CN207602567U - A kind of remote fluorescence LED component - Google Patents
A kind of remote fluorescence LED component Download PDFInfo
- Publication number
- CN207602567U CN207602567U CN201720996732.XU CN201720996732U CN207602567U CN 207602567 U CN207602567 U CN 207602567U CN 201720996732 U CN201720996732 U CN 201720996732U CN 207602567 U CN207602567 U CN 207602567U
- Authority
- CN
- China
- Prior art keywords
- led
- package substrate
- functional areas
- blocks
- led package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides a kind of remote fluorescence LED component, which includes LED package substrate, blocks of solid fluorophor, LED chip；Functional areas are provided in the LED package substrate, more than one LED chip is provided in the functional areas, wherein, the blocks of solid fluorophor is set to the top of the functional areas for the LED package substrate for having completed LED chip installation, the blocks of solid fluorophor forms the cavity of a complete closure with LED package substrate, meanwhile more than two through-holes are provided in the functional areas of the LED package substrate.Packaging silicon rubber is by more than one through-hole injection cavity, the air in cavity is discharged by addition more than one remaining through-hole, so as to which packaging silicon rubber be made to be filled up completely the cavity.The light-source structure of the remote fluorescence LED component can effectively solve the problem that blocky fluorescent material uses the dislocation generated in silicone filler and adhesion process and the application problem of bubble.
Description
Technical field
The utility model is related to LED component field, more particularly to a kind of remote fluorescence LED component.
Background technology
With technological progress and the expansion of application field, high-power LED light source is increasingly valued by people.And it passes
System LED light source is usually to be packaged using fluorescent powder mixing organic colloid, and such packaged type causes fluorescent powder to be close to LED
Chip.When power is smaller, which is effective and feasible, but after increasing with power density, in particular by collection
Into encapsulation mode when, two high-power heat sources can be mutually superimposed.This can lead to the very fast raising of the junction temperature of LED chip, and fluorescence
Powder also will appear attenuation aging or even organic colloid there is also carbonization situation, and the service life is reduced so as to cause light source light-emitting efficiency
It reduces.
In order to solve the heat-resisting and heat dissipation problem of high-power LED light source fluorescent material, blocks of solid fluorescent material combines remote
The mode of excitation of journey fluorescence is used more and more widely.It is sealed on common bulk fluorophor high power LED integration packaging or plate
Filling (or being COB encapsulation) mode is：(the generally material of high reflectance) the fixed LED core in the functional areas of heat-radiating substrate
Piece, usually plurality of LEDs chip carry out putting for orderly array, according still further to cut-in voltage with being carried out using the requirement of electric current
The operation (rational connection in series-parallel quantity) of electrical connection with silica gel or is mixed with functional areas of the silica gel by heat-radiating substrate of fluorescent powder
It fills up, then blocky fluorescent material is affixed on to the top of functional areas, it is finally toasted to cure silica gel.Above-mentioned high-power LED light source
Structure and packaging method, since its drying glue process will undergo the process that a silica gel viscosity becomes smaller, this stage bulk fluorescence
Material easily slides and blocky fluorescent material is made to misplace, and due to that may enclose bubble when blocky fluorescent material is bonded,
Microbubble merging becomes larger and can not discharge and make functional areas there are air bubble problems during silica gel baking.
In the prior art, patent of invention 201510602713.X provides a kind of packaged type of remote fluorescence, that is, is dissipating
It is opened on hot substrate there are one injection through-hole, and the injection fluid media (medium) in injection through-hole.The viscosity of the fluid media (medium) is 30-
1000mm2/ s, as long as purpose is used to serve as coolant.And when not solving blocky fluorescent material using silicone filler and bond
The dislocation of generation and air bubble problem.Current silica gel used in great power LED on the market simultaneously, viscosity is all in 3000mm2/s
More than, therefore the design of its simple injection through-hole can not solve problem above well.
