CN212874535U

CN212874535U - Structure for packaging solid fluorescent material for white light LED

Info

Publication number: CN212874535U
Application number: CN202022430497.4U
Authority: CN
Inventors: 张光懿; 智国磊; 高乐乐; 赛青林; 赵芬; 池建义; 唐晶晶
Original assignee: Baotou Rare Earth R&d Center Chinese Academy Of Sciences
Current assignee: Baotou Rare Earth R&d Center Chinese Academy Of Sciences
Priority date: 2020-10-28
Filing date: 2020-10-28
Publication date: 2021-04-02
Anticipated expiration: 2030-10-28

Abstract

The utility model discloses a structure for packaging a solid fluorescent material for a white light LED, which comprises a substrate and a blue light LED wafer, wherein the upper surface of the substrate is provided with a placing groove, and the blue light LED wafer is arranged in the placing groove; a thin yellow phosphor is packaged on the blue LED wafer, the area of the yellow phosphor is larger than that of the placing groove, the opening at the upper part of the placing groove is covered by the yellow phosphor, and the peripheral edge of the yellow phosphor and the substrate are sealed by black and black glue for one circle; the packaging structure packages the yellow sheet-shaped fluorescent body and the existing blue LED/LD chip together to realize LED/LD white light illumination.

Description

Structure for packaging solid fluorescent material for white light LED

Technical Field

The utility model relates to a structure that white light LED carries out encapsulation with solid fluorescent material.

Background

At present, fluorescent powder materials are widely applied to LED/LD white light illumination, and the LED/LD white light illumination is realized by using a combination scheme that a blue LED/LD chip carries yellow fluorescent powder. However, epoxy resin or silica gel materials are used for packaging the fluorescent powder material, and the materials have the disadvantages of low thermal conductivity, no high temperature resistance and easy aging, and the generated heat can not be removed in time under the irradiation of the LED/LD with high lumen density, so that the overall temperature of the fluorescent material is increased rapidly, and finally the fluorescent material generates a temperature quenching effect and even generates a carbonization phenomenon of the fluorescent material; in the prior art, for example, the white light LED package process disclosed in chinese patent publication No. CN103489996B, the white light LED package method disclosed in chinese patent publication No. CN102800793B, and the like are all technologies of blue LED/LD chip carrying yellow phosphor.

I research a flaky yellow phosphor, and the main difference of the flaky yellow phosphor from the existing phosphor is that the flaky yellow phosphor is in a solid flaky shape and has excellent high-temperature resistance; the process method is detailed in the Chinese patent with publication No. CN110983433A, which discloses a process method for producing rare earth eutectic phosphor by a guide mold method; the yellow sheet-shaped phosphor can be packaged with the existing blue LED/LD chip to realize LED/LD white light illumination; the invention mainly protects a novel packaging structure.

Disclosure of Invention

An object of the utility model is to provide a structure that white light LED encapsulates with solid fluorescent material realizes LED LD white light illumination with yellow sheet form fluorophor and current blue LED LD chip package together.

The utility model adopts the technical scheme as follows: a structure for packaging a solid fluorescent material for a white light LED comprises a substrate and a blue light LED wafer, wherein a placing groove is formed in the upper surface of the substrate, and the blue light LED wafer is arranged in the placing groove; the blue LED chip is packaged with a sheet yellow phosphor, the area of the yellow phosphor is larger than that of the placing groove, the opening at the upper part of the placing groove is covered with the yellow phosphor, and the periphery of the yellow phosphor and the substrate are sealed by black and black glue for one circle.

Furthermore, a circle of the placing groove is outwards expanded to form a second clamping groove, the shape of the second clamping groove is matched with that of the yellow phosphor, and the yellow phosphor is placed in the second clamping groove; and a circle of glue coating groove is formed at the edge of the second clamping groove outwards, and black glue is filled in the glue coating groove to seal the peripheral edge of the yellow phosphor.

Further, a metal elastic pressing piece made of aluminum or copper is attached to the periphery of the yellow phosphor, and the yellow phosphor is pressed against the substrate.

Furthermore, the elastic pressing sheet consists of a clamping part and a fixing part, wherein the cross section of the clamping part is L-shaped and is used for clamping the edge of the yellow phosphor, the fixing part is Z-shaped, one end of the fixing part is connected to the clamping part, and the other end of the fixing part is fixed on the substrate.

The beneficial effects of the utility model reside in that: the utility model provides a structure that white light LED encapsulated with solid fluorescent material realizes LED LD white light illumination with yellow lamellar fluorophor and current blue LED LD chip package together.

Drawings

Fig. 1 is an exploded view of the structure of example 1.

Fig. 2 is a schematic structural diagram after packaging in embodiment 1.

Fig. 3 is an exploded view of the structure of example 2.

Fig. 4 is a diagram showing a top surface structure of a substrate in embodiment 2.

