/m 3 。
The combined base plate is characterized in that the thickness of the deformation layer is larger than or equal to the warping degree of the PCB deformation plate.
The combined base plate is characterized in that when the thickness of the PCB deformation plate is 3-8mm, the warping degree is not less than 2 and not more than 6mm, the deformation layer is a double-layer deformation layer, the double-layer deformation layer is composed of an easily deformable layer, an adhesive layer and a high-strength supporting layer which are sequentially stacked, the easily deformable layer is made of sponge with the hardness of 25-65HF, the high-strength supporting layer is made of 75-99HF sponge with the hardness and the density of 38-85kg/m 3 EVA (ethylene-vinyl acetate copolymer) with the density of 15-40kg/m 3 EPE and a density of 30-60kg/m 3 In EPS ofTo one of (1).
The combined base plate is characterized in that the adhesive layer is made of one of a hot melt adhesive, an epoxy adhesive, a polyurethane adhesive, an acrylate AB adhesive, an alpha-cyanoacrylate adhesive, a photosensitive adhesive, an organic silicon rubber adhesive, a UV ultraviolet ray adhesive and an anaerobic adhesive.
The combined base plate is characterized in that the thickness of the easy-deformation layer is larger than the warping degree of the PCB deformation plate, and the thickness of the high-strength supporting layer is 1-5mm; the thickness of the adhesive layer is 3-50um.
The combined base plate is characterized in that the flash suppression layer is one of an aluminum sheet, PET (polyethylene terephthalate), a cold punching sheet, PP (polypropylene), PVC (polyvinyl chloride), an acrylic sheet and an iron sheet.
The combined base plate is characterized in that the hardness of the flash inhibition layer is 2B-9H, and the thickness of the flash inhibition layer is 0.1-1.0mm.
Has the advantages that: the invention provides a combined base plate which comprises a flash suppression layer and a deformation layer arranged on the flash suppression layer. The invention utilizes the characteristics of easy deformation, strong support and high hardness of the combined base plate, locks the PCB deformation plate and the base plate when drilling, leads the PCB deformation plate to be tightly attached to the base plate, achieves the effect of inhibiting the burr generation of the drilling, replaces the burr inhibiting layer after drilling and is recombined with the deformation layer, and the formed combined base plate can be repeatedly used.
Drawings
Fig. 1 is a schematic structural view of a combined backing plate of the present invention.
Detailed Description
The present invention provides a combined backing board, and in order to make the purpose, technical scheme and effect of the present invention more clear and definite, the present invention is further explained in detail below. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Because the PCB board that thickness is more than 3mm all is the rigid body with current backing plate, so when the drilling of PCB board, this kind of thick PCB board deformation region is difficult to closely laminate with the backing plate, and backing plate this moment can't effectively restrain and drape over one's shoulders the cutting edge of a knife or a sword, and the place that does not have the backing plate to support drapes over one's hair greatly, needs the manual work to get rid of, and consuming time and wasting force and increase cost. The prior art usually inhibits the burr of the drill hole by coating a layer of coating on the surface of the PCB deformed plate, but the treatment mode needs to add new processes such as coating, curing, stripping and the like and related equipment, so that the operation is complex, the time and the labor are consumed, the cost is high, more waste water and waste residue are easily generated, and the environment is polluted.
Based on this, the invention provides a combined backing plate for drilling a PCB deformation plate with the thickness of more than 3.0mm, as shown in FIG. 1, the combined backing plate comprises a deformation layer 10 and a flash suppression layer 20 arranged on the deformation layer 10.
The combined base plate provided by the invention comprises the burr inhibiting layer and the deformation layer which are arranged in a stacked mode, so that the combined base plate has the characteristics of easiness in deformation, strong support property and high hardness, the PCB deformation plate and the combined base plate are locked during drilling, the combined base plate can deform and is tightly attached to the warped surface of the PCB deformation plate at the moment, the effect of inhibiting burr generation during drilling is achieved, the burr inhibiting layer is replaced after drilling and is recombined with the original deformation layer, and the formed combined base plate can be repeatedly used. The use mode of the combined base plate provided by the invention is the same as that of the conventional base plate, the use is simple and convenient, but partial materials can be repeatedly used after being recombined; compared with the existing method for inhibiting the flash by coating the coating on the PCB deformed plate, the method does not need to add new process and equipment, and increases the production efficiency.