Patent of invention 201310493235.4, although the mode of excitation of remote fluorescence has been used, in LED chip and block
Silicone filler is not used between shape fluorescent material.This adds increased the total reflections of chip interface, reduce the outer quantum effect of chip
Rate, while the design of remote fluorescence material vacantly is also unfavorable for the heat dissipation of fluorescent material itself very much.
Utility model content
To solve the above problems, the utility model provides a kind of remote fluorescence LED component, using the light of this LED component
Source structure can effectively solve the problem that blocky fluorescent material uses the dislocation generated in silicone filler and adhesion process and the application of bubble
Problem.
The utility model adopts the following technical solution realizes：
A kind of remote fluorescence LED component, including LED package substrate, blocks of solid fluorophor, LED chip；The LED envelopes
Functional areas are provided on dress substrate, more than one LED chip is provided in the functional areas,
Wherein, the blocks of solid fluorophor is set to the functional areas for the LED package substrate for having completed LED chip installation
Top, the blocks of solid fluorophor form the cavity of a complete closure with LED package substrate,
Meanwhile more than two through-holes are provided in the functional areas of the LED package substrate.
Preferably, packaging silicon rubber is filled in the cavity.
According to the utility model, the packaging silicon rubber is injected by one Yi Shang through-hole in the cavity, in cavity
Air is discharged by addition more than one remaining through-hole, so as to which packaging silicon rubber be made to be filled up completely the cavity.
It completes to be electrically connected according to the utility model, between the LED chip, the electrode of LED chip and LED package substrate
Between complete be electrically connected.
According to the utility model, the LED component is obtained by the way of LED chip remote excitation blocks of solid fluorophor
White light.
According to the utility model, the LED package substrate can select all that can process not according to specific needs
Same shape, for example, square, rectangle, circle, semicircle etc..
According to the utility model, the functional areas that are set in the LED package substrate can select one according to specific needs
Cut the different shapes that can be processed, for example, square, rectangle, circle, semicircle etc..
According to the utility model, the blocks of solid fluorophor can select what all can be processed according to specific needs
Different shapes, for example, sheet, hemispherical or dome shape etc., and the LED package substrate and the blocks of solid fluorophor
The region engaged is plane.
According to the utility model, the blocks of solid fluorophor is set to the LED package substrate for having completed LED chip installation
Functional areas surface；
Preferably, the center of the blocks of solid fluorophor is coaxial with the center of the functional areas of the LED package substrate.
According to the utility model, the LED chip is fixedly connected in the functional areas of the LED package substrate.
According to the utility model, the shape of through holes of the functional areas of the LED package substrate is the shape that all can be machined
Shape, for example, round, rectangle, sector etc..
According to the utility model, the blocks of solid fluorophor is being fixedly connected on the LED package substrate functional areas just
Top, the mode being fixedly connected include, and binding agent connection, the bonding of organic gel class, metal welding or additional fixture make two
Person is temporarily fixed to together etc..
The preparation method of remote fluorescence LED component provided by the utility model includes the following steps：
(1) more than one LED chip is fixed in the functional areas of LED package substrate；
(2) blocks of solid fluorophor is covered in and has completed the work(that LED chip fixes the LED package substrate with being electrically connected
The top in energy area, and both blocks of solid fluorophor and LED package substrate are relatively fixed, formation one is closed to be placed with
The cavity of LED chip；
(3) LED encapsulation packaging silicon rubbers are injected into the through-hole in the functional areas of LED package substrate, when encapsulation silicon
Glue cures silica gel after being full of cavity.
The utility model, which is used, sets more than two through-holes in functional areas, and packaging silicon rubber injects cavity by more than one through-hole
Interior, the air in cavity is discharged by addition more than one remaining through-hole, so as to which packaging silicon rubber be made to be filled up completely the cavity.It should
LED light source structure can effectively avoid blocks of solid fluorescent material that the silica gel bubble that generates in the process of attachment and sliding is being used to ask
Topic.
Description of the drawings
The vertical view of the LED component of Fig. 1 embodiments 1.
The side view of the LED component of Fig. 2 embodiments 1.
The vertical view of the LED component of Fig. 3 embodiments 2.
