CN201936920U

CN201936920U - Light-emitting diode (LED) package structure capable of improving light-extracting rate

Info

Publication number: CN201936920U
Application number: CN2011200340109U
Authority: CN
Inventors: 王海军
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-01-31
Filing date: 2011-01-31
Publication date: 2011-08-17
Anticipated expiration: 2021-01-31

Abstract

The utility model relates to a light-emitting diode (LED) package structure capable of improving the light-extracting rate, which comprises a heat dissipation substrate. At least one transparent base is arranged on the heat dissipation substrate, and an LED chip and a transparent protective frame are installed on the outer circumferential surface of the transparent base. The transparent protective frame is covered on the LED chip and the transparent base in pressing mode, and the shape of the transparent protective frame is adapted to the shapes of the transparent base and the LED chip which is arranged on the transparent base. A reflection plane and a transmission plane are formed on the outer circumferential surface where the transparent base is contacted with the transparent protective frame. The transparent base and the transparent protective frame of the LED package structure are made of transparent ceramic materials because transparent ceramics are quick in heat dissipation, high in rigidity, and good in insulation. The light-extracting rate of the LED chip can be greatly enhanced when the LED chip is installed on the transparent base and the transparent protective frame is used for protection of the LED chip. When the transparent base is in a spherical structure, the contacting area between the transparent base and the heat dissipation substrate is large. Accordingly, the heat dissipation effect is enhanced, and the service life of the LED chip is prolonged. The LED package structure is simple in structure, convenient in installation and use, and safe and reliable.

Description

A kind of LED encapsulating structure that improves light emission rate

Technical field

The utility model relates to a kind of LED encapsulating structure, and especially a kind of LED encapsulating structure that improves light emission rate belongs to the technical field that LED encapsulates.

Background technology

At present, along with the development of LED material epitaxy and chip technology, LED has shown good prospects for application, great power LED particularly, and its application is constantly expanded, and has been widely used in fields such as Landscape Lighting, mine lamp, street lamp, emergent street lamp.

LED is a kind of special diode, and the chip that its core is made up of P type semiconductor and N type semiconductor, these semi-conducting materials are in advance by explained hereafter P/N junction structures such as injection or doping.In the P/N of some semi-conducting material knot, electric current among the LED can flow to the N utmost point from the P utmost point easily, two kinds of different charge carriers are that tie to P/N from electrode stream under different electrode voltage effects with electronics in the hole, when hole and electronics meet and produce compound, electronics can drop into lower energy rank, and the mode with photon gives off energy simultaneously, and adds reverse voltage to the P/N knot, minority carrier is difficult to inject, so not luminous.

At present, in the high-power LED encapsulation structure, the light emission rate of LED is not high, and the radiating effect of LED is poor simultaneously, influences the useful life of LED.

Summary of the invention

The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of LED encapsulating structure that improves light emission rate is provided, and it is simple and compact for structure, and is easy to install, has improved the light emission rate of LED, has prolonged LED useful life, safe and reliable.

According to the technical scheme that the utility model provides, the LED encapsulating structure of described raising light emission rate comprises heat-radiating substrate, is provided with a transparent base on the described heat-radiating substrate at least, and described transparent base is fixedly installed on the heat-radiating substrate; The transparency protected frame that is used for luminous led chip and is used to protect led chip is installed on the outer peripheral face of transparent base, described transparency protected frame gland is on led chip and transparent base, and the shape of transparency protected frame and transparent base and the led chip shape that is positioned on the transparent base adapt; Transparent base and the contacted outer peripheral face of transparency protected frame are formed for the reflecting surface and the transmission plane that penetrate after light reflection in the transparent base or the transmission inciding.

Described transparent base structure spherical in shape, tabular or class cylindrical structure.The material of described transparent base comprises transparent ceramic, magnesium aluminate spinel or silica crystals.The material of described transparent base is an aluminium nitride ceramics.

During described transparent base structure spherical in shape, the South Pole end of transparent base is embedded in the heat-radiating substrate, and fixes with heat-radiating substrate; Transparent base is concaved with reflection groove corresponding to the South Pole end that is embedded in the heat-radiating substrate, and the arctic end of transparent base is concaved with mounting groove; Led chip is fixedly installed in the mounting groove, and is fixedly connected with transparent base.

