CN213636028U

CN213636028U - Light emitting diode packaging part assembly

Info

Publication number: CN213636028U
Application number: CN202022944319.3U
Authority: CN
Inventors: 刘小宇
Original assignee: Shenzhen Chengyifeng Photoelectric Co ltd
Current assignee: Shenzhen Chengyifeng Photoelectric Co ltd
Priority date: 2020-12-07
Filing date: 2020-12-07
Publication date: 2021-07-06
Anticipated expiration: 2030-12-07

Abstract

The utility model relates to a emitting diode technical field, specific emitting diode packaging part subassembly that says so, which comprises a bracket, support upper end fixed mounting has the base plate, the solid fixed ring of base plate upper end fixedly connected with, the base plate upper end just is located the solid fixed ring in fixed ring fixed mounting and has emitting diode, the emitting diode outer lane is provided with the side heat-conducting layer, circumference equidistance fixedly connected with conducting strip between side heat-conducting layer and the solid fixed ring. The utility model encapsulates the lens through the encapsulation colloid, thereby encapsulating the light emitting diode and protecting the light emitting diode; the heat of the side edge of the substrate is guided to the fixing ring through the side heat conduction layer and the heat conduction fins, the heat dissipation efficiency of the fixing ring is accelerated through the first heat dissipation fins, so that the heat dissipation efficiency of the light emitting diode is improved, the heat dissipation effect of the lower end face of the substrate is achieved through the second heat dissipation fins and the heat dissipation grooves, and the heat dissipation effect of the light emitting diode is better.

Description

Light emitting diode packaging part assembly

Technical Field

The utility model relates to a emitting diode technical field specifically is a emitting diode packaging part subassembly.

Background

A light emitting diode is a kind of semiconductor diode, which can convert electric energy into light energy, often abbreviated as LED. The light emitting diode generally needs to be packaged and protected. The existing light-emitting diode packaging component has a weak heat dissipation effect, so that heat accumulated in the packaging component cannot be dissipated, and the light-emitting diode is easy to damage for a long time. To this end, we propose a light emitting diode package assembly.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a light emitting diode packaging part subassembly to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a light emitting diode packaging part subassembly, includes the support, support upper end fixed mounting has the base plate, the solid fixed ring of base plate upper end fixedly connected with, the base plate upper end just is located the fixed ring in fixed ring fixed mounting has light emitting diode, the light emitting diode outer lane is provided with the side heat-conducting layer, circumference equidistance fixedly connected with conducting strip between side heat-conducting layer and the solid fixed ring, the first radiating fin of solid fixed ring outside circumference equidistance fixedly connected with, gu fixed ring outside fixedly connected with lens, support outside fixedly connected with transparent frame, be equipped with the cavity between transparent frame and the lens, the cavity intussuseption is filled with the encapsulation colloid, the support is the metal heat-conducting plate.

As a further optimization of the technical scheme, fluorescent particles are mixed in the packaging colloid.

As a further optimization of the technical scheme, the encapsulation colloid is an organic resin colloid.

As a further optimization of the technical scheme, a heat dissipation groove is formed in the lower end face of the support and located between the two adjacent groups of the second heat dissipation fins.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model encapsulates the lens through the encapsulation colloid, thereby encapsulating the light emitting diode and protecting the light emitting diode; the heat of the side edge of the substrate is guided to the fixing ring through the side heat conduction layer and the heat conduction fins, the heat dissipation efficiency of the fixing ring is accelerated through the first heat dissipation fins, so that the heat dissipation efficiency of the light emitting diode is improved, the heat dissipation effect of the lower end face of the substrate is achieved through the second heat dissipation fins and the heat dissipation grooves, and the heat dissipation effect of the light emitting diode is better.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of the top view structure of the present invention.

In the figure: 1. a support; 2. a substrate; 3. a fixing ring; 4. a light emitting diode; 5. a side heat conduction layer; 6. a heat conductive sheet; 7. a first heat radiation fin; 8. a lens; 9. a transparent frame; 10. packaging the colloid; 11. a second heat radiation fin; 12. a fluorescent particle; 13. and (4) a groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a light emitting diode packaging part subassembly, which comprises a

bracket

1, 1 upper end fixed mounting of support has

base plate

2, 2 upper end fixedly connected with solid fixed ring 3 of base plate, 2 upper ends of base plate just are located solid fixed ring 3 internal fixation and have emitting diode 4, emitting diode 4 outer lane is provided with side heat-conducting layer 5, circumference equidistance fixedly connected with conducting strip 6 between side heat-conducting layer 5 and the solid fixed ring 3, gu the first radiating fin 7 of 3 outside circumference equidistance fixedly connected with of fixed ring, through the solid fixed ring 3 of heat direction of side heat-conducting layer 5 and conducting strip 6 with emitting diode 4 side, the radiating efficiency of solid fixed ring 3 is accelerated through first radiating fin 7, thereby improve emitting diode 4.

3 outside fixedly connected with lens 8 of solid fixed ring, 1 outside fixedly connected with transparent frame 9 of support, be equipped with the cavity between transparent frame 9 and the lens 8, the cavity intussuseption is filled with packaging colloid 10, and is concrete, and packaging colloid 10 is the organic resin colloid, and the internal mixing of packaging colloid 10 has phosphor particle 12, encapsulates lens 8 through packaging colloid 10 to encapsulate emitting diode 4, protect emitting diode 4.

The support 1 is a metal heat-conducting plate, the second radiating fins 11 are distributed at the lower end of the support 1 at equal intervals, radiating grooves 13 are formed in the lower end face of the support 1 and located between two adjacent groups of the second radiating fins 11, and the lower end face of the base plate 2 is radiated through the second radiating fins 11 and the radiating grooves 13.

Specifically, when the LED packaging structure is used, the lens 8 is packaged through the packaging colloid 10, so that the LED 4 is packaged, and the LED 4 is protected; through the heat direction solid fixed ring 3 of side heat-conducting layer 5 and conducting strip 6 with the heat of base plate 2 side, accelerate solid fixed ring 3's radiating efficiency through first radiating fin 7 to improve emitting diode 4's radiating efficiency, play radiating effect through second radiating fin 11 and heat dissipation recess 13 to base plate 2 lower terminal surface.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A light emitting diode package assembly comprising a support (1), characterized in that: a base plate (2) is fixedly arranged at the upper end of the bracket (1), a fixing ring (3) is fixedly connected at the upper end of the base plate (2), the upper end of the base plate (2) is fixedly provided with a light emitting diode (4) in the fixing ring (3), the outer ring of the light-emitting diode (4) is provided with a side heat conduction layer (5), heat conduction sheets (6) are fixedly connected between the side heat conduction layer (5) and the fixing ring (3) at equal intervals in the circumferential direction, the outer side of the fixing ring (3) is fixedly connected with first radiating fins (7) at equal intervals in the circumferential direction, the outer side of the fixing ring (3) is fixedly connected with a lens (8), the outer side of the bracket (1) is fixedly connected with a transparent frame (9), a cavity is arranged between the transparent frame (9) and the lens (8), a packaging colloid (10) is filled in the cavity, the support (1) is a metal heat-conducting plate, and second radiating fins (11) are distributed at the lower end of the support (1) at equal intervals.

2. The led package assembly of claim 1, wherein: fluorescent particles (12) are mixed in the packaging colloid (10).

3. The led package assembly of claim 1, wherein: the packaging colloid (10) is organic resin colloid.

4. The led package assembly of claim 1, wherein: and a heat dissipation groove (13) is formed in the lower end face of the support (1) and is positioned between the two adjacent groups of second heat dissipation fins (11).