The side view of the LED component of Fig. 4 embodiments 2.
The vertical view of the LED component of Fig. 5 embodiments 3.
The side view of the LED component of Fig. 6 embodiments 3.
The vertical view of the LED component of Fig. 7 embodiments 4.
The side view of the LED component of Fig. 8 embodiments 4.
The vertical view of the LED component of Fig. 9 embodiments 5.
The side view of the LED component of Figure 10 embodiments 5.
Wherein, 10 be package substrate, and 111 be circular through hole, and 112 be arc-shaped through-hole, and 113 be rectangular through-hole, and 12 seal for LED
The functional areas of substrate are filled, 20 be LED chip, and 30 be blocks of solid fluorophor, and 40 be cavity, and 31 be the side of blocks of solid fluorophor
Edge, 10 be package substrate, and 12 be the functional areas of LED package substrate.
Specific embodiment
With reference to specific embodiment, the utility model is expanded on further.It should be understood that these embodiments are merely to illustrate this
Utility model rather than limitation the scope of the utility model.Furthermore, it is to be understood that having read in recorded in the utility model
After appearance, those skilled in the art can make various changes or modifications the utility model, and such equivalent forms equally fall within this
Utility model limited range.
Embodiment 1
As shown in Figure 1, LED package substrate 10 used herein is mirror-surface aluminum base board, the functional areas 12 of LED package substrate
For circle, LED chip 20 of uniformly arranging in its round functional areas, the line and non-line of chips and chip chamber represent
The series-parallel system of chip, the upper and lower ends in functional areas 12 are respectively arranged with circular through hole 111.Left view as shown in Figure 2,
Blocks of solid fluorophor 30 is Ce:YAG ceramics, shape are disc, and diameter is slightly larger than functional areas diameter of a circle.It will be blocky
In the circumferential edges smearing industry of solid fluorescence body after common LED packaging silicon rubbers, which is affixed on
Through being mounted with LED chip 20 and completing on the substrate 10 being electrically connected.The center of circle of blocks of solid fluorophor 30 and LED package substrate
The center of circle of 10 functional areas 12 is coaxial.Component after installation is complete is put into oven cooking cycle, so that silica gel cures.When silica gel cures
Afterwards, a cavity 40 is formed between blocks of solid fluorophor 30 and package substrate 10.Again by packaging silicon rubber by circular through hole 111 its
In a circular through hole inject in the cavity 40, with the injection of packaging silicon rubber, the air in cavity is gradually by circular through hole 111
The discharge of another circular through hole, the effect finally needed should be, and silica gel takes cavity 40 completely, and the air bubble of noresidue.Note
The LED component is put into oven cooking cycle again after the completion of glue, so as to the silica gel curing of cavity 40 be filled up, so as to complete entire LED
The manufacturing process of device.
Embodiment 2
As shown in figure 3, LED package substrate 10 used herein is the copper base of electrosilvering, the function of LED package substrate
Area 12 is circle, LED chip 20 of uniformly arranging in its round functional areas, the line and non-line of chips and chip chamber
Represent the series-parallel system of chip, the circle centre position in functional areas 12 is provided with a circular through hole 111, while in the upper of functional areas 12
Lower both ends are respectively arranged with arc-shaped through-hole 112.As shown in figure 4, blocks of solid fluorophor 30 is fluorescent powder vitreum, shape is
Disc, diameter are slightly larger than functional areas diameter of a circle.The circumferential edges of blocks of solid fluorophor 30 are smeared into LED packaging silicon rubbers
Afterwards, which is affixed on and has been mounted with LED chip 20 and has completed on the substrate 10 being electrically connected.Bulk is solid
The center of circle of body fluorophor 30 is coaxial with the center of circle of the functional areas 12 of LED package substrate 10.Component after installation is complete is put into roasting
Case toasts, so that silica gel cures.After silica gel cures, a cavity is formed between blocks of solid fluorophor 30 and package substrate 10
40.Packaging silicon rubber is injected by the circular through hole 111 of 12 circle centre position of functional areas in the cavity 40 again, with the note of packaging silicon rubber
Enter, the air in cavity is gradually discharged by two arc-shaped through-holes 112 of the upper and lower ends for being arranged on functional areas 12, is finally needed
Effect should be, and silica gel takes cavity 40 completely, and the air bubble of noresidue.The LED component is put into again after the completion of injecting glue roasting
Case toasts, so as to the silica gel curing of cavity 40 be filled up, so as to complete the manufacturing process of entire LED component.