Described transparency protected frame is corresponding to being concaved with location notch with the corresponding surface of led chip, and described location notch is positioned at the top of led chip, and corresponding with the shape of led chip.The material of described transparency protected frame comprises glass lens, quartz, transparent class pottery or transparent class PMMA.

The corresponding surface of the center of described transparency protected frame and led chip is provided with and is used for the light output groove that led chip is exposed.Described heat-radiating substrate is provided with radiating bottom plate corresponding to the opposite side that links to each other with transparent base, is provided with a heat-radiating substrate on the described radiating bottom plate at least.The material of described heat-radiating substrate comprises silver, copper, silicon or pottery.

Advantage of the present utility model: transparent base is fixedly installed on the heat-radiating substrate, by mounting groove led chip is installed on the transparent base, the transparent base upper press cover has transparency protected frame, transparent base can form reflecting surface and transmission plane corresponding to the outer peripheral face that links to each other with transparency protected frame, penetrate after reflection of the light that thereby led chip can be injected or the transmission, thereby the light that sends around energy led chip bottom and the end edge is derived, and the light of all light-emitting areas of led chip is penetrated; And the transparent setting of transparent base and transparency protected frame, the emission and the transmission of the light in the time of can increasing led chip work, the light emission rate of raising led chip, the brightness that improves led chip; When transparent base and transparency protected frame all adopt transparent ceramic material to make, because transparent ceramic has rapid heat dissipation, hardness height, good insulating; Led chip is installed on transparent base, and when utilizing transparency protected frame that led chip is protected, can be greatly improved the light emission rate of led chip; During transparent base structure spherical in shape, the contact area between transparent base and heat-radiating substrate is big, can improve radiating effect, prolongs the useful life of led chip; Simple and compact for structure, easy to install, safe and reliable.

Description of drawings

Fig. 1 is a kind of structural representation of the present utility model.

Fig. 2 is an another kind of structural representation of the present utility model.

Fig. 3 is a kind of user mode figure of Fig. 1.

Fig. 4 is the vertical view of Fig. 3.

Fig. 5 is the another kind of user mode figure of Fig. 1.

Fig. 6 is the third structural representation of the present utility model.

Structural representation when Fig. 7 is dull and stereotyped assembling structure for the utility model transparent base.

Embodiment

The utility model is described in further detail below in conjunction with concrete drawings and Examples.

As Fig. 1 ~ shown in Figure 7: the utility model comprises led chip 1, mounting groove 2, transparency protected frame 3, transparent base 4, heat-radiating substrate 5, radiating bottom plate 6, light output groove 7, location notch 8 and lens 9.

Led chip 1 is rectangular structure, has six different light-emitting areas, and under the existing integrated encapsulation condition, the light of the bottom of led chip 1 can be absorbed or block, and the light that can not respective surfaces sends extracts.Therefore, in order to improve the light emission rate of led chip 1, the light that led chip 1 bottom need be sent extracts accordingly, can improve the light emission rate of led chip 1.

As shown in Figure 6: be provided with a transparent base 4 on the described heat-radiating substrate 5 at least, described transparent base 4 structures spherical in shape, plate-like structure or class column structure; Transparency carrier 4 adopts spherical structure among the figure, described transparent base 4 is provided with led chip 1, transparent base 4 can be luminous with 1 high back of led chip, the transparent setting of transparent base 4, transparent base 4 can not absorb the light of led chip 1 bottom or block, can not influence simultaneously the luminous of led chip 1 other four surfaces and upper surface, the light that led chip 1 bottom is injected in the transparent base 4 is penetrated by transparent base 4 projections or emission back, the light that send on while led chip 1 corresponding four surfaces also can penetrate by transparent base 4, can improve the light emission rate of led chip 1.The material of transparent base 4 comprises pottery, magnesium aluminate spinel or silica crystals (crystal), preferably transparent ceramic; In transparent ceramic, the material of transparent base 4 is aluminium nitride ceramics preferably, and transparent base 4 can also adopt the metal material with good heat radiating characteristic simultaneously.

