CN202487664U - Lateral reflection-type light-emitting diode (LED) integrated packaging structure - Google Patents
Lateral reflection-type light-emitting diode (LED) integrated packaging structure Download PDFInfo
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- CN202487664U CN202487664U CN2012200949662U CN201220094966U CN202487664U CN 202487664 U CN202487664 U CN 202487664U CN 2012200949662 U CN2012200949662 U CN 2012200949662U CN 201220094966 U CN201220094966 U CN 201220094966U CN 202487664 U CN202487664 U CN 202487664U
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- sidepiece
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- mirror lens
- chip array
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Abstract
The utility model relates to a lateral reflection-type light-emitting diode (LED) integrated packaging structure which comprises a substrate and an LED chip array, a lateral reflection lens is covered on the substrate, a cavity is arranged on the surface in the lateral reflection lens in a recessed mode, the surface in the lateral reflection lens corresponds to the LED chip array, and the LED chip array is located in the cavity; the lateral reflection lens comprises a lateral full reflection surface and a light emitting surface corresponding to the lateral full reflection surface, and light rays emitted by the LED chip array and the light rays reflected by the lateral full reflection surface are emitted by the light emitting surface. The lateral reflection-type LED integrated packaging structure is capable of effectively preventing glaring, improving luminance and reducing the length of a whole illuminant; the LED chip array which is used as the illuminant is located at the bottom of the lateral reflection lens so that the illuminant and the lateral reflection lens are convenient to install; by means of the arrangement, the light rays emitted by the light surface are evenly distributed; and under the condition of full color, an LED chip is good in mixing light, according to the lateral reflection-type LED integrated packaging structure, packaging materials are reduced, packaging costs are reduced, the absorption of materials is reduced, the light emitting efficiency is improved, and the safety and the reliability of the LED integrated packaging structure are guaranteed.
Description
Technical field
The utility model relates to a kind of encapsulating structure, and especially a kind of sidepiece reflecting LED integrated encapsulation structure belongs to the technical field that LED encapsulates.
Background technology
At present, along with the development of LED material epitaxy and chip technology, LED has shown good prospects for application, great power LED particularly, and its application is constantly expanded, and has been widely used in fields such as Landscape Lighting, mine lamp, street lamp, emergent street lamp.
LED is a kind of special diode, and the chip that its core is made up of P type semiconductor and N type semiconductor, these semi-conducting materials are in advance through explained hereafter P/N junction structures such as injection or doping.In the P/N of some semi-conducting material knot, the electric current among the LED can flow to the N utmost point from the P utmost point easily, and two kinds of different charge carriers are that tie to P/N from electrode stream under different electrode voltage effects with electronics in the hole; When hole and electronics meet and produce compound; Electronics can drop into lower ability rank, and the mode with photon gives off energy simultaneously, and adds reverse voltage to the P/N knot; Minority carrier is difficult to inject, so not luminous.
At present, on the market to the rising angle of LED and light extraction efficiency require increasingly high, particularly during the illumination in small angle range; Have shadow in the lens arrangement in the past, photochromic inhomogeneous, a lot of bad phenomenon such as light extraction efficiency is low have influenced the rising angle and the light extraction efficiency of LED illumination.
Summary of the invention
The purpose of the utility model is to overcome the deficiency that exists in the prior art, and a kind of sidepiece reflecting LED integrated encapsulation structure is provided, and it is simple and compact for structure; Easy to install, bright dipping is photochromic evenly, and light extraction efficiency is high; Bright-dark cut is clear, reduces use cost, and is applied widely.
According to the technical scheme that the utility model provides, said sidepiece reflecting LED integrated encapsulation structure comprises substrate and is positioned at the some led chip arrays on the said substrate; Be stamped the sidepiece mirror lens corresponding to the surface pressure that the led chip array is set on the said substrate, be concaved with the cavity that is used to hold the led chip array with the corresponding surface of led chip array in the said sidepiece mirror lens, the led chip array is positioned at cavity; The sidepiece mirror lens comprises that the sidepiece fully reflecting surface reaches and the corresponding exiting surface of said sidepiece fully reflecting surface, light that the led chip array sends and the light process exiting surface ejaculation of reflecting through the sidepiece fully reflecting surface.
The material of said sidepiece mirror lens comprises optical glass.The sidepiece fully reflecting surface of said sidepiece mirror lens is the curved surface shape.
Said sidepiece fully reflecting surface forms through on the surface of sidepiece mirror lens, electroplating the reflector, and the material of electroplating the reflector is aluminium or silver.
Said sidepiece mirror lens is fixedly installed on the substrate through press box.Said sidepiece mirror lens is provided with and is press-fitted step, and the said shape that is press-fitted step and press box matches, press box be press-fitted the step corresponding matching after the sidepiece mirror lens is fixed on the substrate.
Said press box is covered in the sidepiece fully reflecting surface, and is complementary with the shape of sidepiece fully reflecting surface.The material of said substrate comprises copper or aluminium.
Said led chip array comprises at least one led chip; Be filled with protection silica gel in the said cavity.Said sidepiece mirror lens reflector forms some equally distributed miniature curved surfaces on the sidepiece diversing lens.