Embodiment 3
As shown in figure 5, LED package substrate 10 used herein is ceramic substrate, die bond and bonding wire on ceramic substrate
Region is metallized, and is electrically connected with facilitating.The functional areas 12 of package substrate 10 are circle, in its round functional areas
The line of even LED chip 20 of arranging, chips and chip chamber represents the series-parallel system of chip with non-line, in functional areas
12 upper and lower ends are respectively arranged with circular through hole 111 and arc-shaped through-hole 112.In left view as shown in Figure 6, blocks of solid
Fluorophor 30 is Ce:YAG monocrystalline, shape is arc-shaped for smaller part, and diameter of a circle where small semicircle is justified slightly larger than functional areas 12
Diameter.The center of circle in the center of circle and the functional areas 12 of LED package substrate 10 of circle where 30 small semicircle of blocks of solid fluorophor is total to
Axis, and clamped the two with fixture.Packaging silicon rubber is injected by the circular through hole 111 of functional areas 12 in cavity 40, with encapsulation
The injection of silica gel, the air in cavity are gradually discharged by another arc-shaped through-hole 112, and the effect finally needed should be, and silica gel is complete
It is complete to take cavity 40, and the air bubble of noresidue.The LED component is put into oven cooking cycle again after the completion of injecting glue, so as to fill up
The silica gel curing of cavity 40, so as to complete the manufacturing process of entire LED component.
Embodiment 4
As shown in fig. 7, LED package substrate 10 used herein is mirror-surface aluminum base board, the functional areas 12 of LED package substrate
For square, LED chip 20 of uniformly arranging in its functional areas 12, the line and non-line of chips and chip chamber represent
The series-parallel system of chip is provided with circular through hole 111 in one end of functional areas 12, while the other end in functional areas 12 is set
There is rectangular through-hole 113.As shown in figure 8, blocks of solid fluorophor 30 is the silica gel of fluorescent powder mixing, shape is square for sheet
Shape, the length of side is slightly larger than the length of side of 12 square of functional areas.It will be common in the edge smearing industry of blocks of solid fluorophor 30
LED packaging silicon rubbers, after the blocks of solid fluorophor 30 is affixed on be mounted with LED chip 20 and complete be electrically connected substrate
On 10.The diagonal of square bulk solid fluorescence body 30 is overlapped with the diagonal of square functional areas 12.After installation is complete
Component be put into oven cooking cycle so that silica gel cure.After silica gel cures, shape between blocks of solid fluorophor 30 and package substrate 10
Into a cavity 40.Packaging silicon rubber is injected by the circular through hole 111 of 12 one end of functional areas in the cavity 40 again, with encapsulation silicon
The injection of glue, the air in cavity are gradually discharged by the rectangular through-hole of the other end 113, and the effect finally needed should be, and silica gel is complete
It is complete to take cavity 40, and the air bubble of noresidue.The LED component is put into oven cooking cycle again after the completion of injecting glue, so as to fill up
The silica gel curing of cavity 40, so as to complete the manufacturing process of entire LED component.