As Fig. 1, Fig. 3 and shown in Figure 4: for the transparent base 4 with spherical structure is installed on the heat-radiating substrate 5, the South Pole end of transparent base 4 is embedded in the heat-radiating substrate 5, and fixes with heat-radiating substrate 5; Simultaneously, led chip 1 is positioned at the arctic end of transparent base 4; Transparent base 4 structures spherical in shape, transparent base 4 is big with the contact area of heat-radiating substrate 5, can increase area of dissipation, prolongs the useful life of led chip 1.For led chip 1 better is installed, the arctic end of transparent base 4 is concaved with mounting groove 2, and described mounting groove 2 is complementary with led chip 1.Led chip 1 is embedded in the mounting groove 2, and the end edge of led chip 1 contacts corresponding to the inwall that mounting groove 2 is set with transparent base 4 respectively, thereby led chip 1 is installed on the transparent base 4; The power line of led chip 1 outwards connects by mounting groove 2, guarantees led chip 1 easy for installation and reliability.After led chip 1 is installed in the mounting groove 2 on the transparent base 4, the light that led chip 1 bottom and surrounded surface send is input in the transparent base 4 by mounting groove 2, corresponding light can not blocked or absorb to transparent base 4, respective ray of light transmission or reflection back can also be penetrated, can improve the light emission rate of led chip 1.Transparent base 4 is concaved with reflection groove corresponding to the South Pole end that is embedded in the heat-radiating substrate 5, the light reflection back of injecting in the transparent base 4 can be penetrated the light emission rate when improving led chip 1 work by reflection groove.

Transparent base 4 is provided with transparency protected frame 3, described transparency protected frame 3 glands are on transparent base 4, transparency protected frame 3 is corresponding with the shape of transparent base 4 contacted end shapes and transparent base 4, transparency protected frame 3 is concaved with location notch 8 with led chip 1 corresponding surface, described location notch 8 is positioned at led chip 1 top, and corresponding with the shape of led chip 1; When transparency protected frame 3 glands are on transparent base 4; transparency protected frame 3 installs and fixes by led chip 1 opposite position on location notch 8 and the transparent base 4; transparency protected frame 3 can be protected led chip 1, can prevent that fluorescent material and silica gel on the led chip 1 are excessive simultaneously.The material glass lens of transparency protected frame 3, quartzy crystal, transparent class pottery or transparent class PMMA(Polymethyl Methacrylate) etc. the injection moulding plastic material; When transparent base 4 all adopted transparent ceramic material to make with transparency protected frame 3, transparent ceramic had rapid heat dissipation, hardness height, good insulating; Led chip 1 is installed on transparent base 4, and when utilizing 3 pairs of led chips 1 of transparency protected frame to protect, can be greatly improved the light emission rate of led chip 1.The end of transparency protected frame 3 links to each other with heat-radiating

substrate

5, and 5 of transparency protected frame 3 and heat-radiating substrates form sealed whole, and transparent base 4 and led chip 1 are closed, can be as the luminous intensity distribution of led chip 1.Simultaneously; transparent base 4 is corresponding to forming reflecting surface and transmission plane with transparency protected frame 3 contacted outer peripheral faces; described fully reflecting surface can be gone out light reflection or transmission that led chip 1 is injected transparent base 4 by mounting groove 2; light emission rate when improving led chip 1 work greatly improves luminosity.As shown in Figure 3 and Figure 4:, after a plurality of equally distributed transparent base 4 and corresponding led chip 1 are set on the heat-radiating substrate 5, can improve the luminosity of led chip 1 as light source for the structural representation of three transparent base 4 is set on the heat-radiating substrate 5.

As shown in Figure 7: when transparent base 4 adopts plate armature, plurality of LEDs chip 1 is set on the transparent base 4 simultaneously, flat transparent base 4 can increase the contact area with heat-radiating substrate 5, and the radiating efficiency when improving led chip 1 work effectively prolongs useful life of led chip 1.Among Fig. 7, evenly arranged three LEDs chips 1 simultaneously on the transparent base 7, lens 9 is set on the led chip 1, lens 9 gland simultaneously is used for the luminous luminous intensity distribution that carries out to led chip 1 on three LEDs chips 1.Led chip 1 has transparency protected frame 3 by behind lens 9 luminous intensity distributions at lens 9 upper press covers, and the shape of described transparency protected frame 3 is corresponding with the shape of lens 9, and transparency protected frame 3 is covered in lens 9 on the transparent base 4.After transparent base 4, lens 9 and the 3 corresponding cooperations of transparency protected frame, the light that led chip 1 bottom can be sent, thus improved the light emission rate of led chip 1.