The advantage of the utility model: the light that the led chip array sends incides corresponding advancing on the light face in the cavity, incides into that the light part of light face penetrates through exiting surface, and a part incides on the sidepiece fully reflecting surface; Incide and to penetrate from exiting surface after light on the sidepiece fully reflecting surface is reflected, thereby can effectively prevent to dazzle the eyes and improve brightness, fall the length of end integrated light source simultaneously.Owing to the bottom that is positioned at the sidepiece mirror lens as the led chip array of light source, more convenient installation light source of ability and the favourable heat radiation of sidepiece mirror lens; Through after above-mentioned the setting, the more even distribution of the light that penetrates from exiting surface; Led chip better mixed light under full-color situation is compared with encapsulating structure in the past, can prevent to dazzle the eyes and improve brightness.Can reduce encapsulating material, reduce packaging cost, reduce the absorption of material, improve light extraction efficiency, safe and reliable.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment 1.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the structural representation of the utility model embodiment 2.
Fig. 4 is the vertical view of Fig. 3.
Description of reference numerals: 1-sidepiece mirror lens, 2-exiting surface, 3-substrate, 4-LED chip array, 5-assembling step, 6-cavity, 7-press box, 8-are press-fitted step, 9-sidepiece fully reflecting surface and 10-and advance the light face.
Embodiment
Below in conjunction with concrete accompanying drawing and embodiment the utility model is described further.
Embodiment 1
As depicted in figs. 1 and 2: in order to improve light extraction efficiency, make light penetrate more even distribution simultaneously, said encapsulating structure comprises substrate 3, and said substrate 3 is provided with some led chip arrays 4, and said led chip array 4 comprises at least one led chip; When a plurality of led chip array 4 is set, can reach the light effect that of area source.Substrate 3 is stamped sidepiece mirror lens 1 corresponding to the surface pressure that led chip array 4 is set; Said sidepiece mirror lens 1 caves inward with led chip array 4 corresponding surfaces and forms cavity 6; Led chip array 4 is positioned at cavity 6, and cavity 6 corresponding inner surfaces form into light face 10.Substrate 3 convexes with assembling step 5 corresponding to the surface that led chip array 4 is set, and led chip array 4 is positioned on the assembling step 5, can conveniently led chip array 4 be installed on the substrate 3 through assembling step 5; Also can in cavity 6, fill protection silica gel.Sidepiece mirror lens 1 comprises that exiting surface 2 reaches and said exiting surface 2 corresponding sidepiece fully reflecting surfaces 9; The light that led chip array 4 sends incides on the light face 10; Be mapped on sidepiece fully reflecting surface 9 and the exiting surface 2 after passing sidepiece mirror lens 1; The light that incides on the exiting surface 2 penetrates from exiting surface 2, can penetrate from exiting surface 2 after the light that incides sidepiece fully reflecting surface 9 is reflected again, and reaches the effect that improves light utilization efficiency.The sidepiece fully reflecting surface 9 of sidepiece mirror lens 1 is the curved surface shape, and sidepiece fully reflecting surface 9 is a dome shape especially; Exiting surface 2 is plane, and exiting surface 2 is perpendicular to substrate 3; Especially, sidepiece mirror lens 1 is 1/4 sphere structure.Sidepiece fully reflecting surface 9 can form through on the respective surfaces of sidepiece mirror lens 1, electroplating the reflector, and the material in said plating reflector is aluminium or silver; Said plating reflector forms some equally distributed miniature curved surfaces on sidepiece mirror lens 1, and constitutes matrix array, and miniature curved surface is convexly set in the surface of sidepiece mirror lens 1.
Sidepiece mirror lens 1 adopts glass to process, and sidepiece fully reflecting surface 9 forms through electroplating the reflector on sidepiece mirror lens 1 body.In order can sidepiece mirror lens 1 to be fixed on the substrate 3, sidepiece mirror lens 1 is press-fitted through press box 7 and is installed on the substrate 3, and the material of substrate 3 comprises copper or aluminium.Sidepiece mirror lens 1 is press-fitted step 8 corresponding to being provided with substrate 3 contacted ends; Press box 7 is complementary with the shape that is press-fitted step 8; Press box 7 links to each other with sidepiece mirror lens 1 through being press-fitted step 8, after press box 7 and substrate 3 are fixed, can sidepiece mirror lens 1 be fixed with pressure on substrate 3.
Embodiment 2
Like Fig. 3 and shown in Figure 4: in order to protect said sidepiece fully reflecting surface 9; Said press box 7 and sidepiece mirror lens 1 be press-fitted step 8 corresponding matching after; Also be covered on the sidepiece fully reflecting surface 9; And the shape of the side plate reflecting surface 9 of the shape of press box 7 and sidepiece mirror lens 1 matches, and blocks protection thereby can counter-lateral quadrents fully reflecting surface 9 carry out gland.