In some embodiments, when the thickness of the PCB deformation plate is 3-8mm and the warpage is less than or equal to 2mm, the deformation layer is a single-layer deformation layer, and the single-layer deformation layer is made of one of sponge, EVA and EPE.
In this embodiment, since the thickness of the PCB deformation board is 3-8mm, and the warping degree is less than or equal to 2mm, it indicates that the PCB deformation board is a rigid board and has a small deformation degree, the deformation layer of the combined backing plate may be a single-layer deformation layer, and the single-layer deformation layer is made of one of sponge, EVA (ethylene vinyl acetate copolymer) and EPE (expandable polyethylene, also called pearl wool), but not limited thereto.
In this embodiment, if the material of the single-layer deformation layer is sponge, the hardness of the sponge is 65 to 99HF. The deformation layer defined in this embodiment has better deformability and supportability, and if the hardness of the deformation layer is too low (less than 65 HF), the flash suppression capability of the combined base plate is weak; if the hardness of the deformation layer is too high (greater than 99 HF), the deformation amplitude of the combined base plate is small, so that the joint degree of the PCB deformation plate and the combined base plate is low, and the burr suppression effect of the combined base plate is poor.
In this embodiment, if the single-layer deformation layer is made of EVA, the density of the EVA is 10-50kg/m 3 (ii) a If the single-layer deformation layer is made of EPE, the density of the EPE is 15-30kg/m 3 。
In some embodiments, the thickness of the deformation layer may be selected according to a warpage of a PCB deformation board, and the thickness of the deformation layer is greater than or equal to the warpage of the PCB deformation board. Because, if the thickness of deformation layer is less than the angularity of PCB deformation board, the deformation range that explains the deformation layer is less, can cause PCB deformation board and combination backing plate laminating degree step-down to lead to easily that combination backing plate flash suppression effect is poor. By way of example, the deformation layer has a thickness of 1-10mm, and the deformation layer is not too thick, because too thick deformation layer affects the penetration depth of the drill pin.
In some embodiments, when the thickness of the PCB deformation plate is 3-8mm, the warping degree is more than or equal to 2 and less than or equal to 6mm, the deformation layer is a double-layer deformation layer, the double-layer deformation layer consists of an easily deformable layer, an adhesive layer and a high-strength supporting layer which are sequentially stacked, the easily deformable layer is made of a sponge with the hardness of 25-65HF, the high-strength supporting layer is made of a sponge with the hardness of 75-99HF and the density of 38-85kg/m 3 EVA (ethylene-vinyl acetate copolymer) with the density of 15-40kg/m 3 EPE and a density of 30-60kg/m 3 The EPS of (1).
In this embodiment, since the thickness of the PCB deformation plate is 3-8mm and the warping degree is 2 or more and 6mm or less, it indicates that the PCB deformation plate is a rigid plate and has a large deformation degree, and the deformation layer of the combined backing plate may be a double-layer deformation layer. The combined base plate formed by the double-layer deformation layer and the flash suppression layer has large deformation amplitude, and can be tightly attached to a PCB (printed circuit board) deformation plate during drilling, so that the combined base plate has an excellent flash suppression effect.
In this embodiment, the deformable layer is a sponge with a hardness of 25-65HF, and the thickness of the deformable layer is greater than the warping degree of the PCB deformable plate. The easily deformable layer in this embodiment has excellent deformability, and if the hardness of the easily deformable layer is too high (greater than 65 HF), the deformation range is small, which may reduce the adhesion between the PCB deformable plate and the composite pad plate, and may easily result in weak burr suppression capability of the composite pad plate, and if the hardness of the easily deformable layer is too low (less than 25 HF), the support property is low, which may easily result in weak burr suppression capability of the composite pad plate. In this embodiment, the thickness of the layer of easily transforming can be selected according to the warpage of PCB deformation board, the thickness more than or equal to of the layer of easily transforming the warpage of PCB deformation board. Because, if the thickness of easy deformation layer is less than the angularity of PCB deformation board, it is less to explain the deformation range of easy deformation layer, can cause PCB deformation board and combination backing plate laminating degree step-down to lead to easily that combination backing plate flash of a shawl suppresses the effect poor. By way of example, the thickness of the easily deformable layer is 2-10mm, and the thickness of the easily deformable layer is not too thick, because too thick easily deformable layer affects the drilling depth of the drill point.