When transparent base 4 adopts cylinder or hemicycle column structure, led chip 1 is positioned at the top of cylindrical transparent pedestal 4, the light that led chip 1 sends can not blocked or absorb to transparent base 4 with led chip 1 contacted surface, after the light that send led chip 1 bottom was injected in the transparent base 4, transparent base 4 can penetrate corresponding light reflection or projection back.Corresponding to the end that led chip 1 is installed light-distribution lens is set on the transparent base 4, and light-distribution lens and heat-radiating substrate 5 is connected into sealed whole body by transparency protected frame 3.

As shown in Figure 2: be another kind of structural representation of the present utility model.Among Fig. 2; transparent base 4 adopts spherical structure; described transparency protected frame 3 is provided with light output groove 7 with led chip 1 corresponding surface; described light output groove 7 is positioned at the top of transparent base 4 arctic ends; simultaneously the led chip on the transparent base 41 is exposed out, the light that sends during led chip 1 work is most of outwards to be penetrated by light output groove 7.

As shown in Figure 5: the structural representation that simultaneously a plurality of heat-radiating substrates 5 is used simultaneously for the utility model.Heat-radiating substrate 5 is uniformly distributed on the radiating bottom plate 6 simultaneously, and radiating bottom plate 6 can enlarge the area of dissipation of heat-radiating substrate 5, and the heat efficiently radiates heat that heat-radiating substrate 5 conduction are come out is gone out.Radiating bottom plate 6 comprises silver, copper, silicon or pottery with the material of heat-radiating substrate 5, has better heat radiating effect.

As Fig. 1 ~ shown in Figure 5: during use, the South Pole end of transparent base 4 is embedded in the heat-radiating substrate 5, and it is fixing with heat-radiating substrate 5, during transparent base 4 structure spherical in shape, transparent base 4 has bigger cooling surface area, transparent base 4 is embedded in the heat-radiating substrate 5, has improved the heat radiation contact area, the heat that led chip 1 sends can be left fast and effectively.The arctic end of transparent base 4 is concaved with mounting groove 2, is provided with led chip 1 in the mounting groove 2, after the power line of led chip 1 is installed, at transparent base 4 upper press covers transparency protected frame 3 is arranged.Transparency protected frame 3 can be protected led chip 1, and transparency protected frame 3 contacts with heat-radiating substrate 5, forms the integral body of a relative closure; Transparency protected frame 3 adopts lens to make, and the light transmission that led chip 1 goes into to inject can be gone out.Heat-radiating substrate 5 is uniformly distributed on the radiating bottom plate 6, a plurality of heat-radiating substrates 5 are set on the radiating bottom plate 6 after, as the brightness of light source, increased area of dissipation simultaneously in the time of can increasing led chip 1 work, can effectively prolong the useful life of led chip 1.During work,, make led chip 1 be in luminous operating state with the power connection of led chip 1.The most of direct projection of light when led chip 1 is luminous is gone out, but having part light injects in the transparent base 4 by the inwall of mounting groove 2.Because transparent base 4 is transparent configuration with transparency protected frame 3; and transparent base 4 is corresponding to forming reflecting surface and transmission plane with transparency protected frame 3 contacted outer peripheral faces; therefore entering the light of transparent base 4 can transmission go out or penetrates by reflecting surface; thereby with the luminous effective output of led chip 1 lower surface; the light that led chip 1 surrounded surface sends can also can penetrate by transparent base 4 and transparency protected frame 3; extracted the light of led chip 1 all light-emitting areas; avoided the shortcoming that led chip 1 bottom can not be luminous under the existing integrated encapsulation condition; improve the light emission rate of led chip 1, improved the work brightness of led chip 1.The heat that sends during led chip 1 work is delivered on the heat-radiating substrate 5 by transparent base 4, and transparent base 4 is big with the contact area of heat-radiating substrate 5, has improved radiating effect; Heat-radiating substrate 5 is distributed on the radiating bottom plate 6 simultaneously, has further improved radiating effect, prolongs the useful life of led chip 1.