Like Fig. 1 ~ shown in Figure 4: during use; Some led chip arrays 4 are installed on substrate 3; Led chip array 4 is positioned on the assembling step 5; Sidepiece mirror lens 1 is positioned on the substrate 3, and the cavity 6 of sidepiece mirror lens 1 is corresponding with led chip array 4, and sidepiece mirror lens 1 is fixedly installed on the substrate 3 through press box 7; Simultaneously, protection silica gel can be in cavity 6, filled, led chip array 4 can be protected through protection silica gel.During work, the light that led chip array 4 sends incides corresponding advancing on the light face 10 in the cavity 6, incides into that the light part of light face 10 penetrates through exiting surface 2, and a part incides on the sidepiece fully reflecting surface 9; Can penetrate from exiting surface 2 after inciding light on the sidepiece fully reflecting surface 9 and being reflected, thereby can effectively prevent to dazzle the eyes and improve brightness, fall the length of end integrated light source.Owing to the bottom that is positioned at sidepiece mirror lens 1 as the led chip array 4 of light source, more convenient installation light source of ability and sidepiece mirror lens 1; Through after above-mentioned the setting, the more even distribution of the light that penetrates from exiting surface 2; Led chip better mixed light under full-color situation is compared with encapsulating structure in the past, can reduce encapsulating material, has reduced the absorption of material; Improved light extraction efficiency, safe and reliable, be particularly suitable for car light, projector; The electric bicycle lamp, head lamp, fields of employment such as mine lamp.
Claims (10)
1. a sidepiece reflecting LED integrated encapsulation structure comprises substrate (3) and is positioned at the some led chip arrays (4) on the said substrate (3); It is characterized in that: said substrate (3) is gone up and is stamped sidepiece mirror lens (1) corresponding to the surface pressure that led chip array (4) is set; Be concaved with the cavity (6) that is used to hold led chip array (4) with the corresponding surface of led chip array (4) in the said sidepiece mirror lens (1), led chip array (4) is positioned at cavity (6); Sidepiece mirror lens (1) comprises that sidepiece fully reflecting surface (9) reaches and the corresponding exiting surface of said sidepiece fully reflecting surface (9) (2), light that led chip array (4) sends and light process exiting surface (2) ejaculation of reflecting through sidepiece fully reflecting surface (9).
2. sidepiece reflecting LED integrated encapsulation structure according to claim 1 is characterized in that: the material of said sidepiece mirror lens (1) comprises optical glass.
3. sidepiece reflecting LED integrated encapsulation structure according to claim 1 is characterized in that: the sidepiece fully reflecting surface (9) of said sidepiece mirror lens (1) is the curved surface shape.
4. sidepiece reflecting LED integrated encapsulation structure according to claim 1 is characterized in that: said sidepiece fully reflecting surface (9) forms through on the surface of sidepiece mirror lens (1), electroplating the reflector, and the material of electroplating the reflector is aluminium or silver.
5. sidepiece reflecting LED integrated encapsulation structure according to claim 1 is characterized in that: said sidepiece mirror lens (1) is fixedly installed on the substrate (3) through press box (7).
6. sidepiece reflecting LED integrated encapsulation structure according to claim 5; It is characterized in that: said sidepiece mirror lens (1) is provided with and is press-fitted step (8); The said shape that is press-fitted step (8) and press box (7) matches, press box (7) be press-fitted step (8) corresponding matching after sidepiece mirror lens (1) is fixed on the substrate (3).
7. sidepiece reflecting LED integrated encapsulation structure according to claim 5 is characterized in that: said press box (7) is covered in sidepiece fully reflecting surface (9), and is complementary with the shape of sidepiece fully reflecting surface (9).
8. sidepiece reflecting LED integrated encapsulation structure according to claim 1 is characterized in that: the material of said substrate (3) comprises copper or aluminium.
9. sidepiece reflecting LED integrated encapsulation structure according to claim 1 is characterized in that: said led chip array (4) comprises at least one led chip; Said cavity is filled with protection silica gel in (6).
10. sidepiece reflecting LED integrated encapsulation structure according to claim 4 is characterized in that: said sidepiece mirror lens (1) reflector is gone up at sidepiece diversing lens (1) and is formed some equally distributed miniature curved surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200949662U CN202487664U (en) | 2012-03-14 | 2012-03-14 | Lateral reflection-type light-emitting diode (LED) integrated packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200949662U CN202487664U (en) | 2012-03-14 | 2012-03-14 | Lateral reflection-type light-emitting diode (LED) integrated packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202487664U true CN202487664U (en) | 2012-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200949662U Expired - Fee Related CN202487664U (en) | 2012-03-14 | 2012-03-14 | Lateral reflection-type light-emitting diode (LED) integrated packaging structure |
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| Country | Link |
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| CN (1) | CN202487664U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109742212A (en) * | 2018-12-21 | 2019-05-10 | 华中科技大学鄂州工业技术研究院 | A kind of LED packaging structure and packaging method |
-
2012
- 2012-03-14 CN CN2012200949662U patent/CN202487664U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109742212A (en) * | 2018-12-21 | 2019-05-10 | 华中科技大学鄂州工业技术研究院 | A kind of LED packaging structure and packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121010 Termination date: 20140314 |