In this embodiment, the material of the high strength support layer is selected from the group consisting of a sponge having a hardness of 75-99HF and a density of 38-85kg/m 3 EVA (ethylene-vinyl acetate copolymer) with the density of 15-40kg/m 3 EPE and a density of 30-60kg/m 3 The EPS of (1). When the material of the high-strength supporting layer is selected from sponge with the hardness of 75-99HF, the high-strength supporting layer has high supporting performance and easy flexibility, if the hardness of the high-strength supporting layer is lower, the supporting capability of the high-strength supporting layer is poor, so that the burr inhibition capability of the combined base plate is weak, and if the hardness of the high-strength supporting layer is higher, the bending amplitude of the high-strength supporting layer is small, so that the attaching degree of the PCB deformation plate and the combined base plate is low, and the burr inhibition capability of the combined base plate is weak. In this embodiment, the thickness of the high-strength supporting layer is 1-5mm, if the thickness of the high-strength supporting layer is too thin, the supporting performance is low, which may cause the cushion plate burr suppression capability to be weak, and if the thickness of the high-strength supporting layer is too thickIf the degree is too thick, the bending amplitude is small, so that the bonding degree between the PCB deformation plate and the base plate is low, and the base plate burr suppression capability is weak. In this embodiment, the material of the high-strength support layer may also be selected from EVA (ethylene-vinyl acetate copolymer, density 38-85 kg/m) 3 ) EPE (expandable polyethylene, also called pearl wool, density 15-40kg/m 3 ) And EPS (Expandable polystyrene, density 30-60 kg/m) 3 ) But is not limited thereto. The high-strength supporting layer formed by the materials also has high supporting performance and easy bending performance, if the density of the high-strength supporting layer is low, the supporting capacity is poor, so that the burr suppression capacity of the combined base plate is weak, and if the density of the high-strength supporting layer is high, the bending amplitude is small, so that the attaching degree of the PCB deformation plate and the combined base plate is low, and the burr suppression capacity of the combined base plate is weak.
In this embodiment, the material of the adhesive layer is selected from one of a hot melt adhesive, an epoxy adhesive, a polyurethane adhesive, an acrylate AB adhesive, an α -cyanoacrylate adhesive, a photosensitive adhesive, a silicone rubber adhesive, a UV ultraviolet ray and an anaerobic adhesive, but is not limited thereto. The adhesive layer is mainly used for adhering the easy-deformation layer and the high-strength supporting layer together. In this embodiment, the thickness of gluing agent layer is 3-50um, gluing agent layer must have strong adhesion, if gluing agent layer's thickness is thin then the adhesion is poor, gluing agent layer's thickness is thick then not only with high costs and twine easily to appear when drilling, influence PCB deformation board drilling quality.
In this embodiment, the double-layer deformation layer is manufactured as follows: and coating the adhesive on the easily deformable layer, then adhering and adhering the easily deformable layer and the high-strength supporting layer together, and curing to prepare the double-layer deformable layer, wherein the coating mode comprises but is not limited to brushing, spraying, roll coating and the like.
In some embodiments, the flash suppression layer is one of aluminum sheet, PET, cold punching sheet, PP, PVC, acryl sheet, and iron sheet, but is not limited thereto. The hardness of the flash inhibition layer is 2B-9H, and the thickness is 0.1-1.0mm. The burr suppressing layer defined in this embodiment has to have high hardness, flexibility, and high support. If the hardness of the flash suppression layer is soft (less than 2B), the flash suppression capability of the base plate is weak, and if the hardness of the flash suppression layer is hard (more than 9H), the bending amplitude is small, so that the bonding degree of the PCB deformation plate and the base plate is reduced, and the flash suppression capability of the base plate is easily weak. Similarly, if the thickness of the burr suppressing layer is too thin (less than 0.1 mm), the supporting performance is low, which tends to weaken the burr suppressing capability of the pad plate, and if the thickness of the burr suppressing layer is too thick (greater than 1.0 mm), the bending width is small, which tends to weaken the fitting between the PCB deformation plate and the pad plate, which tends to weaken the burr suppressing capability of the pad plate.
In some embodiments, when the combined base plate provided by the invention is used, the deformation layer is placed at the lowest part, then the burring suppression layer is placed on the deformation layer to form the combined base plate, the PCB deformation plate is placed on the burring suppression layer of the combined base plate, the PCB deformation plate is locked with four corners of the combined base plate, so that the combined base plate is bent and deformed and is tightly attached to the warping part of the PCB deformation plate, after drilling is completed, the deformation layer does not need to be replaced, and only the new burring suppression layer needs to be replaced to form a new combined base plate for continuous use.