Embodiment 5
As shown in figure 9, LED package substrate 10 used herein is mirror-surface aluminum base board, the functional areas 12 of LED package substrate
For square, LED chip 20 of uniformly arranging in its functional areas 12, the line and non-line of chips and chip chamber represent
The series-parallel system of chip, the upper and lower ends in functional areas 12 are respectively arranged with rectangular through-hole 113.Left view as shown in Figure 10
Figure, blocks of solid fluorophor 30 are ceramic phosphor, and the one side being connected with package substrate is planar rondure, and another side is ball
Shape face, plane diameter of a circle are slightly larger than the catercorner length of square functional areas 12.By the edge of blocks of solid fluorophor 30
31 carry out metalized, while be covered with copper foil with the corresponding position that blocks of solid fluorophor 30 is connected in mirror-surface aluminum base board, make
Obtaining blocks of solid fluorophor 30 and the bonding of package substrate 10 can carry out the mode of metal welding.When blocks of solid fluorescence
A cavity 40 can be formed after being bonded between body 30 and package substrate 10 with the mode of eutectic or soldering.Again by packaging silicon rubber by
The rectangular through-hole 113 of 12 one end of functional areas is injected in the cavity 40, with the injection of packaging silicon rubber, air in cavity gradually by
Another rectangular through-hole 113 is discharged, and the effect finally needed should be, and silica gel takes cavity 40 completely, and the air bubble of noresidue.Note
The LED component is put into oven cooking cycle again after the completion of glue, so as to the silica gel curing of cavity 40 be filled up, so as to complete entire LED
The manufacturing process of device.
More than, the embodiment of the utility model is illustrated.But the utility model is not limited to above-mentioned implementation
Mode.Within the spirit and principle of the utility model, any modification, equivalent substitution, improvement and etc. done, should be included in
Within the scope of protection of the utility model.
Claims (15)
1. a kind of remote fluorescence LED component, including LED package substrate, blocks of solid fluorophor, LED chip；The LED encapsulation
Functional areas are provided on substrate, more than one LED chip is provided in the functional areas,
Wherein, the blocks of solid fluorophor is set to the upper of the functional areas for the LED package substrate for having completed LED chip installation
Side, the blocks of solid fluorophor form the cavity of a complete closure with LED package substrate, meanwhile, the LED package substrate
Functional areas in be provided with more than two through-holes.
2. LED component according to claim 1, which is characterized in that filled with packaging silicon rubber, the encapsulation in the cavity
Silica gel is injected by one Yi Shang through-hole in the cavity, and the air in cavity is arranged by addition more than one remaining through-hole
Go out, so as to which packaging silicon rubber be made to be filled up completely the cavity.
3. LED component according to claim 1, which is characterized in that complete to be electrically connected between the LED chip, LED core
It completes to be electrically connected between piece and the electrode of LED package substrate.
4. LED component according to claim 1, which is characterized in that the LED component uses LED chip remote excitation block
The mode of shape solid fluorescence body obtains white light.
5. LED component according to claim 1, which is characterized in that the LED package substrate, can according to specific needs,
It is processed into different shapes.
6. LED component according to claim 5, which is characterized in that the shape of the LED package substrate is square, square
Shape, circle or semicircle.
7. according to the LED component described in any one of claim 1-6, which is characterized in that set in the LED package substrate
Functional areas can be processed into different shapes according to specific needs.
8. LED component according to claim 7, which is characterized in that the shape of the functional areas is square, rectangle, circle
Shape or semicircle.
9. according to the LED component described in any one of claim 1-6, which is characterized in that the blocks of solid fluorophor, it can
According to specific needs, different shapes, and the area that the LED package substrate is engaged with the blocks of solid fluorophor are processed into
Domain is plane.
10. LED component according to claim 9, which is characterized in that the shape of the blocks of solid fluorophor for sheet,
Hemispherical or dome shape.
11. according to the LED component described in any one of claim 1-6, which is characterized in that the blocks of solid fluorophor setting
In the surface of the functional areas for the LED package substrate for having completed LED chip installation；
Wherein, the center of the blocks of solid fluorophor is coaxial with the center of the functional areas of the LED package substrate.
12. according to the LED component described in any one of claim 1-6, which is characterized in that the LED chip is fixedly connected on
In the functional areas of the LED package substrate.
13. according to the LED component described in any one of claim 1-6, which is characterized in that the function of the LED package substrate
The shape of through holes in area is the shape that all can be machined.
14. LED component according to claim 13, which is characterized in that the shape of through holes is circle, rectangle or sector.