Fig. 5 is a schematic structural diagram after packaging in embodiment 2.

In the figure: base plate 1, standing groove 2, second draw-in groove 3, blue light LED wafer 4, yellow fluorophor 5, black glue 6, elasticity preforming 7, card limit portion 8, fixed part 9, rubber coating groove 10.

Detailed Description

In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings, which are only used for illustrating the technical solutions of the present invention and are not limited.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention; furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated; thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature; in the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other; the specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

Example 1

In the embodiment, an LED projection lamp produced by Hongfu lighting technology ltd of Dongguan city is adopted for transformation, the model number of the LED projection lamp is STL-100AC1, the rated power is 100W, and the input alternating voltage is 100-plus 240 VAC.

As shown in fig. 1, a structure for packaging a solid fluorescent material for a white light LED includes a substrate 1 and a blue light LED chip 4, wherein a placement groove 2 is formed on the upper surface of the substrate 1, and the blue light LED chip 4 is mounted in the placement groove 2; as shown in fig. 2, a sheet-shaped yellow phosphor 5 is packaged on the blue LED chip 4, specifically, in this embodiment, the yellow phosphor 5 is cut into a square shape, the yellow phosphor 5 is larger than the placing groove 2 in area, the opening at the upper part of the placing groove 2 is covered with the yellow phosphor 5, and the periphery of the yellow phosphor 5 and the substrate 1 are sealed by a black and black glue 6 to prevent light leakage; in order to prevent the yellow phosphor 5 from falling off after the black paste 6 fails, a metal elastic pressing piece 7 made of aluminum or copper is arranged around the yellow phosphor 5, and the yellow phosphor 5 is pressed on the substrate 1; as shown in fig. 2, in the present embodiment, the elastic pressing sheet 7 is composed of two parts, namely a clamping part 8 and a fixing part 9, wherein the clamping part 8 has an L-shaped cross section for clamping the edge of the yellow phosphor 5, the fixing part 9 has a Z-shaped cross section, one end of the fixing part 9 is connected to the clamping part 8, and the other end is fixed on the substrate 1; in this embodiment, the yellow phosphor 5 is square, and an elastic pressing piece 7 is mounted on each of four sides thereof; the metal elastic pressing sheet 7 made of aluminum or copper can also guide away part of heat generated by the yellow fluorescent body 5 during working, and has a certain heat dissipation effect.

Example 2

In the embodiment 1, the black glue 6 is coated between the surfaces, so that the coating is troublesome, the coating amount is insufficient, and the problem of light leakage is easily caused; for this reason, the improved design is as follows: as shown in fig. 3, on the basis of the placement groove 2 in embodiment 1, a circle is expanded outward with the placement groove 2 as a center to form a second slot 3, the second slot 3 is matched with the yellow phosphor 5 in shape, in this embodiment, the second slot 3 is square, and the yellow phosphor 5 is placed in the second slot 3; as shown in fig. 4, a glue groove 10 is further formed on the edge of the second slot 3, and the glue groove 10 is filled with black glue 6 to seal the peripheral edge of the yellow phosphor 5, as shown in fig. 5.

Although the present invention has been described in detail with reference to the foregoing examples, it will be apparent to those skilled in the art that modifications may be made to the above-described embodiments, or equivalent changes and modifications may be made to some of the technical features of the embodiments.

Claims

1. A structure for packaging a solid fluorescent material for a white light LED comprises a substrate and a blue light LED wafer, wherein a placing groove is formed in the upper surface of the substrate, and the blue light LED wafer is arranged in the placing groove; the blue light LED chip is packaged with a sheet yellow phosphor, and is characterized in that the area of the yellow phosphor is larger than that of the placing groove, the opening at the upper part of the placing groove is covered with the yellow phosphor, and the periphery of the yellow phosphor and the substrate are sealed by black and black glue for one circle.

2. The structure of the white LED package with solid phosphor according to claim 1, wherein: a circle of groove is formed by expanding outwards by taking the placing groove as the center, the shape of the second groove is matched with that of the yellow phosphor, and the yellow phosphor is placed in the second groove; and a circle of glue coating groove is formed at the edge of the second clamping groove outwards, and black glue is filled in the glue coating groove to seal the peripheral edge of the yellow phosphor.

3. The structure of the white LED package with solid phosphor according to claim 1, wherein: a metal elastic pressing piece made of aluminum or copper is mounted around the yellow phosphor, and the yellow phosphor is pressed against the substrate.

4. The structure of claim 3, wherein the solid fluorescent material encapsulates the LED, and the structure further comprises: the elastic pressing sheet consists of a clamping part and a fixing part, wherein the section of the clamping part is L-shaped and is used for clamping the edge of the yellow fluorescent body, the fixing part is Z-shaped, one end of the fixing part is connected to the clamping part, and the other end of the fixing part is fixed on the substrate.