The invention is further illustrated by the following specific examples:
example 1
Selecting sponge with the thickness of 3mm and the hardness of 80HF as a deformation layer, selecting PET with the thickness of 0.5mm as a burr suppression layer with higher hardness, and directly placing the PET with the thickness of 0.5mm on the sponge with the thickness of 3mm and the hardness of 80HF to form a combined base plate (1) during drilling;
during drilling, place PCB and warp the board and place on the flash of a knife or a sword suppression layer of combination backing plate (1), will PCB warp the board and locks with this combination backing plate (1), make combination backing plate (1) take place shape bending deformation and with the warping position of PCB warp the board closely laminates, after having bored the hole, the sponge that the thickness is 80HF need not to be changed for 3mm hardness, can continue to use after changing new 0.5mm PET, and the thickness of the used PCB of test is 6.5mm, warpage 2mm.
Example 2
Selecting sponge with the thickness of 5mm and the hardness of 75HF as a deformation layer, selecting a cold punching plate with the thickness of 0.3mm as a flash inhibition layer with higher hardness, and directly placing the cold punching plate with the thickness of 0.3mm on the sponge with the thickness of 5mm and the hardness of 75HF to form a combined base plate (2) during drilling;
during drilling, place PCB deformation board on the flash of a knife or a sword suppression layer of combination backing plate (2), will PCB deformation board and this combination backing plate (2) locking make combination backing plate (2) take place shape bending deformation and with the warpage position of PCB deformation board closely laminates, has bored the hole after, and the thickness is 5mm hardness and need not to change for 75 HF's sponge, can continue to use after changing new 0.3 mm's cold punching board, and the thickness of the PCB board that the test was used is 6mm, warpage 2mm.
Example 3
Selecting sponge with the thickness of 3mm and the hardness of 95HF as a deformation layer, selecting a cold punching plate with the thickness of 0.3mm as a flash inhibition layer with higher hardness, and directly placing the cold punching plate with the thickness of 0.3mm on the sponge with the thickness of 3mm and the hardness of 95HF to form a combined base plate (3) during drilling;
during drilling, place PCB deformation board on the flash of a knife or a sword suppression layer of combination backing plate (3), will PCB deformation board and this combination backing plate (3) locking make combination backing plate (3) take place shape bending deformation and with the warpage position of PCB deformation board closely laminates, has bored the hole after, and the sponge that thickness is 95HF need not to be changed for 3mm hardness, can continue to use after changing new 0.3 mm's cold punching board, and the thickness of the PCB board that the test was used is 6.5mm, warpage 2mm.
Example 4
Selecting an easy-deformation layer (3 mm hardness 50HF sponge) with good deformation, a high-strength supporting layer (3 mm hardness 95HF sponge) with good supporting performance and an adhesive (epoxy glue) with good caking performance, coating the epoxy glue on the 3mm hardness 50HF sponge, then adhering the epoxy glue and the 3mm hardness 95HF sponge together, baking the adhesive at 100 ℃ for 5min for solidification to manufacture a double-layer structure deformation layer (4), then selecting a flash suppression layer (0.3 mm cold punching plate) with high hardness, and directly placing the 0.3mm cold punching plate on the double-layer structure deformation layer (4) during drilling to form a combined base plate (4);
during drilling, place PCB deformation board on the flash of a knife or a sword suppression layer of combination backing plate (4), will PCB deformation board and this combination backing plate locking make combination backing plate (4) take place to appear crooked deformation and with the warpage position of PCB deformation board closely laminates, has bored the hole after, bilayer structure deformation layer (4) need not to be changed, can continue to use after the 0.3mm cold punching board of renewal, and the thickness of the used PCB board of test 5mm, warpage 3mm.