15. according to the LED component described in any one of claim 1-6, which is characterized in that the blocks of solid fluorophor is fixed
The surface of the LED package substrate functional areas is connected to, the mode being fixedly connected includes, binding agent connection, organic gel
Bonding, metal welding or the additional fixture of class make the two be temporarily fixed to together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720996732.XU CN207602567U (en) | 2017-08-10 | 2017-08-10 | A kind of remote fluorescence LED component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720996732.XU CN207602567U (en) | 2017-08-10 | 2017-08-10 | A kind of remote fluorescence LED component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207602567U true CN207602567U (en) | 2018-07-10 |
Family
ID=62752430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720996732.XU Active CN207602567U (en) | 2017-08-10 | 2017-08-10 | A kind of remote fluorescence LED component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207602567U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611118A (en) * | 2017-08-10 | 2018-01-19 | 中国科学院福建物质结构研究所 | A kind of remote fluorescence LED component and preparation method thereof |
| CN113113553A (en) * | 2021-03-30 | 2021-07-13 | 深圳市辉中盛科技有限公司 | OLED liquid crystal screen packaging structure |
-
2017
- 2017-08-10 CN CN201720996732.XU patent/CN207602567U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611118A (en) * | 2017-08-10 | 2018-01-19 | 中国科学院福建物质结构研究所 | A kind of remote fluorescence LED component and preparation method thereof |
| CN113113553A (en) * | 2021-03-30 | 2021-07-13 | 深圳市辉中盛科技有限公司 | OLED liquid crystal screen packaging structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100474646C (en) | Packaging method for white light illuminating diode | |
| CN103730565B (en) | A kind of method for packing of aluminium nitride COB LED light source | |
| CN101364626B (en) | LED device | |
| CN202094175U (en) | Far fluorescent powder LED encapsulating structure | |
| CN100565000C (en) | Utilize the YAG crystalline ceramics to prepare the method for white light LEDs | |
| CN207602567U (en) | A kind of remote fluorescence LED component | |
| CN208385404U (en) | A kind of high-color rendering remote fluorescence LED component | |
| CN104282676A (en) | Integrated LED lamp panel packaging structure and technology | |
| CN103367346A (en) | Novel high-power LED light source and implementation method thereof | |
| CN106098919A (en) | High-thermal-conductivity and high-insulation LED light engine packaging structure and preparation method | |
| CN103151434B (en) | A kind of method improving LED fluorescent material distributing homogeneity | |
| CN207021277U (en) | A kind of remote fluorescence LED component | |
| CN207602608U (en) | A kind of remote fluorescence LED component | |
| CN207353243U (en) | A kind of remote fluorescence LED component | |
| CN107546221A (en) | A kind of remote fluorescence LED component and preparation method thereof | |
| CN207947310U (en) | A kind of COB light source of high reflecting mirror surface glass plate encapsulation | |
| CN103715190B (en) | Luminescent device | |
| CN107611118A (en) | A kind of remote fluorescence LED component and preparation method thereof | |
| CN107369743B (en) | Remote fluorescent LED device and preparation method and application thereof | |
| CN206040705U (en) | White light LED collection moulding piece of independent encapsulation | |
| CN103855280A (en) | LED wafer-level packaging method | |
| CN205028918U (en) | LED support and LED packaging body | |
| CN211125695U (en) | L ED support with ceramic dam | |
| CN206268819U (en) | A kind of split type LED light source | |
| CN203589071U (en) | An LED support and an LED |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Guo Wang Inventor after: Deng Zhonghua Inventor after: Liu Zhuguang Inventor after: Chen Jian Inventor after: Huang Qiufeng Inventor after: Huang Jiquan Inventor after: Zhang Weifeng Inventor after: Hong Maochun Inventor before: Guo Wang Inventor before: Deng Zhonghua Inventor before: Liu Zhuguang Inventor before: Chen Jian Inventor before: Huang Qiufeng Inventor before: Huang Jiquan Inventor before: Zhang Weifeng Inventor before: Hong Maochun |
|
| CB03 | Change of inventor or designer information |