The utility model transparent base 4 is fixedly installed on the heat-radiating substrate 5, by mounting groove 2 led chip 1 is installed on the transparent base 4, transparent base 4 upper press covers have transparency protected frame 3, transparent base 4 can form reflecting surface and transmission plane corresponding to the outer peripheral face that links to each other with transparency protected frame 3, thereby the light that sends around energy led chip 1 bottom and the end edge is derived, the light of led chip 1 all light-emitting areas is penetrated, with luminous effective output of led chip 1 bottom, the light of led chip 1 all light-emitting areas is penetrated; And the transparent setting of transparent base 4 and transparency protected frame 3, the emission and the transmission of the light in the time of can increasing led chip 1 work, the light emission rate of raising led chip 1, the brightness that improves led chip 1; When transparent base 4 all adopts transparent ceramic material to make with transparency protected frame 3, because transparent ceramic has rapid heat dissipation, hardness height, good insulating; Led chip 1 is installed on transparent base 4, and when utilizing 3 pairs of led chips 1 of transparency protected frame to protect, can be greatly improved the light emission rate of led chip 1; During transparent base 4 structure spherical in shape, the contact area that transparent base 4 and heat-radiating substrate are 5 is big, can improve radiating effect, prolongs the useful life of led chip 1; Simple and compact for structure, easy to install, safe and reliable.

Claims

1. LED encapsulating structure that improves light emission rate, it is characterized in that: comprise heat-radiating substrate (5), be provided with a transparent base (4) on the described heat-radiating substrate (5) at least, described transparent base (4) is fixedly installed on the heat-radiating substrate (5); The transparency protected frame (3) that is used for luminous led chip (1) and is used to protect led chip (1) is installed on the outer peripheral face of transparent base (4), described transparency protected frame (3) gland is on led chip (1) and transparent base (4), and the shape of transparency protected frame (3) and transparent base (4) and led chip (1) shape that is positioned on the transparent base (4) adapt; Transparent base (4) and the contacted outer peripheral face of transparency protected frame (3) are formed for the reflecting surface and the transmission plane that penetrate after light reflection in the transparent base (4) or the transmission inciding.

2. the LED encapsulating structure of raising light emission rate according to claim 1 is characterized in that: described transparent base (4) structure spherical in shape, tabular or class cylindrical structure.

3. the LED encapsulating structure of raising light emission rate according to claim 1 and 2 is characterized in that: the material of described transparent base (4) comprises transparent ceramic, magnesium aluminate spinel or silica crystals.

4. the LED encapsulating structure of raising light emission rate according to claim 1 is characterized in that: the material of described transparent base (4) is an aluminium nitride ceramics.

5. the LED encapsulating structure of raising light emission rate according to claim 2 is characterized in that: during described transparent base (4) structure spherical in shape, the South Pole end of transparent base (4) is embedded in the heat-radiating substrate (5), and fixes with heat-radiating substrate (5); Transparent base (4) is concaved with reflection groove corresponding to the South Pole end that is embedded in the heat-radiating substrate (5), and the arctic end of transparent base (4) is concaved with mounting groove (2); Led chip (1) is fixedly installed in the mounting groove (2), and is fixedly connected with transparent base (4).

6. the LED encapsulating structure of raising light emission rate according to claim 1; it is characterized in that: described transparency protected frame (3) is corresponding to being concaved with location notch (8) with the corresponding surface of led chip (1); described location notch (8) is positioned at the top of led chip (1), and corresponding with the shape of led chip (1).

7. the LED encapsulating structure of raising light emission rate according to claim 1 is characterized in that: the material of described transparency protected frame (3) comprises glass lens, quartz, transparent class pottery or transparent class PMMA.

8. the LED encapsulating structure of raising light emission rate according to claim 1 is characterized in that: the center of described transparency protected frame (3) and the corresponding surface of led chip (1) are provided with and are used for the light output groove (7) that led chip (1) is exposed.

9. the LED encapsulating structure of raising light emission rate according to claim 1, it is characterized in that: described heat-radiating substrate (5) is provided with radiating bottom plate (6) corresponding to the opposite side that links to each other with transparent base (4), is provided with a heat-radiating substrate (5) on the described radiating bottom plate (6) at least.

10. the LED encapsulating structure of raising light emission rate according to claim 1 is characterized in that: the material of described heat-radiating substrate (5) comprises silver, copper, silicon or pottery.