Example 5
Selecting an easily-deformable layer (3 mm hardness 50HF sponge) with better deformation, a high-strength supporting layer (2 mm hardness 95HF sponge) with better supporting property and an adhesive (epoxy glue) with better caking property, coating the epoxy glue on the 3mm hardness 50HF sponge, coating the epoxy glue with the thickness of 30 mu m, then adhering and adhering the epoxy glue and the 2mm hardness 95HF sponge together, baking at 100 ℃ for 5min for curing to manufacture a double-layer structure deformation layer (5), then selecting a burr inhibition layer (0.3 mm aluminum sheet) with higher hardness, and directly placing the 0.3mm aluminum sheet on the double-layer structure deformation layer (5) to form a combined base plate (5) during drilling;
during drilling, place PCB deformation board on the flash suppression layer of combination backing plate (5), will PCB deformation board and this combination backing plate locking make combination backing plate (5) take place to appear crooked deformation and with PCB deformation board warpage position closely laminates, has bored the hole after, bilayer structure deformation layer (5) need not to be changed, can continue to use behind the 0.3mm aluminum sheet of more renewing, and the thickness of the used PCB board of test is 6mm, warpage 3mm.
Example 6
The combined mats prepared in examples 1 to 5 were subjected to a drilling test under conditions of a hole diameter of 0.35mm and a hole number of 500 holes, and the results of the test are shown in table 1:
TABLE 1 results of drilling experiments
Figure BDA0003395226450000091
Figure BDA0003395226450000101
As can be seen from the drilling experiment results in Table 1, the combined base plate prepared by the embodiment of the invention has an excellent burr inhibiting effect and meets the PCB drilling standard requirements.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.

Claims (9)

1. The combined base plate is characterized by being used for drilling a PCB (printed circuit board) deformation plate with the thickness larger than 3.0mm, and the combined base plate comprises a deformation layer and a flash suppression layer arranged on the deformation layer.
2. The composite pad board according to claim 1, wherein when the thickness of the PCB deformation board is 3-8mm and the warping degree is less than or equal to 2mm, the deformation layer is a single-layer deformation layer, and the single-layer deformation layer is made of one of sponge, EVA and EPE.
3. The composite mat of claim 2, wherein the sponge has a hardness of 65-99HF and the EVA has a density of 10-50kg/m 3 The density of the EPE is 15-30kg/m 3 。
4. The composite pad of any one of claims 1 to 3, wherein the thickness of the deformation layer is greater than or equal to the warping degree of the PCB deformation board.
5. The composite pad board according to claim 1, wherein when the thickness of the PCB deformable plate is 3-8mm, the warpage is 2-6 mm, the deformable layer is a double-layer deformable layer, the double-layer deformable layer is composed of an easily deformable layer, an adhesive layer and a high-strength supporting layer which are sequentially stacked, the easily deformable layer is made of a sponge with the hardness of 25-65HF, the high-strength supporting layer is made of a sponge with the hardness of 75-99HF and the density of 38-85kg/m 3 EVA (ethylene-vinyl acetate copolymer) with the density of 15-40kg/m 3 EPE and a density of 30-60kg/m 3 Is one of the EPS of (1).
6. The composite pad board of claim 5, wherein the adhesive layer is made of one of a hot melt adhesive, an epoxy adhesive, a polyurethane adhesive, an acrylate AB adhesive, an alpha-cyanoacrylate adhesive, a photosensitive adhesive, a silicone rubber adhesive, a UV ultraviolet ray adhesive, and an anaerobic adhesive.
7. The composite pad board according to claim 5, wherein the thickness of the easily deformable layer is greater than the warpage of the PCB deformable plate, and the thickness of the high-strength support layer is 1-5mm; the thickness of the adhesive layer is 3-50um.
8. The composite mat of claim 1, wherein the flash suppression layer is one of aluminum sheet, PET, cold punching sheet, PP, PVC, acrylic sheet, and iron sheet.
9. The composite mat according to claim 1, wherein the flash suppression layer has a hardness of 2B to 9H and a thickness of 0.1 to 1.0mm.
CN202111482056.1A 2021-12-06 2021-12-06 Combined backing plate Active CN115339204B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104260425A (en) * 2014-09-22 2015-01-07 烟台天奕电子有限公司 Base plate for PCB drilling and manufacturing method of base plate for PCB drilling
CN212876208U (en) * 2020-10-09 2021-04-02 深圳市宏宇辉科技有限公司 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104260425A (en) * 2014-09-22 2015-01-07 烟台天奕电子有限公司 Base plate for PCB drilling and manufacturing method of base plate for PCB drilling
CN212876208U (en) * 2020-10-09 2021-04-02 深圳市宏宇辉科技有限公司 5G backboard drapes over one's shoulders cutting edge of a knife or a sword solution device

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